F离子注入新型Al0．25Ga0．75N／GaNHEMT器件耐压分析

为了缓解AlGaN／GaNhighelectronmobilitytransistors（HEMT）器件n型GaN缓冲层高的泄漏电流,本文提出了具有氟离子注入新型Al0．25Ga0．75N／GaNHEMT器件新结构．首先分析得出n型GaN缓冲层没有受主型陷阱时,器件输出特性为欧姆特性,这样就从理论和仿真方面解释了文献生长GaN缓冲层掺杂Fe,Mg等离子的原因．利用器件输出特性分别分析了栅边缘有和没有低掺杂漏极时,氟离子分别注入源区、栅极区域和漏区的情况,得出当氟离子注入源区时,形成的受主型陷阱能有效俘获源极发射的电子而减小GaN缓冲层的泄漏电流,击穿电压达到262v通过减小GaN缓冲层体泄漏电流,提高器件击穿电压,设计具有一定输出功率新型A1GaN／GaNHEMT提供了科学依据．     

Characterization of tetragonal distortion in a thick Al_(0.2)Ga_(0.8)N epilayer with an AlN interlayer by Rutherford backscattering/channeling

An Al0.2Ga0.8N/AlN/Al0.2Ga0.8N heterostructure was grown by metalorganic chemical vapor deposition on a sapphire(0001) substrate with a thick(> 1 μm) GaN intermediate layer. The Al composition was determined by Rutherford backscattering(RBS). Using the channeling scan around an off-normal [1213] axis in the(1010) plane of the Al0.2Ga0.8N layer, the tetragonal distortion eT, which is caused by the elastic strain in the epilayer, is investigated. The results show that eTin the high-quality Al0.2Ga0.8N layer is dramatically released by the AlN interlayer from 0.66% to 0.27%.     

阶梯AlGaN外延新型Al0.25Ga0.75N/GaNHEMTs器件实验研究

本文报道了作者提出的阶梯AlGaN外延层新型AlGaN/GaN HEMTs结构的实验结果. 实验利用感应耦合等离子体刻蚀(ICP)刻蚀栅边缘的AlGaN外延层, 形成阶梯的AlGaN 外延层结构, 获得浓度分区的沟道2DEG, 使得阶梯AlGaN外延层边缘出现新的电场峰, 有效降低栅边缘的高峰电场, 从而优化了AlGaN/GaN HEMTs器件的表面电场分布. 实验获得了阈值电压-1.5 V的新型AlGaN/GaN HEMTs器件. 经过测试, 同样面积的器件击穿电压从传统结构的67 V提高到新结构的106 V, 提高了58%左右; 脉冲测试下电流崩塌量也比传统结构减少了30%左右, 电流崩塌效应得到了一定的缓解.     

A polarization mismatched p-GaN/p-Al0.25Ga0.75N/p-GaN structure to improve the hole injection for GaN based micro-LED with secondary etched mesa

A low hole injection efficiency for InGaN/GaN micro-light-emitting diodes (μLEDs) has become one of the main bottlenecks affecting the improvement of the external quantum efficiency (EQE) and the optical power. In this work, we propose and fabricate a polarization mismatched p-GaN/p-Al$_{0.25}$Ga$_{0.75}$N/p-GaN structure for 445 nm GaN-based μLEDs with the size of $40 \times 40 $μm$^{2}$, which serves as the hole injection layer. The polarization-induced electric field in the p-GaN/p-Al$_{0.25}$Ga$_{0.75}$N/p-GaN structure provides holes with more energy and can facilitate the non-equilibrium holes to transport into the active region for radiative recombination. Meanwhile, a secondary etched mesa for μLEDs is also designed, which can effectively keep the holes apart from the defected region of the mesa sidewalls, and the surface nonradiative recombination can be suppressed. Therefore, the proposed μLED with the secondary etched mesa and the p-GaN/p-Al$_{0.25}$Ga$_{0.75}$N/p-GaN structure has the enhanced EQE and the improved optical power density when compared with the μLED without such designs.     

Phase Transition and Band Structure Tuned by Strains in Al_(1/2)Ga_(1/2)N Alloy of Complex Structure

Phase transition and band structure tuned by uniaxial and biaxial strains are systematically investigated based on the density-functional theory for ordered Al_(1/2)Ga_(1/2)N alloys of complex structures.Although the structural transformations to graphite-like from wurtzite are energetically favorable for both types of strain,the phase transitions are different in nature:the second-order transition induced by uniaxial strain is jointly driven by the mechanical and dynamical instabilities and the first-order transition by biaxial strain only by the mechanical instability.The wurtzite phase always shows the direct band gap,while the band gap of the graphite-like phase is always indirect.Furthermore,the band gaps of the wurtzite phase can be reduced by both types of strain,while that of the graphite-like phase is enhanced by uniaxial strain and is suppressed by biaxial strain.     

