The electrical, optical and crystalline properties of GaAs: C grown by GSMBE using TMG and AsH3 for application to HBTs

We report the results of a comprehensive study on the electrical, optical and crystalline properties of heavily carbon doped p-type (100) GaAs epilayers (p = 6.3 × 10¹⁸−1.3 × 10²⁰ cm^-3; THICKNESS = 250−420 nm) grown by gas source molecular beam epitaxy using trimethylgallium and arsine. X-ray analysis showed epilayer lattice contraction with a mismatch of δa/a = -1.8 × 10^-3 at p = 1.3 × 10²⁰ cm^-3. Room temperature photoluminescence peak energy shifted from 1.40 eV (p = 6.3 × 10¹⁸ cm^-3) to 1.37 eV (p = 1.3 × 10²⁰ cm^-3). Stokes Raman spectra showed two modes assigned as the unscreened LO phonon (292 cm^-1) and the low frequency branch of the coupled hole-plasmon-LO-phonon (266 cm^-1). Conservation of Raman scattering rules under all incident light configurations showed that the (100) GaAs:C epilayers were of high crystalline quality without the presence of faceting or other such crystalline defects. Annealing at 900°C for between 30 s to 45 min, resulted in a significant reduction in the hole concentration, lattice contraction and photoluminescence intensity for all epilayers. The implications of these results for the development of GaAs/AlGaAs HBTs are discussed.     

CBE growth of high-quality AlGaAs/GaAs heterostructures for HEMT applications

AlGaAs/GaAs heterostructures were grown by chemical beam epitaxy using triethylgallium, triisobutylaluminium and pure arsine in flow control mode with hydrogen as carrier gas. For substrate temperatures of 580°C and V/III ratios of 10, high quality AlGaAs layers are obtained; heterostructures show abrupt and smooth interfaces. Modulation doping with silicon evaporated from a conventional effusion cell gives two-dimensional electron gases with carrier densities up to 1×10¹² cm^-2. Mobilities of 70000 cm²/V·s are obtained at 77 K for carrier densities of 4×10¹¹ cm^-2. The lateral homogeneity of the heterostructures in layer thickness, composition and doping level is excellent. Perfect morphology with defect densities of about 100 cm^-2 is observed. High electron mobility transistors (gate length 0.3 nm) fabricated from quantum well structures show a transconductance of about 380 mS/mm.     

Growth of GaAs/AlGaAs HBTs by MOMBE (CBE)

In this paper, we will discuss how the unique growth chemistry of MOMBE can be used to produce high speed GaAs/AlGaAs heterojunction bipolar transistors (HBTs). The ability to grow heavily doped, well-confined layers with carbon doping from trimethylgallium (TMG) is a significant advantage for this device. However, in addition to high p-type doping, high n-type doping is also required. While elemental Sn can be used to achieve doping levels up to 1.5×10¹⁹ cm^-3, severe segregation limits its use to surface contact layers. With tetraethyltin (TESn), however, segregation does not occur and Sn doping can be used throughout the device. Using these sources along with triethylgallium (TEG), trimethylamine alane (TMAA), and AsH₃, we have fabricated Npn devices with 2 μm×10 μm emitter stripes which show gains of ≥ 20 with either ƒ_t = 55 GHz and ƒ_max = 70 GHz or ƒ_t = 70 GHz and ƒ_max = 50 GHz, depending upon the structure. These are among the best RF values reported for carbon doped HBTs grown by any method, and are the first reported for an all-gas source MOMBE process. In addition, we have fabricated a 70 transistor decision circuit whose performance at 10 Gb/s equals or exceeds that of similar circuits made from other device technologies and growth methods. These are the first integrated circuits reported from MOMBE grown material.     

Growth by self-flux method and post-annealing effect of Bi2Sr2Ca1Cu2Ox single crystals

Post-annealing effects on superconducting characteristics have been studied in Bi₂Sr₂Ca₁Cu₂O_x single crystals grown by a conventional flux method. Also, favorable growth conditions and the effect of the pre-sintering process on the starting materials for flux growth have been examined. The best superconducting behavior is obtained in post-annealed crystals grown from pre-sintered powder materials. The critical current density J_c estimated from magnetization hysteresis in annealed crystals grown with pre-sintered materials is roughly 8×10⁵ A/cm² (Hc) and 5×10⁴ A/cm² (Hc) at 4.2 K at zero field.     

