Circuits using uniform TFTs based on amorphous In‐Ga‐Zn‐O

Abstract— High‐performance and excellent‐uniformity thin‐film transistors (TFTs) having bottom‐gate structures are fabricated using an amorphous indium‐gallium‐zinc‐oxide (IGZO) film and an amorphous‐silicon dioxide film as the channel layer and the gate insulator layer, respectively. All of the 94 TFTs fabricated with an area 1 cm² show almost identical transfer characteristics: the average saturation mobility is 14.6 cm²/(V‐sec) with a small standard deviation of 0.11 cm²/(V‐sec). A five‐stage ring‐oscillator composed of these TFTs operates at 410 kHz at an input voltage of 18 V. Pixel‐driving circuits based on these TFTs are also fabricated with organic light‐emitting diodes (OLED) which are monolithically integrated on the same substrate. It is demonstrated that light emission from the OLED cells can be switched and modulated by a 120‐Hz ac signal input. Amorphous‐IGZO‐based TFTs are prominent candidates for building blocks of large‐area OLED‐display electronics.     

Oxide engineering of ZnO thin‐film transistors for flexible electronics

Abstract— In this paper, we show that ZnO thin‐film transistors (TFTs) are potentially a higher performance alternative to organic and amorphous‐Si TFTs for macroelectronics on plastic substrates. Specifically, we fabricated nanocrystalline ZnO thin‐film transistors using low‐temperature processing, compatible with flexible electronics on plastic substrates. The ZnO semiconductor was rf magnetron sputtered, and the Al₂O₃ gate dielectric was deposited either by electron‐beam evaporation or atomic layer deposition. By controlling the partial pressure of oxygen pO₂) during ZnO sputtering, we could engineer the field‐effect mobility of ZnO transistors to be between 2 and 42 cm²/V‐sec, attractive for high‐performance electronic applications. We contend that pO₂ controls the oxygen‐vacancy content or stoichiometry of ZnO, and that allows control of transistor field‐effect mobility. Although most of the devices described here were fabricated on Si substrates, devices we made on a thin (50 μm thick) polyimide substrate had about equivalent performance, affirming the compatibility of our processes with plastic substrates. Finally, we show that properties of our nanocrystalline ZnO transistors can be explained by transport models that account for grain‐boundary trapping of mobile carriers.     

Effects of post‐annealing on a‐Si:H TFT characteristics fabricated on stainless‐steel substrate

Abstract— A 14.1‐in.‐diagonal backplane employing hydrogenated amorphous‐silicon thin‐film transistors (a‐Si:H TFTs) was fabricated on a flexible stainless‐steel substrate. The TFTs exhibited a field‐effect mobility of 0.54 cm²/V‐sec, a threshold voltage of 1.0 V, and an off‐current of 10^?13 A. Most of the electrical characteristics were comparable to those of the TFTs fabricated on glass substrates. To increase the stability of a‐Si:H TFTs fabricated on stainless‐steel substrate, the specimens were thermally annealed at 230°C. The field‐effect mobility was reduced to 71% of the initial value because of the strain of the released hydrogen atoms and residual compressive stress in a‐Si:H TFT under thermal annealing at 230°C.     

High performance a‐IGZO thin‐film transistors with mf‐PVD SiO2 as an etch‐stop‐layer

In this work, we report on high‐performance bottom‐gate top‐contact (BGTC) amorphous‐Indium‐Gallium‐Zinc‐Oxide (a‐IGZO) thin‐film transistor (TFT) with SiO₂ as an etch‐stop‐layer (ESL) deposited by medium frequency physical vapor deposition (mf‐PVD). The TFTs show field‐effect mobility (μ_FE) of 16.0 cm²/(V.s), sub‐threshold slope (SS^?1) of 0.23 V/decade and off‐currents (I_OFF) < 1.0 pA. The TFTs with mf‐PVD SiO₂ ESL deposited at room temperature were compared with TFTs made with the conventional plasma‐enhanced chemical vapor deposition (PECVD) SiO₂ ESL deposited at 300 °C and at 200 °C. The TFTs with different ESLs showed a comparable performance regarding μ_FE, SS^?1, and I_OFF, however, significant differences were measured in gate bias‐stress stability when stressed under a gate field of +/?1 MV/cm for duration of 10⁴ s. The TFTs with mf‐PVD SiO₂ ESL showed lower threshold‐voltage (V_TH) shifts compared with TFTs with 300 °C PECVD SiO₂ ESL and TFTs with 200 °C PECVD SiO₂ ESL. We associate the improved bias‐stress stability of the mf‐PVD SiO₂ ESL TFTs to the low hydrogen content of the mf‐PVD SiO₂ layer, which has been verified by Rutherford‐Back‐Scattering‐Elastic‐Recoil‐Detection technique.     

