260 GHz GaN高功率三倍频器设计

基于GaN太赫兹二极管芯片,采用非平衡式电路结构,设计了一款260 GHz三倍频器。采用GaN肖特基二极管芯片提高电路的耐受功率和输出功率;采用“减高+减宽”的输出波导结构抑制二次谐波;采用高低阻抗带线结构设计了倍频器的输入滤波器和输出滤波器。测试结果显示,该三倍频器在261 GHz峰值频率下,实现最大输出功率为69.1 mW,转换效率为3.3%,同时具有较好的谐波抑制特性。     

基于肖特基二极管单片集成芯片的340GHz收发链路

针对太赫兹通信及成像等系统对高集成度射频收发链路的需求,在自主研制的太赫兹肖特基二极管的基础上,建立了器件的精确模型,设计并制备出基于二极管的倍频/混频单片集成芯片,解决了传统二极管装配难度大、一致性差的难题,提高了器件的性能。成功研制出170 GHz、340 GHz倍频器和340 GHz混频器模块,并且开发出集成化的340 GHz发射与接收链路。发射端一体化模块实现了342 GHz功率为22 mW的输出,接收端一体化模块实现了330～350 GHz单边带变频损耗在10 dB上下。该模块的开发为未来太赫兹通信及成像技术的应用奠定基础。     

基于肖特基变容二极管和改进型CSMRs滤波器单级340GHz四倍频器

在四倍频器设计中首先对二极管进行I-V曲线、C-V曲线、等离子振荡和趋肤效应等进行计算,完成肖特基二极管电路建模;通过谐波和三维电磁仿真工具优化电路中各次谐波最佳阻抗值;通过引入改进紧凑型悬置微带线震荡器(Compact Suspended Microstrip Resonators(CSMRs))滤波器,成功将二次和三次谐波短路,同时减小长宽比,满足装配条件。实验表明,四倍频在334~346 GHz频段内输出功率均大于1 mW,最大输出4 mW,当驱动功率为100 mW时,最高效率可达3%。     

高效170 GHz平衡式肖特基二极管倍频器

太赫兹源的输出功率是限制太赫兹技术远距离应用的重要参数。为了实现高效的太赫兹倍频器,基于高频特性下肖特基二极管的有源区电气模型建模方法,利用指标参数不同的两种肖特基二极管,研制出了两种170 GHz平衡式倍频器。所采用的肖特基二极管有源结区模型完善地考虑了二极管IV特性,载流子饱和速率限制,直流串联电阻以及趋肤效应等特性。通过对两种倍频器仿真结果进行对比,完备地分析了二极管主要指标参数对倍频器性能的影响。最后测试结果显示两种平衡式170 GHz倍频器在155~178 GHz工作带宽内的最高倍频效率分别大于11%和24%,最高输出功率分别大于15 mW和25 mW。从仿真和测试结果表示,采用的肖特基二极管建模方法和平衡式倍频器结构适用于研制高效的太赫兹倍频器。     

多阳极220GHz倍频器单片设计

介绍了一款基于GaAs肖特基二极管单片工艺的220 GHz倍频器的设计过程以及测试结果。为提高输出功率,倍频器采用多阳极结构,8个二极管在波导呈镜像对称排列,形成平衡式倍频器结构。采用差异式结电容设计解决了多阳极结构端口散射参数不一致问题,提高了倍频器的转换效率和工作带宽。对设计的倍频器进行流片、装配和测试,测试结果显示：倍频器在204～234 GHz频率范围内,转化效率大于15%;226 GHz峰值频率下实现最大输出功率为90.5 mW,转换效率为22.6%。设计的220 GHz倍频器输出功率高,转化效率高,工作带宽大。     

