电磁驱动推拉式射频MEMS开关的设计与制作

提出了一种新型电磁驱动推拉式射频MEMS开关。针对传统静电驱动单臂梁开关所需驱动电压大、恢复力不足等问题,设计了一种推拉式开关结构,降低了驱动电压(电流),提高了开关的隔离度,同时实现了单刀双掷的功能。单晶Si梁由于自身无应力,解决了悬臂梁残余应力引起的梁变形问题。通过理论计算和有限元分析,优化了开关设计尺寸,在外围永磁铁磁感应梯度dB/dz=100T/m,在线圈通入100mA电流的驱动下,单晶Si扭转梁末端可以获得约10μm的弯曲量,满足开关驱动要求。给出了开关的详细微细加工流程,对开关的传输参数进行了测试,在10GHz时隔离度为-40dB.     

低压驱动RF MEMS开关设计与模拟

RF MEMS开关存在驱动电压高、开关时间长等问题,利用ANSYS对电容式开关加以改进,设计扭转臂杠杆与打孔电容膜相结合的新型开关。通过静电耦合与模态分析的仿真,可以在理论上改善RF MEMS开关的射频性能,并有工艺的可行性。     

4臂边缘驱动变形镜校正低阶像差的仿真计算

围绕未来固态大功率激光系统中低阶像差补偿的需求,开展了边缘驱动变形反射镜的优化设计和仿真分析。提出了4臂边缘驱动变形镜设计结构,并建立了仿真模型,以变形镜拟合残差面形的均方根(RMS)值和峰-谷(PV)值为目标,分析了不同结构参数对变形镜校正低阶像差能力的影响。根据对离焦、像散和彗差校正拟合残差面形的RMS值和PV值随结构参数变化的曲线,确定了变形镜的最佳设计参数并给出了该参数下拟合离焦、像散和彗差的残差面形RMS值和PV值。对于PV值分别为20、10、10μm的离焦、像散和彗差,拟合残差面形RMS值和PV值分别为0.2366μm和1.3762μm、0.0112μm和0.1146μm以及0.1606μm和0.9773μm。以上结果表明,设计的4臂边缘驱动变形镜的校正效果符合设计要求。     

一种用于AMOLED显示驱动芯片的电荷泵设计

基于开关电容系统理论,设计了一种多通路输出的电荷泵,为AMOLED显示驱动芯片中的源驱动和栅驱动电路提供电源电压.使用混合调制模式,根据源驱动和栅驱动的等效负载情况,分别设计相应的环路调制电路,在实现恒压输出的同时,降低VDH纹波电压与电源噪声,提高功率效率.基于0.18μm HVCMOS工艺的仿真结果表明,电路能够获...     

翘板式射频MEMS开关的研究

提出了一种新型的翘板式静电射频微系统开关,给出了理论模拟,结构分析结果和工艺制作方法。该结构采用了5μm厚的无应力单晶硅作为开关的可动部分,可以缓解薄膜应力变形。翘板式结构解决了传统静电设计中动作力弱的问题,并且通过调整支点解决了开关回复力不可调的难题。利用该结构可以在保持高隔离度的同时使驱动电压降低,有限元理论模拟驱动电压为5~10V;采用翘板式结构增加了开关的使用周期,而且结构自身具有单刀双掷特点,可以直接应用于高频通信的频道选择。给出了开关共面波导传输线的测试结果和设计讨论。     

具有光纤自定位保持结构的2×2扭转微镜光开关阵列的制作和机电特性

应用基于表面硅、体硅微电子工艺的混合微加工技术,制作了新型2×2扭转微镜光开关阵列,并研究了其在外加静电场和交变电场中的机电特性.当该光开关中悬挂多晶硅微镜的弹性扭转梁的厚度约为1μm时,驱动微镜以实现其"开"状态的拐点静电电压为270～290V,而维持微镜"开"状态的最低保持电压在55V左右.理论分析表明,在关于该光开关结构的一系列设计参数中,拐点静电电压对于弹性扭转梁的厚度最敏感.该光开关的开关寿命超过108次,而其开关时间预计小于2ms.对单片集成制造在该光开关阵列芯片上的两种新型光纤自定位保持结构的力学分析表明,它们具有光纤自固定、自对准的性质.     

