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1.
主要对影响锗单晶抛光后表面微粗糙度的关键因素—抛光液组分的作用进行分析。采用变量控制的实验方法,从活性剂、有机胺碱、氧化剂、硅溶胶磨料和螯合剂五个因素出发进行实验。针对粗糙度影响因素进行分析与优化,同时对抛光速率进行了分析,研究得出,抛光液组分中氧化剂浓度对CMP过程中锗衬底片表面微粗糙度及去除速率的影响最为显著。优化抛光液组分配比,在抛光速率基本满足工业要求(1.5μm/min)下,经过CMP后锗衬底表面微粗糙度可有效降到1.81 nm(10μm×10μm)。在最佳配比下,采用小粒径、低分散度(99%82.2 nm)的硅溶胶磨料配制抛光液,其抛光效果明显优于采用大粒径、高分散度的硅溶胶磨料配制的抛光液。  相似文献   

2.
以采用改进无皂乳液聚合法制备的纳米尺寸聚苯乙烯(PS)微球为内核,采用原位化学沉淀法制备了不同壳层厚度的PS/CeO2核/壳包覆结构复合微球。将所制备的复合颗粒用于二氧化硅介质层的化学机械抛光,用原子力显微镜测定晶片的微观形貌和粗糙度。电镜结果表明:复合颗粒呈规则球形,其PS内核尺寸约为72 nm,CeO2壳厚为5~20 nm。抛光结果显示:在本实验范围内,抛光速率随抛光压力的增加而增大,而过低(2.4 psi,1 psi=6 895 Pa)或过高(6.1 psi)的抛光压力均使晶片表面产生划痕。当抛光压力适中(4.5 psi)时,经复合磨料(壳厚约为13 nm)抛光后的晶片表面无明显划痕,在5μm×5μm范围内表面均方根粗糙度为0.265 nm,抛光速率达98.7 nm/min。  相似文献   

3.
在本文中,采用化学机械抛光(CMP)对TiO2薄膜进行平坦化处理,以降低TiO2薄膜表面粗糙度和提升抛光去除速率。实验基于优化的TiO2薄膜CMP工艺参数,通过研究抛光液组分:硅溶胶浓度、螯合剂和活性剂浓度以及抛光液pH值对材料去除速率和表面粗糙度的影响,获得最佳的抛光液组分。实验结果表明:在磨料SiO2浓度为8 %、螯合剂为10 ml/L、活性剂为50 ml/L,pH = 9.0时,TiO2薄膜材料去除速率(MRR)为65.6 nm/min,表面粗糙度(Ra)为1.26 ?(测试范围: 10 μm×10 μm),既保证了较高去除速率又降低了表面粗糙度。  相似文献   

4.
为实现TSV硅衬底表面微粗糙度及去除速率的优化,对影响TSV硅衬底精抛后表面微粗糙度的关键因素——抛光液组分的作用进行分析。采用正交实验方法进行精抛液组分(包括有机胺碱、螯合剂、磨料和活性剂)配比控制的组合实验。实验结果表明,抛光液组分中活性剂体积分数对CMP过程中硅衬底片表面微粗糙度及去除速率的影响最为显著。优化抛光液组分配比条件下,CMP后硅衬底表面微粗糙度可有效降到0.272 nm(10μm×10μm),去除速率仍可达到0.538μm/min。将优化后的抛光液与生产线上普遍采用的某国际商用抛光液进行对比,在抛光速率基本一致的条件下,粗糙度有效降低50%。  相似文献   

5.
为了在浅沟槽隔离(STI)化学机械平坦化(CMP)过程中提高对SiO2介质层去除速率的同时保持晶圆表面一致性,研究了SiO2/CeO2混合磨料的协同作用以及对SiO2介质层去除速率及一致性的影响。结果显示,相比于单一磨料,采用混合磨料能够兼顾介质去除速率和一致性。采用质量分数10%SiO2(粒径为80 nm)与质量分数0.7%CeO2磨料混合抛光后,对介质层的去除速率达到347 nm/min,片内非均匀性(WIWNU)为9.38%。通过场发射扫描电子显微镜(FESEM)观察颗粒状态发现,晶圆表面吸附大量的SiO2颗粒会阻碍CeO2磨料与晶圆表面接触,从而降低对晶圆中心的去除速率,使化学作用更均匀。通过将小粒径SiO2磨料(40 nm)与CeO2磨料混合,使介质层去除速率进一步提升至374 nm/min, WIWNU降低到8.83%,用原子力显微镜(AFM)表征抛光后晶圆...  相似文献   

