(SiC)TiN/Cu复合材料的显微组织和导电性能

以醇盐水解--氨气氮化法在SiC颗粒表面包覆TiN,然后采用放电等离子体烧结制备出(SiC)TiN/Cu复合材料.结果表明:醇盐水解--氨气氮化法能够制备出TiN包覆SiC复合粉末,TiN包覆层均匀连续,TiN颗粒的粒径为30～80nm.TiN包覆层能够促进复合材料的致密化并改善界面结合.(SiC)TiN/Cu复合材料的电导率介于15.5～35.7 m.Ω-1.mm-2之间,并且随着SiC体积分数的增加而降低.TiN包覆层和基体中网络结构TiN的存在能够有效提高复合材料的电导率.复合材料的电导率较接近P.G模型的预测值.     

Al_2O_3/SiC纳米陶瓷复合材料的制备及力学性能

采用一次粒径分别为10nm和15nm的αAl2O3和SiC粉体为原料,制备了Al2O3/SiC纳米陶瓷复合材料·纳米SiC颗粒明显抑制Al2O3基体晶粒的长大,SiC体积分数超过4%时,材料的断裂方式由沿晶断裂变为穿晶断裂·随SiC含量的增加,Al2O3/SiC纳米复合材料的硬度增大·材料的弯曲强度和断裂韧性在SiC体积分数为5%时达到最大值·最大三点弯曲强度和断裂韧性分别为641MPa和47MPam1/2,明显高于热压单相Al2O3陶瓷(344MPa和31MPam1/2)·复合材料的强化主要来源于内晶颗粒残余应力强化和晶粒细化...     

SPS烧结CNTs/Cu纳米复合材料的制备与性能

综述了国内外关于放电等离子体烧结(SPS)制备CNTs/Cu纳米复合材料的研究成果,总结了目前CNTs/Cu纳米复合材料制备中的关键问题,即CNTs的均匀分散问题。针对此给出了主要的分散方法,并分别对各种分散方法和试验结果进行了简要的概述。归纳了SPS烧结CNTs/Cu纳米复合材料的物理和力学性能,在此基础上讨论了CNTs在Cu基纳米复合材料中的强化作用。     

POSS/PMMA纳米复合材料制备及其热性能研究

文章以CuCl/2,2’-联吡啶为催化剂,单功能基POSS-Cl为引发剂,采用原子转移自由基聚合方法制备了POSS/PMMA核壳型结构的纳米复合材料,通过FTIR1、H-NMR、XPS等手段对其进行表征,并用DSC、TGA等检测手段对其热性能进行研究。研究结果表明,ATRP法制备POSS/PMMA纳米复合材料是可行的,POSS的加入对PMMA的热性能有较大程度地提高。     

不同类型碳化硅制备的BAS/SiC复合材料组织及力学性能的研究

采用放电等离子烧结(SPS)方法在1 800℃制备了不同类型碳化硅(Si C)的BAS/Si C陶瓷基复合材料.采用阿基米德排水法、XRD、SEM及三点弯曲等分析测试手段研究了复合材料的致密度、物相组成、显微结构及室温力学性能.实验结果表明,BAS能有效地促进复合材料的致密化.复合材料中没有发生β-Si C→α-Si C相的转变.Si C晶粒均匀地分散在连续的BAS晶相中,且与BAS之间结合紧密.与以α-Si C为原始粉体制备的复合材料的室温抗弯强度相比,β-Si C为原始粉体制备的复合材料的室温抗弯强度提高13.93%.     

外氧化法制备Al_2O_3/Cu复合材料的组织与性能

在不添加外氧化剂Cu2O的条件下,通过外氧化法生成氧化剂Cu2O,真空条件下进行Al2O3内氧化与烧结、热挤压和冷拉拔制备了Al2O3颗粒弥散强化的铜基复合材料,对其微观组织和硬度、导电率进行了分析测试。结果表明:外氧化法制备的Al2O3/Cu复合材料,随着Al2O3含量的增加,材料的硬度增加,而导电率减小;进行热挤压变形后,Al2O3/Cu复合材料的硬度随变形量的增加而增加,而导电率降低;制备的冷拉拔变形率为24.8%的1.04wt.%Al2O3/Cu复合材料硬度为69.2 HRB,导电率为73.6%IACS。     

纳米结构合金的机械合金化制备

简要回顾了机械合金化（MA）技术发展的概况，简述了MA在合金中引起的结构演变和非平衡相变的基本过程和机制，在此基础上，结合作者近年来的研究工作，介绍了纳米晶过饱和固溶体合金,纳米相复合合金，纳米结构储氢合金等非平衡态材料的MA制备，及其相关的微观结构与性能。     