基于肖特基二极管的太赫兹二倍频器设计

固态倍频器是太赫兹源应用中的关键器件,如何利用非线性器件提高太赫兹倍频器件的效率是设计太赫兹固态电路的关键。本文介绍了利用肖特基二极管非线性特性设计固态太赫兹二倍频器的2种方法,即采用直接阻抗匹配和传输模式匹配设计了2种不同拓扑结构的170 GHz二倍频器,针对设计的结构模型,分别进行三维有限元电磁仿真和非线性谐波平衡仿真。仿真结果表明,在17 dBm输入功率的驱动下,倍频器在160 GHz~180 GHz输出频率范围内,倍频效率在15%左右,输出功率大于7 mW。最后对2种方法设计的倍频器结构进行了简单对比和分析,为今后太赫兹倍频研究和设计提供仿真方法。     

基于倒扣技术的190~225 GHz肖特基二极管高效率二倍频器

基于分立式GaAs肖特基势垒二极管,研制出了190～225 GHz高效率二倍频器.50 μm厚石英电路利用倒扣技术,实现二极管的良好散热、可靠的射频信号及直流地.通过数值分析方法,二极管非线性结采用集总端口模拟,提取二极管的嵌入阻抗,以设计阻抗匹配电路.在202 GHz,测得最高倍频效率为9.6％,当输入驱动功率为85.5 mW时,其输出功率为8.25 mW;在190～225 GHz,测得倍频效率典型值为7.5％;该二倍频器工作频带宽、效率响应曲线平坦,性能达到了国外文献报道的水平.     

基于肖特基二极管的275 GHz三倍频器研制

为达到接收机中550 GHz混频器前端本振源的输出功率,对核心器件倍频器进行了研究.采用固态电子器件的方式设计并实现了275 GHz非平衡式三倍频器.通过建立理想倍频器电路模型,分析了肖特基二极管管芯参数对整体倍频器性能的影响,并对电路中等效电容、电感值及输入输出匹配端阻抗和相位进行了优化设计,以提升带外抑制特性和倍频...     

340 GHz基于肖特基二极管未匹配电路倍频源

太赫兹技术是一个新兴的交叉研究领域。在过去20 年,太赫兹技术有了巨大的发展。倍频器是太赫兹差分接收机重要技术,主要运用在天文、大气和行星科学射频前端。太赫兹空白的存在主要因素是缺少高效太赫兹源和探测器。通过倍频器技术和放大技术,可以得到高稳定低相噪的倍频源。340 GHz 是太赫兹大气传输窗口之一,所以340 GHz 倍频源能够运用在各种通信成像系统中。肖特基二极管倍频源可以工作在常温和低温下。倍频器是倍频链路最关键的部分。通过理论分析和3D 电磁仿真设计了一个340 GHz 倍频器。实验得到最大输出功率为4.8 dBm,最大效率为3%,在331~354.5 GHz输出功率大于0 dBm。实验结果证明电路仿真和建模的可行性。     

基于AlGaN/GaN HEMT太赫兹探测器的340 GHz无线通信接收前端

利用天线耦合AlGaN/GaN HEMT太赫兹探测器的自混频和外差混频效应,分别设计并测试了340 GHz频段直接检波式和外差混频式接收机前端。通过接收机信噪比的测量和接收功率的定标,得到了两种接收机的等效噪声功率。直接检波模式下探测器的响应度约为20 mA/W,直接检波模式和外差混频模式下接收机的等效噪声功率分别约为?64.6 dBm/Hz1/2和?114.79 dBm/Hz。在相同的载波功率和接收信号带宽条件下,当本振太赫兹波功率大于?7 dBm时,外差混频接收的信噪比优于直接检波的信噪比。当本振功率大于0 dBm时,外差混频接收机表现出优良的解调特性,其信噪比高出直接检波接收机的信噪比10 dB以上。     