Lithium doping and gate dielectric dependence study of solution‐processed zinc‐oxide thin‐film transistors

Abstract— The effects of lithium (Li) doping concentration and gate dielectrics on the performance of solution‐processed zinc‐oxide (ZnO) thin‐film transistors (TFTs) has been investigated. ZnO films with strong c‐axis orientation and lower background conductivity was obtained with 15 at.% of Li. Different crystallization behavior of ZnO was observed in the case of various dielectric surfaces. The 15‐at.% Li‐doped ZnO films (thickness ～20 nm) prepared on SiO² and SiN^x were found to be present in crystalline form, whereas the film prepared on aluminum titanium oxide (ATO) was found to be amorphous. A field‐effect mobility of 1.81 cm²/V‐sec and an Ion/Ioff ratio of 2 × 10⁶ were obtained for the 15‐at.% Li‐doped ZnO TFTs with a bilayer gate dielectric of SiO² and SiN^x. The comparison of dielectric studies showed that the performance of TFTs prepared on SiN^x and ATO are higher than that of the TFTs prepared on SiO².     

Influence of channel‐deposition conditions and gate insulators on performance and stability of top‐gate IGZO transparent thin‐film transistors

Abstract— Amorphous‐oxide‐semiconductor thin‐film transistors (TFTs) have gained wide attention in recent years due to their many merits. In this paper, a series of top‐gate transparent thin‐film transistors (TFTs) based on amorphous‐indium—gallium—zinc—oxide (a‐IGZO) semiconductors have been fabricated and investigated. Specifically, low‐temperature SiNx and SiOx were used as the gate insulator and different Ar/O² gas‐flow ratios were used for a‐IGZO channel deposition to study the influences of gate insulators and channel‐deposition conditions. In addition to the investigation of device performance, the stability of these TFTs was also examined by applying constant‐current stressing. It was found that a high mobility of 30‐45 cm²/V‐sec and small threshold‐voltage shift in constant‐current stressing can be achieved using SiNx with suitable hydrogen‐content stoichiometry as the gate insulator and the carefully adjusted Ar/O² flow ratio for channel deposition. These results may be associated with hydrogen incorporation into the channel, the lower defect trap density, and the better water/oxygen barrier properties (impermeability) of the low‐temperature SiNx.     

Amorphous‐oxide TFT backplane for large‐sized AMOLED TVs

Abstract— Amorphous‐oxide thin‐film‐transistor (TFT) arrays have been developed as TFT backplanes for large‐sized active‐matrix organic light‐emitting‐diode (AMOLED) displays. An amorphous‐IGZO (indium gallium zinc oxide) bottom‐gate TFT with an etch‐stop layer (ESL) delivered excel lent electrical performance with a field‐effect mobility of 21 cm²/V‐sec, an on/off ratio of >10⁸, and a subthreshold slope (SS) of 0.29 V/dec. Also, a new pixel circuit for AMOLED displays based on amorphous‐oxide semiconductor TFTs is proposed. The circuit consists of four switching TFTs and one driving TFT. The circuit simulation results showed that the new pixel circuit has better performance than conventional threshold‐voltage (VTH) compensation pixel circuits, especially in the negative state. A full‐color 19‐in. AMOLED display with the new pixel circuit was fabricated, and the pixel circuit operation was verified in a 19‐in. AMOLED display. The AMOLED display with a‐IGZO TFT array is promising for large‐sized TV because a‐IGZO TFTs can provide a large‐sized backplane with excellent uniformity and device reliability.     