Magnesium-doped InGaAs using (C2H5C5H4)2Mg: application to InP-based HBTs

Heavily magnesium-doped p-type-InGaAs layers on InP(100) substrates were successfully grown, for the first time, by low-pressure metalorganic chemical vapor deposition (MOCVD) using bis-ethylcyclopentadienyl-magnesium, (C₂H₅C₅H₄)₂Mg (EtCp₂Mg), as organometallic precursor for the Mg. It was experimentally verified that the room-temperature hole concentration of Mg into InGaAs increased with increase of the V/III ratio and decrease of the growth temperature. A maximum hole concentration of over 4 × 10¹⁹ cm⁻³ was obtained. The diffusion coefficient of Mg in InGaAs was experimentally derived to be 10⁻¹² cm²/s at 800°C, which was comparable to that of Be. Finally, InP/InGaAs heterojunction bipolar transistors (HBTs) with Mg-doped bases were fabricated successfully. Measured maximum current gain was about 320 with a 90 nm thick base and a sheet resistance of the base layer of 1.28 kΩ/sq.     

Gettering properties of PrO2 in In0.53Ga0.47As LPE growth

Praseodymium oxide was used for the gettering of background impurities from the melt, during In_0.53Ga_0.47As/InP LPE growth. The low amount of PrO₂ in the growth solution enables one to prepare n-type In_0.53Ga_0.47As epitaxial layers with electron concentration in the range of 2 × 10¹⁴ to 2 × 10¹⁶ cm^-3 and electron mobilities of 11,000 and 8400 cm²/V·s, respectively. These results were achieved without long time baking of the melt; homogenization lasted only 1 h. The electrical parameters and photoluminescence spectra of the grown layers are presented.     

Heavily carbon-doped p-type InGaAs by MOMBE

Carbon-doped In_xGa_1−xAs layers (x=0−0.96) were grown by metalorganic molecular beam epitaxy (MOMBE) using trimethylgallium (TMG), solid arsenic (As₄) and solid indium (In) as sources of Ga, As and In, respectively. The carrier concentration is strongly affected by growth temperature and indium beam flux. Heavy p-type doping is obtained for smaller In compositions. The hole concentration decreases with the indium composition from 0 to 0.8, and then the conductivity type changes from p to n at x=0.8. Hole concentrations of 1.0×10¹⁹ and 1.2×10¹⁸ cm^-3 are obtained for x=0.3 and 0.54, respectively. These values are significantly higher than those reported on carbon-doped In_xGa_1−xAs by MBE. Preliminary results on carbon-doped GaAs/In_xGa_1−xAs strained layer superlattices are also discussed.     

MOVPE growth of GaInP/GaAs hetero-bipolar-transistors using CBr4 as carbon dopant source

Carbon doping of GaAs with carbon tetrabromide (CBr₄) in low pressure MOVPE has been investigated and applied to the fabrication of GaInP/GaAs HBTs. Especially the hydrogen incorporation and the associated acceptor passivation has been studied. The hydrogen found in single GaAs:C layers is predominantly incorporated during cooling the sample under AsH₃ after growth, n-Type capping layers can block this H indiffusion and GaAs:C base layers in HBTs show much lower H concentrations than GaAs:C single layers without a cap. A further reduction of acceptor passivation is possible by optimization of the growth procedure. First HBTs processed from layers with a base that was doped using CBr₄ show promising DC and HF performance (β = 45, for 2 × 20 μm² devices).     

