电阻栅结构负阻异质结双极晶体管

设计并研制成功了具有电阻栅结构的n-InGaP/p-GaAs/n-GaAs负阻异质结双极晶体管.研制出的器件I-V特性优于相关文献的报导;得到了恒定电压和恒定电流两种模式的负阻特性曲线;对两种模式负阻特性产生的物理机制进行了解释;最后对此器件的应用前景进行了预测.     

光电双向负阻晶体管的数值模拟与实验研究

光电双向负阻晶体管(PBNRT)是一种新型S型光电负阻器件.本文对它的光电负阻特性进行了数值模拟和实验研究,给出了器件等效电路.PBNRT在光电混合工作模式下具有光控电流开关效应,可通过光照和控制电压两种控制方式改变器件的S型负阻特性.模拟和实验结果均表明:光照强度增大,维持电压基本保持不变,转折电压减小,负阻电压摆幅减小;而增大控制电压,维持电压和转折电压均增大,输出负阻特性曲线右移.上述特点使得PBNRT可望在光电开关、光控振荡和光电探测等方面有很好的应用前景.     

负阻发光二极管的结构原理及应用

负阻发光二极管是一种p-n-p-n四层结构的半导体发光器件．它具有负阻特性，故其有开关特性．硅四层结构器件如接成三端形式，便是可控硅器件．如果发光二极管所用的晶体做成两端p-n-p-n器件，就可获得负阻特性并在通态发光．以下，介绍其结构原理及应用．     

表面杂质浓度分布对晶体管负阻特性的影响

本文对镓、镓－硼两种基区的３ＤＤ２０２型晶体管负阻摆幅现象进行了比较和理论分析，证明了基区表面杂质浓度分布对器件发射极－集电极电压负阻特性有较大影响．找到了改善晶体管击穿特性的具体措施     

双管S型负阻器件的研究

模拟电路实验证明用两个同极性的晶体管以多种电路接法都能获得具有Ｓ型负阻特性的两端器件。在此实验基础上研制得到一种双向两端Ｓ型负阻器件（ＴＢＮＲＤ器件）。本文还对该器件产生负阻的原因进行了理论分析。     

Si光电负阻器件和Si-Ge异质结混合模式晶体管的模拟研究

“硅光负阻器件的研究”、“高频高速硅光负阻器件的研究”是国家自然科学基金和天津自然科学基金资助的项目,由天津大学电子信息工程学院微电子系新型器件小组承担研究工作。笔者围绕着该两项课题进行了硅光电负阻器件的基础研究工作,对两种硅光电负阻器件的机理进行了探讨。进行了二维器件模拟（简称器件模拟）,对影响器件性能的主要参数进行了模拟分析,并与实验进行了对比。建立了两种光电负阻器件的电路模型,并进行了实验验证。为光电负阻器件基础研究和应用研究打下了良好的基础。“SOI／SiGe/BiCMOS集成电路的研究”是国家自然科学基金重点项目,天津大学和清华大学共同承担了这项研究工作。笔者围绕着该项研究工作进行了SiGe/BiMOS的基础研究和设计工作,进行了器件模拟,对影响器件性能的主要参数进行模拟分析,模拟为器件设计提供了有意义的指导,完成版图设计和工艺设计。为SOI／SiGe/BiCMOS集成电路的研制奠定良好开端。具体研究的主要内容包括以下九个方面。     

基于MEMS技术新型硅磁敏三极管负阻-振荡特性

介绍了一种新型硅磁电负阻振荡器件——S型负阻-振荡硅磁敏三极管．该器件是基于MEMS技术在p型高阻单晶硅片上制作的具有立体结构的新型磁电转换器件，采用KOH各向异性腐蚀技术实现发射区及引线的制作．实验结果表明，集电极电流随外加磁场的变化而变化；在基极注入电流一定时，出现集电极电流受外加偏压VCE调制的负阻-振荡特性，且集电极电流振荡随外加磁场而变化．对该器件负阻振荡特性的形成机理进行了讨论，结果表明，在集电区n+π结和基区与π区形成的p+π结均处于反偏条件下，当π区满足雪崩倍增效应产生的条件时，该磁敏三极管伏-安特性曲线中的Vp+π偏压相对应的基极注入条件下的集电极电流出现S型负阻-振荡特性．在发射极和基极间的n+π结和p+π结附近存在的大量深能级杂质将对负阻-振荡特性进行调制．     

