Al-Si-Cu-Zn急冷钎料钎焊铝及铝合金的界面结构及强度

采用Al70Si7.5Cu20Zn2.5和Al65Si10Cu20Zn5两种急冷钎料钎焊L2纯铝和6063铝合金,研究钎焊接头的界面微观结构和力学性能.结果表明,急冷钎料钎焊接头由母材、界面区和钎缝中心组成.界面区为αAl固溶体,钎缝中心组织为αAl固溶体 θ(Al2Cu)相 Si相.采用Al65Si10Cu20Zn5急冷钎料钎焊的接头抗剪强度均高于Al70Si-7.5Cu20Zn2.5急冷钎料钎焊的接头强度;匹配氯化物钎剂钎焊的接头强度均高于氟化物钎剂.在相同的工艺条件下,采用急冷钎料钎焊的L2纯铝接头,其抗剪强度都明显高于相应的常规钎料,其增加值在40%左右.     

Zn-Al钎料成分对Cu/Zn-Al/Al钎焊接头界面结构及性能的影响

分别采用Zn-15Al,Zn-22Al,Zn-28Al,Zn-37Al和Zn-45Al钎料钎焊获得Cu/Al接头.利用SEM,EDS和XRD研究了Zn-Al钎料成分对Cu/Al接头中Cu母材/钎缝界面结构的影响,并系统阐述了Zn-Al钎料成分-接头界面结构-接头抗剪切强度之间的关系.研究发现,Cu/Zn-15Al/Al接头中Cu母材/钎缝界面结构为Cu/Al4.2Cu3.2Zn0.7,且Al4.2Cu3.2Zn0.7界面层较薄,其厚度为2~3μm,接头具有较高的抗剪切强度,达66.3 MPa.随着钎料中Al含量的提高,在Cu/Zn-22Al/Al接头界面处Al4.2Cu3.2Zn0.7界面层的厚度逐渐增大,甚至在Cu/Zn-28Al/Al接头的Al4.2Cu3.2Zn0.7界面层附近出现少量的Cu Al2,接头的抗剪切强度逐渐降低.当采用Al含量较高的Zn-37Al钎料钎焊Cu/Al接头时,Cu母材/钎缝界面结构转变为Cu/Al4.2Cu3.2Zn0.7/Cu Al2;脆性Cu Al2层的出现,使接头抗剪切强度大幅下降,为34.5 MPa.当采用Al含量最高的Zn-45Al钎料钎焊Cu/Al接头时,Cu母材/钎缝界面结构转变为Cu/Cu Al2,接头抗剪切强度最低,为31.6 MPa.     

硬质合金与高温合金钎焊界面组织与极端工况下的力学性能

随着现代工业的急速发展,常规硬质合金与钢钎焊工具逐渐难以满足复杂极端工作环境的需求,针对此问题,研究了不同钎焊温度(860℃~950℃)对AgCuNiMn钎料真空钎焊YG6X硬质合金与GH4169高温合金钎焊接头微观组织的影响,测试了860℃~950℃焊接温度下试样在常温与理论工作温度227℃下的抗拉强度,并测试了860℃焊接温度下试样的深低温(-238℃)抗拉强度。钎缝微观组织主要由Ag基固溶体与Cu基固溶体组成,随着钎焊温度的升高,钎缝中心区Cu基固溶体的数量逐渐减少,钎缝间隙逐渐变窄,两侧界面处Cu基固溶体反应层逐渐变厚,一定程度上提高了钎料与母材的界面结合强度,但同时也使得钎缝处残余应力增加。钎缝在常温下的抗拉强度呈现先升高后降低的趋势,在890℃~950℃焊接温度区间,227℃的拉伸试验温度对接头抗拉强度基本没有影响,在钎焊温度为890℃时,平均拉伸强度达到最高值为715.3 MPa。在860℃焊接温度下,接头的平均抗拉强度表现为-238℃拉伸强度(474.8 MPa)>常温拉伸强度(430.2 MPa)>227℃拉伸强度(278 MPa),深低温环境下接头的抗拉强度相较于常温下提高了约10%;由于860℃焊接温度相对较低,钎料与母材溶解与扩散程度较低,导致钎料在227℃下发生软化,抗拉强度急剧下降。     

