锑锰锆钛酸铅压电陶瓷的MnO2改性研究

探讨了MnO2过量对锑锰锆钛酸铅(Pb(Mn1/3Sb2/3)0.05Zr0.47Ti0.48O3,简写为PMSZT5)压电陶瓷的性能影响。通过X线衍射(XRD)分析了PMSZT5+z%MnO2(z=0～0.7,质量分数)陶瓷的相组成。结果发现,合成温度900℃保温2h后可得到完全钙钛矿结构。随着锰含量的增大,体系从准同型相界向三方相转变。z>0.1、1 240℃烧结温度下,介电常数ε3T3/ε0、压电常数d33、机电耦合系数kp达到最佳值,即ε3T3/ε0=1 560、d33=350pC/N、kp=0.63。该组成的谐振频率fr、横向机电耦合系数k31和压电常数d31的温度稳定性与未掺杂相比有所改善。过量锰的加入使PMSZT5的居里温度降低。     

PMSZT压电陶瓷的镍掺杂改性研究

探讨了Ni2O3掺杂对Pb(Mn1/3Sb2/3)0.05Zr0.47Ti0.48O3(PMSZT)材料相组成、显微结构、电性能及温度稳定性的影响。结果发现,合成温度900℃时可以得到钙钛矿结构。随着掺杂量的增大,四方相的含量减少,准同型相界向三方相移动,且居里温度增加。掺杂w(Ni2O3)=0.05%时,rε、d33、kp和Qm达到最佳值:rε=1 780、tanδ=0.003 5、d33=375 pC/N、kp=0.665、Qm=2 580。谐振频率变化率随温度变化由正到负。体系适于大功率陶瓷材料的应用。     

SiO_2掺杂低温烧结PMMNS压电陶瓷的结构和性能

采用固相二步合成法制备SiO2掺杂Pb(Mg1/3Nb2/3)0.05(Mn1/3Nb2/3)0.04(Mn1/3Sb2/3)0.01Zr0.45Ti0.45O3(PMMNS)压电陶瓷,探讨了不同SiO2掺杂量对陶瓷样品的相结构和机电性能的影响。结果表明:在烧结温度为980℃时,可以得到纯钙钛矿结构PMMNS陶瓷。SiO2的加入,明显降低了PMMNS陶瓷的烧结温度。当SiO2的掺杂量为质量分数0.10%时,所得性能最佳:kp=0.51,d33=323pC/N,Qm=1475,tanδ=0.0038和εr=1762。     

SiO2掺杂对PMS-PZT陶瓷结构和电性能的影响

对Pb0.98Sr0.02(Mn1/3Sb2/3)0.1Zr0.47Ti0.43O3(简称PMS-PZT)+w(SiO2)(0≤w≤0.6%)三元系压电陶瓷材料的微观结构和电性能进行了研究。XRD图谱表明室温下该材料为钙钛矿结构,并随SiO2掺杂物的加入材料由四方相向三方相转变。实验结果表明:当w(SiO2)为0.1%时,在1300℃,1h条件下烧结,能获得较好的综合性能:εr为1642,tgδ为0.0043,kp为0.57,Qm为1553,d33为325pC·N–1,可以满足压电电动机和压电变压器等高功率应用方面的要求。     

PMS对PBSZT压电陶瓷结构与性能的影响

采用传统固相合成法制备了Pb(Mn1/3Sb2/3)O3掺杂的(1–x)(Pb0.92Ba0.02Sr0.06)(Zr0.52Ti0.48)O3-xPb(Mn1/3Sb2/3)O3[xPMS-(1–x)PBSZT]压电陶瓷。通过XRD、SEM和准静态d33仪等手段探讨了PMS掺杂量对xPMS-(1–x)PBSZT陶瓷样品的相结构、显微结构和电性能的影响。结果表明:适量的PMS掺杂有助于降低陶瓷样品的烧结温度,x=0.01的样品在1 230℃烧结具有最大体积密度7.83 g/cm3。当x=0.02时,其具有最佳综合电性能,主要参数为:d33=349pC/N,kp=0.592,εr=1 587,tanδ=0.46%。     