Temperature effects of GaAs/Al_(0.45)Ga_(0.55)As superlattices on chaotic oscillation

For widespectrum chaotic oscillation, superlattice cryptography is an autonomous controllable brand-new technology.Originating from sequential resonance tunneling of electrons, the chaotic oscillation is susceptible to temperature change,which determines the performance of superlattices. In this paper, the temperature effects of chaotic oscillations are investigated by analyzing the randomness of a sequence at different temperatures and explained with superlattice microstates.The results show that the bias voltage at different temperatures makes spontaneous chaotic oscillations vary. With the temperature of superlattices changing, the sequence dives in entropy value and randomness at specific bias. This work fills the gap in the study of temperature stability and promotes superlattice cryptography for practice.     

阶梯AlGaN外延新型Al_(0.25)Ga_(0.75)N/GaNHEMTs击穿特性分析

为了优化AlGaN/GaN HEMTs器件表面电场,提高击穿电压,本文首次提出了一种新型阶梯AlGaN/GaN HEMTs结构.新结构利用AlGaN/GaN异质结形成的2DEG浓度随外延AlGaN层厚度降低而减小的规律,通过减薄靠近栅边缘外延的AlGaN层,使沟道2DEG浓度分区,形成栅边缘低浓度2DEG区,低的2DEG使阶梯AlGaN交界出现新的电场峰,新电场峰的出现有效降低了栅边缘的高峰电场,优化了AlGaN/GaN HEMTs器件的表面电场分布,使器件击穿电压从传统结构的446 V,提高到新结构的640 V.为了获得与实际测试结果一致的击穿曲线,本文在GaN缓冲层中设定了一定浓度的受主型缺陷,通过仿真分析验证了国际上外延GaN缓冲层时掺入受主型离子的原因,并通过仿真分析获得了与实际测试结果一致的击穿曲线.     

Leakage current reduction by thermal oxidation in Ni/Au Schottky contacts on lattice-matched In0.18Al0.82N/GaN heterostructures

By using temperature-dependent current–voltage, variable-frequency capacitance–voltage, and Hall measurements,the effects of the thermal oxidation on the electrical properties of Ni/Au Schottky contacts on lattice-matched In0.18Al0.82N/GaN heterostructures are investigated. Decrease of the reverse leakage current down to six orders of magnitude is observed after the thermal oxidation of the In0.18Al0.82N/GaN heterostructures at 700oC. It is confirmed that the reverse leakage current is dominated by the Frenkel–Poole emission, and the main origin of the leakage current is the emission of electrons from a trap state near the metal/semiconductor interface into a continuum of electronic states associated with the conductive dislocations in the InxAl1-xN barrier. It is believed that the thermal oxidation results in the formation of a thin oxide layer on the InxAl1-xN surface, which increases the electron emission barrier height.     

温度对Al_(0.5)Ga_(0.5)As/AlAs分布布喇格反射器的反射谱影响

采用光学传输矩阵理论对Al0.5Ga0.5As/AlAs材料分布布喇格反射器(DBR)进行理论研究,分析了-10℃到100℃的范围内,温度变化对不同DBR结构的反射光谱影响.结果表明:随着温度的升高,传统20周期DBR的反射光谱向长波长方向移动,速率约0.05 nm/℃,其中由线热膨胀系数带来的影响小于0.001 nm/℃.当传统DBR的周期数增大时,温度对DBR光谱反射率的影响在减小,同时DBR的反射谱峰值波长发生红移.为了降低温度对DBR反射光谱的影响,提出一种新型的复式DBR结构.分析指出:该复式DBR比传统DBR有更大的反射光谱半峰宽,基本能覆盖同温度的AlGaInP LED电致发光光谱,这对提高LED的出光效率有现实意义.     

Structural characterization of Al_(0.55)Ga_(0.45)N epitaxial layer determined by high resolution x-ray diffraction and transmission electron microscopy

Structural characteristics of Alo.55 Gao.45N epilayer were investigated by high resolution x-ray diffraction(HRXRD)and transmission electron microscopy(TEM);the epilayer was grown on GaN/sapphire substrates using a high-temperature A1 N interlayer by metal organic chemical vapor deposition technique.The mosaic characteristics including tilt,twist,heterogeneous strain,and correlation lengths were extracted by symmetric and asymmetric XRD rocking curves as well as reciprocal space map(RSM).According to Williamson-Hall plots,the vertical coherence length of AlGaN epilayer was calculated,which is consistent with the thickness of AlGaN layer measured by cross section TEM.Besides,the lateral coherence length was determined from RSM as well.Deducing from the tilt and twist results,the screw-type and edge-type dislocation densities are 1.0×10~8 cm~(-2) and 1.8×10~(10) cm~(-2),which agree with the results observed from TEM.     

