流延法制备Si3N4块体及Si3N4／BN层状材料

采用流延法制备了Ｓｉ３Ｎ４块体及Ｓｉ３Ｎ４／ＢＮ层状材料。流延法已经在陶瓷的制备工艺中得到了广泛的应用,但是很少用于Ｓｉ３Ｎ４体系,尤其是水基流延法。用流延法制备Ｓｉ３Ｎ４／ＢＮ层状材料时,可以较为容易的控制坯片的厚度,得到性能稳定的层状材料。     

Si3N4/FePd/Si3N4薄膜的晶体结构和磁性能研究

采用磁控溅射的方法制备了Si₃N₄/FePd/Si₃N₄三层膜, 研究了非磁性材料Si₃N₄作为插入层对磁记录FePd薄膜结构与磁性能的影响。结果表明, 热处理后Si₃N₄分布在FePd纳米颗粒之间, 抑制了FePd晶粒的生长, 与纯FePd薄膜相比, Si₃N₄/FePd/Si₃N₄薄膜的颗粒明显得到细化; 通过添加Si₃N₄层, FePd薄膜的晶体学参数c/a从0.960减小到0.946, 表明Si₃N₄可以有效促进FePd薄膜的有序化进程, 同时提升了矫顽力和剩磁比, 分别提高到249 kA/m、0.86; 随着600℃退火时间的进一步延长, 添加Si₃N₄的薄膜磁性没有迅速下降, 在较宽的热处理时间范围内磁性能保持在比较高的水平, 提高了抗热影响的能力。Si₃N₄作为插入层对FePd薄膜的磁性能具有较大的提升作用, 这对磁记录薄膜的发展具有重要意义。     

相分离技术制备多孔Si3N4陶瓷

使用苯甲酸作为造孔剂,苯甲酸-无水乙醇溶液作为液相配置Si3N4陶瓷料浆,通过湿法成型制备多孔Si3N4陶瓷坯体。利用固相在不同温度下溶解度不同,通过改变固／液相的分离温度,在陶瓷基体中引入造孔剂。通过改变相分离的温度来实现对多孔Si3N4气孔率的控制。造孔剂苯甲酸可以在低温下挥发,从而减少了排除造孔剂过程中对Si3N...     

添加TiN改善Si3N4陶瓷加工性的研究

通过添加ＴｉＮ改善Ｓｉ３Ｎ４陶瓷的加工性,结果表明,添加ＴｉＮ含量达３０ｗｔ％,可实现电火花切割加工。     

Si3N4-SiC-TiN陶瓷燃烧合成工艺研究

以TiSi2和SiC为原料,利用SHS方法合成Si3N4-SiC-TiN复相陶瓷.在不同稀释剂含量及氮气压力下进行燃烧合成,计算了毛坯转化率和产物相对密度,并对产物进行了XRD分析.结果表明,氮气压力增高有利于提高转化率及产物相对密度.反应物转化率随稀释剂含量增加而增大.孔隙率为53%(体积分数)毛坯,稀释剂SiC含量为35%(质量分数)压坯相对密度达到最大值,且当稀释剂含量高于35%(质量分数)时,SiC发生氮化反应,生成Si3N4和C.     

Si3N4／SiC纳米复合陶瓷的微观结构

利用ＪＥＭ２０００ＥＸⅡ高分辨电镜和ＨＦ２０００冷场发射枪透射电镜对Ｓｉ３Ｎ４ＳｉＣ纳米笔合陶瓷材料的微观组织，结构和成分进行了研究。结果表明，ＳｉＣ颗粒弥散分布基体相β－Ｓｉ３Ｎ４晶内和晶界，晶内ＳｉＣ颗粒与基体相的界面结构有三种类型；１）直接结合的的界面；２）完全非晶态的界面；３）混合型的界面，晶间ＳｉＣ颗粒与基体相的界面大部分是直接结合的。     

反应烧结Si3N4透波陶瓷的制备与能研究

以国产Si粉和Si3N4粉为原料,添加适量的Y2O3和Al2O3烧结助剂,经凝胶注模成型后,在流动的高纯氮气氛中,采用反应烧结工艺制备出结构均匀、性能良好的Si3N4透波陶瓷,并深入研究了组分配方和烧结工艺对硅粉氮化率及材料的力学性能与介电性能的影响.研究结果表明:提高烧结温度能明显改善硅粉的氮化程度,当烧结温度超过1450℃、保温4h以上时,硅粉可完全氮化;起始原料中Si3N4含量为65％时,样品的介电性能最好,其介电常数为4.8,损耗角正切值为0.78×10-2;起始原料中Si3N4含量为35％时,样品的力学性能最好,其抗弯强度为129.5MPa.     