Mn1/3Sb2/3对压电陶瓷材料性能的影响

研究了Pb(Mn1/3Sb2/3)y(Zn1/3Nb2/3)0.16(Zr,Ti)0.84-yO3(系压电陶瓷的主要特性，讨论了（Mn1/3Sb2/3)现代量变化对材料性能的影响。通过测试材料的介电损耗tanδ介电常数ε、机电耦合系数kp和机械品质因数Qm，判断出Mn1/3Sb2/3在PMZN系材料中的最佳取代范围。     

一种大功率压电陶瓷变压器材料研究

采用传统陶瓷工艺制备了Pb(Ni1/2W1/2)O3-Pb(Mn1/3Sb2/3)O3-Pb(Ti1/2Zr1/2)O3(PNW-PMS-PZT)四元系压电陶瓷。分析了粉体和陶瓷的相结构组成,结果表明烧结温度的提高和PZT含量的增加有助于钙钛矿相的生成,同时发现PZT的含量在0.91～0.93附近有准同型相界存在。研究了室温下烧结温度和PMS含量对相对介电常数εr,机电耦合系数kp,机械品质因数Qm和压电常数d33的影响,实验表明在室温下随着PMS含量的增加εr、kp、d33逐渐减小,Qm增加;随着烧结温度的提高,kp、d33增大。制得了室温下εr为1959,d33为390pC/N,kp为0.614,Qm为1349的大功率压电陶瓷变压器压电材料。     

低损耗、高Q_m值Pb(Nb_(2/3)Mn_(1/3))O_3-Pb(Sb_(2/3)Mn_(1/3))O_3-PZT材料

研究了组分变化及掺杂对四元系 Pb( Nb2 /3Mn1 /3) O3- Pb( Sb2 /3Mn1 /3) O3- PZT压电材料性能的影响 ,发现 Zr/Ti比值在准同型相界附近该材料有最大的压电常数 d33,而机械品质因数 Qm 值较小 ;Zr/Ti比偏离该相界时则机械品质因数 Qm 升高 ,相应的压电常数 d33减小。通过改变 Pb( Nb2 /3Mn1 /3) O3、Pb( Sb2 /3Mn1 /3) O3两组分的含量及掺入 Sr、Ce等杂质 ,获得的材料介电损耗为 0 .14 % ,机械品质因数为 2 3 4 1,压电常数为 2 16p C/N。     

Zr/Ti比及Sr掺杂对PNN-PSN-PMN-PZT压电陶瓷性能的影响

采用固相烧结法制备了五元系PNN-PSN-PMN-PZT压电陶瓷,通过X线衍射(XRD)研究了组分不同Zr/Ti比的相结构,并研究不同Zr/Ti比和Sr掺杂量对组分介电、压电性能的影响。研究表明,组分的相结构均为单一的钙钛矿结构;随着Zr/Ti比的增加,组分的相结构由三方相向四方相转变,且组分的准同型相界位于r(Zr)/r(Ti)=0.98附近;在r(Zr)/r(Ti)=0.98的组分中掺杂Sr发现,随着Sr含量的逐渐增加,压电陶瓷的介电和压电性能先增加后减小,当x(Sr)=4.0%时,介电和压电性能出现极大值,即介电常数ε~T_(33)/ε_0=3 578,压电常数d_(33)=652pC/N,机电耦合系数k_p=0.81,品质因数Q_m=65,介电损耗tanδ=1.72%,居里温度T_C=191℃,且具有典型的介电弛豫特性。     

低损耗、高Qm值Pb(Nb2/3Mnl/3)O3-Pb(Sb2/3Mnl/3) O3-PZT材料

研究了组分变化及掺杂对四元系Pb(Nb2/3Mn1/3)O3-Pb(Sb2/3Mn1/3)O3-PZT压电材料性能的影响,发现Zr/Ti比值在准同型相界附近该材料有最大的压电常数d33,而机械品质因数Qm值较小;Zr/Ti比偏离该相界时则机械品质因数Qm升高,相应的压电常数d33减小.通过改变Pb(Nb2/3Mn1/3)O3、Pb(Sb2/3Mn1/3)O3两组分的含量及掺入Sr、Ce等杂质,获得的材料介电损耗为014%,机械品质因数为2341,压电常效为216 pC/N.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.