Annealing effect of low‐temperature (<150°C) Cat‐CVD gate dielectric silicon nitride films diluted with atomic hydrogen

Abstract— The effect of in‐situ hydrogen pretreatment on dielectric properties of silicon nitride (SiN^x) thin films for a gate dielectric layer has been studied. SiN^xthin films were grown at a low temperature (150°C) by Catalytic CVD followed by conventional furnace annealing at 150°C for 2 hours. The in‐situ hydrogen pretreatment was performed without vacuum break before the sample was transferred to the furnace for thermal annealing. Capacitance—voltage (C‐V) and current‐density—voltage (J‐V) measurement showed that the hydrogen pretreatment was effective in reducing the hysteresis in the C‐V curve and in increasing the breakdown voltage. Without the treatment, the 150°C annealing failed to produce reliable C‐V and I‐V characteristics. The C‐V hysteresis and the threshold voltage shift of SiN^x were improved by furnace annealing as the hydrogen dilution ratio increased. Also, addition of hydrogen to the deposition gas mixture helped to improve the dielectric properties of the SiN^x films after thermal annealing. The combination of hydrogen dilution of the source gas and the in‐situ hydrogen treatment was successful in producing low‐temperature SiN^x films applicable to a‐Si TFTs. The TFT fabricated by using these films showed a field‐effect mobility of 0.23 cm²/V‐sec and a Vth of 3.1 V.     

Novel self‐aligned top‐gate oxide TFT for AMOLED displays

Abstract— A novel highly reliable self‐aligned top‐gate oxide‐semiconductor thin‐film transistor (TFT) formed by using the aluminum (Al) reaction method has been developed. This TFT structure has advantages such as small‐sized TFTs, lower mask count, and small parasitic capacitance. The TFT with a 4‐μm channel length exhibited a field‐effect mobility of 21.6 cm²/V‐sec, a threshold voltage of ?1.2 V, and a subthreshold swing of 0.12 V/decade. Highly reliable TFTs were obtained after 300°C annealing without increasing the sheet resistivity of the source/drain region. A 9.9‐in.‐diagonal qHD AMOLED display was demonstrated with self‐aligned top‐gate oxide‐semiconductor TFTs for a low‐cost and ultra‐high‐definition OLED display. Excellent brightness uniformity could be achieved due to small parasitic capacitance.     

Study on parasitic and channel resistance of poly‐Si thin‐film transistors by metal‐induced crystallization

Abstract— The channel‐length‐dependent transfer characteristics of TFTs using poly‐Si by metal‐induced crystallization through a cap (MICC) of a‐Si to evaluate the parasitic and channel resistances have been studied. The MICC p‐channel TFTs studied in the present work showed a maximum field‐effect mobility, threshold voltage, and gate swing of 53 cm²/V‐sec, −4.4 V, and 0.8 V/dec for W/L = 12 μm/6 μm, 71 cm²/V‐sec, −5.3 V, and 0.9 V/dec for W/L = 12 μm/12 μm, and 113 cm²/V‐sec, −7 V, and 1 V/dec for W/L = 12 μm/24 μm, respectively. It is found that the parasitic resistance is higher than the channel resistance, and both decrease with increasing temperature.     

Amorphous‐silicon thin‐film transistor on soda‐lime glass

Abstract— Amorphous‐silicon (a‐Si:H) thin‐film transistors (TFTs) on soda‐lime glass were fabricated by using a diffusion barrier and a low‐temperature process at 200°C. The silicon nitride barrier was optimized in terms of diffusion blocking effectiveness, film adhesion, and surface finish. TFTs on soda‐lime glass achieved a saturation mobility 0.47 cm²/V‐sec, threshold voltage of 0 V, an off‐current of 7.7×10^?11 A, and a sub‐threshold swing of 1.0 V/dec. From diffusion experiments, a 30,000‐hour lifetime for the TFT device at 80°C was estimated, and the robustness of the silicon nitride barrier against long‐term migration of sodium was demonstrated.     