Cu在Zr掺杂CeO2(111)面吸附特性的第一性原理研究

采用基于广义梯度近似的投影缀加平面波方法和具有三维周期性边界条件的超晶胞结构模型,用第一原理计算方法,计算并分析了Cu在Zr掺杂的CeO2(111)面吸附所形成的Cu/ Ce0.75Zr0.25O2(111)界面体系的吸附能、吸附结构和电子结构。结果表明：（1）Cu在Ce0.75Zr0.25O2(111)面上次层O的顶位,且邻近Zr原子的吸附位置的吸附能最大,吸附最强;（2）Zr的掺杂增强了Cu与CeO2衬底的作用;（3）Cu的吸附,在CZ(111)面的O2p-Ce4f态之间引入了新的间隙态,这些间隙态主要来自于Cu3d与衬底O2p的杂化作用,这是Cu与CeO2/ZrO2有较强作用的主要原因;（4）吸附的Cu被Ce0.75Zr0.25O2氧化为Cuδ+,并伴随着表面Ce4+ → Ce3+的转化,该反应可以总结为：Cu/Ce4+→ Cu δ+/Ce3+。     

Breakdown voltage analysis of Al0.25Ga0.75N/GaN high electron mobility transistors with partial silicon doping in the AlGaN layer

In this paper,two-dimensional electron gas（2DEG） regions in AlGaN/GaN high electron mobility transistors（HEMTs） are realized by doping partial silicon into the AlGaN layer for the first time.A new electric field peak is introduced along the interface between the AlGaN and GaN buffer by the electric field modulation effect due to partial silicon positive charge.The high electric field near the gate for the complete silicon doping structure is effectively decreased,which makes the surface electric field uniform.The high electric field peak near the drain results from the potential difference between the surface and the depletion regions.Simulated breakdown curves that are the same as the test results are obtained for the first time by introducing an acceptor-like trap into the N-type GaN buffer.The proposed structure with partial silicon doping is better than the structure with complete silicon doping and conventional structures with the electric field plate near the drain.The breakdown voltage is improved from 296 V for the conventional structure to 400 V for the proposed one resulting from the uniform surface electric field.     

Influence of the channel electric field distribution on the polarization Coulomb field scattering in In0.18 Al0.82 N/AlN/GaN heterostructure field-effect transistors

By making use of the quasi-two-dimensional(quasi-2D) model, the current–voltage(I–V) characteristics of In0.18Al0.82N/AlN/GaN heterostructure field-effect transistors(HFETs) with different gate lengths are simulated based on the measured capacitance–voltage(C–V) characteristics and I–V characteristics. By analyzing the variation of the electron mobility for the two-dimensional electron gas(2DEG) with electric field, it is found that the different polarization charge distributions generated by the different channel electric field distributions can result in different polarization Coulomb field scatterings. The difference between the electron mobilities primarily caused by the polarization Coulomb field scatterings can reach up to 1522.9 cm2/V·s for the prepared In0.18Al0.82N/AlN/GaN HFETs. In addition, when the 2DEG sheet density is modulated by the drain–source bias, the electron mobility presents a peak with the variation of the 2DEG sheet density,the gate length is smaller, and the 2DEG sheet density corresponding to the peak point is higher.     

钛酸锶钡薄膜的室温光学性能研究

采用溶胶-凝胶法制备了(Ba0.75Sr0.25)TiO3薄膜,研究了不同退火温度下样品的物相结构、薄膜的光致发光性能和光学透过率。结果表明:室温下非晶钛酸锶钡薄膜在蓝光激发下具有明显的发光现象,发光波长范围是500～650 nm,峰值在525 nm附近。延长非晶态薄膜的退火时间能够显著提高样品的发光强度,且发光强度随薄膜厚度增加而增大。晶态薄膜有微弱的发光现象。透射谱测试结果表明,钛酸锶钡薄膜在可见光范围内具有良好的光学透过率。     

Polarization properties of nonpolar GaN films and (In,Ga)N/GaN multiple quantum wells

We have grown GaN films and (In,Ga)N/GaN multiple quantum wells (MQWs) by plasma-assisted molecular-beam epitaxy on -LiAlO₂(100) substrates. Due to the crystal symmetry of -LiAlO₂(100), GaN films and (In,Ga)N/GaN MQWs can be realized in a nonpolar (M-plane) configuration, i.e., the c axis of the wurtzite unit cell lies in the growth plane. For compressively, anisotropically strained M-plane GaN films, the band structure of the valence band changes in such a way that the optical transmittance becomes 100% linearly polarized for two orthogonal in-plane directions, where one of these directions is parallel to the c axis of the GaN film. The photoluminescence properties of M-plane In_0.1Ga_0.9N/GaN MQWs exhibit a strong in-plane optical anisotropy for linear polarization with an energy-dependent polarization degree of up to 96%, which is presumably also due to a large valence-band splitting induced by the large compressive strain in the QWs. PACS 78.40.Fy; 78.66.Fd; 71.20.Nr     