3003铝合金ZnAl钎料的火焰钎焊(英文)

采用Al含量为2%~22%(质量分数)的ZnAl钎料,配合改进型CsF-AlF3钎剂,研究ZnAl钎料在3003铝合金板材上的铺展性能及钎焊接头的力学性能与显微组织。结果表明,当Al含量低于8%时,3003铝合金的火焰钎焊接头成形良好,且抗拉强度较高。钎缝显微组织为Al基固溶体及Zn基固溶体。由于固溶强化作用,钎缝的显微硬度比母材的高。钎缝界面由三部分组成,母材、扩散区和界面区,但影响接头强度的主要因素为钎缝内固溶体的分布情况,而不是扩散区的宽度。     

药芯铝钎料钎焊Cu/Al异种金属接头的力学性能及反应物

以3种药芯铝钎料对Cu/Al异种金属进行了火焰钎焊,研究了钎焊接头的力学性能及反应物.通过测试和分析3种钎焊接头的强度、组织和显微硬度,从中选取综合性能较优的试样ZAAg2;采用扫描电镜(SEM)、X射线衍射仪(XRD)、X射线能谱仪(EDS)等进一步分析该钎焊接头的组织及反应物.结果表明:性能较优钎焊接头ZAAg2接头强度高达75 MPa,接头的主要断裂形式为沿晶脆性断裂,断裂主要产生在CuAl,CuAl2,Al4Cu9等脆性组织与α - Al基体的界面处.钎料与母材发生界面反应,钎缝中靠近铝侧生成α-Al固溶体,靠近铜侧生产CuAl,CuAl2,Al4 Cu9等脆性相.     

泡沫铝氮气保护炉中钎焊界面结构及力学性能

对泡沫铝板采用铝基钎料炉中钎焊界面结构进行试验研究,采用SEM和显微镜观察分析钎缝组织,EDS分析界面元素分布,并用计算机层析扫描技术（X-CT）等对钎焊界面孔结构进行观察并重构了界面三维图像,在接触界面模型基础上分析钎焊接头力学性能和影响因素。结果表明,钎焊方法未改变钎缝孔结构;钎缝界面由端面胞壁棱接触相交点组成,未形成持续膜层;钎缝主要由边缘区aAl枝状晶组织和中心区的Al-Si共晶组织组成;钎焊接头强度与母材相当并随孔隙率增大而降低;胞棱数量越多钎着面积越大,接头强度接近母材强度,高孔隙率（〉88％）泡沫铝接触界面模型中的胞棱数量与实测值相吻合;     

采用Ni基钎料和Cu中间层真空钎焊W/CuCrZr的接头组织和性能研究

以20μm厚的纯Cu片作为中间层,采用20μm厚的非晶态Ni基钎料箔在在900、930、950℃下保温10min真空钎焊W和CuCrZr合金。采用SEM和EDS分析了钎焊接头的界面形貌,检测钎焊接头的剪切强度及显微硬度。结果表明,中间层Cu与母材CuCrZr合金一侧界面结合良好,在CuCrZr合金一侧形成了钎焊热影响区;钎料与W母材界面处形成了反应层,在W母材侧有微裂纹。随着钎焊温度的升高,W侧裂纹增多,造成接头性能的迅速恶化。W和CuCrZr的钎焊温度最好控制在930℃以下。以纯Cu片为中间层,采用Ni基钎料钎焊W和CuCrZr的过程,实质上是Ni与Cu、W互相扩散并反应生成化合物层和固溶体的过程。钎焊接头的最佳剪切强度为144MPa,断裂主要发生在W母材及W与反应层之间的界面。钎缝区域的显微硬度随钎焊温度的升高而降低,CuCrZr合金焊接热影响区的硬度高于其母材。     

