高弹性导电合金Cu—Ni—Sn的研究现状

Ｃｕ－Ｎｉ－Ｓｎ合金是调幅分解强化型合金。本文综述了Ｃｕ－Ｎｉ－Ｓｎ合金的研究现状，对材料的制备，热处理工艺，合金的强化机理，微观结构，性能，及它们在电子工业中的应用作了介绍。     

Cu-15Ni-8Sn导电弹性材料的研究现状与进展

综述了Cu-15Ni-8Sn合金的研究概况，分析了合金性能的优势与不足。着重介绍了对合金性能的改进，并展望了合金的应用方向和发展趋势。     

高弹性合金的现状与发展趋势

简述了高弹性合金的发展和分类,阐明了各类高弹性合金的使用现状,从合金化的角度展望了高弹性合金的发展趋势。     

机械合金化Cu—9Ni—6Sn合金的时效

本文对机械合金化法制备的Ｃｕ－９Ｎｉ－６Ｓｎ合金的时效过程研究后发现，时效时发生调幅分解的临界温度为４００－４５０℃。时效前施加一定冷形变量能够加速合金时效强化过程的进程，而且还提高了时效后硬度值。     

化学镀Ni—Sn—P三元合金的工艺和性能的研究

在确定的化学镀Ni-Sn-P镀液组成的条件下，研究了工艺参数（镀液温度和PH）对沉积速度和镀层中含锡量及含磷量的影响，并对该合金镀层的结构，孔隙率及耐蚀性能进行了测试，结果表明：在一定的工艺条件下获得的非晶态合金镀层具有较小的孔隙率和良好的耐蚀性能。     

化学镀Ni－Sn－P三元合金的工艺和性能的研究

在确定的化学镀Ｎｉ－Ｓｎ－Ｐ镀液组成的条件下，研究了工艺参数（镀液温度和ｐＨ）对沉积速度和镀层中含锡量及含磷量的影响，并对该合金镀层的结构、孔隙率及耐蚀性能进行了测试。结果表明：在一定的工艺条件下获得的非晶态合金镀层具有较小的孔隙率和良好的耐蚀性能。     

Ni—Cu—P合金化学镀层制备及组织结构的研究

研究了Ni-Cu-P化学镀液主要成分、pH值及时间等工艺参数对化学沉积Ni-Cu-P合金镀层分及镀速的影响。通过选择适当的镀液成分及工艺参数,得到了Cu含量从0到56．18wt%的Ni-Cu-P合金镀层。利用X射线能谱术（EDS）和X射线衍射术（XRD）研究了镀液中硫酸铜浓度对Ni-Cu-P合金镀层成分及组织结构的影响。在硫酸铜浓度低于3g/l时,Ni-Cu-P合金镀层中P含量高于7．05wt%,合金底层是非晶态结构。     

Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

A kinetic model based on the principle of maximum degradation rate of the total system free energy, MDR law using thermodynamic data, is proposed and successfully applied to the selection of the first intermetallic compound (IMC) phase in Cu/Sn and Ni/Sn diffusion couples. The first phases predicted with this model for Cu/Sn and Ni/Sn are Cu₆Sn₅ and Ni₃Sn₄, respectively, resulting in good agreement with experimental observations.     

Cu-9Ni-6Sn合金概述

综述了Cu-9Ni-6Sn合金的组织特征与强化机理,着重叙述了添加Mn对合金性能的改进,并介绍了合金的应用情况.     

机械合金化Cu-9Ni-6Sn合金的时效

本文对机械合金化法制备的 Cu-9Ni-6Sn合金的时效过程研究后发现 ,时效时发生调幅分解的临界温度为 4 0 0 -4 50℃。时效前施加一定冷形变量能够加速合金时效强化过程的进程 ,而且还提高了时效后硬度值。     

舰船用BFe10-1-1铜镍合金凸缘管件研制

以５７×１．５管为代表探讨了船用ＢＦｅ１０－１－１凸缘管件的成形方法及工艺状况，给出了合理可行的工艺参数。将研制产品与同规格德国产品进行了对比检测。检测结果表明，研制产品满足相应的德国标准的要求     

Al、Sn、Cu元素对钛合金力学性能及弹性模量的影响

研究了Al、Sn、Cu元素对钛合金强度、延伸率以及弹性模量的影响。结果表明,随着合金元素的增加,合金强度均升高;在试验范围内,Sn元素含量超过5%后,合金弹性模量和延伸率呈下降趋势,Al、Cu元素的增加对合金延伸率无明显影响,与弹性模量呈线性关系。     