6.
对InP晶片进行了集群磁流变抛光实验,研究了抛光过程中磨料参数(类型、质量分数和粒径)对InP材料去除速率和表面粗糙度的影响。实验结果表明,InP晶片的去除速率随磨料硬度的增加而变大,表面粗糙度受磨料硬度和密度的综合影响;在选取的金刚石、SiC、Al2O3和SiO2等4种磨料中,使用金刚石磨料的InP去除速率最高,使用SiC磨料的InP抛光后的表面质量最好。随着SiC质量分数的增加,InP去除速率逐渐增加,但表面粗糙度先减小后增大。当使用质量分数4%、粒径3μm的SiC磨料对InP晶片进行抛光时,InP去除速率达到2.38μm/h,表面粗糙度从原始的33 nm降低到0.84 nm。  相似文献   

7.
针对硅衬底的化学机械抛光,采用自制的大粒径硅溶胶抛光液进行抛光实验,研究了抛光液中主要组分对抛光速率和表面平整度的影响,以提高抛光速率和抛光质量,采用测厚仪、AFM、台阶仪对抛光速率和表面进行了测试和表征.通过优化实验获得了高速率、高平整的抛光表面.去除速率(MRR)达697nm/min,表面粗糙度(RMS)降低至0.4516nm,在提高抛光速率的同时对硅片实现了超精密抛光.  相似文献   

8.
针对硅衬底的化学机械抛光,采用自制的大粒径硅溶胶抛光液进行抛光实验,研究了抛光液中主要组分对抛光速率和表面平整度的影响,以提高抛光速率和抛光质量,采用测厚仪、AFM、台阶仪对抛光速率和表面进行了测试和表征.通过优化实验获得了高速率、高平整的抛光表面.去除速率(MRR)达697nm/min,表面粗糙度(RMS)降低至0.4516nm,在提高抛光速率的同时对硅片实现了超精密抛光.  相似文献   

9.
为提高硅晶片双面超精密抛光的抛光速率,在分析双抛工艺过程基础上,采用自制大粒径二氧化硅胶体磨料配制了SIMIT8030-Ⅰ型新型纳米抛光液,在双垫双抛机台上进行抛光实验.抛光液、抛光前后厚度、平坦性能及粗糙度通过SEM、ADE-9520型晶片表面测试仪、AFM进行了表征.结果表明:与进口抛光液Nalco2350相比,SIMIT8030-Ⅰ型抛光液不仅提高抛光速率40%(14μm/h vs 10μm/h);而且表面平坦性TTV和TIR得到改善;表面粗糙度由0.4728nm降至0.2874nm,即提高抛光速率同时显著改善了抛光表面平坦性和粗糙度.  相似文献   

10.
针对硅衬底的化学机械抛光,采用自制的大粒径硅溶胶抛光液进行抛光实验,研究了抛光液中主要组分对抛光速率和表面平整度的影响,以提高抛光速率和抛光质量,采用测厚仪、AFM、台阶仪对抛光速率和表面进行了测试和表征. 通过优化实验获得了高速率、高平整的抛光表面. 去除速率(MRR)达697nm/min,表面粗糙度(RMS)降低至0.4516nm,在提高抛光速率的同时对硅片实现了超精密抛光.  相似文献   

11.
The impact of various rapid thermal annealing used during the integration on the La2O3/HfO2 and HfO2/La2O3 stacks deposited by Atomic Layer deposition was analyzed. The consequences of lanthanum localization in such stacks on the evolution of the films during the rapid thermal annealing are investigated in term of morphology, crystalline structure, silicate formation and film homogeneity as a function of the depth. It appeared that the La2O3 location has an impact on the temperature of the quadratic phase formation which could be linked to the formation of SiOHfLa silicate and the resistance of the films to dissolution in HF 0.05 wt%.  相似文献   

12.
在分析了混响室中引起混响时间测量随机误差之后,提出将测点置于混响室角点上,这是更为合理的测量方法。  相似文献   

13.
It is reported for that H2 plasma followed by O2 plasma is more effective for passivating grain boundary states in polysilicon thin film. Polysilicon thin-film transistors (TFTs) made after H2/O2 plasma treatment can exhibit a turn-on threshold voltage of -0.1 V, a subthreshold swing of 0.154 V/decade, an ON/OFF current ratio Ion/Ioff over 1×108, and an electron mobility of 40.2 cm2 /V-s  相似文献   

