IC10单晶过渡液相扩散焊接头微观组织与力学性能

采用扫描电镜（SEM）和能谱分析仪（EDS）研究IC10单晶高温合金过渡液相（TLP）扩散焊接头微观组织演变．结果表明,接头由连接区和基体区所组成,连接区由等温凝同区和快速凝固区组成．快速凝固区可以通过延长保温时间的方法予以消除．随着保温时间从2h增加到8h,基体内的γ＇相尺寸达到了0．9μm．通过限制TLP扩散焊接头内晶界的形成,以及焊后固溶处理的方法可以有效提高接头的力学性能．在温度1000℃下,接头平均抗拉强度为507MPa．在温度1000℃、应力144MPa下接头持久寿命可达到120h以上．     

BNi68CrWB钎焊K24/GH648异种高温合金的界面形成机理

采用BNi68CrWB钎料粉末对K24和GH648异种高温合金进行钎焊连接,分析了接头典型界面组织,提出了钎焊过程反应机理.结果表明,接头由共晶区、等温凝固区和扩散区组成.共晶区由WB,CrB和镍基固溶体组成,等温凝固区为镍基固溶体,GH648侧扩散区由WB,W_xB_y,Cr_xB_y,以及沿晶界析出的镍基固溶体和少量的Cr₂Ni₃相组成,K24侧扩散区与母材差异不明显.钎焊过程由元素富集、母材溶解、等温凝固和共晶凝固四个阶段组成.其中等温凝固阶段是钎焊过程中最关键的阶段,等温凝固不完全时,钎缝中央存在共晶组织,影响接头性能.钎焊温度1 150℃,保温120 min时,等温凝固完全,接头组织均匀,力学性能最优,室温拉剪强度可达323 MPa.     

5A06铝合金厚板双丝PMIG焊接头组织与性能

采用双丝PMIG协同式高效焊接方法对板厚为60 mm的5A06铝合金进行了焊接试验,获得了优良的焊接接头,并对焊接接头进行了金相组织和力学性能分析. 结果表明,母材保持轧制态纤维状组织,焊缝组织细密均匀,主要为α(Al),β(Mg₂Al₃)及部分Mg₂Si杂质相. 接头平均抗拉强度和断后伸长率分别为306.17 MPa和11.93%,达到母材的90.5%和61.5%. 对比接头各层显微组织和力学性能发现,热输入影响焊接接头热影响区宽度和力学性能. 在焊接热输入最小的正面盖面层,焊缝组织更细,热影响区宽度更窄,试样力学性能更好.     

激光偏束焊对铌/钢接头组织及性能的影响

文中对铌/钢进行了激光焊接,当激光束直接作用于铌/钢接触面时,由于Nb-Fe金属间化合物Fe₂Nb的生成呈现连续分布的特点会使焊后接头发生断裂.针对该问题,采用激光偏束焊对铌/钢进行焊接,通过激光束偏钢侧来抑制铌的熔化量,进而减少接头中Fe₂Nb的生成.结果表明,通过采用激光偏束焊的方式可以较好地抑制接头开裂的问题.组织分析表明,焊后接头组织主要由γ奥氏体相与一定量的Fe₂Nb相及少量的δ铁素体组成.力学性能结果显示,断裂发生在接头Fe₂Nb金属间化合物层处,其抗拉强度为221 MPa,最高硬度出现在Fe₂Nb金属间化合物层约为1 143 HV.     

双相不锈钢多层多道焊接接头微观组织表征

采用钨极氩弧焊制备了双相钢焊接接头,基于热力学方法计算了母材和焊缝的平衡相变过程,采用OM,SEM,EDS,TEM等方法表征了接头不同区域的微观组织.结果表明,焊缝中添加镍显著促进γ形成并抑制Cr₂N析出.焊缝和热影响区γ₁主要包含晶粒边界奥氏体、魏氏奥氏体和晶粒内奥氏体,不同类型的奥氏体呈现显著的成分差异.焊缝和热影响区析出两种类型的γ₂:晶粒内γ₂和晶粒间γ₂.γ₂易于在δ内和δ/γ₁边界处富Ni和N元素而贫Cr和Mo元素的区域析出.Cr₂N主要分布于热影响区的δ内、δ/γ₂边界以及δ/δ边界处.     

