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1.
An X-band high-power and high power added efficiency (PAE), two-stage AlGaAs/InGaAs/GaAs psuedomorphic high electronic mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) power amplifier is presented. The amplifier is designed to fully match a 50 Omega input and output impedance. Based on a 0.35 mum gate-length power PHEMT technology, the MMIC is fabricated on a 3 mil thick wafer. Under an 8 V DC bias condition, the characteristics of 17.5 dB small-signal gain, 10 W continuous wave mode saturation output power of 42% PAE, and 12.6 W pulse saturation output power of 52.6% PAE at 9.4 GHz can be achieved.  相似文献   

2.
A successful development of a very high performance and reliable power PHEMT MMIC technology is reported. In this paper, a Ku-Band 1 W AlGaAs/InGaAs/GaAs PHEMT MMIC power amplifier for VSAT ODU application is demonstrated. This four-stage amplifier is designed to fully match for a 50 Ω input and output impedance. With 7 V and 700 mA DC bias condition, the amplifier has achieved 30 dB small-signal gain, 30.8 dBm 1-dB gain compression power with 24.5% power-added efficiency (PAE) and 31.3 dBm saturation power with 27.5% PAE from 14 to 17 GHz.  相似文献   

3.
A built-in linearizer was applied to improve the linearity in a 5.2-GHz power amplifier microwave monolithic integrated circuit (MMIC), which was undertaken with 0.15-μm AlGaAs/InGaAs D-mode PHEMT technology.The power amplifier (PA) was studied taking into account the linearizer circuit and the coplanar waveguide (CPW) structures. Based on these technologies, the power amplifier, which has a chip size of 1.44 × 1.10 mm~2, obtained an output power of 13.3 dBm and a power gain of 14 dB in the saturation region. An input third-order intercept point (IIP_3) of-3 dBm, an output third-order intercept point (OIP_3) of 21.1 dBm and a power added efficiency (PAE) of 22% were attained, respectively. Finally, the overall power characterization exhibited high gain and high linearity, which illustrates that the power amplifier has a compact circuit size and exhibits favorable RF characteristics. This power circuit demonstrated high RF characterization and could be used for microwave power circuit applications at 5.2 GHz.  相似文献   

4.
采用0.25μm AlGaAs/InGaAs/GaAs PHEMT工艺技术,研制出了6~18GHz三级MMIC全匹配宽带功率放大器单片.在6~18GHz的工作频率下,放大器的平均功率增益为19dB,输出功率大于33.3dBm,在10GHz处有最大输出功率34.7dBm,输入回波损耗S11低于-10dB,输出回波损耗S22低于-6dB.与报道的C-X-Ku频段宽带功率放大器相比,有较好的功率平坦度.  相似文献   

5.
采用0.5μm GaAs PHEMT工艺研制了一种单电源共栅电流模跨阻抗前置放大器(TIA).测量得到放大器-3dB带宽为7.5GHz,跨阻增益为45dBΩ;输入输出电压驻波比(VSWR)均小于2;等效输入噪声电流谱密度在14.3~22pA/ Hz之间,平均值为17.2pA/ Hz.在输入10Gb/s非归零(NRZ)伪随机二进制序列(PRBS)信号下,放大器输出眼图清晰,具有14ps的定时抖动和138mV的峰峰电压.  相似文献   

6.
Wide frequency bandwidth has been internationally allocated for unlicensed operation around the oxygen absorption frequency at 60 GHz. A power amplifier and a low noise amplifier are presented as building blocks for a T/R-unit at this frequency. The fabrication technology was a commercially available 0.15 m gallium arsenide (GaAs) process featuring pseudomorphic high electron mobility transistors (PHEMT). Using on-wafer tests, we measured a gain of 13.4 dB and a +17 dBm output compression point for the power amplifier at 60 GHz centre frequency when the MMIC was biased to 3 volts Vdd. At the same frequency, the low noise amplifier exhibited 24 dB of gain with a 3.5 dB noise figure. The AM/AM and AM/PM characteristics of the power amplifier chip were obtained from the large-signal S-parameter measurement data. Furthermore, the power amplifier was assembled in a split block package, which had a WR-15 waveguide interface in input and output. The measured results show a 12.5 dB small-signal gain and better than 8 dB return losses in input and output for the packaged power amplifier.  相似文献   