具有光纤自定位保持结构的2×2扭转微镜光开关阵列的制作和机电特性

应用基于表面硅、体硅微电子工艺的混合微加工技术,制作了新型2×2扭转微镜光开关阵列,并研究了其在外加静电场和交变电场中的机电特性.当该光开关中悬挂多晶硅微镜的弹性扭转梁的厚度约为1μm时,驱动微镜以实现其"开"状态的拐点静电电压为270～290V,而维持微镜"开"状态的最低保持电压在55V左右.理论分析表明,在关于该光开关结构的一系列设计参数中,拐点静电电压对于弹性扭转梁的厚度最敏感.该光开关的开关寿命超过108次,而其开关时间预计小于2ms.对单片集成制造在该光开关阵列芯片上的两种新型光纤自定位保持结构的力学分析表明,它们具有光纤自固定、自对准的性质.     

RFMEMS电容式并联开关的研制

通过分析MEMS电容式并联开关的工作原理,设计并制作出一款适合Ka波段分布式MEMS移相器的电容式开关。通过理论计算和经验选取,初步得到了MEMS电容式并联开关的结构尺寸。采用HFSS软件建立了开关的三维电磁场模型并优化了关键结构参数。仿真表明开关在Ka波段插入损耗小于0．15dB,回波损耗大于15dB。采用CoventorWare软件进行了开关的机电耦合仿真,得出其驱动电压为2．1V。为了满足流片单位的实际工艺约束条件,对开关的设计版图和微加工工艺进行了多轮改进,研制成功MEMS电容式并联开关工艺样品。开关动态特性测试表明,在驱动电压36V时,桥下拉的高度约为2μm。     

一个1.2 V,9 ppm/℃的CMOS带隙电压基准源

基于传统CMOS带隙电压基准源电路的分析,结合曲率补偿技术设计了一种带衬底驱动运算放大器的低电源电压的电压基准源电路,主体电路采用电流模式基准源结构,并结合所采用的衬底驱动运放作为基准源的负反馈运放。整个电路采用0.5μm标准CMOS工艺实现,在电源电压1.2 V的条件下用HSpice进行仿真,仿真结果表明输出基准电压在-40~120℃范围内温度系数为9 ppm/℃。     

电容式MEMS开关中弹性膜应力对驱动电压的影响

详细分析了多种参数对 MEMS电容式开关驱动电压的影响 ,包括材料选取和工艺参数变化 ,并对驱动电压理论值进行计算。利用表面微机械加工技术在硅衬底上实现了电容式开关 ,测试结果表明采用 Al0 .96 Si0 .0 4弹性膜和厚胶牺牲层工艺能获得适中的剩余应力释放 ,微桥应力约为 10 6 N/m2 ,这为获得较低的开关驱动电压提供了可能。对长 1m m的 MEMS开关 ,当弹性膜厚为 0 .5μm,桥高为 3μm、桥宽为 30 μm、桥长为 2 50 μm时获得了 2 5V的驱动电压 ,S参数测试表明该电容式开关 1～ 4 0 GHz频段内的插入损耗低于 1d B。     

高隔离度X波段RF MEMS电容式并联开关

研究了一种新型的、应用于X波段的高隔离度RF MEMS电容式并联开关结构。相比于普通的并联结构,该开关通过共面波导(CPW)传输线与地平面之间的衬底刻槽结构将隔离度提高了7dB,关态时在13.5GHz谐振频率处的隔离度为-54.6dB,执行电压为26V。弹簧梁结构开关的执行电压下降为14V,在11GHz处其隔离度为-42.8dB。通过两个并联开关级联与开关间的高阻传输线构成的π型调谐开关电路,在11.5GHz处的隔离度为-81.6dB。     

Thermal and electrostatic reliability characterization in RF MEMS switches

The reliability of RF MEMS switches is closely linked to their operational and environmental conditions. This paper examines the reliability of five different capacitive switch designs by a combined use of modeling and experimental tools. Three-dimensional multiphysics finite element analysis was performed to estimate the actuation voltage and deflection vs. temperature variations of the micro-switches. The effect of temperature and temperature cycles on switch dilatation and pull-in voltage are studied, as well as the influence of different operational signals on switch reliability.     

Low-voltage high-isolation DC-to-RF MEMS switch based on an S-shaped film actuator

This paper presents a new electrostatically actuated microelectromechanical series switch for switching dc to radio frequency (RF) signals. The device is based on a flexible S-shaped film moving between a top and a bottom electrode in touch-mode actuation. This concept, in contrast to most other microelectrochemical systems (MEMS) switches, allows a design with a low actuation voltage independent of the off-state gap height. This makes larger nominal switching contact areas for lower insertion loss possible, by obtaining high isolation in the off-state. The actuation voltages of the first prototype switches are 12 V to open, and 15.8 V to close the metal contact. The RF isolation with a gap distance of 14.2 /spl mu/m is better than -45 dB up to 2 GHz and -30 dB at 15 GHz despite a large nominal switching contact area of 3500 /spl mu/m/sup 2/.     

