基于双参数比较的光网络多点带内串扰攻击定位算法

分析了光网络中带内串扰攻击的攻击源特点,提出了一种基于双参数比较的分布式多点带内串扰攻击定位算法,该算法通过同时比较节点本身检测到的光信噪比参数和信号功率参数以及直接上游节点检测到的对应参数来判断攻击源的位置。仿真结果表明,该算法能够实现对多点攻击情况下攻击源的快速准确定位。     

SDN环境下基于条件熵的DDoS攻击检测研究

随着软件定义网络(SDN)研究的发展,其安全性越来越受到重视。由于集中控制和软件可编程的特点,使得SDN容易遭受分布式拒绝服务攻击(DDo S)攻击的威胁。针对基于信息熵的DDo S攻击检测方法的改进,文章提取了流表项中的TTL和源IP地址,得到相同TTL值下源IP地址的条件熵,进一步使用滑动窗口非参数CUSUM算法来分析熵值变化以检测DDo S攻击,最后运用仿真实验验证了其有效性。该方法拥有更低的误报率和更高的敏感度,占用资源少,检测速度快,非常适合SDN环境。     

基于独立分量分析的盲水印算法

独立分量分析(ICA)是一种近期发展起来倍受关注的盲源分离算法。文章提出一种基于ICA的数字水印嵌入和提取算法。实验表明,该算法可以实现水印的盲分离,并且具有很好的鲁棒性。     

基于多层次特征的RoQ隐蔽攻击无监督检测方法

针对RoQ攻击隐藏在海量背景流量中难以识别,且现有样本稀少无法提供大规模学习数据的问题,提出了在极少先验知识条件下基于多层次特征的RoQ隐蔽攻击无监督检测方法。首先,考虑到大部分正常流量会对后续结果产生干扰,基于流特征,研究了半监督谱聚类的流量筛选方法,实现被筛除的流量中正常样本比例接近100%。其次,为了找到隐蔽攻击特征与正常流量之间的微小差异且不依赖于攻击样本,基于时序包特征,构造了基于n-Shapelet子序列的无监督检测模型,使用具有明显辨识度的局部特征来辨别微小差异,从而实现RoQ隐蔽攻击的检测。实验结果表明,在只有少量学习样本的情况下,所提方法与现有方法相比具有较高的精确率和召回率,对规避攻击具有稳健性。     

一种基于独立分量分析的OFDM-IDMA检测方法

提出了一种基于独立分量分析(ICA)的OFDM-IDMA检测新方法。独立分量分析是信号盲源分离领域中的新技术,它可以在系统用户特征序列未知的情况下,成功地提取出有用信号,节省了系统的资源。经过进一步优化,ICA可适用于OFDM-IDMA系统中,成功地实现对系统用户信号的检测。最后通过计算机仿真结果验证了该算法的有效性,且检测性能优于过去的方法;采用ICA算法检测器的OFDM-IDMA系统,还可减小通信传输时的误码率。     

基于ICA的无线电通信干扰抑制

抑制无线电通信信号中的干扰是提高通信可靠性的有效措施.传统的干扰抑制技术存在算法、设备复杂,对信号有损伤和实时性差等问题.针对存在的问题,在分析研究盲源分离(BSS)的理论基础上建立了基于最大信噪比算法的ICA通信干扰抑制模型;基于该模型仿真实现了无线电通信信号的分离提取和多路干扰信号的抑制.仿真结果表明,基于ICA的...     

基于SNMP和神经网络的DDoS攻击检测

DDoS（Distributed Denial of Service）已经严重威胁计算机网络安全。对DDoS攻击检测的关键是找到能反映攻击流和正常流区别的特征,设计简单高效的算法,实时检测。通过对攻击特点的分析,总结出15个基于SNMP（Simple Network Management Protocol）的检测特征。利用BP神经网络高效的计算性能,设计了基于SNMP和神经网络的DDoS攻击检测模型,提高了检测实时性和准确性。实验表明：该检测模型对多种DDoS攻击都具有很好的检测效果。     

一种新的DDoS攻击检测算法

为了准确及时的进行DDoS攻击检测,提出了一种新的DDoS攻击检测算法。该算法在基于传统的小波分析检测DDoS攻击的基础上融入了主成分分析法和小波分析法中DDoS检测方法,并根据该算法设计相应的模型和算法来检测 DDoS 攻击,并且引入信息论中的信息熵对源IP地址的分散程度进行度量,根据初始阶段Hurst指数及熵值的变化自适应地设定阈值以检测攻击的发生。实验结果表明,该方法大幅度的提高了DDoS检测的速度。     

无线Mesh网络中的虫洞攻击检测研究

为了有效检测出无线mesh网络中的虫洞攻击,针对微软提出的支持多射频的链路质量源路由MR-LQSR(multi-radio link-quality souse routing)协议提出了一种虫洞攻击模型,并根据虫洞攻击及无线mesh网的特点,在基于端到端的虫洞攻击检测算法、投票机制、邻居检测机制和基于身份加密技术的基础上提出一种基于端到端的虫洞攻击检测机制.最后通过理论分析和实验证实了该机制能有效地抵御无线mesh网中的虫洞攻击和提高无线mesh网的安全性.     