Cu/Ni3Ti原位复合材料的显微组织和力学性能

通过真空电弧熔炼法制备了Cu/Ni₃Ti原位复合材料。采用X射线衍射仪、扫描电子显微镜、显微硬度计和纳米压痕仪分别测试了Cu/Ni₃Ti原位复合材料的相组成、微观组织形貌、显微硬度和弹性模量。结果显示,Ni₃Ti相在铜基体中呈针状分布,且铸锭边缘与心部平均晶粒直径分别约为1.74和249 μm。Cu/Ni₃Ti原位复合材料在时效温度为550℃时的强化效果最佳,此时铜基体与Ni₃Ti相的显微硬度最大值分别达到了174和209。在热处理后,Ni₃Ti相的最大硬度和弹性模量分别达到10.5 GPa和249.7 GPa,远高于Cu基体,Ni₃Ti相是一种理想的增强相。     

机械合金化制备γ－TiAl＋Ti_2AlN纳米复合材料

研究了Ｔｉ_（５０）Ａｌ_（５０）混合粉末在氮气氛的机械合金化过程。球磨３０ｈ后Ｔｉ_（５０）Ａｌ_（５０）混合粉末已形成非晶合金；经适当的热处理，可原位形成纳米复合材料γ－ＴｉＡｌ＋Ｔｉ_２ＡｌＮ。     

CVI-RMI法制备C/SiC复合材料的微观结构与弯曲性能

以T700炭纤维准三维编织针刺整体毡为预制体,在炭纤维表面CVI预沉积热解炭涂层,利用化学气相渗透-反应熔体浸渗法(CVI-RMI)制备C/SiC复合材料,观察材料的微观形貌,并探讨界面对弯曲性能的影响。研究结果表明:利用CVI-RMI联合工艺制备的C/SiC复合材料致密度高,开孔率较小(10%),基体分布均匀;材料弯曲强度达133 MPa,呈逐层破坏机制,表现出良好的假塑性;热解炭涂层与CVI-SiC基体减少了RMI工艺过程对炭纤维的损伤,且热解炭涂层调节了炭纤维与基体之间的界面结合状况,有利于纤维的拔出。     

Mechanical and microstructural characterization of Al7075/SiC nanocomposites fabricated by dynamic compaction

This paper describes the synthesis of Al7075 metal matrix composites reinforced with SiC, and the characterization of their microstructure and mechanical behavior. The mechanically milled Al7075 micron-sized powder and SiC nanoparticles are dynamically compacted using a drop hammer device. This compaction is performed at different temperatures and for various volume fractions of SiC nanoparticles. The relative density is directly related to the compaction temperature rise and indirectly related to the content of SiC nanoparticle reinforcement, respectively. Furthermore, increasing the amount of SiC nanoparticles improves the strength, stiffness, and hardness of the compacted specimens. The increase in hardness and strength may be attributed to the inherent hardness of the nanoparticles, and other phenomena such as thermal mismatch and crack shielding. Nevertheless, clustering of the nanoparticles at aluminum particle boundaries make these regions become a source of concentrated stress, which reduces the load carrying capacity of the compacted nanocomposite.     

Microstructure,thermal properties,and corrosion behaviors of FeSiBAlNi alloy fabricated by mechanical alloying and spark plasma sintering

An equiatomic FeSiBAlNi amorphous high-entropy alloy (HEA) was fabricated by mechanical alloying (MA). A fully amorphous phase was obtained in the FeSiBAlNi HEA after 240 h of MA. The bulk FeSiBAlNi samples were sintered by spark plasma sintering (SPS) at 520 and 1080℃ under a pressure of 80 MPa. The sample sintered at 520℃ exhibited an amorphous composite structure comprising solid-solution phases (body-centered cubic (bcc) and face-centered cubic (fcc) phases). When the as-milled amorphous HEA was consolidated at 1080℃, another fcc phase appeared and the amorphous phase disappeared. The sample sintered by SPS at 1080℃ exhibited a slightly higher melting temperature compared with those of the as-milled alloy and the bulk sample sintered at 520℃. The corrosion behaviors of the as-sintered samples were investigated by potentiodynamic polarization measurements and immersion tests in seawater solution. The results showed that the HEA obtained by SPS at 1080℃ exhibited better corrosion resistance than that obtained by SPS at 520℃.     

低热膨胀PVDF/PA11/SiC纳米复合材料的结构与性能研究

具有高度尺寸稳定性的聚合物材料在众多领域有着广泛的应用前景.文章以PVDF/PA11共混物为基体、以纳米SiC为填料制备具有低热膨胀性的三元高分子纳米复合材料,系统研究了纳米SiC对PVDF/PA11共混物结构和性能的影响.结果表明:通过熔融共混制备的该三元复合体系具有独特的阶层式构造,在PVDF和PA11这两相结构中,纳米SiC只选择性地分散在PA11相中,而PVDF相中分散有少量PA11的纳米微区;同时,SiC的加入也可引起PVDF/PA11共混物结构的变化.尤为重要的是,纳米SiC能有效的降低共混物的热膨胀性能,提高材料的拉伸强度和拉伸模量.     

