一种基于MEMS的射频低相位噪声压控振荡器的研制

利用微机械可变电容作为频率调节元件,制备了一种中心频率为2GHz的 LC VCO.微机械可变电容的控制极板与电容极板分离,并采用表面微机械工艺制造,在2GHz时的Q值最高约为38.462.MEMS VCO的测试结果表明,偏离2.007GHz的载波频率100kHz处的单边带相位噪声为-107.5dBc/Hz,输出功率为-13.67dBm.对微机械可变电容引起的机械热噪声以及减小空气压膜阻尼来降低相位噪声的方法进行了讨论,提出了一种优化阻尼孔数目的方法.     

一种基于MEMS的射频低相位噪声压控振荡器的研制

利用微机械可变电容作为频率调节元件,制备了一种中心频率为2GHz的 LC VCO.微机械可变电容的控制极板与电容极板分离,并采用表面微机械工艺制造,在2GHz时的Q值最高约为38.462.MEMS VCO的测试结果表明,偏离2.007GHz的载波频率100kHz处的单边带相位噪声为-107.5dBc/Hz,输出功率为-13.67dBm.对微机械可变电容引起的机械热噪声以及减小空气压膜阻尼来降低相位噪声的方法进行了讨论,提出了一种优化阻尼孔数目的方法.     

一种低调谐增益变化的宽带电感电容压控振荡器

设计了一个应用于数字电视调谐器的宽带电感电容压控振荡器.该振荡器包含了一个开关可变电容阵列,用以抑制调谐增益的变化.整个电路采用0.18μm CMOS工艺实现.测试结果表明:压控振荡器的频率范围从1.17GHz至2.03GHz(53.8%);调谐增益从69MHz/V变化至93MHz/V,其变化幅度与最大值相比为25.8%;最差相位噪声为-126dBc/Hz@1MHz;在1.5V电源电压下,压控振荡器的功耗约为9mW.     

一种低调谐增益变化的宽带电感电容压控振荡器

设计了一个应用于数字电视调谐器的宽带电感电容压控振荡器.该振荡器包含了一个开关可变电容阵列,用以抑制调谐增益的变化.整个电路采用0.18μm CMOS工艺实现.测试结果表明:压控振荡器的频率范围从1.17GHz至2.03GHz(53.8%);调谐增益从69MHz/V变化至93MHz/V,其变化幅度与最大值相比为25.8%;最差相位噪声为-126dBc/Hz@1MHz;在1.5V电源电压下,压控振荡器的功耗约为9mW.     

低相位噪声、宽调谐范围LC压控振荡器设计

基于开关电容和MOS可变电容相结合的电路结构,设计了一种分段线性压控振荡器,很好地解决了相位噪声与调谐范围之间的矛盾.另外,在尾电流源处加入电感电容滤波,进一步降低相位噪声.采用TSMC 0.18(m CMOS工艺,利用Cadence中的SpectreRF对电路进行仿真,当电源电压VDD=1.8V时,其中心频率为1.8GHz,可调频率为1.430～2.134GHz,调谐范围达到37%,在偏离中心频率1MHz处,相位噪声为-131dBc/Hz,静态工作电流为5.2mA.     

一种低调谐增益变化、自适应功率控制的宽带电感电容压控振荡器

本文提出了一种电感电容宽带压控振荡器结构。为解决宽输出频率范围对振荡器调谐增益和起振条件的影响,设计了具有优化单位值的二进制开关可变电容阵列和二进制开关负阻抗阵列。该振荡器采用0.18um工艺制造,其输出频率范围约为1.9-3.1GHz。在1.8V电压下,消耗电流为14.2mA-4mA。测试结果表明,采用本文所提出调谐增益抑制技术,在整个频率调谐范围内调谐增益的变化为50-60MHz/V. 在3GHz频率处1MHz频偏下的相位噪声为-117dBc/Hz.     

2.5GHz低相位噪声CMOS LC VCO的设计

用0 .35μm、一层多晶、四层金属、3.3V的标准全数字CMOS工艺设计了一个全集成的2 .5 GHz L C VCO,电路采用全差分互补负跨导结构以降低电路功耗和减少器件1/ f噪声的影响.为了减少高频噪声的影响,采用了在片L C滤波技术.可变电容采用增强型MOS可变电容,取得了2 3%的频率调节范围.采用单个16边形的对称片上螺旋电感,并在电感下加接地屏蔽层,从而减少芯片面积,优化Q值.取得了在离中心频率1MHz处- 118d Bc/ Hz的相位噪声性能.电源电压为3.3V时的功耗为4 m A.     

