Simulation and implementation of a porous silicon reflector for epitaxial silicon solar cells

One of the main challenges in the ongoing development of thin film crystalline silicon solar cells on a supporting silicon substrate is the implementation of a long‐wavelength reflector at the interface between the epitaxial layer and the substrate. IMEC has developed such a reflector based on electrochemical anodization of silicon to create a multi‐layer porous silicon stack with alternating high and low porosity layers. This innovation results in a 1–2% absolute increase in efficiency for screenprinted epitaxial cells with a record of 13·8%. To reach a better understanding of the reflector and to aid in its continued optimization, several extensive optical simulations have been performed using an in‐house‐developed optical software programme. This software is written as a Microsoft Excel workbook to make use of its user‐friendliness and modular structure. It can handle up to 15 individual dielectric layers and is used to determine the influence of the number and the sequence of the layers on the internal reflection. A sensitivity analysis is also presented. A study of the angle at which the light strikes the reflector shows separate regions in the physical working of the reflector which include a region where the Bragg effect is dominant as well as a region where total internal reflection plays the largest role. The existence of these regions is proved using reflection measurements. Based on these findings, an estimate is made for the achievable current gain with an ideal reflector and the potential of epitaxial silicon solar cells is determined. Copyright © 2008 John Wiley & Sons, Ltd.     

>16% thin‐film epitaxial silicon solar cells on 70‐cm2 area with 30‐µm active layer,porous silicon back reflector,and Cu‐based top‐contact metallization

We demonstrate the use of a copper‐based metallization scheme for the specific application of thin‐film epitaxial silicon wafer equivalent (EpiWE) solar cells with rear chemical vapor deposition emitter and conventional POCl₃ emitter. Thin‐film epitaxial silicon wafer equivalent cells are consisting of high‐quality epitaxial active layer of only 30 µm, beneath which a highly reflective porous silicon multilayer stack is embedded. By combining Cu‐plating metallization and narrow finger lines with an epitaxial cell architecture including the porous silicon reflector, a J_sc exceeding 32 mA/cm² was achieved. We report on reproducible cell efficiencies of >16% on >70‐cm² cells with rear epitaxial chemical vapor deposition emitters and Cu contacts. Copyright © 2011 John Wiley & Sons, Ltd.     

Reorganized Porous Silicon Bragg Reflectors for Thin-Film Silicon Solar Cells

Stacks of porous silicon layers have been successfully applied to maximize internal reflection at the interface between a silicon substrate and an epitaxially grown layer. The stack is consist of alternating porous layers of high and low porosity, defined by the quarter-wavelength rule. During the hydrogen bake prior to epitaxial growth of the epitaxial layer, the porous silicon stack crystallizes in the form of thin quasi-monocrystalline silicon layers incorporating large voids. Experimental data of the measured external reflectance have been linked to the internal reflectance. An optical-path-length enhancement factor of seven was calculated in the wavelength range of 900–1200 nm. Application on thin-film epitaxial solar cells showed a 12% increase in short-circuit current and efficiency.     

Evaluation of the influence of an embedded porous silicon layer on the bulk lifetime of epitaxial layers and the interface recombination at the epitaxial layer/porous silicon interface

Porous silicon plays an important role in the concept of wafer‐equivalent epitaxial thin‐film solar cells. Although porous silicon is beneficial in terms of long‐wavelength optical confinement and gettering of metals, it could adversely affect the quality of the epitaxial silicon layer grown on top of it by introducing additional crystal defects such as stacking faults and dislocations. Furthermore, the epitaxial layer/porous silicon interface is highly recombinative because it has a large internal surface area that is not accessible for passivation. In this work, photoluminescence is used to extract the bulk lifetime of boron‐doped (10¹⁶/cm³) epitaxial layers grown on reorganised porous silicon as well as on pristine mono‐crystalline, Czochralski, p⁺ silicon. Surprisingly, the bulk lifetime of epitaxial layers on top of reorganised porous silicon is found to be higher (~100–115 µs) than that of layers on top of bare p⁺ substrate (32–50 µs). It is believed that proper surface closure prior to epitaxial growth and metal gettering effects of porous silicon play a role in ensuring a higher lifetime. Furthermore, the epitaxial layer/porous silicon interface was found to be ~250 times more recombinative than an epitaxial layer/p⁺ substrate interface (S ≅ 10³ cm/s). However, the inclusion of an epitaxially grown back surface field on top of the porous silicon effectively shields minority carriers from this highly recombinative interface. Copyright © 2013 John Wiley & Sons, Ltd.     