14.
TiO_2/SiO_2、ZrO_2/SiO_2多层介质膜光学损耗及激光损伤研究   总被引:9,自引:0,他引:9  
吴周令  范正修 《中国激光》1989,16(8):468-470
以TiO_2/SiO_2及ZrO_2/SiO_2多层介质膜为例,测试了不同工艺条件及不同膜系结构下薄膜样品的光学损耗及激光损伤阈值,同时对实验结果作了初步的分析讨论.  相似文献   

15.
This paper describes reaction kinetics of chemical vapor deposition of WSix films from WF6 and SiH2Cl2, focusing on the effect of added H2, SiH4, and Si2H6 as an active reaction initiator. Our studies indicate that the temperature at which film formation is extinguished, Tex, can be lowered by introducing H2 instead of the standard Ar carrier gas. For a SiH2Cl2/WF6 pressure ratio of 20, H2 addition changed the deposition mode from selective W deposition to blanket WSix deposition. The added H2 also improved the step-coverage profile for substrate temperatures below 600 °C. Measured step coverage profiles indicate that the activation energy of deposition species was 147 kJ/mol. Adding either SiH4 or Si2H6 can assist the film-forming reactions to achieve acceptable Si/W atomic composition ratios. Under these conditions, the residual fluorine concentration remained at acceptably low levels that are typical of conventional WF6/SiH2Cl2 CVD processes.  相似文献   

16.
The harmonic generating properties of potassium lanthanum nitrate (KLN) and potassium cerium nitrate (KCN) are described. These crystals have much larger nonlinear coefficients than potassium dihydrogen phosphate (KDP) and are nearly noncritically phase matched at room temperature for Type I frequency doubling of 1.064-μm light, and for Type II doubling of light near 0.95 μm. Thus, these crystals are useful for generating blue-green light by frequency doubling high-power near-infrared lasers. The crystal growth of KLN and KCN are described by the three component phase diagrams. Crystallographic data for KCN that confirms its structural similarity to KLN are presented. The optical absorption spectra of the two materials are discussed, and the linear refractive indexes are given  相似文献   

17.
《Microelectronics Journal》1992,23(8):665-669
The high-Tc superconducting material YBa2 Cu3 Oy, well known as a 1–2–3 compound, shows other very interesting properties. One of them is very strong conductivity-oxygen content dependence. On the basis of our previous measurements, an investigation of dilatation synthesis, X-ray diffraction (XRD) analysis and conductivity measurements were performed. The results on quenched and slowly cooled samples show a phase transition region and an obvious interdependence between conductivity, unit cell volume and oxygen content.  相似文献   

18.
The Time-Dependent-Dielectric Breakdown (TDDB) characteristics of MOS capacitors with Hf-doped Ta2O5 films (8 nm) have been analyzed. The devices were investigated by applying a constant voltage stress at gate injection, at room and elevated temperatures. Stress voltage and temperature dependences of hard breakdown of undoped and Hf-doped Ta2O5 were compared. The doped Ta2O5 exhibits improved TDDB characteristics in regard to the pure one. The maximum voltage projected for a 10 years lifetime at room temperature is −2.4 V. The presence of Hf into the matrix of Ta2O5 modifies the dielectric breakdown mechanism making it more adequate to the percolation model. The peculiarities of Weibull distribution of dielectric breakdown are discussed in terms of effect of three factors: nature of pre-existing traps and trapping phenomena; stress-induced new traps generation; interface layer degradation.  相似文献   

19.
Chemical solution deposition, a very useful method for oxide film growth, is used to fabricate Y2Ti2O7 (YTO)-La2Zr2O7 (LZO) composite buffer layers on NiW (200) substrates. It is found that the orientation of the YTO layer is epitaxially related to the orientation of the LZO-NiW template. When YTO is prepared on a 900degC -annealed LZO layer, the orientation of the YTO is (222); however, the (400) oriented YTO layer is obtained when it is deposited on a 1000degC-annealed LZO-NiW template. These results suggest that the YTO orientation can be tuned by the LZO orientation and that YTO can be considered as one of the cap layers for coated conductors.  相似文献   

20.
施敏加 《电子学报》2013,41(6):1088-1092
最近,剩余类环上的常循环码及常循环自对偶码引起了编码学者的极大关注.本文首先利用一些相关的线性码,建立了一类特殊有限链环上长为N的常循环自对偶码的一般理论,利用其结果给出了该环上长为N的(1+uλ)-常循环自对偶码存在的充分条件,得到了该环上长为N的一些常循环自对偶码,并给出了其生成多项式.  相似文献   

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