Oxide TFT with multilayer gate insulator for backplane of AMOLED device

Abstract— An indium gallium zinc oxide (IGZO) film with an amorphous phase was deposited and had a very flat morphology with a RMS value of 0.35 nm. IGZO TFTs were fabricated on a glass substrate by conventional photolithography and wet‐etching processes. IGZO TFTs demonstrated a high mobility of 124 cm²/V‐sec, a high on/off ratio of over 10⁸, a desirable threshold voltage of 0.7 V, and a sub‐threshold swing of 0.43 V/decade. High mobility partially resulted from the fringing‐electric‐field effect that leads to an additional current flow beyond the device edges. Therefore, considering our device geometry, the actual mobility was about 100 cm²/V‐sec, and had a very low dependence on the variation of W/L (channel width and length) and thickness of the active layer. IGZO TFTs were also fabricated on a flexible metal substrate for a conformable display application. TFT devices showed an actual mobility of 72 cm²/V‐sec, a high on/off ratio of ～10⁷, and a sub‐threshold swing of 0.36 V/decade. There was no significant difference before, during, or after bending. Moreover, an IGZO TFT array was fabricated and a top‐emitting OLED device was successfully driven by it. Therefore, the oxide TFT could be a promising candidate as a backplane for OLED devices.     

12.1‐in. WXGA AMOLED display driven by InGaZnO thin‐film transistors

Abstract— A full‐color 12.1‐in.WXGA active‐matrix organic‐light‐emitting‐diode (AMOLED) display was, for the first time, demonstrated using indium‐gallium‐zinc oxide (IGZO) thin‐film transistors (TFTs) as an active‐matrix backplane. It was found that the fabricated AMOLED display did not suffer from the well‐known pixel non‐uniformity in luminance, even though the simple structure consisting of two transistors and one capacitor was adopted as the unit pixel circuit, which was attributed to the amorphous nature of IGZO semiconductors. The n‐channel a‐IGZO TFTs exhibited a field‐effect mobility of 17 cm²/V‐sec, threshold voltage of 1.1 V, on/off ratio >10⁹, and subthreshold gate swing of 0.28 V/dec. The AMOLED display with a‐IGZO TFT array is promising for large‐sized applications such as notebook PCs and HDTVs because the a‐IGZO semiconductor can be deposited on large glass substrates (larger than Gen 7) using the conventional sputtering system.     

Fabrication of poly‐Si complementary metal oxide semiconductor inverter by all sputtering deposition process

Direct current sputtering was used for deposition of Si film for precursor film of excimer laser annealing, n⁺‐Si/p⁺‐Si film for source/drain contact, and SiO₂ film for gate insulator of polycrystalline silicon thin‐film transistor. Using these methods, poly‐Si thin‐film complementary metal oxide semiconductor inverter was fabricated by all sputtering process for the first time. The field‐effect mobility was, respectively, 6.5 and 12.5 cm²/Vs for n‐TFTs and p‐TFTs. This inverter exhibits a full rail‐to‐rail swing and abrupt voltage transfer characteristics over the entire voltage range, and the output voltage gain was ~117 at V_dd = 20 V.     

Flexible color LCD panel driven by low‐voltage‐operation organic TFT

Abstract— A flexible color LCD panel driven by organic TFTs (OTFTs) was successfully demonstrated. A pentacene OTFT with an anodized Ta₂O₅ gate insulator, which can be operated at low voltage, was developed. In order to improve the electrical performance of the OTFT, the gate insulator was surface treated by processes such as O₂ plasma, UV light irradiation, and hexamethyldisilane treatments. The fabricated OTFT exhibited a mobility of 0.3 cm²/V‐sec and a current on/off ratio of 10⁷ with a low operating drain voltage of ?5 V. A fast‐response‐time flexible ferroelectric LCD, which contains polymer networks and walls, was integrated with the OTFTs by using a lamination and a printing technique. As a result, color images were achieved on the fabricated panel by using a field‐sequential‐color method at a low driving voltage of less than 15 V_pp.     