TiN/Si3N4纳米多层膜的生长结构与超硬效应

采用磁控溅射方法制备了一系列不同Si3N4和TiN层厚的TiN/Si3N4纳米多层膜,采用X射线衍射、高分辨电子显微分析和微力学探针表征了薄膜的微结构和力学性能,研究了Si3N4和TiN层厚对多层膜生长结构和力学性能的影响.结果表明:当Si3N4层厚小于0.7 nm时,原为非晶的Si3N4在TiN的模板作用下晶化并与之形成共格外延生长的柱状晶,使TiN/Si3N4多层膜产生硬度和弹性模量异常升高的超硬效应.最高硬度和弹性模量分别为34.0 GPa和353.5 GPa.当其厚度大于1.3 nm时,Si3N4呈现非晶态,阻断了TiN的外延生长,多层膜的力学性能明显降低.此外,TiN层厚的增加也会对TiN/Si3N4多层膜的生长结构和力学性能造成影响,随着TiN层厚的增加,多层膜的硬度和弹性模量缓慢下降.     

Si3N4薄膜的表面微观特性

利用偏心静电单探针诊断了反应室内的等离子体密度的空间分布;在不同的工艺条件下制备了Si3N4薄膜,由STM和Telystep-Hobbso轮廓仪研究了ECR－PECVD制备的Si3N4薄膜的表面微观特性,分析了沉积温度对ECR－PECVD制备的Si3N4薄膜表面平整度特性影响的物理机理;结果表明ECR－PECVD制备的薄膜是一种表面均匀致密的纳米Si3N4薄膜。     

Hardfacing characteristics of S42000 stainless steel powder with added silicon nitride using a CO2 laser

This study examined hardfaced cladding of S42000 stainless steel powder with added silicon nitride Si₃N₄ on a medium carbon steel using a 1200-W CO₂ laser. Experimental results indicated that a well-proportioned cladding layer was obtained with an overlap of 50% at a traverse speed of 5 mm/s and a powder feed rate of 2 g/min. The degree of dilution, depth/width (D/W) ratio and microhardness of the cladding layer was increased by adding up to 5 wt.% silicon nitride. Retained austenite and wear decreased with increasing amounts of silicon nitride addition. The silicon nitride decomposed in the cladding layer during the laser treatment.     

纳米Fe包覆Si3N4的制备及其高温烧结微观组织

采用非均相沉淀-热还原法制备了Fe/Si₃N₄颗粒复合粉末并在热处理温度1873K和0.1MPa氮气气氛下进行常压与热压烧结。通过扫描电镜(SEM)、透射电镜(TEM)、电子能谱(EDS)、X射线衍射(XRD)等方法观察Fe/Si₃N₄复合粉末的结构形貌及常压、热压烧结后的微观组织。结果表明：Fe/Si₃N₄复合粉末物相主要存在Fe相与Si₃N₄相,微观结构为纳米薄层 Fe均匀包覆Si₃N₄颗粒;高温烧结后的常压与热压样品的组织成分与微观结构有极大的不同,除了存在Si₃N₄相之外,常压样品金属Fe相衍射峰消失,并有晶粒粗大铁硅化合物生成,热压样品则保留有金属Fe相,并存在晶粒相对细小铁硅化合物及致密的玻璃态物质。     

Quantitative determination of the volume fraction of intergranular amorphous phase in sintered silicon nitride

In this paper, a commercial liquid phase sintered silicon nitride with Y₂O₃ and Al₂O₃ additives is investigated. The material is characterised by a large, and stable, internal friction peak near 1150 °C. The peak is linked with the glass transition in intergranular amorphous volumes, whose presence is confirmed with transmission electron microscopy. An estimate of the volume fraction of the amorphous phase is calculated from the difference in stiffness below and above the glass transition temperature. The procedure relies on accurate Young’s modulus data, which were obtained with the impulse excitation technique (IET). The amount of amorphous pocket phase was estimated at 12.4 vol.%. For the first time, microstructural evidence supporting this estimate is obtained, using analysis of scanning electron microscopy (SEM) images. The rather large amount of amorphous matter explains the limited high temperature potential of the material, which was primarily and successfully developed for wear applications.     