SiC epitaxial layer growth in a novel multi-wafer vapor-phase epitaxial (VPE) reactor

Experimental results are presented for SiC epitaxial layer growths employing a unique planetary SiC-VPE reactor. The high-throughput, multi-wafer (7×2″) reactor, was designed for atmospheric and reduced pressure operation at temperatures up to and exceeding 1600°C. Specular epitaxial layers have been grown in the reactor at growth rates ranging from 3–5 μm/h. The thickest layer grown to date is 42 μm thick. The layers exhibit minimum unintentional n-type doping of 1×10¹⁵ cm⁻³, and room temperature mobilities of 1000 cm²/V s. Intentional n-type doping from 5×10¹⁵ cm⁻³ to >1×10¹⁹ cm⁻³ has been achieved. Intrawafer layer thickness and doping uniformities (standard deviation/mean at 1×10¹⁶ cm⁻³) are typically 4 and 7%, respectively, on 35 mm diameter substrates. Moderately doped, 4×10¹⁷ cm⁻³, layers, exhibit 3% doping uniformity. Recently, 3% thickness and 10% doping uniformity (at 1×10¹⁶ cm⁻³) has been demonstrated on 50 mm substrates. Within a run, wafer-to-wafer thickness deviation averages 9%. Doping variation, initially ranging as much as a factor of two from the highest to the lowest doped wafer, has been reduced to 13% at 1×10¹⁶ cm⁻³, by reducing susceptor temperature nonuniformity and eliminating exposed susceptor graphite. Ongoing developments intended to further improve layer uniformity and run-to-run reproducibility, are also presented.     

Heavily carbon-doped p-type (In)GaAs grown by gas-source molecular beam epitaxy using diiodomethane

Heavily carbon-doped p-type In_xGa_1−xAs (0≤x<0.49) was successfully grown by gas-source molecular beam epitaxy using diiodomethane (CH₂I₂), triethylindium (TEIn), triethylgallium (TEGa) and AsH₃. Hole concentrations as high as 2.1×10²⁰ cm⁻³ were achieved in GaAs at an electrical activation efficiency of 100%. For In_xGa_1−xAs, both the hole and the atomic carbon concentrations gradually decreased as the InAs mole fraction, x, increased from 0.41 to 0.49. Hole concentrations of 5.1×10¹⁸ and 1.5×10¹⁹ cm⁻³ for x = 0.49 and x = 0.41, respectively, were obtained by a preliminary experiment. After post-growth annealing (500°C, 5 min under As₄ pressure), the hole concentration increased to 6.2×10¹⁸ cm⁻³ for x = 0.49, probably due to the activation of hydrogen-passivated carbon accepters.     

Growth of semi-insulating InP by GSMBE

Fe doped semi-insulating InP layers have been grown by gas source MBE with a solid iron source. Structure as n-i-n, p-i-n and p-n-i-n were characterized by I(V) measurements and secondary ion mass spectroscopy profiling (SIMS). As shown by SIMS, uniform Fe doping and abrupt transitions are achieved for the different structures studied. Resistivities as high as 1.5×10⁹ Ω cm are determined from I(V) curves for Fe concentrations in the 10¹⁷ cm^-3 range. Lasers with semi-insulating layers have been realized for the first time by gas source MBE. Preliminary results show power emission of 43 mW, without antireflecting coating, comparable to state-of-the-art characteristics.     

p-Type GaAs doped by diiodomethane (CI2H2) in molecular beam epitaxy, metalorganic molecular beam epitaxy, and chemical beam epitaxy

Highly p-type carbon-doped GaAs epitaxial layers were obtained using diiodomethane (CI₂H₂) as a carbon source. In the low 10¹⁹ cm⁻³ range, almost all carbon atoms are electrically activated and at 9×10¹⁹ cm⁻³, 91% are activated. The carbon incorporation efficiency in GaAs layers grown by metalorganic molecular beam epitaxy (MBE) and chemical beam epitaxy (CBE) is lower than that by MBE due to the site-blocking effect of the triethylgallium molecules. In addition, in CBE of GaAs using tris-dimethylaminoarsenic (TDMAAs), the carbon incorporation is further reduced, but it can be increased by cracking TDMAAs. Annealing studies indicate no hydrogenation effect.     