基于独立分量分析的极化SAR图像非监督分类方法

提出了一种针对极化合成孔径雷达(SAR)图像的新的分类方法--基于独立分量分析(ICA)的非监督分类方法.该方法将ICA和基于模糊集理论的非监督分类方法结合起来.用ICA方法对原始极化SAR图像进行特征提取,并用模糊C均值(FCM)算法对提取出的独立分量图像进行分类.该算法可对极化SAR图像进行自动分类,并减少由相干斑噪声所引起的分类错误,且其收敛速度快、稳定性高.采用SIR-C/X-SAR数据的试验证明了该算法的有效性.     

Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C

The interfacial microstructure and shear strength of Sn3.8Ag0.7Cu-xNi (SAC-xNi, x = 0.5, 1, and 2) composite solders on Ni/Au finished Cu pads were investigated in detail after aging at 150 °C for up to 1000 h. The interfacial characteristics of composite solder joints were affected significantly by the weight percentages of added Ni micro-particles and aging time. After aging for 200 h, the solder joints of SAC, SAC-0.5Ni and -1Ni presented duplex intermetallic compound (IMC) layers regardless of the initial interfacial structure on as-reflowed joints, whose upper and lower IMC layers were comprised of (CuNi)₆Sn₅ and (NiCu)₃Sn₄, respectively. Only a single (NiCu)₃Sn₄ IMC layer was ever observed at the SAC-2Ni/Ni interface on whole aging process. Based on the compositional analysis, the amount of Ni within the IMC regions increased as the proportion of Ni addition increased. The IMC (NiCu)₃Sn₄ layer thickness on the interface of SAC and SAC-0.5Ni grew more slowly when compared to that of SAC-1Ni and -2Ni, while for the (CuNi)₆Sn₅ layer the reverse is true. Except the IMCs sizes are increased with increased aging time, the interfacial IMCs tended to transfer their morphologies to polyhedra. In all composite joints testing, the shear strengths were approximately equal to non-composite joints. The fracturing observed during shear testing of composite joints occurred in the bulk solder, indicating that the SAC-xNi/Ni solder joints had a desirable joint reliability.     

BNBST无铅压电陶瓷的制备工艺研究

设计了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3（BNBST[100x-100a／100b]）无铅压电陶瓷新体系。该体系压电陶瓷具有工艺特性及压电响应好，压电常数高的特点，且有实际应用前景的新型压电陶瓷材料体系。采用传统的陶瓷工艺制备了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3无铅压电陶瓷，研究了制备工艺参数对其物化结构性能的影响。生料的热重-差热（TGA-DTA）分析表明，粉料合成过程中，先是SrTiO3、BaTiO3的形成，然后是（Bi0．5Na0．5）Tio，的形成，同时三者形成固溶体；密度测试表明，陶瓷的体积密度随烧结温度的升高而增大，可较易获得理论密度94％的陶瓷；X-射线能谱分析（EDAX）研究表明，陶瓷的Bi、Na的挥发随着烧结温度的升高而加剧。研究结果表明，要制备性能优良的无铅压电陶瓷，需要精确控制制备工艺。     

有机发光二极管中ADN掺杂ErQ的1.54μm电致发光

自行设计了基于8-羟基喹啉铒(ErQ)为发射层(EMLs)和二硝酰胺铵(ADN)为蓝光主体材料的近红外有机发光二级管.器件的基本结构为(p-Si/NPB/EML/Bphen/Bphen:Cs2CO3/Sm/Au),设计并比较了三套不同发射层结构(ErQ/ADN为双层结构器件,(ErQ/ADN)×3为多层结构器件,ErQ:ADN为掺杂结构器件)的器件.三组器件在一定的偏压下,均可发出1.54μm的光,对应三价铒离子4I13/2→4I15/2的跃迁.其中,ADN:ErQ(1∶1)掺杂结构的近红外电致发光强度是ADN/ErQ双层结构中的三倍.此外,不同掺杂浓度的ADN:ErQ复合膜做了以下表征:吸收谱、光致发光谱和荧光寿命谱.实验结果证实了在近红外电致发光过程中存在从ADN主体分子到ErQ发射分子的高效率的能量转移.     

Emerging interconnects: a state-of-the-art review and emerging solutions

Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor??????? delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that multiwalled CNTs, multilayer GNR and mixed CNT bundles are promising candidates and are ultimate choice that can strongly address the problems faced by copper but on integration basis copper would last for coming years.     

