智能大厦结构化综合布线系统的设计与实现

主要介绍了智能大厦结构化综合布线系统的含义和组成，以及设计目标和要点，并结合某大楼综合布线系统的具体实例，阐述了工程建设中计算机网络结构化综合布线系统的设计思想。     

综合布线系统设计探讨

综合布线系统目前正从普及超五类布线系统向六类、七类布线系统过渡，发展速度运远大于需求。本文在对目前需求状况进行分析的基础上，对综合布线的设计进行了深入探讨。     

智能大厦综合布线系统基础设施

智能大厦综合布线系统基础设施郑华杰，刘冠云，叶关君智能大厦的智能构成是通信自动化、办公自动化、楼宇自动化三者的有机结合。综合布线系统为三个自动化提供信息传输通道。１智能大区综合布线系统基础设施的组成为了满足大量信息的传输要求，一般都采用综合布线系统作...     

综合布线系统与广电宽带综合业务信息网的有机结合

综合布线系统把建筑物或建筑群内的各种弱电设备集成一个高效的布线系统中。广播电视接入网在工程设计、施工上如何融入综合布线系统中，通过理论与实践方式做了深刻说明。同时，提出了广电领域应借鉴电信业的经验，编制出适应本行业发展的“布线标准”。     

综合布线的测试和验收

目前综合布线系统已得到了广泛应用，但广大用户并未认识到综合布线系统测试的重要性，本文全面地介绍了综合布线测试的重要性、测试标准、测试电气技术参数的测试原理。     

广电智能化办公大楼综合布线系统的设计与实现

结合邵阳广电办公大楼综合布线的经验，从综合布线系统的要求、组成、产品选型、管槽设计与管线铺设及系统测试几个方面，详细地阐述了广电智能化办公大楼综合布线系统的设计与实现。     

浅谈综合布线

本文简要介绍综合布线的标准和评测的参数，并阐明了与综合布线有关的几个概念的辨别及如何选择综合布线系统。     

高速公路信息工程综合布线系统的建设实践与思考

为解决电话、计算机联网布线的难题，在80年代后期结构化布线系统(Structured Cabling System)或电信布线系统(Telecommunication Cabling System)较好地满足了现代建筑信息网络应用需求。我国结构化布线系统的建设始于1993年，通常简称为综合布线系统。     

论智能建筑中的综合布线系统

综合布线系统是智能建筑的根基,本文主要介绍了综合布线系统的概念与特点,然后说明了综合布线系统与智能建筑的关系,最后简要阐述了智能建筑中综合布线系统的设计。     

通信设备机房综合布线系统的规范设计建设

本文结合部队通信设备机房综合布线系统整体划分情况,阐述了通信设备机房综合布线工艺要求,提出了通信设备机房综合布线系统的规范设计建设思路,旨为加强通信设备机房综合布线系统整体规划,促进综合布线系统规范化建设与发展。     

微硅型光机电系统集成化技术中的金属布线

针对微硅型光机电系统集成化技术中电路和金属布线与硅微各向导性深腐蚀工艺之间的不相容问题，从寻求一种电路和金属布线保护层的思想出发，提出了用ＳｉＯ２／Ｃｒ复合膜作电路和布线保护膜的新工艺方法。解决了微硅型光机电系统集成技术中长期存在的电路和布线中的关键技术。     

A subnanosecond 2000 gate array with ECL 100K compatibility

Describes a subnanosecond-gate array with 2000 gates fabricated by an advanced bipolar process. A 700-ps delay time was achieved for a basic ECL gate under a general usage condition of a 3 fan-in, 3 fan-out and 3-mm wiring length, with power dissipation of 1.9 mW/gate. A 450-MHz typical toggle frequency has been obtained by using a series-gated flip-flop. Utilizing an integrated computer-aided design system, 100% routability has been attained for automatic placement and wiring in spite of 90% cell utilization. Low thermal resistance (6/spl deg/C/W) packages are used for this LSI chip to permit its installation in an air-cooled system.     