Numerical simulation of UV LEDs with GaN and BGaN single quantum well

The objective of this work is to simulate a single quantum well ultraviolet light emitting diode (LED) based on AlGaN/GaN/AlGaN and AlGaN/BGaN/AlGaN, by using TCAD Silvaco simulator. The first structure has a GaN quantum well taken between two layers, of n-AlGaN and p-AlGaN. The second one has a BGaN quantum well instead of GaN. We fix the concentration of the boron in BGaN to only 1% and we vary the thickness of GaN and BGaN quantum well layer from 7 to 20 nm, for the two structures. As results, we obtain respectively for GaN-LED and BGaN-LED, a maximum current of 0.52 and 0.27 mA, a maximum power spectral density of 1.935 and 6.7 W cm⁻¹ eV⁻¹, a maximum spontaneous emission of 3.34 × 10²⁸ and 3.43 × 10²⁸ s⁻¹ cm⁻³ eV⁻¹, and a maximum Light output power of 0.56 and 0.89 mW.     

GaN基蓝光器件的研究进展

本文对近几年ＧａＮ基蓝光器件，包括ＧａＮ基发光二极管和激光二极管的发展历程进行了全面介绍和评价。指出ＧａＮ基蓝光ＬＥＤ的研究开发技术将在１－２年内走向成熟，从而实现大规模商业化生产，而ＧａＮ基蓝光ＬＤ也将在近二年内实用化。     

（英）基于肖特基平面二极管的150 GHz和180 GHz固定调节式倍频源

利用GaAs肖特基平面二极管,基于石英薄膜电路工艺,采用场和路相结合的综合分析方法,研制出了两个不同频率带宽的倍频器.在场软件中,二极管非线性结采用集总端口模拟,以提取二极管的嵌入阻抗,设计二倍频器的无源匹配电路,优化倍频的整体电路性能,提取相应的S参数文件,分析倍频器的效率.150 GHz二倍频器在149.2 GHz测得最高倍频效率7.5％,在147.4～152 GHz效率典型值为6.0％;180 GHz二倍频器在170 GHz测得最高倍频效率14.8％,在150 ～ 200 GHz效率典型值为8.0％.     

Influence of growth temperature and growth rate of p-GaN layers on the characteristics of green light emitting diodes

We investigated the electrical and structural qualities of Mg-doped p-type GaN layers grown under different growth conditions by metalorganic chemical vapor deposition (MOCVD). Lower 300 K free-hole concentrations and rough surfaces were observed by reducing the growth temperature from 1,040°C to 930°C. The hole concentration, mobility, and electrical resistivity were improved slightly for Mg-doped GaN layers grown at 930°C with a lower growth rate, and also an improved surface morphology was observed. In_0.25Ga_0.75N/GaN multiple-quantum-well light emitting diodes (LEDs) with p-GaN layers grown under different conditions were also studied. It was found from photoluminescence studies that the optical and structural properties of the multiple quantum wells in the LED structure were improved by reducing the growth temperature of the p-layer due to a reduced detrimental thermal annealing effect of the active region during the GaN:Mg p-layer growth. No significant difference in the photoluminescence intensity depending on the growth time of the p-GaN layer was observed. However, it was also found that the electroluminescence (EL) intensity was higher for LEDs having p-GaN layers with a lower growth rate. Further improvement of the p-GaN layer crystalline and structural quality may be required for the optimization of the EL properties of long-wavelength (∼540 nm) green LEDs.     

Comparison of GaN and In<Subscript>0.04</Subscript>Ga<Subscript>0.96</Subscript>N <Emphasis Type="Italic">p</Emphasis>-Layers on the Electrical and Electroluminescence Properties of Green Light Emitting Diodes

We have compared the effects of Mg-doped GaN and In_0.04Ga_0.96N layers on the electrical and electroluminescence (EL) properties of the green light emitting diodes (LEDs). To investigate the effects of different p-layers on the LED performance, the diode active region structures were kept identical. For LEDs with p-InGaN layers, the p-In_0.04Ga_0.96N/GaN polarization-related EL peak was dominant at low current levels, while the multiple-quantum-well (MQW) peak became dominant at higher current levels, different from LEDs with p-GaN layers. Also, LEDs with p-InGaN exhibited slightly higher turn on voltages (V _on ) and forward voltages (V _f ) compared to LEDs with p-GaN layers. However, the MQW related EL intensity was much higher and diode series resistance lower for LEDs with p-InGaN layers compared with LEDs with p-GaN, showing possible improvements in output power for LEDs with p-InGaN layers. The diodes with p-GaN layers typically showed V _f of ∼3.1 V at a drive current of 20 mA, with a series resistance of ∼24.7 Ω, while diodes with p-InGaN showed V _f of ∼3.2 V, with a series resistance of ∼18.5 Ω, for device dimensions of 230 μm by 230 μm.     

