pH对锡-银-铜三元合金共沉积的影响

以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等研究了pH对Sn-Ag-Cu三元合金共沉积的影响。镀液组成及工艺参数为:Sn(CH3SO3)2110g/L,Ag2O0.0811g/L,Cu(CH3SO3)20.876g/L,HEDTA278.3g/L,硫脲4.6g/L,烷基糖苷1g/L,温度25°C,电流密度10mA/cm2。结果表明,随pH增大,Sn-Ag-Cu的沉积电位负移。pH为3.22～7.74时,Sn-Ag-Cu合金镀层结晶细致、表面平整。Sn-Ag-Cu合金镀层由Sn、Ag3Sn和Cu6Sn5组成,其结晶取向随pH改变而变。HEDTA体系电沉积Sn-Ag-Cu合金镀层的适宜pH为3.00～6.00,最优范围是5.00～6.00。     

添加剂对锡–银–铜共沉积的影响

通过测定循环伏安曲线、镀层表面形貌和X射线衍射谱图,研究了单一的烷基糖苷(APG)或APG+槲皮素的组合添加剂对Sn–Ag–Cu三元合金共沉积的影响。镀液的基础组成和工艺条件为:Sn(CH3SO3)20.18 mol/L,Ag2O 0.006 mol/L,Cu(CH3SO3)20.001 2 mol/L,硫脲0.06 mol/L,羧乙基乙二胺三乙酸(HEDTA)1.0 mol/L,pH 5.0,温度25°C,电流密度6.6 mA/cm2,时间30 min。结果表明,镀液中APG或APG+槲皮素的存在使锡离子的扩散系数减小,Sn–Ag–Cu三元合金的共沉积过程受阻。镀液中加入1.00 g/L APG或1.00 g/L APG+0.05 g/L槲皮素后,Sn–Ag–Cu镀层外观改善,镀层结晶细致、均匀,晶面择优取向由Sn(211)转变为Sn(200)。因此,APG或APG与少量槲皮素的组合适合用作Sn–Ag–Cu共沉积的添加剂。     

甲基磺酸盐电镀锡及锡合金的研究进展

介绍了甲基磺酸盐镀锡的工艺优点,综述了甲基磺酸盐镀锡的发展现状及历史.列出了电镀锡及锡基合金的工艺配方,对比了甲基磺酸盐镀锡和锡基合金镀液及镀层的性能.展望了甲基磺酸盐镀锡的发展前景.     

LaCl3在柠檬酸体系电沉积锡-镍-铁三元合金中的应用

通过赫尔槽试验、极化曲线以及镀液和镀层性能的测定,探讨了LaCl<,3>对柠檬酸体系中电沉积锡-镍-铁三元合金的影响.结果表明,LaCl<,3>的加入能增大光亮电流密度范围和阴极极化作用,提高镀液分散能力,降低镀层孔隙率,镀层中Ni质量分数从3.45%提高到5.95%,其耐蚀性提高了约一倍.     

焦磷酸盐铜-锡合金镀液性能的研究

以焦磷酸铜和锡酸钠为主盐,焦磷酸盐为配位剂,加入一种自制的铜-锡合金添加剂组成焦磷酸盐镀液,通过赫尔槽实验优选出最佳镀液配方和工艺条件,并对镀液的分散能力、深镀能力、阴极电流效率和沉积速率等性能进行测试。结果表明:镀液的分散能力为98.05%,深镀能力为100%,平均电流效率为86.65%,平均沉积速率为59.2μm/h。加入添加剂后明显改善了镀液的极化性能,提高了铜离子及锡离子的析出电位,得到均匀致密、结晶细致、光亮整平的铜-锡合金镀层。     

工艺参数对电沉积锡-钴合金镀层性能的影响

研究了在泡沫镍基体上电沉积锡-钴合金镀层的工艺方法,分析了电沉积工艺参数对锡-钴合金镀层性能的影响,并对工艺进行了优化.研究表明:采用该优化工艺所制得的锡-钴合金能提高锂离子电池的容量、稳定性和循环性能.     

氟硼酸盐镀铅锡铜三元合金溶液中铅,锡,铜的连续滴定

1前言随着现代汽车工业的发展，轴瓦镀铅锡铜三元合金镀层及其具有良好的顺应性、嵌入性、耐磨性及抗疲劳强度而越来越在汽车工业上得到了广泛的重视和应用，尽管目前少数有三元电镀技术工艺的厂家对于这一技术还处于不完全公开阶段。有国外引进的技术，也有国内自行研究的工艺。不管那种工艺，其电镀液中需要控制的金属离子的浓度的大体比例如下Pb（BF4）2（Pb2＋占溶液中金属离子总量的80％）Sn（BF4）2（Sn2＋占溶液中金属离子总量的18％）Cu（BF4）2（Cu2＋占溶液中金属离子总量的2％）HBF4适量混合添加剂适量[1]本文所介绍的分析…     

配位剂对弱酸性体系电沉积Sn-Ag-Cu镀层的影响

在含有甲磺酸盐和碘化物的弱酸性镀液中电沉积得到了Sn-Ag-Cu三元合金镀层.研究了该镀液体系中配位剂的用量对Sn-Ag-Cu合金镀层外观和镀液电流效率的影响,探讨了配位剂对镀液阴极极化的影响.结果表明,配位剂K4P2O7、KI、TEA的加入使Sn、Ag、Cu三种金属的沉积电势趋于一致,能够实现共沉积.优化的镀液组成及工艺条件为:0.2 mol/L Sn(CH3SO3)2,4.5 mmol/L AgI,1.5 mmol/L Cu(CH3SO3)2,0.6 mol/L K4P2O7,1.35mol/L,0.225mol/L TEA,1 g/L光亮剂,1 g/L抗氧化剂,温度20℃,pH 5.5.     

