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本文用扫描隧道显微镜(STM)在大气中研究了Cu-27.2wt.%Zn-4.7wt.%Al合金中的贝氏体的精细结构,并与透射电镜(TEM)及扫描电镜(SEM)下的形态进行了比较,发现Cu-Zn-Al合金中虫氏体是由亚片条或亚单元组成,亚单元由超亚单元构成,进而为贝氏相变机制的再认识提供了重要的实验基础,并在此基础上提出Cu-Zn-Al合金中贝氏体的形成模型。 相似文献
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从Cu-Zn-Al合金相变产物的形貌与亚结构的特征着手分析了贝氏体相变的阶段性。测定了贝氏体相变阶段的体转变激活能并讨论了贝氏体相变的性质。 相似文献
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Onuki J. Koubuchi Y. Suwa M. Koizumi M. Gardner D.S. Suzuki H. Minowa E. 《Electron Devices, IEEE Transactions on》1992,39(6):1322-1326
An Al-Si-Pd-Nb alloy and a bilayered interconnection using this alloy with molybdenum have been investigated for ULSI interconnections. The electromigration lifetime of Al-Si-0.3 wt.% Pd-0.4 wt.% Nb was 5 times better as compared to Al-Si-0.5 wt.% Cu. In addition, layering this alloy with low-resistivity molybdenum improved the electromigration resistance considerably as compared to Al-Si-Cu layered with a high-resistivity metal, i.e., TiW. PdO was thought to be formed on the Al-Si-0.3 wt.% Pd-0.4 wt.% Nb alloy's surface. The corrosion resistance of this alloy is much better than that of Al-Si-Cu because of this PdO. The ease in patterning the alloy at submicrometer linewidths (to 0.5 μm) is quite satisfactory. The Al-Si-Pd-Nb/Mo layered system is therefore thought to be promising for future interconnection applications requiring durability against high current densities 相似文献
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Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability. 相似文献
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Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment 总被引:2,自引:0,他引:2
John N. Lalena Nancy F. Dean Martin W. Weiser 《Journal of Electronic Materials》2002,31(11):1244-1249
A bismuth-silver alloy (Bi-11wt.%Ag) has been identified as a viable Pb-free power die-attach solder. The alloy has a solidus
at 262.5°C and a liquidus at 360°C. It has a shear modulus of 13.28 GPa and an ultimate tensile strength (UTS) of 59 MPa.
Bismuth-silver alloys oxidize in air but will solder to nickel, silver, and gold under reducing atmospheres. Germanium may
be added in small amounts (≤500 ppm) to improve the wetting. Wire, ribbon, and preform shapes of the alloy have been fabricated
by conventional metalworking techniques. 相似文献
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Creep properties of lead-free Sn-3.5Ag-based alloys with varying amounts of Cu or Bi were studied by single lap-shear test.
Solder balls with five different compositions of Cu (0 wt.%, 0.75 wt.%, 1.5 wt.%) and Bi (2.5 wt.%, 7.5 wt.%) were reflowed
on Cu. The Cu-containing alloy had a lower creep rate than the Bi-containing alloy. The Sn-3.5Ag alloy showed the lowest creep
rate on Cu, implying that the Cu element already dissolved in the Sn-3.5Ag alloy during reflow. The Cu-containing alloy was
strengthened by dispersed small precipitates of Cu6Sn5. As the Cu content increased up to 1.5 wt.%, the Cu6Sn5 coarsened and platelike Ag3Sn intermetallics were found, which deteriorated the creep resistance. 相似文献
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Leonardo R. Garcia Wislei R. Osório Leandro C. Peixoto Amauri Garcia 《Journal of Electronic Materials》2009,38(11):2405-2414
A comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a
view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties
(ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic
Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with
the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the
eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength. 相似文献
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Dhafer Abdul-Ameer Shnawah Suhana Binti Mohd Said Mohd Faizul Mohd Sabri Irfan Anjum Badruddin Teh Guan Hoe Fa Xing Che Adnan Naama Abood 《Journal of Electronic Materials》2012,41(8):2073-2082
This work investigates the effects of 0.1?wt.% and 0.5?wt.% Al additions on bulk alloy microstructure and tensile properties as well as on the thermal behavior of Sn-1Ag-0.5Cu (SAC105) lead-free solder alloy. The addition of 0.1?wt.% Al reduces the amount of Ag3Sn intermetallic compound (IMC) particles and leads to the formation of larger ternary Sn-Ag-Al IMC particles. However, the addition of 0.5?wt.% Al suppresses the formation of Ag3Sn IMC particles and leads to a large amount of fine Al-Ag IMC particles. Moreover, both 0.1?wt.% and 0.5?wt.% Al additions suppress the formation of Cu6Sn5 IMC particles and lead to the formation of larger Al-Cu IMC particles. The 0.1?wt.% Al-added solder shows a microstructure with coarse ??-Sn dendrites. However, the addition of 0.5?wt.% Al has a great effect on suppressing the undercooling and refinement of the ??-Sn dendrites. In addition to coarse ??-Sn dendrites, the formation of large Sn-Ag-Al and Al-Cu IMC particles significantly reduces the elastic modulus and yield strength for the SAC105 alloy containing 0.1?wt.% Al. On the other hand, the fine ??-Sn dendrite and the second-phase dispersion strengthening mechanism through the formation of fine Al-Ag IMC particles significantly increases the elastic modulus and yield strength of the SAC105 alloy containing 0.5?wt.% Al. Moreover, both 0.1?wt.% and 0.5?wt.% Al additions worsen the elongation. However, the reduction in elongation is much stronger, and brittle fracture occurs instead of ductile fracture, with 0.5?wt.% Al addition. The two additions of Al increase both solidus and liquidus temperatures. With 0.5?wt.% Al addition the pasty range is significantly reduced and the differential scanning calorimetry (DSC) endotherm curve gradually shifts from a dual to a single endothermic peak. 相似文献
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An Al-Pd-Si alloy conductor which has higher corrosion resistance than an Al-Si conductor after resin molding is discussed. A palladium oxide-rich (PdO-rich) area is formed by annealing in the surface oxide film on the Al-Pd-Si alloy conductors. It is responsible for the increased corrosion resistance of Al-Pd-Si with over 0.3 wt.% Pd 相似文献
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Sn−5wt.%Sb alloy is used for the soldering of ceramic devices. Reaction couples, dissolution, and differential scanning calorimetry
experiments are conducted to examine the interfacial reactions and dissolution of Ag substrates with the molten Sn−5wt.%Sb
solder. One intermetallic compound, Ag3Sn, is formed at 260°C at the Sn−5wt.%Sb/Ag contact. With the intake of Ag from the substrate, the binary Sn−5wt.%Sb alloy
becomes a ternary (Sn−5wt.%Sb)100−xAgx melt. It is found that a small amount of Ag addition significantly lowers the melting point of the Sn−5wt.%Sb alloy. This
phenomenon is illustrated with the (Sn−5wt.%Sb)100−xAgx isoplethal section. 相似文献