7.
利用0.2μmGaAsPHEMT工艺研制了40Gb/s光通信系统中的光调制器驱动放大器。该放大器芯片采用有源偏置的七级分布放大器结构,工作带宽达到40GHz,输入输出反射损耗约-10dB,功率增益14dB,功耗700mW,最大电压输出幅度达到7V。两级芯片级连后,功率增益约27dB,在40Gbit/s速率下得到清晰的眼图。  相似文献   

8.
正A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor(PHEMT) technology from Win Semiconductor of Taiwan.A special optional gate bias technique is introduced to allow an adjustable gain control range of 10 dB.A novel cascode structure is adopted to extend the output voltage and bandwidth.The measurement results show that the amplifier gives an average gain of 15 dB with a gain flatness of±1 dB in the 2-20 GHz band.The noise figure is between 2 and 4.1 dB during the band from 2 to 20 GHz.The amplifier also provides 13.8 dBm of output power at a 1 dB gain compression point and 10.5 dBm of input third order intercept point(IIP3),which demonstrates the excellent performance of linearity.The power consumption is 300 mW with a supply of 5 V,and the chip area is 2.36×1.01 mm~2.  相似文献   

9.
俞汉扬  陈良月  李昕  杨涛  高怀 《电子科技》2011,24(12):38-41
基于0.15μm GaAs PHEMT工艺设计了一款C波段宽带单片集成低噪声放大器。电路由三级放大器级联而成,三级电路结构均使用电阻自偏压技术来实现单电源供电,它既可保证PHEMT管处于低噪声高增益的工作点,又可将所有元器件集成在单片GaAs衬底上,解决了供电复杂的问题。第三级电路采用了并联负反馈结构,降低了带内低频端...  相似文献   

10.
研制了一款60~90 GHz功率放大器单片微波集成电路(MMIC),该MMIC采用平衡式放大结构,在较宽的频带内获得了平坦的增益、较高的输出功率及良好的输入输出驻波比(VSWR)。采用GaAs赝配高电子迁移率晶体管(PHEMT)标准工艺进行了流片,在片测试结果表明,在栅极电压为-0.3 V、漏极电压为+3 V、频率为60~90 GHz时,功率放大器MMIC的小信号增益大于13 dB,在71~76 GHz和81~86 GHz典型应用频段,功率放大器的小信号增益均大于15 dB。载体测试结果表明,栅极电压为-0.3 V、漏极电压为+3 V、频率为60~90 GHz时,该功率放大器MMIC饱和输出功率大于17.5 dBm,在71~76 GHz和81~86 GHz典型应用频段,其饱和输出功率可达到20 dBm。该功率放大器MMIC尺寸为5.25 mm×2.10 mm。  相似文献   

11.
This letter presents a compact X-band high gain and high power four-stage AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) high power amplifier (PA). This amplifier is designed to fully match a 50-Omega input and output impedance. Based on 0.35-mum gate-length power PHEMT technology, this PA MMIC is fabricated on a 3-mil thick wafer. While operating under 8 V and 2700-mA dc bias condition, the characteristics of 40-dB small-signal gain, a 10-W continuous-wave saturation output power, and 33% power added efficiency at 9.7GHz can be achieved  相似文献   

12.
采用OMMIC公司提供的0.2μm GaAs PHEMT工艺(fT=60 GHz)设计并实现了一种适用于宽带无线通信系统接收前端的低噪声放大器。在3.1~10.6 GHz的频带内测试结果如下:最高增益为13 dB;增益波动<2dB;输入回波损耗S11<-11 dB;输出回波损耗S22<-16 dB;噪声系数NF<3.9 dB。5 V电源供电,功耗为120mW。芯片面积为0.5 mm×0.9 mm。与近期公开发表的宽带低噪声放大器测试结果相比较,本电路结构具有芯片面积小、工作带宽大、噪声系数低的优点。  相似文献   

13.
GaAs单片集成电路具有体积小、质量轻和可靠性高等特性,已经成为微波领域重要的器件。采用MBE技术生长出双面掺杂AlGaAs/InGaAs PHEMT结构的外延材料,研制了高效率的GaAs PHEMT器件,S波段功率附加效率大于55%。建立了基于EEHEMT的大信号模型,利用ADS软件搭建了有耗匹配的二级放大电路拓扑结构,进行最佳效率匹配,得到优化电路。采用4英寸(1英寸=2.54cm)GaAs0.35μm标准工艺研制了AlGaAs/InGaAs/GaAsPHEMT MMIC电路,测试结果表明,在测试频率为2.2~3.4GHz,测试电压VDS为10V时,输出功率大于12W,功率增益大于22dB,功率附加效率大于40%。  相似文献   