MoS2/SnS异质结太阳能电池的模拟研究

硫化亚锡(SnS)是一种Ⅳ-Ⅵ族层状化合物半导体材料,其禁带宽度与太阳能电池最佳带隙1.5 eV非常接近,并且在可见光范围内光的吸收系数很大(α>10⁴ cm^-1),因此SnS是一种很有应用前景的材料。本文利用太阳能电池模拟软件wxAMPS模拟了MoS₂/SnS异质结太阳能电池,主要研究SnS吸收层的厚度、掺杂浓度和缺陷态等因素对太阳能电池性能的影响。研究发现:SnS吸收层最佳厚度为2 μm,最佳掺杂浓度为1.0×10¹⁵ cm^-3;同时高斯缺陷态浓度超过1.0×10¹⁵ cm^-3时,电池各项性能参数随着浓度的增加而减小,而带尾缺陷态超过1.0×10¹⁹ cm^-3·eV^-1时,电池性能才开始下降;其中界面缺陷态对太阳能电池影响比较严重,界面缺陷态浓度超过1.0×10¹² cm^-2时,开路电压、短路电流、填充因子和转换效率迅速下降。另外,通过模拟获得的转换效率高达24.87%,开路电压为0.88 V,短路电流为33.4 mA/cm²。由此可知,MoS₂/SnS异质结太阳能电池是一种很有发展潜力的光伏器件结构。     

Investigations on the effect of InSb and InAsSb step-graded buffer layers in InAs0.5Sb0.5 epilayers grown on GaAs (0 0 1)

We report the structural and electrical properties of InAsSb epilayers grown on GaAs (0 0 1) substrates with mid-alloy composition of 0.5. InSb buffer layer and InAs_xSb_1−x step-graded (SG) buffer layer have been used to relax lattice mismatch between the epilayer and substrate. A decrease in the full-width at half-maximum (FWHM) of the epilayer is observed with increasing the thickness of the InSb buffer layer. The surface morphology of the epilayer is found to change from 3D island growth to 2D growth and the electron mobility of the sample is increased from 5.2×10³ to 1.1×10⁴ cm²/V s by increasing the thickness of the SG layers. These results suggest that high crystalline quality and electron mobility of the InAs_0.5Sb_0.5 alloy can be achieved by the growth of thick SG InAsSb buffer layer accompanied with a thick InSb buffer layer. We have confirmed the improvement in the structural and electrical properties of the InAs_0.5Sb_0.5 epilayer by quantitative analysis of the epilayer having a 2.09 μm thick InSb buffer layer and 0.6 μm thickness of each SG layers.     

A novel technique to reduce the concentration of carbon in LEC gallium arsenide

An in-situ method has been developed to reduce the concentration of carbon in the liquid encapsulated growth of gallium arsenide. Sublimated As₂O₃ was bubbled through a GaAs melt to remove carbon via the production of CO₂. When a melt of known high starting carbon concentration ( 30 × 10¹⁴ atoms/cm³) was bubbled with As₂O₃, the subsequent crystal contained 4 × 10 ¹⁴ carbon atoms/cm³. This low carbon crystal was subsequently carbon doped and regrown, demonstrating the ability to return As₂O₃ treated GaAs to desired carbon concentrations and electrical properties.     

New aluminium precursors for MOMBE (CBE): a comparative study

Recently different new Al precursors have been developed to improve the electrical and optical quality of AlGaAs layers grown by MOMBE (CBE), since AlGaAs layers still suffer from the high incorporation of oxygen and carbon. Three approaches are introduced and results obtained from Al_xGa_1−xAs layers (0 < x ≤ 1) are discussed. APAH, a double ring structure molecule, was found to yield AlGaAs layers with high contents of carbon and nitrogen. The use of an Alane-adduct decreases impurity concentrations and improves optical properties. However, TIBAl is superior and provides highest PL response together with carrier concentrations below p = 10¹⁶ cm^-3. Even though the concept of coordinative saturation is promising, results achieved by TIBAl showed that trialkyls could also be well suited for AlGaAs, assuming that they are properly synthesized.     