Active cooling substrates for thermal management of microelectronics

Heat removal in printed wiring boards (PWB) is primarily accomplished through conduction. This work presents a microelectromechanical system (MEMS) device comprised of an active cooling substrate (ACS) designed and fabricated to add fluidic cooling functionality to the PWB. Thermal management is enhanced through the additional heat convection mode. Synthetic jet technology makes the compact, but easily integrated, MEMS cooling device possible. The fluid control unit, a synthetic jet, has been implemented in an epoxy-glass printed wiring board by multilayer lamination. An air reservoir is drilled through the core of printed wiring board. A flexible polymeric diaphragm and a low profile electromagnetic driver create an active pumping system to produce vibrating air jets downstream of microfluidic channels which transports heat generated by hot microelectronic components. Test heater chips have been directly die attached to the substrate. The integrated packaging system has been characterized mechanically, electrically, and thermally. Peak jet velocities of 14 m/s and average jet velocities of approximately 3 m/s have been achieved at actuator powers of 60 mW. This integrated active cooling substrate has the potential for broad applications in thermal management at the system packaging level.     

Integrated wiring system for construction equipment

Advances in electronic technology have brought numerous changes in design of most types of construction equipment. Due to the electronic devices and electric loads, such as lamps and motors, a typical construction vehicle has many wires and connectors. The next phase of the changes is to focus on how to reduce these complex wires by using digital communications. This paper presents the development of an integrated wiring system for construction equipment. More specifically, an excavator that has more than 40 devices has been chosen in order to apply the concept of the integrated wiring system. After grouping electrical devices by their locations and functions, two communication controllers, i.e., an instrument controller and an engine-hydraulic controller, are defined. Two test controllers have been developed in order to prove the concept     

弱电工程综合布线和安防系统施工及工艺分析

文章采用文献研究、案例分析等方法,研究弱电工程的综合布线工作和安防系统,主要基于二者当前施工存在的问题,研究二者施工过程要点及具体施工工艺,并从施工设计、管理等方面提出部分建议,希望能够有针对性地解决综合布线和安防施工目前存在的一些问题,给相关的技术人员和企业提供有价值的技术参考.     

The Electronic Circuit Composition and Structure of Thread for a Novel Braid Electronics-Systems by Kumihimo Structure

The new integrated circuit concept that forms electronic equipment by the textile structure using the flexible fiber has been proposed. In this report, we propose another integrated system-concept of flexible electronics based on "braid structure." The braid integrated system forms electronic equipment constructed by the filamentous body. Electronic integrated circuits are constructed with kumihimo-structure by weaving more than eight threads on which field effect transistors, photoelectric transducers, contact electrode pad and wiring pattern are mounted periodically. The circuit composition and a concrete structure of threads for kumihimo are discussed.     

二次继电保护装置在智能变电站的应用设计

对于大朗变电站建站的背景进行了阐述,指出了大朗变电站当前所面临的问题,对于二次继电保护装置在智能变电站中的具体应用包括综合自动化系统、二次接线、直流系统、元件保护与自动化装置中的应用进行了阐述,以期为大朗变电站智能化的改造提供一定的借鉴.     

硅基多层布线集成组装技术

本文叙述了多芯片组件和多层布线集成组装技术的研究和进展,介绍了硅基多层布线集成组装技术的特点和设计考虑,扼要地叙述了硅基多层布线的制造工艺,并讨论了工艺中所出现的问题。     

High-speed characterization of a monolithically integratedGaAs-AlGaAs quantum-well laser-detector

The high-frequency response of a GaAs-AlGaAs edge-illuminated photodiode monolithically integrated with a single-quantum-well laser and resistor network has been measured and simulated. The measured response of the monitor diode to a step impulse applied to the laser exhibits a nonoptically induced precursor pulse. Simulations show this interference arises primarily from mutual inductive coupling between on-chip wiring and wirebond connections. If the coupling is eliminated, simulations show that the risetime of the laser-detector combinations is around 575 ps. Although these coupling effects are not intrinsic problems, the work demonstrates the importance of including packaging parasitics and on-chip wiring interactions in OEIC (optoelectronic integrated circuit) data link design