14.
利用0.25μmGaAsPHEMT低噪声工艺,设计并制造了2种毫米波大动态宽带单片低噪声放大器。第1种为低增益大动态低噪声放大器,单电源+5V工作,测得在26~40GHz范围内,增益G=10±0.5dB,噪声系数NF≤2.2dB,1分贝压缩点输出功率P1dB≥15dBm;第2种为低压大动态低噪声放大器,工作电压为3.6V,静态电流0.6A(输出功率饱和时,动态直流电流约为0.9A),在28~35GHz范围内,测得增益G=14~17dB,噪声系数约4.0dB,1分贝压缩点输出功率P1dB≥24.5dBm,最大饱和输出功率≥26.8dBm,附加效率约10%~13.6%。结果中还给出了2种放大器直接级联的情况。  相似文献   

15.
Ka波段PHEMT功率放大器   总被引:1,自引:0,他引:1  
报道了 Ka波段的 PHEMT功率放大器的设计和研制。 PHEMT器件采用 0 .2 μm栅长的 Φ 76 mm Ga As工艺制作 ,并利用 CAD技术指导材料生长和器件制作。单级的 MIC放大器采用0 .3mm栅宽的 PHEMT,在 34GHz处 ,输出功率 10 0 m W,功率增益 4 d B。  相似文献   

16.
利用pHEMT工艺设计了一个Ka波段微波单片低噪声放大器电路。电路采用四级放大的结构形式。利用微带电路实现射频输入、输出和级间匹配。采用多目标优化方法对电路增益、噪声系数、驻波比、稳定系数和输出1dB压缩点等特性进行了研究。设计出一个增益大于20dB,噪声系数小于1.0dB,1dB压缩点的输出功率在10dBm以上,性能优异的LNA。  相似文献   

17.
运用微波在片测试技术和IC-CAP模型提取软件对总栅宽为850μm PHEMT器件进行了大信号建模,并利用此模型,采用分布式放大器与电抗匹配相结合的方法,制备了一款三级宽带功率放大器。实验测试结果和ADS仿真结果相吻合。其测试结果为:在6~18GHz频段内,平均输出功率Po为33dBm,功率增益Gp在22~24dB之间,功率附加效率PAE在23%~28%之间,输入输出端口电压驻波比VSWR<1.8,稳定性判断因子K>1(在5~19GHz内)。  相似文献   

18.
21~28GHz波段平衡式放大器   总被引:1,自引:0,他引:1  
采用OMM IC的0.2μm PHEM T工艺设计了工作在21~28 GH z的平衡式放大器。正交耦合电桥采用兰格电桥。兰格电桥和平衡式放大器的在片测试结果和仿真结果基本吻合,平衡式放大器在21~28 GH z的增益为18~20 dB,输入和输出回波损耗小于-20 dB,在26 GH z处的输出1 dB压缩点功率为21 dBm。  相似文献   

19.
A wideband MMIC power amplifier at W-band is reported in this letter. The four-stage MMIC, developed using 0.1 μm GaAs pseudomorphic HEMT (PHEMT) technology, demonstrated a flat small signal gain of 12.4±2 dB with a minimum saturated output power (Psat) of 14.2 dBm from 77 to 100 GHz. The typical Psat is better by 16.3 dBm with a flatness of 0.4 dB and the maximum power added efficiency is 6% between 77 and 92 GHz. This result shows that the amplifier delivers output power density of about 470 mW/mm with a total gate output periphery of 100 μm. As far as we know, it is nearly the best power density performance ever published from a single ended GaAs-based PHEMT MMIC at this frequency band.  相似文献   

20.
本文设计了一款基于0.25 um氮化镓PHEMT工艺的8.5-10.5GHz MMIC收发前端芯片,该收发前端由一个功率放大器和一个单刀双掷开关组成.经仿真优化后,在工艺线上进行了流片,并载片测试了其性能参数.测试结果显示,发射路的功率放大器饱和输出功率大于33dBm,功率附加效率39%.接收路开关插入损耗0.6dB,开关隔离度大于37dB.  相似文献   

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