一种互补结型场效应管负阻器件

介绍了一种利用集成互补结型场效应管的简单复合而构成的负阻器件，并且对该负阻器件的温度特性进行了分析，为设计具有温度稳定性的负阻器件提供了有益的参考。     

与HBT工艺兼容的新型负阻器件的研制与分析

在HBT工艺基础上,通过对器件结构的特殊设计,研制出了一类新型三端负阻器件,其恒压控制型负阻的PVCR大于800,并伴有恒流控制型负阻。通过atlas器件模拟软件进行模拟后对其物理机制进行了解释。该器件既能保持HBT高频、高速的特点,又具有负阻、双稳、自锁等特性,同时与普通台面HBT工艺兼容,易于集成,是一种具有研究和应用价值的新型负阻器件。     

新型恒压控制型负阻HBT的研制进展

研究了HBT产生负阻的可能机制,通过对材料结构和器件结构的特殊设计,采用常规台面HBT工艺,先后研制出3类高电流峰谷比的恒压控制型负阻HBT.超薄基区HBT的负阻特性是由超薄基区串联电阻压降调制效应造成的,在GaAs基InGaP/GaAs和AlGaAs/GaAs体系DHBT中均得到了验证.双基区和电阻栅型负阻HBT均为复合型负阻器件.双基区负阻HBT通过刻断基区,电阻栅负阻HBT通过在集电区制作基极金属形成集电区反型层,构成纵向npn与横向pnp的复合结构,由反馈结构(pnp)的集电极电流来控制主结构(npn)的基极电流从而产生负阻特性.3类负阻HBT与常规HBT在结构和工艺上兼容,兼具HBT的高速高频特性和负阻器件的双稳、自锁、节省器件的优点.     

A new photo-sensitive voltage-controlled differential negative resistance device—The lambda bipolar photo-transistor

A new photo-sensitive voltage-controlled differential negative resistance device called the LAMBDA bipolar photo-transistor is presented. The basic structure of the Lambda bipolar photo-transistor consists of the simultaneous integration of a bipolar junction transistor and a merged metal-oxide-semiconductor field effect transistor. The IV characteristic of this new device will exhibit a voltage-controlled differential negative resistance when the device is exposed to light. The operational principle of this new device will be described and the characteristics of the fabricated device are discussed.     

负阻异质结晶体管的模拟与实验

采用MBE方法生长了8nm基区的InGaP/GaAs双异质结材料,研制成具有负阻特性的异质结晶体管.在恒压恒流条件下均观察到了负阻特性并对其物理机制进行了讨论.推导出集电极电流Ic与VCE的关系表达式,讨论了负阻与器件结构和参数的关系.使用PSPICE模拟软件建立电路网表模型,代入推导出的IC-VCE公式进行模拟,模拟结果与器件的测量结果十分接近.     

“GAMBIT: GAte Modulated BIpolar Transistor”

A planar, interdigitated, integrated device structure is described whose characteristics show a voltage controlled negative resistance between two of its terminals. This negative resistance can be controlled by the applied bias to a third terminal. Devices have been fabricated with this structure to achieve negative resistance values ranging from a few hundred thousand ohms down to less than a hundred ohms. The physical mechanisms that give rise to this negative resistance are described and a dc analysis of its behavior is presented. The analysis shows excellent agreement with the observed device characteristics.     