聚对苯撑苯并双(口恶)唑发光及其器件制备

采用光谱技术,研究了聚对苯撑苯并双(口恶)唑(PBO)溶液的光敏发光特性,并用相对法估算出溶液发光效率在50%范围.结合光谱技术、半导体电学和电化学等研究手段,具体研究了以PBO为发光层的单层电致发光器件,研究结果显示,电致发光与薄膜的光致发光有具有相同的发光中心,峰值位于510 nm左右.同时发现,由于存制备过程中不同处理条件使得不同厚度薄膜残留的掺杂物质浓度不同,从而引起薄膜的导电性的不同.使得器件的阈值场强随PBO厚度的减小而逐渐增加.     

钠离子对poly(dT).poly(dA).poly(dT)三螺旋DNA分子呼吸模式的影响

利用分子结构的螺旋对称性,建立了一个包括钠离子的三链DNA分子poly(dT)*poly(dA)*poly(dT)的晶格动力学模型,计算了poly(dT)*poly(dA)*poly(dT)的氢键呼吸模式.结果发现钠离子的加入明显地淬灭了位于较低频率的几个最为强烈的Hoogensteen氢键呼吸模式,而对Watson-Crick氢键呼吸模式影响不明显,这说明钠离子能提高poly(dT)*poly(dA)*poly(dT)三螺旋结构的稳定性.该计算结果很好地解释了poly(dT)*poly(dA)*poly(dT)的热融化实验.     

人小肠粘膜免疫酶的定位研究—光镜和电镜免疫组织化学染色法

本文对免疫酶组织化学的样品制备程序和染色方法做了详细的阐述。用直接法、间接法和ABC法,对人小肠免疫酶的定位,进行了光镜和电镜的观察,染色阳性反应显著,获得了满意的效果。并对染色技巧做了分析和探讨。     

Arsenic deposition as a precursor layer on silicon (211) and (311) surfaces

We investigate the properties of arsenic (As) covered Si(211) and Si(311) surfaces by analyzing data from x-ray photoelectron spectroscopy (XPS) and low-energy electron diffraction (LEED) images. We then create a model using total surface energy calculations. It was found that both Si(211) and Si(311) had 0.68±0.08 surface As coverage. Si(211) had 0.28±0.04 Te coverage and Si(311) had 0.24±0.04 Te coverage. The Si(211) surface replaces the terrace and trench Si atoms with As for a lower surface energy, while the Si edge atoms form dimers. The Si(311) surface replaces all terrace atoms and adsorbs an As dimer every other edge site. These configurations imply an improvement in the mean migration path from the bare silicon surface by allowing the impinging atoms for the next epitaxial layer, tellurium (Te), to bind at every other pair of edge atoms, and not the step terrace sites. This would ensure a nonpolar, B-face growth.     

Joint estimation of TOA and DOA in IR-UWB system using a successive propagator method

Impulse radio ultra-wideband (IR-UWB) ranging and positioning require accurate estimation of time-of-arrival (TOA) and direction-of-arrival (DOA). With receiver of two antennas, both of the TOA and DOA parameters can be estimated via two-dimensional (2D) propagator method (PM), in which the 2D spectral peak searching, however, renders much higher computational complexity. This paper proposes a successive PM algorithm for joint TOA and DOA estimation in IR-UWB system to avoid 2D spectral peak searching. The proposed algorithm firstly gets the initial TOA estimates in the two antennas from the propagation matrix, then utilises successively one-dimensional (1D) local searches to achieve the estimation of TOAs in the two antennas, and finally obtains the DOA estimates via the difference in the TOAs between the two antennas. The proposed algorithm, which only requires 1D local searches, can avoid the high computational cost in 2D-PM algorithm. Furthermore, the proposed algorithm can obtain automatically paired parameters and has better joint TOA and DOA estimation performance than conventional PM algorithm, estimation of signal parameters via rotational invariance techniques algorithm and matrix pencil algorithm. Meanwhile, it has very close parameter estimation to that of 2D-PM algorithm. We have also derived the mean square error of TOA and DOA estimation of the proposed algorithm and the Cramer-Rao bound of TOA and DOA estimation in this paper. The simulation results verify the usefulness of the proposed algorithm.     

系统级封装新型埋入式电源滤波结构的研究

在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题.这种电压抖动所占频带相当宽,几百MHz到几个GHz的中频电源噪声普通方法很难去除.结合埋入式电容和电源分割方法的特点,提出一种新型高性能埋入式电源低通滤波结构直接替代电源/地平面.研究表明,在0.65～4GHz的频带内隔离深度可达-40～75 dB,电源阻抗均在0.25ohm以下,实现了宽频高隔离度的高性能滤波作用.分别用电磁场和广义传输线两种仿真器模拟,高频等效电路模型分析这种低通滤波器的工作原理以及结构对隔离性能的影响,并进行了实验验证.