TIG钎焊铜-铝异种金属接头的组织和力学性能

本文研究了Zn-5wt%Al药芯焊丝氩弧(TIG)钎焊纯铜和纯铝搭接接头的组织结构及力学性能。在其他工艺参数不变的条件下,分析了不同TIG电流对钎料润湿角、钎缝组织和接头力学性能的影响。结果表明,随着TIG电流的增大,钎料与两侧母材的润湿角均减小,界面扩散和反应增强。TIG电流为70 A的钎焊接头力学性能最佳,平均拉剪强度超过90 MPa,约为工业纯铝板抗拉强度的75%;钎料与母材结合良好,钎缝的组织以Zn-Al共晶为主,未见显著的金属间化合物生成,钎缝两侧的Cu、Al界面上均有一层3～4μm厚的富Zn扩散层。     

SiC_P/Al复合材料的钎焊工艺研究

采用Zn98Al和Zn72.5Al两种Zn-Al药芯钎料对SiCP/Al复合材料进行氩气保护钎焊试验,研究了钎焊温度和保温时间对接头剪切强度及显微组织的影响。结果表明,用这两种钎料在氩气保护炉中钎焊SiCP/Al复合材料,可以获得质量良好的钎焊接头。对Zn98Al钎料,当温度为490℃、保温45min时可获得剪切强度为71.01MPa的钎焊接头;而Zn72.5Al钎料,在温度为560℃、保温11 min时可获得剪切强度为63.71MPa的钎焊接头。两种钎料的钎焊接头显微硬度均略低于母材。两种接头钎缝区的XRD相结构分析发现,钎缝中都只存在α(Al)和β(Zn)两相;接头断口扫描观察显示,接头整体呈韧性断裂特征。     

SiC_p/Al激光诱导钎焊接头界面行为及性能

针对T/R模块壳体结构封装的特殊性,提出了激光诱导钎焊方法并建立其机理模型.以增强相体积分数为55%的Si CP/Al复合材料为母材,根据激光诱导温度场的特殊性,采用Al Zn25Si1,Zn Al7,纳米铝粉,微颗粒锡4种钎料对铝基复合材料进行了氩保护气氛钎焊试验,利用扫描电镜和EDS能谱分析的方法对钎焊接头的界面结合和断口形貌进行了研究.在保证接头材料表面不受热损伤、且搭接界面钎料熔化的特殊温度场的条件下,确定了激光的参数.结果表明,低熔点的Zn Al7、纳米铝粉钎料容易得到良好的接头,界面层通过扩散实现了冶金结合,断口分析表明,钎焊接头的断口位于钎缝偏于母材内一侧,具有一定的连接强度.     

Residual stresses in welded joints in 1460 aluminium alloy

In order to obtain high-strength aluminium butt joints with corrosion resistance, ultrasonic soldering of A1070 rods was conducted using quasi-melting Sn–xZn (x = 23, 40, 82 mass%) hypereutectic alloy. Ultrasonic vibrations were applied at soldering temperatures ranging 220–300°C through A1070 rods without a solder bath.

The tensile strength of the solder joints with Sn–23Zn or 40Zn alloy were higher than that of the joint soldered with Sn–9Zn eutectic alloy. The joints soldered with Sn–23Zn or 40Zn alloy showed the same strength as A1070 rods which employed the same heat treatment as the ultrasonic soldering process. The thickness of the hypereutectic solder layer in the joints was thicker than that of the Sn–9Zn solder layer because unmelted α-Zn solid solution should have prevented the solder from being pressed out of the joint gap by the applied pressure during soldering. Tensile tests of the joints after immersion in NaCl aqueous solution revealed that the corrosion resistance of the joints soldered with hypereutectic alloy was higher than that of the joint soldered with Sn–9Zn alloy. It is considered that the improvement was achieved by the thick hypereutectic solder layer which should have reduced the notch effect in the joints.     