Different Diffusion Behavior of Cu and Ni Undergoing Liquidesolid Electromigration

The diffusion behavior of Cu and Ni atoms undergoing liquidesolid electromigration（L-S EM） was investigated using Cu/Sn/Ni interconnects under a current density of 5.0 103A/cm2 at 250℃. The flowing direction of electrons significantly influences the cross-solder interaction of Cu and Ni atoms, i.e., under downwind diffusion, both Cu and Ni atoms can diffuse to the opposite interfaces; while under upwind diffusion,Cu atoms but not Ni atoms can diffuse to the opposite interface. When electrons flow from the Cu to the Ni, only Cu atoms diffuse to the opposite anode Ni interface, resulting in the transformation of interfacial intermetallic compound（IMC） from Ni3Sn4into（Cu,Ni）6Sn5and further into [（Cu,Ni）6Sn5t Cu6Sn5], while no Ni atoms diffuse to the opposite cathode Cu interface and thus the interfacial Cu6Sn5 remained.When electrons flow from the Ni to the Cu, both Cu and Ni atoms diffuse to the opposite interfaces,resulting in the interfacial IMC transformation from initial Cu6Sn5into（Cu,Ni）6Sn5and further into[（Cu,Ni）6Sn5t（Ni,Cu）3Sn4] at the anode Cu interface while that from initial Ni3Sn4into（Cu,Ni）6Sn5and further into（Ni,Cu）3Sn4at the cathode Ni interface. It is more damaging with electrons flowing from the Cu to the Ni than the other way.     

Phase Segregation in Cu0.5Ni0.5 Alloy Boosting Urea-Assisted Hydrogen Production in Alkaline Media

Coupling urea oxidation reaction (UOR) and hydrogen evolution reaction (HER) is promising for energy-efficient hydrogen production. However, developing cheap and highly active bifunctional electrocatalysts for overall urea electrolysis remains challenging. In this work, a metastable Cu_0.5Ni_0.5 alloy is synthesized by a one-step electrodeposition method. It only requires the potentials of 1.33 and −28 mV to obtain the current density of ±10 mA cm⁻² for UOR and HER, respectively. The metastable alloy is considered to be the main reason causing the above excellent performances. In the alkaline medium, the as-prepared Cu_0.5Ni_0.5 alloy exhibits good stability for HER; and conversely, NiOOH species can be rapidly formed during the UOR due to the phase segregation of Cu_0.5Ni_0.5 alloy. In particular, for the energy-saving hydrogen generation system coupled with HER and UOR, only 1.38 V of voltage is needed at 10 mA cm⁻²; and at 100 mA cm⁻², the voltage decreases by ≈305 mV compared with that of the routine water electrolysis system (HER || OER). Compared with some catalysts reported recently, the Cu_0.5Ni_0.5 catalyst owns superior electrocatalytic activity and durability. Furthermore, this work provides a simple, mild, and rapid method for designing highly active bifunctional electrocatalysts toward urea-supporting overall water splitting.     

Characteristics of ultrahigh electrical conductivity for Cu–Sn alloys

Abstract

The resistivity and mechanical properties of Cu–Sn alloys with different compositions were explored by casting, normalising, cold work and subsequent annealing treatment. Results indicated that the Cu–Sn alloy had the characteristics of ultrahigh electrical conductivity, when the Sn content was ～0·5 wt-%. Note that the resistivity of the as cast and annealed Cu–0·5 wt-%Sn alloys is 1·55 and 1·26 μΩ cm respectively.     

Cavitation Erosion Behavior of as-Welded Cu12Mn8Al3Fe2Ni Alloy

Cavitation erosion behavior of as-welded Cu12Mn8Al3Fe2Ni alloy in 3.5% NaCl aqueous solution was studied bymagnetostrictive vibratory device for cavitation erosion. The results show that the cavitation erosion resistance ofthe as-welded Cu12Mn8Al3Fe2Ni alloy is much more superior to that of the as-cast one. The cumulative mass lossand the mass loss rate of the as-welded Cu12Mn8Al3Fe2Ni alloy are almost 1/4 that of the as-cast one. SEM analysisof eroded specimens reveals that the as-cast Cu12Mn8Al3Fe2Ni alloy is attacked more severely than the as-weldedone. Microcracks causing cavitation damage initiate at the phase boundaries.