Chemical,mechanical, and thermal expansion properties of a carbon nanotube-reinforced aluminum nanocomposite

In the present study, the chemical and mechanical properties and the thermal expansion of a carbon nanotube (CNT)-based crystalline nano-aluminum (nano Al) composite were reported. The properties of nanocomposites were tailored by incorporating CNTs into the nano Al matrix using a physical mixing method. The elastic moduli and the coefficient of thermal expansion (CTE) of the nanocomposites were also estimated to understand the effects of CNT reinforcement in the Al matrix. Microstructural characterization of the nanocomposite reveals that the CNTs are dispersed and embedded in the Al matrix. The experimental results indicate that the incorporation of CNTs into the nano Al matrix results in the increase in hardness and elastic modulus along with a concomitant decrease in the coefficient of thermal expansion. The hardness and elastic modulus of the nanocomposite increase by 21% and 20%, respectively, upon CNT addition. The CTE of CNT/Al nanocomposite decreases to 70% compared with that of nano Al.     

CuCrW(Al2O3) nanocomposite: mechanical alloying,microstructure, and tribological properties

The effect of alumina nanoparticle addition on the microstructure and tribological properties of a CuCrW alloy was investigated in this work.Mechanical alloying was carried out in a satellite ball mill.The tribological properties of the samples were evaluated using pin-on-disk wear tests with different pins (alumina,tungsten carbide,and steel pins).The results indicated that the tungsten carbide pin had a lower coefficient of friction than the alumina and steel pins because of its high hardness and low surface roughness.In addition,when the sliding rate was decreased,the weight-loss rate increased.The existence of alumina nanoparticles in the nanocomposite led to a lower weight-loss rate and to a change in the wear mechanism from adhesive to abrasive.     

机械合金化与等离子体烧结法制备CoSb3热电材料

研究用机械合金化及等离子体烧结法制备热电材料CoSb3化合物,试验结果表明,原始粉末机械合金化10h后,在500~600℃采用等离子体活化烧结能获得单相的CoSb3化合物,随烧结温度的升高,烧结样品密度增大,热导率随烧结温度的升高而降低。     

SPS方法制备铜/金刚石复合材料

采用放电等离子烧结(SPS)方法制备出高体积分数的铜/金刚石复合材料,并对复合材料的致密度、热导率和热膨胀系数等进行了研究.结果表明,采用该方法制备的铜/金刚石复合材料微观组织均匀,致密度分布为94%～99%,最高热导率为305W.(m.K)-1,热膨胀系数与常见电子半导体材料相匹配,能够满足电子封装材料的要求.     

点缺陷对B2-NiAl力学与热学性能影响的第一性原理计算

基于密度泛函理论的第一性原理平面波赝势法,计算了反位缺陷与空位对B2-NiAl力学与热学性能的影响．采用杨氏模量、剪切模量、弹性常数、Cahchy压力、泊松比、Debye温度、比热、热膨胀系数等参数评判反位缺陷与空位对B2-NiAl合金的延性、硬度及热学性能的影响．结果表明：NiAl,VNi均能提高B2-NiAl晶体的硬度而降低其本征延性,AlNi与vAl对晶体力学性能的影响可以忽略不计．点缺陷对晶体比热的影响均集中在Debye温度以下,在此温度范围内,4种点缺陷均能降低晶体的比热,降幅从高到低依次为VNi〉NiAl〉A1Ni〉VAl．而当温度高于1000K时,4种点缺陷对晶体比热的影响基本消失而使比热趋于同一数值25J／mol·K．当温度高于600K时,对晶体相对热膨胀系数影响较明显的点缺陷是vAl,与NiM前者使晶体的相对热膨胀系数提高,而后者使晶体的相对热膨胀系数降低．     

封装SiCp/Cu复合材料组织性能研究

采用粉末冶金法制备SiC体积分数分别为20%、35%、50%的SiCp/Cu复合材料,并采用扫描电镜、热膨胀仪、热分析仪、洛氏硬度计等对其显微组织、热物理性能和力学性能进行表征。结果表明,随着SiCP含量升高,偏聚现象趋于明显,SiCp/Cu复合材料热导率减小,分别为167、145、130W/m·K,SiCp/Cu复合材料热膨胀系数分别为10.2×10-6、8.6×10-6、9.6×10-6 K-1,呈先减小后增大趋势;在SiCp/Cu复合材料中,当SiC体积分数小于35%时,其硬度值变化取决于SiCp含量,当SiC体积分数大于35%时,其硬度值取决于致密度。     

聚变堆面向等离子体SiC/Cu梯度材料的制备与评价

用超高压梯度烧结法制备出了成分分布从0－100％的接近理论密度的SiC/Cu聚变堆面向等离子体功能梯度材料,化学溅射实验表明其CD4产额与二次纯化石墨相比降低了80％,热解吸收气率约为石墨的10％,在398MW/m2的激光热冲击下,材料表现出现疲劳裂纹和化学分解现象,原位等离子体辐照结果显示陶瓷材料表面出现一定程度的溅射损伤。