Zn基钎料钎焊镁合金AZ31B接头的钎缝物相及力学性能

以Zn基钎料对变形镁合金AZ31B进行了高频感应钎焊,研究了钎焊接头的钎缝物相及力学性能.采用扫描电镜、X射线衍射仪、X射线能谱分析仪等分析了钎焊接头的界面组织及钎缝物相,测试了钎焊接头的强度及钎缝组织的显微硬度.结果表明:钎料与母材发生界面反应,在钎缝中生成α-Mg,γ-MgZn相.钎焊搭接接头平均抗剪强度为55 MPa,对接接头平均抗拉强度为77 MPa.接头的主要断裂形式为沿晶脆性断裂,断裂主要产生在α-Mg+γ-MgZn共析体组织处和α-Mg基体与α-Mg+γ-MgZn共析体组织的界面处.     

Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn-Al system solders

The conditions for sound butt-joints of 5056 aluminum alloy containing 4.6 mass% Mg using Zn-xAl (x = 5, 13, and 38 mass%) solder at the relevant temperatures were investigated. Each solder foil was inserted between faying surfaces of 5056 aluminum rods. Ultrasonic vibration at a frequency of 19 kHz was applied to the faying surfaces through an aluminum substrate at soldering temperatures for 4 s in air. The strength of obtained solder joints was measured by tensile tests. The microstructure in the solder layer after the soldering process was evaluated with an SEM-EDX. The results of tensile tests revealed that joints soldered under the liquidus temperature of Zn-Al solders showed higher strength than joints soldered over the liquidus temperature. In the joints soldered over the solder liquidus temperature, the joint strength decreased with an increase in soldering temperature. It was caused by the formation of MgZn₂ in the solder layer due to dissolution of 5056-Al into the solder liquid during the soldering process. On the other hand, ultrasonic-assisted soldering under the solder liquidus temperature suppressed dissolution of 5056-Al and improved the joint strength by reducing the formation of MgZn₂.     

Microstructure and mechanical properties of tungsten inert gas welded–brazed Al/Ti joints

The tungsten inert gas welding–brazing process using Al-based filler metal has been developed for joining 5052 Al alloy to Ti–6Al–4V alloy in a butt configuration. The results indicated that heat input influenced the morphology and thickness of the interfacial reaction layer of Al/Ti joints, which played an important role in the mechanical properties of weldment. With the optimised tungsten electrode offset D of 1.0?mm from Al/Ti initial interface to Al side and welding current of 70?A, the thin cellular-shaped and club-shaped TiAl₃ reaction layers formed in the brazing zone, which contributed to suppressing crack initiation and propagation during tensile test. Eventually, the maximum tensile strength of 183?MPa was obtained and the optimised Al/Ti joint fractured at Al alloy base plate. Moreover, the power density characterisation and joining mechanism of Al/Ti joints were discussed.     

Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder

Al_0.3CrFe_1.5MnNi_0.5 high entropy alloys (HEA) have special properties. The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering (DAS) in air with Sn3.5Ag4Ti active filler at 250 °C for 60 s. The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area. The joint strengths of HEA/HEA and HEA/6061-Al samples, as analyzed by shear testing, were (14.20±1.63) and (15.70±1.35) MPa, respectively. Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.     

Corrosion resistance of ultrasonic soldered aluminium joint using Zn-based solder alloy

In order to obtain high strength aluminium butt joints with high corrosion resistance, ultrasonic soldering of 1070 and 5056 rods was conducted using quasi-melting Zn–18Sn (mass%) alloy and Zn–38A1 alloy. Ultrasonic vibrations were applied at soldering temperature ranging 533–723 K through aluminium rods without using of a solder bath. To evaluate the corrosion resistance of solder joints, tensile tests were conducted after immersion in a 5% NaCl aqueous solution. Though joint strength decreased with an increase in immersion time in the NaCl aqueous solution because of corrosion in the joints, corrosion resistance of 5056 joints with Zn–38A1 alloy was higher than that of joints with Zn–18Sn alloy irrespective of aluminium base material. The strength of joints with Zn–18Sn alloy rapidly decreased by immersion in the NaCl aqueous solution. In these joints, corrosion occurred locally in the soldered interface. Corrosion potential of these joints was unusually lower than that of the solder alloy. In contrast, corrosion occurred slowly in the solder layer in 5056 joints with Zn–38A1 alloy. Corrosion potential of the joints was equivalent to that of the solder alloy.     