深潜器用Ti80电子束焊接接头精细组织结构特征

进行了Ti80大厚板电子束焊接试验,实现了56 mmTi80无缺陷焊接.分析焊缝和热影响区精细组织,结果表明,焊缝上部为柱状晶粒,下部为柱状晶和等轴晶,晶粒内组织为马氏体α相和残余β相.焊缝由上至下高温停留时间逐渐减小、冷却速度逐渐加快,马氏体α相呈长大趋势.热影响区分为靠近焊缝区的Ⅰ区和靠近母材的Ⅱ区.热影响Ⅰ区组织为马氏体α相、初生α相和β相;Ⅱ区组织为初生α相、次生α相和转变β组织.Ⅰ区由于受热影响作用大,其组织更接近于焊缝;Ⅱ区组织则更接近于母材组织.     

镍基单晶高温合金瞬态液相连接接头的微观结构和结晶学取向

采用Ni-15Cr-3．5B非晶合金箔带作为中间层合金对镍基单晶高温合金进行瞬态液相（TLP）连接．利用光学显微镜、扫描电镜、透射电镜对接头的微观结构进行观察和分析,利用电子背散射衍射（EBSD）方法测定了连接区域和基体之间的结晶学取向．结果表明,接头区域由连接区、中间金属／基体金属界面扩散区和基体金属区组成,连接区中心形成M23B6＋γ和MB＋γ共晶,扩散区形成细小的A4382颗粒;均匀化处理后接头与基体的γ＇相的尺寸趋于一致;TLP接头等温凝固过程中,固／液界面向液相移动中外延生长,连接层与所连接的基体金属的结晶学取向一致．     

标准热处理对采用BNi-9焊料的瞬时液相连接IN-738LC高温合金的影响

研究标准热处理对扩散焊IN-738LC高温合金显微组织和力学性能的影响。对连接样品进行全固溶退火、部分固溶退火和时效处理3个不同的热处理。结果表明,在1120℃下焊接5 min,会导致不完全等温凝固,在焊缝处形成富Ni、Cr的硼化物共晶相。当保温时间延长到45 min时,接头中发生完全等温凝固,形成镍的先共晶固溶体γ相。等温凝固和非等温凝固样品的标准热处理能完全消除扩散影响区的硼化物相,并在等温凝固区形成γ’析出相。然而,在非等温凝固样品的接头区观察到不连续的再凝固产物。等温凝固样品经标准热处理后,剪切强度最高(约801 MPa),为基材剪切强度的99%。     

MICROSTRUCTURE CHARACTERISTICS AND CRYSTALLOGRAPHIC ORIENTATION OF TRANSIENT LIQUID PHASE JOINT OF NI-BASE SINGLE CRYSTAL SUPERALLOY

采用Ni-15Cr-3.5B非晶合金箔带作为中间层合金对镍基单晶高温合金进行瞬态液相(TLP)连接. 利用光学显微镜、扫描电镜、透射电镜对接头的微观结构进行观察和分析, 利用电子背散射衍射(EBSD)方法测定了连接区域和基体之间的结晶学取向. 结果表明, 接头区域由连接区、中间金属/基体金属界面扩散区和基体金属区组成, 连接区中心形成M23B6+γ和MB+γ 共晶, 扩散区形成细小的M3B2颗粒; 均匀化处理后接头与基体的γ'相的尺寸趋于一致; TLP接头等温凝固过程中, 固/液界面向液相移动中外延生长, 连接层与所连接的基体金属的结晶学取向一致.     