RF MEMS开关工艺技术研究

RFMEMS开关是用MEMS技术形成的新型电路元件,与传统的半导体开关器件相比具有插入损耗低、隔离度大等优点,将对现有雷达和通信中RF结构产生重大影响。文章介绍了RFMEMS开关的基本工艺流程设计,工艺制作技术的研究。实验解决了种子层技术、聚酰亚胺牺牲层技术、微电镀技术的工艺难题,制作出了RFMEMS开关样品,基本掌握了RFMEMS器件的制作工艺技术。RFMEMS开关样品测试的技术指标为:膜桥高度2μm～3μm、驱动电压<30V、频率范围0～40GHz、插入损耗≤1dB、隔离度≥20dB,样品参数性能达到了设计要求。     

Reliability testing of flexible printed circuit-based RF MEMS capacitive switches

In this paper, reliability results of a novel type of electrostatically actuated RF MEMS capacitive switches developed by our group are discussed. The test setup used for reliability testing consists of the capacitive MEMS switch under test connected in series with a resistor. A specified actuation waveform is applied to the switch and the voltage waveform across the resistor is continuously recorded. The recorded waveform aids in identifying short, open, or stiction failure of the switch. Further, the waveform recorded can be analyzed to study the degradation, reliability, and lifetime characteristics of the switch. The proposed method has been used to study the reliability, failure, and hold-down test characteristics of flexible circuit-based RF MEMS switches. Reliability testing up to 75 million operations has been carried out for flexible circuit-based RF MEMS switches.     

A fully integrated SOI RF MEMS technology for system-on-a-chip applications

In this paper, a silicon-on-insulator (SOI) radio-frequency (RF) microelectromechanical systems (MEMS) technology compatible with CMOS and high-voltage devices for system-on-a-chip applications is experimentally demonstrated for the first time. This technology allows the integration of RF MEMS switches with driver and processing circuits for single-chip communication applications. The SOI high-voltage device (0.7-/spl mu/m channel length, 2-/spl mu/m drift length, and over 35-V breakdown voltage), CMOS devices (0.7-/spl mu/m channel length and 1.3/-1.2 V threshold voltage), and RF MEMS capacitive switch (insertion loss 0.14 dB at 5 GHz and isolation 9.5 dB at 5 GHz) are designed and fabricated to show the feasibility of building fully integrated RF systems. The performance of the fabricated RF MEMS capacitive switches on low-resistivity and high-resistivity SOI substrates will also be compared.     

Low Voltage Rf Mems Capacitive Shunt Switches

Micro-electro-mechanical-systems(MEMS) switches have low resistive loss, negligible power consumption, good isolation and high power handling capability compared with semiconductor switches. Lifetime of capacitive shunt switches strongly depends on the actuation voltage so low voltage switches is necessary to enhance its performance as well as to broaden its application area. This paper presents the design and simulation of low voltage capacitive shunt MEMS switches together with its RF performance for high frequency applications. The low voltage switches are realized by lowering the spring constant of the beam using serpentine spring designs together with large capacitive area so as to achieve the good RF performance as well. The pull-in voltage is analyzed with commercial CAD finite element analysis software CoventorWare. The electromagnetic performance in terms of scattering parameters, insertion loss, and isolation are analyzed with software Ansoft HFSS10. The switches achieved insertion loss \(<\) 0.47 dB in on state from 2 to 40 GHz; it provided better than 25 dB isolation in off state with a capacitance ratio of 94–96. The actuation voltage as low as 1.5 V with actuation area \(110\,\times \,100\,\upmu \mathrm{m^2}\) along with good RF performance is reported. The design parameter optimization including selection of appropriate number of meanders and its width found to be one of the most sensitive factors affecting the spring stiffness and actuation voltage.     

A novel pull-up type RF MEMS switch with low actuation voltage

We report a novel pull-up type radio frequency (RF) microelectromechanical system (MEMS) switch with no elastic deformation of the cantilever involved in the actuation. At a voltage of 4.5V, reliable actuations are achieved such that the movable lower contact pad is pulled up by the electrostatic force to make contact with the upper pad. At a frequency of 50GHz, an insertion loss of 0.5dB, a return loss of 12.4dB, and an isolation of 55dB are obtained from the switch. The measured transient times for switch-on and switch-off are 120 and 130ns, respectively. Compared to the MEMS switches reported thus far, the pull-up type switch shows the best switching speed and isolation characteristic at 50GHz.