周期极化GaAs晶体中差频产生太赫兹辐射的研究

传统的光学差频产生的太赫兹辐射转换效率低,不能获得高功率太赫兹辐射。本文对周期极化GaAs晶体中差频产生太赫兹辐射进行了理论计算,通过温度调谐实现了周期极化GaAs晶体中差频获得可调谐太赫兹波的输出。为了提高差频过程的增益和量子效率,在准相位匹配基础上引进了级联差频机理,并对最佳晶体长度和最佳泵浦频率进行了计算。结果表明,利用周期极化的GaAs晶体可以获得更高能量更高效率的太赫兹波辐射。     

Characteristics of Green Light-Emitting Diodes Using an InGaN:Mg/GaN:Mg Superlattice as p-Type Hole Injection and Contact Layers

Mg-doped InGaN/GaN p-type short-period superlattices (SPSLs) are developed for hole injection and contact layers of green light-emitting diodes (LEDs). V-defect-related pits, which are commonly found in an InGaN bulk layer, can be eliminated in an InGaN/GaN superlattice with thickness and average composition comparable to those of the bulk InGaN layer. Mg-doped InGaN/GaN SPSLs show significantly improved electrical properties with resistivity as low as ∼0.35 ohm-cm, which is lower than that of GaN:Mg and InGaN:Mg bulk layers grown under optimized growth conditions. Green LEDs employing Mg-doped InGaN/GaN SPSLs for hole injection and contact layers have significantly lower reverse leakage current, which is considered to be attributed to improved surface morphology. The peak electroluminescence intensity of LEDs with a SPSL is compared to that with InGaN:Mg bulk hole injection and contact layers.     

电流增益截止频率为236GHz的InAIN/GaN高频HEMT

研制了高电流增益截止频率(fT)的InAlN/GaN高电子迁移率晶体管(HEMT).采用金属有机化学气相沉积(MOCVD)再生长n+GaN非合金欧姆接触工艺将器件源漏间距缩小至600 nm,降低了源、漏寄生电阻,有利于改善器件的寄生效应;使用低压化学气相沉积(LPCVD)生长SiN作为栅下介质,降低了InAlN/GaN HEMT栅漏电;利用电子束光刻实现了栅长为50 nm的T型栅.此外,还讨论了寄生效应对器件fT的影响.测试结果表明,器件的栅漏电为3.8 μA/mm,饱和电流密度为2.5 A/mm,fT达到236 GHz.延时分析表明,器件的寄生延时为0.13 ps,在总延时中所占的比例为19％,优于合金欧姆接触工艺的结果.     

A high power active circulator using GaN MMIC power amplifiers

This paper presents a 2.4 GHz hybrid integrated active circulator consisting of three power amplifiers and three PCB-based Wilkinson power dividers.The power amplifiers were designed and fabricated in a standard0.35- m Al Ga N/Ga N HEMT technology,and combined with three traditional power dividers on FR4 using bonding wires.Due to the isolation of power dividers,the isolation between three ports is achieved; meanwhile,due to the unidirectional characteristics of the power amplifiers,the nonreciprocal transfer characteristic of the circulator is realized.The measured insertion gain of the proposed active circulator is about 2–2.7 d B at the center frequency of 2.4 GHz,the isolation between three ports is better than 20 d B over 1.2–3.4 GHz,and the output power of the designed active circulator achieves up to 20.1–21.2 d Bm at the center frequency.