Multi‐crystalline Si solar cells with very fast deposited (180 nm/min) passivating hot‐wire CVD silicon nitride as antireflection coating

Hot‐wire chemical vapor deposition (HWCVD) is a promising technique for very fast deposition of high quality thin films. We developed processing conditions for device‐ quality silicon nitride (a‐SiN_x:H) anti‐reflection coating (ARC) at high deposition rates of 3 nm/s. The HWCVD SiN_x layers were deposited on multicrystalline silicon (mc‐Si) solar cells provided by IMEC and ECN Solar Energy. Reference cells were provided with optimized parallel plate PECVD SiN_x and microwave PECVD SiN_x respectively. The application of HWCVD SiN_x on IMEC mc‐Si solar cells led to effective passivation, evidenced by a V_oc of 606 mV and consistent IQE curves. For further optimization, series were made with HW SiN_x (with different x) on mc‐Si solar cells from ECN Solar Energy. The best cell efficiencies were obtained for samples with a N/Si ratio of 1·2 and a high mass density of >2·9 g/cm³. The best solar cells reached an efficiency of 15·7%, which is similar to the best reference cell, made from neighboring wafers, with microwave PECVD SiN_x. The IQE measurements and high V_oc values for these cells with HW SiN_x demonstrate good bulk passivation. PC1D simulations confirm the excellent bulk‐ and surface‐passivation for HW SiN_x coatings. Interesting is the significantly higher blue response for the cells with HWCVD SiN_x when compared to the PECVD SiN_x reference cells. This difference in blue response is caused by lower light absorption of the HWCVD layers (compared to microwave CVD; ECN) and better surface passivation (compared to parallel plate PECVD; IMEC). The application of HW SiN_x as a passivating antireflection layer on mc‐Si solar cells leads to efficiencies comparable to those with optimized PECVD SiN_x coatings, although HWCVD is performed at a much higher deposition rate. Copyright © 2007 John Wiley & Sons, Ltd.     

Efficiency (>15%) for thin‐film epitaxial silicon solar cells on 70 cm2 area offspec silicon substrate using porous silicon segmented mirrors

We report on the beneficial use of embedded segmented porous silicon broad‐band optical reflectors for thin‐film epitaxial silicon solar cells. These reflectors are formed by gradual increase of the spatial period between the layer segments, allowing for an enhanced absorption of low energy photons in the epitaxial layer. By combining these reflectors with well‐established solar cell processing by photolithography, a conversion efficiency of 15·2% was reached on 73 cm² area, highly doped offspec multicrystalline silicon substrates. The corresponding photogenerated current densities (J_sc) were well above 31 mA/cm² for an active layer of only 20 µm. Copyright © 2010 John Wiley & Sons, Ltd.     

Screen‐printed epitaxial silicon thin‐film solar cells with 13·8% efficiency

Amidst the different silicon thin‐film systems, the epitaxial thin‐film solar cell represents an approach with interesting potential. Consisting of a thin active c‐Si layer grown epitaxially on top of a low‐quality c‐Si substrate, it can be implemented into solar cell production lines without major changes in the current industrial process sequences. Within this work, ∼30‐μm‐thick epitaxial layers on non‐textured and highly doped monocrystalline Czochralski (Cz) and multicrystalline (mc) Si substrates have been prepared by CVD. Confirmed efficiencies of 13·8% on Cz and 12·3% on mc‐Si substrates have been achieved by applying an industrial process scheme based on tube and in‐line phosphorus diffusion, as well as screen‐printed front and back contacts fired through a SiN_x anti‐reflection coating. An extensive solar cell characterisation, including infrared lock‐in thermography and spectral response measurements is presented. Copyright © 2003 John Wiley & Sons, Ltd.     