Temporary bond—debond technology for high‐performance transistors on flexible substrates

Abstract— A processing technology based upon a temporary bond—debond approach has been developed that enables direct fabrication of high‐performance electronic devices on flexible substrates. This technique facilitates processing of flexible plastic and metal‐foil substrates through automated standard semiconductor and flat‐panel tool sets without tool modification. The key to processing with these tool sets is rigidifying the flexible substrates through temporary bonding to carriers that can be handled in a similar manner as silicon wafers or glass substrates in conventional electronics manufacturing. To demonstrate the power of this processing technology, amorphous‐silicon thin‐film‐transistor (a‐Si:H TFT) backplanes designed for electrophoretic displays (EPDs) were fabricated using a low‐temperature process (180°C) on bonded‐plastic and metal‐foil substrates. The electrical characteristics of the TFTs fabricated on flexible substrates are found to be consistent with those processed with identical conditions on rigid silicon wafers. These TFTs on plastic exhibit a field‐effect mobility of 0.77 cm²/V‐sec, on/off current ratio >10⁹ at Vds = 10 V, sub‐threshold swing of 365 mV/dec, threshold voltage of 0.49 V, and leakage current lower than 2 pA/μm gate width. After full TFT‐array fabrication on the bonded substrate and subsequent debonding, the flexible substrate retains its original flexibility; this enables bending of the EPD display without loss in performance.     

Performance improvements of IGZO and ZnO thin‐film transistors by laser‐irradiation treatment

Abstract— Zinc oxide (ZnO) and indium gallium zinc oxide (IGZO) thin films subjected to laser irradiation were investigated. The structural, optical, and electrical properties of the as‐deposited and laser‐irradiated films at different laser dosages were studied. The crystallinity of the structure increased after laser treatment. The transmittances without/with laser irradiation had a net rise of 85–92% and 80–95% (@550 nm) for 250‐nm ZnO and IGZO films, respectively. Thin‐film transistors (TFTs) with ZnO and IGZO as the active layer were fabricated. The as‐deposited ZnO/IGZO TFT devices had a field‐effect mobility of 0.19 and 1.3 cm²/V‐sec, respectively. The electrical characteristics increased by more than 2.8 times for ZnO and by 5.8 times for IGZO with laser treatment. The field‐effect mobility of ZnO and IGZO are 0.5 and 7.65 cm²/V‐sec.     

High‐performance bottom‐contact organic TFTs on plastic for flexible AMLCDs

Abstract— A high‐performance bottom‐contact organic‐thin‐film transistor (OTFT) array on plastic using a self‐organized process has been developed. The effect of octadecyltrichlorosilane (OTS) treatment on the poly‐4‐vinylphenol (PVP) gate insulator on the performance of OTFT on plastic has been studied. The OTFT without OTS exhibited a field‐effect mobility of 0.1‐cm²/V‐sec on/off current ratio of >10⁷. On the other hand, the OTFT with OTS treatment exhibited a field‐effect mobility of 1.3 cm²/V‐sec and an on/off current ratio of >10⁸. This is mainly due to the enhancement in grain size from less than 10 μm to more than 20 μm.     

Transparent AMOLED display driven by split oxide TFT backplane

We have developed stable and high performance etch‐stopper amorphous indium–gallium–zinc oxide thin‐film transistor (TFT) by using split active oxide semiconductor. The amorphous indium–gallium–zinc oxide TFTs exhibit the mobility as high as over 70 cm²/Vs and the stable operation under positive bias temperature stress. In this work, we demonstrated a 4‐in. transparent active‐matrix organic light‐emitting diode display using oxide TFT backplane with split active layer, where the gate driver is integrated.     

A low‐cost low‐temperature thin‐film‐transistor backplane based on oxide semiconductor

Abstract— An indium‐gallium‐zinc‐oxide (IGZO) thin‐film transistor (TFT) based on an anodized aluminum‐oxide gate dielectric and photoresist passivation has been fabricated. The TFT showed a field‐effect mobility of as high as 18 cm²/V‐sec and a threshold voltage of only 0.5 V. A 50 × 50 AMOLED display based on this type of TFT was designed and fabricated. The average luminance of the panel was 150 cd/m², and the maximum pixel luminance was 900 cd/m².