A new gradual hole injection dual-gate LIGBT

A new shorted-anode lateral insulated gate bipolar transistor (SA-LIGBT), entitled gradual hole injection dual gate LIGBT (GHI-LIGBT), is proposed and fabricated. The new device employs a dual gate and p⁺ injector in order to initiate the hole injection gradually from the anode electrode into the drift region so that the negative differential resistance (NDR) regime may be eliminated. The experimental results show that the NDR regime, which may cause undesirable device characteristics, is completely eliminated in the GHI-LIGBT, and the forward voltage drop is reduced by 1 V at the current density of 200 A/cm² in comparison with the conventional SA-LIGBT     

Strained layer (1.5 μm) InP/InGaAsP lasing opto-electronicswitch (LOES)

We present for the first time a lasing opto-electronic switch (LOES) fabricated in the InP/InGaAsP system. In this device the active region is composed of four 63 Å compressively strained quantum wells. A lasing threshold of 104 mA, or 6933 A/cm², has been observed at a temperature of 298 K, with an external differential quantum efficiency of 14%. The lasing wavelength is centered at 1.52 μm. The current-voltage characteristics manifest pronounced differential negative resistance, characterized by switching and holding voltages of 6.8 V and 1.6 V, respectively, and a switching current density of 33 A/cm². The OFF and ON state resistances are approximately 150 kΩ and 4 Ω, respectively     

一种高性能InP基谐振隧穿二极管的研制

设计并用分子束外延技术生长了InP基InGaAs/AlAs体系RTD材料,采用传统湿法腐蚀、光学接触式光刻、金属剥离、台面隔离和空气桥互连工艺,研制出了具有优良负阻特性和较高阻性截止频率的InP基RTD单管，器件正向PVCR为17.5,反向PVCR为28,峰值电流密度为56kA/cm^2,采用RNC电路模型进行数据拟合后得到阻性截止频率为82.8GHz，实验为今后更高性能RTD单管的研制,以及RTD与其他高速高频三端器件单片集成电路的设计与研制奠定了基础。     

InP/InGaAsP double-heterostructure optoelectronic switch

The double-heterostructure optoelectronic switch (DOES), fabricated in the InP/InGaAsP material system, is demonstrated. The functional characteristics and operational parameters exhibit a lower switching voltage (≈1.8 V) and a higher on-state holding current (≈20 mA) than found in either the Si/SiGe- or GaAs/AlGaAs-based DOES of comparable structures and doping levels. In the on-state, optical emission is observed in a manner analogous to a light emitting diode. However, enhanced optical emission is observed when the device is biased in the regime of negative differential resistance     

一种新型硅三端负阻器件

提出并研制成一种新型硅三端负阻器件。该器件由一n沟耗尽型MOS管、一横向pnp双极晶体管和一个电阻集成而得。它具有“双负阻”特性和正阻区阻值易于控制等特点。由理论计算出的器件I_c—V_(CB)特性和负阻参数与实验结果符合良好。     

Large enhancement of interband tunneling current densities of over105 A/cm2 inIn0.53Ga0.47As-based surface tunnel transistors

In_0.53Ga_0.47As-based Surface Tunnel Transistors (STT's), which control an interband tunneling current between an n-type channel and a p-type drain by an insulated gate, are investigated with the goal of increasing the tunneling current-density for high-speed operation. The fabricated devices enhanced an interband tunneling current density by a factor of 10² compared to the conventional GaAs-STT's due to a smaller bandgap energy and a lighter electron effective mass, and exhibited a clear gate-controlled negative differential resistance (NDR) characteristics with maximum tunneling current densities of over 10⁵ A/cm². The cutoff frequency (F_T) and maximum oscillation frequency (f_max ) of a fabricated device with a 1.0-μm gate length were estimated to be 7.9 GHz and 20 GHz, respectively, in the NDR region     

A GSMBE grown GaInP/GaAs narrow base DHBT exhibiting N-shapenegative differential resistance with variable peak-to-valley currentratio up to 1×107 at room temperature

A Ga_0.51In_0.49P/GaAs DHBT with a heavily doped (1×10¹⁹ cm^-3) narrow base (8 nm) grown by gas source molecular beam epitaxy and fabricated by simple wet chemical etching was demonstrated for the first time. A variable “N” shape negative differential resistance (NDR) controlled by base current was observed in the common-emitter current-voltage characteristics of this device at room temperature. A maximum peak-to-valley current ratio of 1×10⁷ and a maximum current gain of 83 were achieved at room temperature. The largest peak-to-valley current ratio (1×10⁷) achieved is, to our knowledge, the highest reported value to date. The NDR characteristics were explained by the base resistance effect