镀液流速对碳化硅微粒与铜共沉积的影响

本文利用易于控制流速的旋转圆盘电极研究了SiC微粒与Cu的共沉积。得出了在不同镀液流动速度下镀得的复合镀层中微粒含量与镀液中微粒浓度以及与电流密度之间的关系曲线,进而探讨了镀液流速对Cu-SiC共沉积的影响。镀液流速通过影响微粒与阴极之间的弱吸附影响微粒在阴极表面的停留,从而对Cu-SiC复合电沉积过程产生很大影响。     

工艺参数对甲基磺酸盐镀锡铅合金的影响

讨论了主盐、甲基磺酸用量,电流密度,温度,搅拌速率等工艺参数对甲基磺酸盐电镀锡铅合金的影响。结果表明,增大电流密度会改变镀层中合金比例;加大搅拌速率会使铅更容易沉积;镀液温度不会引起合金比例的较大变化,但升温会使沉积加快。在最佳工艺条件下,所得锡铅合金的锡含量及镀层厚度较稳定。?     

助熔剂对甲基磺酸盐镀锡板性能的影响

研究了甲基磺酸盐体系镀锡生产中两种不同的助熔剂对镀锡板耐蚀性和涂装性能的影响。结果表明:对耐腐蚀性能而言,无机盐类助熔剂明显优于烷基磺酸类助熔剂。与采用烷基磺酸类助熔剂时相比,由于采用无机盐类助熔剂形成的钝化膜量略高,且其中热稳定性较好的组分Cr₂O₃较多,因此漆膜与其镀锡板的附着性能略好,但因钝化膜中Cr(OH)₃偏低而抗硫性略差。镀锡板生产前需要综合考虑用户对产品的功能要求来选择适宜的助熔剂。     

Development of a bath for codeposition of copper and platinum

To improve the mechanical properties of electrodeposited copper, a new bath was developed for the codeposition of copper and platinum. A pyrophosphate bath employing chloroplatinic acid as a source of platinum was investigated at current densities ranging from 1 to 4 A dm⁻² and temperatures from 20 to 60 °C. Bright, shiny and crack-free deposits were obtained at low current densities (i.e., 1–2 A dm⁻²). The amount of platinum observed in the deposits was found to increase with the current density and bath temperature. The Knoop hardness was found to increase with platinum content in the deposits. Corrosion rates measured in solutions of NaCl were found to decrease with platinum content. Deposits containing up to 3.9 wt % of platinum can be obtained by electrodeposition. As compared to electrodeposited copper from the acid bath, the Cu—Pt deposits exhibited a 17% increase in Knoop hardness and a 21% increase in corrosion resistance.     

Electrodeposition of ternary nickel-iron-molybdenum alloys from an acetate bath

Ternary nickel-iron-molybdenum alloys containing 0.5–8.5% molybdenum, 18–48% iron and balance nickel were electrodeposited from an acetate bath under a variety of conditions. Satisfactory deposits were obtained from the bath containing 0.3394 M nickel acetate, 0.02878 M ferrous sulphate, 0.0015 M sodium molybdate at current density 2.0 A dm^–2, pH 5.0 and temperature 20°C without agitation for plating times up to 30min. The alloy deposits were examined for their crystal structure by X-ray diffraction and microstructure by metallography.Dedicated in honour of the late Dr D. Singh, Reader in Chemistry, Banaras Hindu University.     

Zinc-nickel alloy electrodeposition from uncomplexed acid bath

Zinc-nickel alloys, as protective coatings, are well known and a new citrate bath has been investigated. It was observed that boric acid favoured nickel deposition playing the dual role of specific adsorption and catalysis. The voltammetric behaviour of the alloy deposition in the presence of boric acid is described. The effect of Ni/Zn ratio, and potential scan range on the cathodic and anodic portions of the voltammograms are discussed. The presence of two cathodic peaks at high Ni/Zn ratios, which disappeared at lower ratios was identified.     

氨基磺酸盐-硫酸盐混合溶液中锌-锰合金的电沉积

本文研究了氨基磺酸盐-硫酸盐混合溶液中锌-锰合金的电沉积机理。实验结果显示，在低电流密度区获得哑光镀层，锰离子的催化析氢作用降低了合金沉积效率．玻璃化炭黑上的伏安试验显示锌沉积过程中的第一个电子转移较慢，阳极溶出伏安试验显示锌合金的异常共沉积导致富锌中间相的产生。     

碱性锌镍合金电镀白钝化工艺的研究

研究了不同镍含量的锌镍合金镀层低铬白钝化工艺，通过中性盐雾试验。比较了不同钝化工艺对不同镍含量的锌镍合金镀层耐蚀性的影响，结果表明，不同镍含量的锌镍合金镀层需采用不同的白钝化工艺。     

Electrodeposition of ternary nickel—iron—cobalt alloys from acetate bath

Ternary nickel—iron—cobalt alloys of wide range composition have been deposited from acetate baths under a variety of conditions and the optimum conditions established are: nickel acetate 0.2828 M, ferrous sulphate 0.0359 M, cobalt acetate 0.2828 M, boric acid 0.1617 M, ascorbic acid 0.0056 M, pH 5.0, cd 1.5 A/dm² and temperature 30°. The bath gave bright, smooth and adherent deposits. Iron and cobalt contents decreased with an increase in cd and pH, X-ray studies of the deposits revealed fcc structure within the composition range studied (43.6–54.0% Ni). The results indicate that acetate bath can be successfully employed for plating purposes.