单晶过渡液相扩散焊接头单晶化机理

为了探明单晶高温合金TLP扩散焊接头单晶化机理,采用扫描电镜（SEM）、背散射电子（BES）和背散射衍射（EBSD）分析接头微观组织.结果表明,接头内形成贯穿型晶界和等轴晶粒是接头无法实现单晶化的主要原因.在实际焊接过程中,应严格控制试样加工、中间层添加、装配、焊接等工序.在等温凝固阶段,液相依附于固态单晶基体以平面晶的方式外延生长,直至液相消失,界面上形成具有一致晶体取向的一块单晶,随着保温时间的延长,固态均匀化过程充分进行,冷却后将形成单晶化的接头.     

Microstructure－properties relationship of transient liquid phase diffusion bonded a third generation single crystal superalloy joint

Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.     

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

Microstructural characteristics of a cast IN718 superalloy bonded by isothermal solidification

Isothermal solidification is a key feature of transient liquid phase bonding which prevents the formation of deleterious intermetallic phases in the joint centerline and results in bonds with improved mechanical performance. This paper discusses the metallurgical characteristics and mechanical properties of an as-cast IN718 superalloy bonded by diffusion-induced isothermal solidification of Ni-7Cr-4.5Si-3.2B-3Fe (wt%) filler metal. After transient liquid phase bonding of as-cast IN718 at 1000 °C for 60 min, a bond exhibiting a solid solution microstructure with joint efficiency of 72% in terms of shear strength was obtained. The joining process was effectively able to prevent the formation of hard and brittle nickel and chromium borides, which typically lead to critical problems in brazing. The formation of Nb-rich Laves phase, which is well known as a major issue in the fusion welding of IN718, was not observed. The bonding time, which governs the extent of isothermal solidification, was a critical parameter for controlling the mechanical properties of the joints in terms of shear strength and hardness distribution across the bond.     

钛合金表面激光熔覆高温自润滑耐磨复合涂层

为了提高钛合金的摩擦学性能,采用激光熔覆技术在Ti-6Al-4V合金表面制备了γ-NiCrAlTi/TiC与γ-NiCrAlTi/TiC/CaF₂复合涂层. 采用 X射线衍射仪(XRD)、扫描电子显微镜(SEM)、能谱仪(EDS)分析了涂层的物相和显微组织,在球-盘式高温摩擦磨损试验机上测试了不同温度下(室温,300 ℃,600 ℃)复合涂层的摩擦学性能. 结果表明,激光熔覆的复合涂层与基体呈冶金结合,γ-NiCrAlTi/TiC/CaF₂复合涂层主要由"原位"生成的小块状,针状TiC颗粒及TiC树枝晶,γ-NiCrAlTi固溶体基体及弥散分布的球状CaF₂颗粒组成. 由于硬质增强相 TiC与增韧相γ-NiCrAlTi的共同作用,γ-NiCrAlTi/TiC与γ-NiCrAlTi/TiC/CaF₂复合涂层的磨损率在试验温度下都远低于Ti-6Al-4V基体;在600 ℃时,γ-NiCrAlTi/TiC/CaF₂涂层的平均摩擦系数为0.21,相对于基体与γ-NiCrAlTi/TiC涂层分别降低了43%,50%,表现出良好的高温自润滑减摩性能.     

搭接形式对铝/黄铜异种热补偿电阻点焊接头的组织与力学性能影响

采用不同搭接形式,对铝合金6061-T6/黄铜H70异种材料热补偿电阻点焊工艺进行研究.对比了两种搭接形式下铝/黄铜异种点焊接头的微观组织与力学性能差异.结果表明,采用热补偿电阻点焊的工艺方法可在较低电流水平下实现铝/黄铜异种材料的焊接.在铝侧施加热补偿垫片进行点焊,接头的抗拉剪载荷更高,其熔核由细小的α-Al等轴晶组成;在黄铜侧施加热补偿垫片进行点焊,接头的抗拉剪载荷较小,但体现出延性断裂的特征,其熔核由板条状铜铝化合物组成.