一种基于键合线电感的LC-VCO设计方法

提出一种利用键合线电感设计VCO的方法,利用HFSS(High Frequency Structure Simulator)软件,建立电感仿真模型,在5 GHz以下与库模型相吻合.仿真结果表明,差分键合线电感受工艺偏差的影响小于15%,并提出一种减小互感的方式,使电感值在1～5 GHz范围内增加15%～175%.利用HFSS提取的等效电路,设计了一款输出频率为2～3.6 GHz的宽带压控振荡器(VCO),当工作在3.6 GHz时,1 MHz频偏处的相位噪声为-111 dBc/Hz,电流为1.5 mA.电路版图面积仅为0.1 mm2,较之采用片上电感的VCO(0.19 mm2),面积减小45%.     

1V 2.5GHz压控振荡器设计

设计了 1V ,2 .5 GHz的全集成压控振荡器 .通过优化集成电感的设计 ,同时采用 NMOS管和开关电容阵列作为可变电容 ,使该设计具有较低的相位噪声和较宽的调谐范围 .采用 0 .18μm CMOS工艺进行仿真 ,结果显示 ,在1V电源电压下 ,在偏离中心频率 6 0 0 k Hz处的相位噪声为 - 119d Bc/ Hz,调谐范围为 2 8% ,功耗为 3.6 m W.     

2.5GHz低相位噪声CMOS LC VCO的设计

用0.35μm、一层多晶、四层金属、3.3V的标准全数字CMOS工艺设计了一个全集成的2.5GHz LC VCO,电路采用全差分互补负跨导结构以降低电路功耗和减少器件1/f噪声的影响.为了减少高频噪声的影响,采用了在片LC滤波技术.可变电容采用增强型MOS可变电容,取得了23%的频率调节范围.采用单个16边形的对称片上螺旋电感,并在电感下加接地屏蔽层,从而减少芯片面积,优化Q值.取得了在离中心频率1MHz处-118dBc/Hz的相位噪声性能.电源电压为3.3V时的功耗为4mA.     

Two movable-plate nitride-loaded MEMS variable capacitor

A microelectromechanical systems (MEMS) variable capacitor having two movable plates loaded with a nitride layer is proposed. A trench in the silicon substrate underneath the capacitor is used to decrease the parasitic capacitance. The use of an insulation dielectric layer on the bottom plate of the MEMS capacitor increases the capacitor's tuning range and eliminates stiction. Experimental and theoretical results are presented for two capacitors having different capacitance values. The measured tuning range is found to be 280% at 1 GHz. The achievable tuning range far exceeds that of the traditional parallel-plate MEMS variable capacitors. The proposed MEMS variable capacitor is built using the MetalMUMP's process.     

宽频率范围的单子带压控振荡器设计

基于TSMC 180 nm CMOS工艺,提出了一种振荡频率为2～3 GHz的宽频率范围、低相位噪声的单子带压控振荡器(VCO).采用双平衡吉尔伯特混频结构,将单子带5～6 GHz压控振荡器与固定频率3 GHz压控振荡器进行下混频,可得到振荡频率为2～3 GHz的单子带压控振荡器,实现相对带宽从18.18％到40％的展...     

Frequency Tunable Microstrip Patch Antenna Using RF MEMS Technology

A novel reconfigurable microstrip patch antenna is presented that is monolithically integrated with RF microelectromechanical systems (MEMS) capacitors for tuning the resonant frequency. Reconfigurability of the operating frequency of the microstrip patch antenna is achieved by loading it with a coplanar waveguide (CPW) stub on which variable MEMS capacitors are placed periodically. MEMS capacitors are implemented with surface micromachining technology, where a 1-mum thick aluminum structural layer is placed on a glass substrate with a capacitive gap of 1.5 mum. MEMS capacitors are electrostatically actuated with a low tuning voltage in the range of 0-11.9 V. The antenna resonant frequency can continuously be shifted from 16.05 GHz down to 15.75 GHz as the actuation voltage is increased from 0 to 11.9 V. These measurement results are in good agreement with the simulation results obtained with Ansoft HFSS. The radiation pattern is not affected from the bias voltage. This is the first monolithic frequency tunable microstrip patch antenna where a CPW stub loaded with MEMS capacitors is used as a variable load operating at low dc voltages     