Ultrathin PECVD epitaxial Si solar cells on glass via low‐temperature transfer process

Fabrication of high‐quality ultrathin monocrystalline silicon layers and their transfer to low‐cost substrates are key steps for flexible electronics and photovoltaics. In this work, we demonstrate a low‐temperature and low‐cost process for ultrathin silicon solar cells. By using standard plasma‐enhanced chemical vapor deposition (PECVD), we grow high‐quality epitaxial silicon layers (epi‐PECVD) from SiH₄/H₂ gas mixtures at 175 °C. Using secondary ion mass spectrometry and transmission electron microscopy, we show that the porosity of the epi‐PECVD/crystalline silicon interface can be tuned by controlling the hydrogen accumulation there. Moreover, we demonstrate that 13–14% porosity is a threshold above which the interface becomes fragile and can easily be cleaved. Taking advantage of the H‐rich interface fragility, we demonstrate the transfer of large areas (∽10 cm²) ultrathin epi‐PECVD layers (0.5–5.5 µm) onto glass substrates by anodic bonding and moderate annealing (275–350 °C). The structural properties of transferred layers are assessed, and the first PECVD epitaxial silicon solar cells transferred on glass are characterized. Copyright © 2016 John Wiley & Sons, Ltd.     

Electron‐beam crystallized large grained silicon solar cell on glass substrate

Thin film hetero‐emitter solar cells with large‐grained poly‐silicon absorbers of around 10 µm thickness have been prepared on glass. The basis of the cell concept is electron‐beam‐crystallization of an amorphous or nanocrystalline silicon layer deposited onto a SiC:B layer. The SiC:B layer covers a commercially well available glass substrate, serving as diffusion barrier, contact layer and dopand source. For silicon absorber deposition a low pressure chemical vapour deposition was used. The successively applied e‐beam crystallization process creates poly‐silicon layers with grain sizes up to 1 × 10 mm² with low defect densities. The high electronic quality of the absorber is reflected in open circuit voltages as high as 545 mV, which are realized making use of the well‐developed a‐Si:H hetero‐emitter technology. Copyright © 2011 John Wiley & Sons, Ltd.     

Determination of the minority carrier lifetime in crystalline silicon thin‐film material

The effective minority carrier lifetimes on epitaxial silicon thin‐film material have been measured successfully using two independent microwave‐detected photoconductivity decay setups. Both measurement setups are found to be equally suited to determine the minority carrier lifetime of crystalline silicon thin‐film (cSiTF) material. The different measurement conditions to which the sample under investigation is exposed are critically analyzed by both simulations and measurements on a large number of lifetime samples. No systematic deviation between the lifetime results from different measurement setups could be observed, underlining the accuracy of the determined lifetime value. Subsequently, a method to separate the epitaxial bulk lifetime and the total recombination velocity, consisting of front surface and interface recombination between the epitaxial layer and the substrate, is presented. The method, based on different thicknesses of the epitaxial layer, is applied to all batches of this investigation. Each batch consists of samples with the same material quality but different epitaxial layer thicknesses whereas different batches differ in their material quality. In addition, the same method is also successfully applied on individual cSiTF samples. From the results, it can be concluded that the limiting factor of the effective minority carrier lifetime for the investigated solar‐grade cSiTF material is the elevated recombination velocity at the interface between epitaxial layer and the substrate compared with microelectronic‐grade material. In contrast, the samples cannot be classified into different material qualities by their epitaxial bulk lifetimes. Even on multicrystalline substrate, solar‐grade material can exhibit high epitaxial bulk lifetimes comparable to microelectronic‐grade material. Copyright © 2012 John Wiley & Sons, Ltd.     

Preparation and measurement of highly efficient a‐Si:H single junction solar cells and the advantages of μc‐SiOx:H n‐layers

Reducing the optical losses and increasing the reflection while maintaining the function of doped layers at the back contact in solar cells are important issues for many photovoltaic applications. One approach is to use doped microcrystalline silicon oxide (μc‐SiO_x:H) with lower optical absorption in the spectral range of interest (300 nm to 1100 nm). To investigate the advantages, we applied the μc‐SiO_x:H n‐layers to a‐Si:H single junction solar cells. We report on the comparison between amorphous silicon (a‐Si:H) single junction solar cells with either μc‐SiO_x:H n‐layers or non‐alloyed silicon n‐layers. The origin of the improved performance of a‐Si:H single junction solar cells with the μc‐SiO_x:H n‐layer is identified by distinguishing the contributions because of the increased transparency and the reduced refractive index of the μc‐SiO_x:H material. The solar cell parameters of a‐Si:H solar cells with both types of n‐layers were compared in the initial state and after 1000 h of light soaking in a series of solar cells with various absorber layer thicknesses. The measurement procedure for the determination of the solar cell performance is described in detail, and the measurement accuracy is evaluated and discussed. For an a‐Si:H single junction solar cell with a μc‐SiO_x:H n‐layer, a stabilized efficiency of 10.3% after 1000 h light soaking is demonstrated. Copyright © 2015 John Wiley & Sons, Ltd.     