高线性度Al_xGa_(1-x)N/Al_yGa_(1-y)N/GaN高电子迁移率晶体管优化设计

对新型复合沟道AlxGa1-xN/AlyGa1-yN/GaN高电子迁移率晶体管(HEMT)进行了优化设计.从半导体能带理论与量子阱理论出发,自洽求解了器件层结构参数对器件导带能级以及二维电子气(2DEG)中载流子浓度和横向电场的影响.用TCAD软件仿真得到了器件的层结构参数对器件性能的影响.结合理论分析和仿真结果确定了器件的最佳外延层结构Al0.31Ga0.69N/Al0.04Ga0.96N/GaNHEMT.对栅长1μm,栅宽100μm的器件仿真表明,器件的最大跨导为300mS/mm,且在栅极电压-2—1V的宽范围内跨导变化很小,表明器件具有较好的线性度;器件的最大电流密度为1300mA/mm,特征频率为11.5GHz,最大振荡频率为32.5GHz.     

Breakdown voltage analysis of Al_0.25Ga_0.75N/GaN high electron mobility transistors with partial silicon doping in the AlGaN layer

In this paper,two-dimensional electron gas(2DEG) regions in AlGaN/GaN high electron mobility transistors(HEMTs) are realized by doping partial silicon into the AlGaN layer for the first time.A new electric field peak is introduced along the interface between the AlGaN and GaN buffer by the electric field modulation effect due to partial silicon positive charge.The high electric field near the gate for the complete silicon doping structure is effectively decreased,which makes the surface electric field uniform.The high electric field peak near the drain results from the potential difference between the surface and the depletion regions.Simulated breakdown curves that are the same as the test results are obtained for the first time by introducing an acceptor-like trap into the N-type GaN buffer.The proposed structure with partial silicon doping is better than the structure with complete silicon doping and conventional structures with the electric field plate near the drain.The breakdown voltage is improved from 296 V for the conventional structure to 400 V for the proposed one resulting from the uniform surface electric field.     

Improved crystal quality of GaN film with the in-plane lattice-matched In_(0.17)Al_(0.83)N interlayer grown on sapphire substrate using pulsed metal organic chemical vapor deposition

We report on an improvement in the crystal quality of GaN film with an In0.17Al0.83N interlayer grown by pulsed metal–organic chemical vapor deposition, which is in-plane lattice-matched to GaN films. The indium composition of about 17% and the reductions of both screw and edge threading dislocations(TDs) in GaN film with the InAlN interlayer are estimated by high resolution X-ray diffraction. Transmission electron microscopy(TEM) measurements are employed to understand the mechanism of reduction in TD density. Raman and photoluminescence measurements indicate that the InAlN interlayer can improve the crystal quality of GaN film, and verify that there is no additional residual stress induced into the GaN film with InAlN interlayer. Atomic force microscopy measurement shows that the InAlN interlayer brings in a smooth surface morphology of GaN film. All the results show that the insertion of the InAlN interlayer is a convenient method to achieve excellent crystal quality in GaN epitaxy.     

Magnetism and transport studies in off-stoichiometric metallic perovskite compounds GdPd3Bx (x=0.25, 0.50 and 0.75)

We report the magnetic and transport properties of the off-stoichiometric metallic perovskite like compounds GdPd₃B_x (x=0.25, 0.50 and 0.75). Our results show that doping with boron in the lattice of parent binary-compound GdPd₃ leads to lattice expansion. Which in turn manifests in contrasting magnetic and transport behaviors of the doped compounds in comparison with the undoped GdPd₃. An attempt has been made to compare and correlate the results of magnetic and transport measurements of GdPd₃B_x with that of stoichiometric compositions GdPd₃B_xC_1−x. The comparative study of GdPd₃B_x and GdPd₃B_xC_1−x confirms that there is a strong correlations between the structural, magnetic and transport properties of these compounds.     

用线性丸盒轨道原子球近似超元胞法计算(Ba1-xKx)BiO3立方超导相(x=0.25,0.5,0.75)的电子结构

用线性丸盒轨道原子球近似(LMTO-ASA)超元胞法计算(Ba_1-xKx)BiO₃立方超导相x=0.25与x=0.5的电子结构,作为对照同时计算立方结构x=0.75的电子结构。计算结果表明,用超元胞法可以得到比“刚带近似”较精确的电子结构参数。给出Fermi面上的能带参数随组分的变化趋势。讨论了不等价的氧原子与周围金属原子价轨道的杂化特征。 关键词：