Si3N4薄膜的成分与结构研究

通过PECVD方法,在Si基体表面制备了Si3N4薄膜,给出了XRD、TEM、AES、DPS的分析结果,表明Si3N4是非晶态结构,薄膜的主要成分是Si3N4,SEM分析结果显示Si3N4薄膜与基体材料的结合强度高,薄膜致密性好.     

Si2ON2 /LAS纳米复合材料的制备与性能研究

研究了Si2ON2/LAS纳米复合材料的制备和性能。结果表明,纳米β－Si3N4可在较低温度下与玻璃热压烧结制备出Si2ON/LASX纳米复合材料,材料的力学性能与生成的纳米Si2ON2含量有关,Si2ON2的含量在20％时材料的抗弯强度和断裂韧性达量高值,分别比未加Si2ON2的材料提高31％和88％。纳米Si2ON2的含量超过20％时,材料的力学性能急剧下降,其原因是材料的致密度迅速降低。     

Doping-induced modulation of electrical and optical properties of silicon nitride

This work presents first-principle calculations of electronic structure and optical properties of doped α-Si₃N₄. It is found that B and P impurities form shallow acceptor and deep donor bands, respectively, in the band gap of α-Si₃N₄. Analysis of the charge neutrality level indicates that bipolar doping of α-SiN_x is possible and that both n- and p-type electrical conductivity can be expected. This result can be helpful to extend the list of device applications of SiN_x. Furthermore, it is shown that upon heavy doping with these impurities, the optical properties of the material are modified by doping. Both the refractive index and extinction coefficients are increased over the photon energy range 0-4 eV as a result of the doping.     

Influences of silicon doping in quantum dot layers on optical characteristics of InAs/GaAs quantum dot infrared photodetector

We have investigated the effects of silicon doping concentration within thirty-period self-assembled quantum dot (QD) layers on quantum dot infrared photodetectors (QDIPs). The lens-shaped quantum dots with the dot density of 1 × 10¹¹ cm^− 2 were observed by atomic force microscope (AFM). From the high ratio of photoluminescence (PL) peak intensities from dot layer to that from wetting layer, we have concluded that high dot density caused the short diffusion length for carriers to be easily captured by QDs. Moreover, the Si-doped samples exhibited the multi-state transitions within the quantum dots, which were different to the single level transition of undoped sample. Besides, the dominant PL peaks of Si-doped samples were red-shifted by about 25 meV compared to that of the undoped sample. It should result from the dopant-induced lowest transition state and therefore, the energy difference should be equal to the binding energy of Si in InAs QDs.     

纳米SiC－Si_3N_4复合粉体的制备及研究

本文以炭黑和气凝氧化硅为原料，采用碳热还原氨化的方法制备纳米ＳｉＣ－Ｓｉ３Ｎ４复合粉体；复合粉中ＳｉＣ的含量由起始粉中Ｃ：ＳｉＯ２的摩尔比控制．在复合粉体的表征中用ＸＲＤ线宽法测量ＳｉＣ粒径大小．ＴＥＭ照片显示Ｓｉ３Ｎ４粒径在１００～２００ｎｍ；ＳｉＣ为纳米级．文中还对生成复合粉体的反应机理进行了探讨．同时利用这一工艺制备出单相的Ｓｉ３Ｎ４粉和ＳｉＣ粉．     

原位无压烧结制备Si2 N2O-Si3 N4复相陶瓷

以Y2O3和Al2O3陶瓷粉体作为烧结助剂,原位无压液相烧结制备Si3N4-Si2N2O复相陶瓷,Si2N2O相通过SiO2 Si3N4 2Si2N2O反应生成.生坯采用注凝成型制备,然后在1780℃保温2h烧结,烧结体基本由板条状的Si2N2O及长柱状的β-Si3N4晶粒构成.Si2N2O陶瓷相对于Si3N4陶瓷而言,具有优异的抗氧化性能,低的弹性模量,以及低的热膨胀系数,因此,Si2N2O-Si3N4复相陶瓷结合了两者的优异性能,并大大提高了材料的热冲击性,材料的热冲击温差即使达到1200℃,其残余强度基本上没有变化.