High-quality InP grown by chemical beam epitaxy

InP films were grown by chemical beam epitaxy using trimethylindium (TMI) and pure phosphine (PH₃) in a flow control mode with hydrogen as the carrier gas, with the TMI flow rate fixed at 3 SCCM. Substrate temperatures were varied between 505 and 580°C and V/III ratios from 3 to 9. InP layers with high optical quality (intense and narrow excitonic transition lines) and high crystalline quality (narrow and symmetric X-ray diffraction peaks) could be grown only within a narrow parameter window around a substrate temperature of 545°C (δT_s ≤ 25°C) and a V/III ratio of 5.5 (δ(V/III) ≤ 2). Carrier densities of 8 × 10¹⁴ cm^-3 with mobilities of 70000 cm²/V.s measured at 77 K were obtained for growth conditions close to the edge of this parameter window towards low V/III ratios. The growth rate of inP was also clearly at its maximum in the given parameter window. Leaving the window, by changing either the growth temperature or the V/III ratio, significantly decreased the growth rate. This reduced growth rate was accompanied by a degradation in the crystalline quality. We also demonstrate that for higher TMI flow the parameter window shifts to higher growth temperatures. The InP could be doped effectively with Si in the range from 9 × 10¹⁵ to 3 × 10¹⁸ cm^-3.     

Growth of heavily C-doped GaAs/AlGaAs MQW structures by MOVPE for 2–3 μm normal incidence photodetectors

The growth and intersubband optical properties of high quality heavily doped p-type GaAs/AlGaAs multiple quantum well (MQW) structures are reported. The MQWs were fabricated by the atmospheric pressure metalorganic vapor phase epitaxy process using liquid CCl₄ to dope the wells with C acceptors (N_a ≈ 2 × 10¹⁹ cm⁻³). A constant growth temperature was maintained for the entire structure while different V/III ratios were used for the well and barrier regions. By this process it is possible to achieve both high C doping densities in the wells and to simultaneously obtain good quality AlGaAs barriers. Fourier transform infrared spectroscopy measurements on heavily doped 10-period MQW structures reveal a new absorption peak at 2 μm with an effective normal incidence absorption coefficient of 4000 cm⁻¹. Photocurrent measurements on mesa-shaped diodes show a corresponding peak at 2.1 μm. The photodiodes exhibit a symmetrical current-voltage characteristic and a low dark current, which are indicative of a high quality MQW structure and a well-controlled C doping profile. The 2 μm absorption represents the shortest wavelength ever reported for any GaAs/AlGaAs or InGaAs/AlGaAs MQW structure and should be very useful for implementing multicolor infrared photodetectors.     

Ion-implanted treatment of (Ba,Sr)TiO3 films for DRAM applications

The effects of ion implantation on the properties of spin-on sol–gel Ba_0.7Sr_0.3TiO₃ (BST) thin films were studied by implanted Ar⁺, N⁺, and F⁺ doses. The F⁺-implanted BST samples present leakage current density <10⁻⁶ A/cm² at 2.5 V and dielectric constant 450. The leakage current of F⁺-implanted BST samples was reduced about one order of magnitude as compared with that of samples with implanted Ar⁺, N⁺ or without implantation. The thickness shrinkage from 135 to 115 nm was observed in F⁺-implanted BST films (before annealing treatment) and a respective increase in the refractive index from 1.84 to 2.05 was measured. After annealing the implanted samples, the changes of thickness and refractive index depend on the concentration of implanted dose. Based on an infrared transmission study of the samples we suggest that the ion-implanted samples with smaller dose (5×10¹⁴ cm⁻²) have fewer −OH contaminants than the non-implanted or implanted samples with the larger doses (1×10¹⁵ cm⁻²). Based on the results presented, we conclude that suitable ion implantation densifies the spin-on sol–gel BST films and reduces the −OH contaminants in the films.     

Tin and tellurium doping of InAs using SnTe in molecular beam epitaxy (MBE)

Tin telluride (SnTe) was utilized as an n-type dopant in the MBE growth of InAs epitaxial layers on GaAs substrates. The highest carrier concentration obtained was 2.9 × 10¹⁹ cm^-3 and the carrier density could be varied over three orders of magnitude by changing the SnTe source temperature. The highest mobilities obtained were 16,900 and 23,300 cm²/V … s at 300 and 77 K, respectively, for carrier concentration of 5 × 10¹⁶ cm^-3. Both Sn and Te were incorporated in the layers as determined by secondary ion mass spectroscopy (SIMS) analysis and the total concentration of Sn and Te were the same as the carrier density in the layer.