A 1.9-GHz CMOS VCO with micromachined electromechanically tunablecapacitors

This paper presents a 1.9-GHz CMOS voltage-controlled oscillator (VCO) where the resonant circuit consists of micromachined electromechnically tunable capacitors and a bonding wire inductor. The tunable capacitors were implemented in a MUMP's polysilicon surface micromachining process. These devices have a nominal capacitance of 2.1 pF and a quality factor (Q-factor) of 9.3 at 1.9 GHz. The capacitance is variable from 2.1 pF to 2.9 pF within a 4-V control, voltage range. The active circuits were fabricated in a 0.5-μm CMOS process. The VCO was assembled in a ceramic package where the MUMP's and CMOS dice were bonded together. The experimental VCO achieves a phase noise of -98 dBc/Hz and -126 dBc/Hz at 100 kHz and 600 kHz offsets from the carrier, respectively. The tuning range of the VCO is 9%. The VCO circuit and the output buffer consume 15 mW and 30 mW from a 2.7-V power supply, respectively     

Post-CMOS micromachined RF varactor with mutual-isolated large-tuning capacitor and low-voltage actuator

A micromachined tunable capacitor is presented with the variable capacitor electrically isolated from the electrostatic actuator for flexible circuit application. Fabricated in low-resisitivity silicon wafer with CMOS-compatible processes, the device exhibits a large tuning range of 218% under 4 V driving, as well as a high Q-factor of 115 at 1 GHz and a high self-resonance frequency of 9.5 GHz.     

Design and modeling of a micromachined high-Q tunable capacitor with large tuning range and a vertical planar spiral inductor

In wireless communication systems, passive elements including tunable capacitors and inductors often need high quality factor (Q-factor). In this paper, we present the design and modeling of a novel high Q-factor tunable capacitor with large tuning range and a high Q-factor vertical planar spiral inductor implemented in microelectromechanical system (MEMS) technology. Different from conventional two-parallel-plate tunable capacitors, the novel tunable capacitor consists of one suspended top plate and two fixed bottom plates. One of the two fixed plates and the top plate form a variable capacitor, while the other fixed plate and the top plate are used to provide electrostatic actuation for capacitance tuning. For the fabricated prototype tunable capacitors, a maximum controllable tuning range of 69.8% has been achieved, exceeding the theoretical tuning range limit (50%) of conventional two-parallel-plate tunable capacitors. This tunable capacitor also exhibits a very low return loss of less than 0.6 dB in the frequency range from 45 MHz to 10 GHz. The high Q-factor planar coil inductor is first fabricated on a silicon substrate and then assembled to the vertical position by using a novel three-dimensional microstructure assembly technique called plastic deformation magnetic assembly (PDMA). Inductors of different dimensions are fabricated and tested. The S-parameters of the inductors before and after PDMA are measured and compared, demonstrating superior performance due to reduced substrate loss and parasitics. The new vertical planar spiral inductor also has the advantage of occupying much smaller silicon areas than the conventional planar spiral inductors.     

Rotational Driven RF Variable Capacitors With Post-CMOS Processes

A ring-shaped on-chip tunable capacitor is proposed and fabricated with CMOS-compatible micromachining processes for radio frequency integrated circuits (RFICs). The rotationally driven variable capacitor features a much higher axial mechanical stiffness compared to its conventional straight-line-driven counterpart, and therefore, can effectively depress the instability caused by environmental vibration when the varactor is used in mobile systems. Meanwhile, the rotationally driven intedigitated capacitor is designed to be very flexible for wide range of electrostatic tuning. Near-room-temperature micromachining techniques are developed for post-CMOS integrating the tunable capacitors into RFIC chips. The fabricated varactor is measured with a tuning ratio of 2.1:1 under an actuation of 12 V. Q-factor is measured as 51.3 at 1 GHz and 35.2 at 2 GHz, while self-resonance frequency is as high as 9.5 GHz. The rotationally driven tunable capacitor shows about two orders of magnitude higher antivibration capability compared to the conventional straight-driven one. Therefore, the high-performance CMOS-compatible tunable capacitors are promising for practical RFIC applications in mobile electronic telecom systems.     

Micromachined varactor with wide tuning range

A micromachined variable capacitor that achieves a wide tuning range is proposed. The device, which was fabricated in a polysilicon surface micromachining process, has a tuning range of 25% and a quality factor of 9.6 at 1 GHz when the capacitance is tuned to 4pF     

硅基铝T形梁MEMS可变电容的设计与模拟

提出了一种新颖的运用于射频通信系统VCO中的RFMEMS可变电容。该电容使用平行板和T形梁结构,使用硅衬底,整个结构由铝材料组成,结构简单,与集成电路工艺兼容,从而能够实现片上可变电容。通过静电力驱动上极板向下运动,电容值相应地发生改变,当上极板加电压从2.4V变化到4.3V时,电容值从0.25pF变化到0.33pF,变化率为中心电容的27%。使用Coventor软件对该器件进行了模拟,给出的模拟结果包括容量、调节范围、瞬时响应、Pullin电压和运用该可变电容的VCO的电路模拟。