Dissimilar Ti/Mg alloy butt welding by fibre laser with Mg filler wire – preliminary study

Abstract

A fibre laser was used to join Ti–6Al–4V alloy to AZ31B Mg alloy with the same thickness of 2 mm, and a filler wire was used to avoid weld underfill resulting from Mg vaporisation. The acceptable joints were only obtained when the laser beam was offset from the edge of the weld seam at 0·2 mm to the AZ31B side of the joint. Cross-weld tensile testing found joint strengths of up to 200·3 MPa, which is 85·1% of the AZ31B tensile strength. All the joints were fractured at the Ti/fusion zone interfacial layer. When the laser offset increased from 0·2 to 0·3 mm or laser power reduced to 1·2 kW, the joining mode of the interfacial layer changed from a semimetallurgical joining with high strength to a mechanical joining with poor strength. Moreover, the fracture surface of acceptable joints was characterised by scraggly remaining weld metal, while that of poor joints was almost only characterised by smooth Ti surface.     

Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn–Zn hypereutectic solder

In order to obtain high-strength aluminum joints, ultrasonic soldering of 1070 aluminum was conducted under liquidus temperature of Sn–Zn hypereutectic solder. A device for ultrasonic soldering was assembled, which propagated ultrasonic vibrations in a direction perpendicular to joining surfaces. This device joined 1070-Al using quasi-melting Sn–Zn hypereutectic solder without using any artificial spacers. The strength of the solder joints was evaluated by tensile tests. The optimum joining conditions were determined, and the effects of solder compositions and soldering temperature on the joint strength and the solder layer thickness were examined. In this ultrasonic soldering process, the highest tensile strength was obtained for the solder joints fabricated at 220 °C for the Sn–23Zn and Sn–40Zn solder compositions. The joint strength was equivalent to that of 1070-Al heat treated at 220 °C. The sound joints were obtained at 300 °C using Sn–82Zn solder, the liquid phase volume fraction of which was theoretically only 0.24. The present work also revealed that the thickness of retained solder layer in the joint after ultrasonic soldering could be estimated. Accordingly, ultrasonic soldering under the liquidus temperature of Sn–Zn hypereutectic solder could be a spacer-free soldering method to obtain high-strength aluminum joints.     

激光再流焊焊接速度对SOP器件焊点力学性能的影响

分别采用半导体激光再流焊与红外再流焊方法钎焊SOP器件,研究了激光焊焊接速度对其焊点抗拉强度的影响,并对焊点断口形貌进行了分析.结果表明,在激光再流焊条件下,激光焊焊接速度对SOP器件焊点的抗拉强度有显著的影响,而Sn-Pb焊点的力学性能对焊接速度的敏感度低于Sn-Ag-Cu无铅焊点,且存在一个最佳焊接速度.通过SEM观察发现,焊接速度相对慢时,断口有浅显韧窝和微孔,焊点断裂类型为微孔聚合型断裂;速度过快时,断口有较多的韧窝群,并且局部区域还有台阶,焊点断裂类型为韧窝型断裂和解理型断裂;焊接速度适中时,断口韧窝大且深,焊点断裂类型为韧性断裂.     

细间距器件无铅焊点力学性能和断口形貌分析

分别采取红外再流焊和激光再流焊焊接细间距器件,研究了SnPb,SnAgCu和SnAg三种钎料在不同焊接热源下焊点的力学性能。结果表明,激光再流焊对应焊点的力学性能优于红外再流焊,该现象在使用SnAg钎料的情况下尤为显著,同时无铅焊点优于传统的SnPb焊点。对焊点断口形貌进行研究,发现激光焊接的条件下,焊点断口韧窝较多、较深,断口的撕裂棱朝固定的方向延伸,而红外热源焊接的条件下,断口韧窝较少,较浅,两种情况下焊点韧窝开裂均为穿晶开裂。