Development of high‐efficiency large‐area screen‐printed solar cells on direct kerfless epitaxially grown monocrystalline Si wafer and structure

This paper demonstrates the potential of epitaxially grown Si wafers with doped layers for high‐efficiency solar cells. Boron‐doped 239 cm² 180–200 µm thick 2 Ω‐cm wafers were grown with and without 15 µm thick p⁺ layer, with a doping in the range of 10¹⁷~10¹⁸ cm⁻³. A layer transfer process involving porous Si layer to lift off epi‐Si wafers from the reusable substrate was used. The pp⁺ wafers were converted into n⁺pp⁺ passivated emitter rear totally diffused (PERT) cells by forming an oxide‐passivated POCl₃‐diffused n⁺ emitter at the front, and oxide/nitride‐passivated epitaxially grown p⁺ BSF at the entire back, with local screen‐printed contacts. To demonstrate and quantify the benefit of the epi‐grown p⁺ layer, standard passivated emitter and rear cells (PERCs) with local BSF and contacts were also fabricated on p‐type epi‐Si wafers as well on commercial‐grade Cz wafers. Sentaurus 2D device model was used to assess the impact of the epi‐grown p⁺ layer, which showed an efficiency gain of ~0.5% for this PERT structure over the traditional PERC. This was validated by the cell results, which showed an efficiency of ~20.1% for the PERC, and ~20.3% for the PERT cell using epi‐Si wafers. Experimental data showed higher FF in PERT cells, largely because of the decrease in lateral resistance on the rear side. Efficiency gain, a result of higher FF, was greater than the recombination loss in the p⁺ layer because of the lightly doped thick p⁺ epi‐grown region used in this study. Copyright © 2016 John Wiley & Sons, Ltd.     

Highly transparent modulated surface textured front electrodes for high‐efficiency multijunction thin‐film silicon solar cells

To further increase the efficiency of multijunction thin‐film silicon (TF‐Si) solar cells, it is crucial for the front electrode to have a good transparency and conduction, to provide efficient light trapping for each subcell, and to ensure a suitable morphology for the growth of high‐quality silicon layers. Here, we present the implementation of highly transparent modulated surface textured (MST) front electrodes as light‐trapping structures in multijunction TF‐Si solar cells. The MST substrates comprise a micro‐textured glass, a thin layer of hydrogenated indium oxide (IOH), and a sub‐micron nano‐textured ZnO layer grown by low‐pressure chemical vapor deposition (LPCVD ZnO). The bilayer IOH/LPCVD ZnO stack guarantees efficient light in‐coupling and light trapping for the top amorphous silicon (a‐Si:H) solar cell while minimizing the parasitic absorption losses. The crater‐shaped micro‐textured glass provides both efficient light trapping in the red and infrared wavelength range and a suitable morphology for the growth of high‐quality nanocrystalline silicon (nc‐Si:H) layers. Thanks to the efficient light trapping for the individual subcells and suitable morphology for the growth of high‐quality silicon layers, multijunction solar cells deposited on MST substrates have a higher efficiency than those on single‐textured state‐of‐the‐art LPCVD ZnO substrates. Efficiencies of 14.8% (initial) and 12.5% (stable) have been achieved for a‐Si:H/nc‐Si:H tandem solar cells with the MST front electrode, surpassing efficiencies obtained on state‐of‐the‐art LPCVD ZnO, thereby highlighting the high potential of MST front electrodes for high‐efficiency multijunction solar cells. Copyright © 2015 John Wiley & Sons, Ltd.     

Textured silicon surface passivation by high‐rate expanding thermal plasma deposited SiN and thermal SiO2/SiN stacks for crystalline silicon solar cells

Expanding thermal plasma (ETP) deposited silicon nitride (SiN) with optical properties suited for the use as antireflection coating (ARC) on silicon solar cells has been used as passivation layer on textured monocrystalline silicon wafers. The surface passivation behavior of these high‐rate (>5 nm/s) deposited SiN films has been investigated for single layer passivation schemes and for thermal SiO₂/SiN stack systems before and after a thermal treatment that is normally used for contact‐firing. It is shown that as‐deposited ETP SiN used as a single passivation layer almost matches the performance of a thermal oxide. Furthermore, the SiN passivation behavior improves after a contact‐firing step, while the thermal oxide passivation degrades which makes ETP SiN a better alternative for single passivation layer schemes in combination with a contact‐firing step. Moreover, using the ETP SiN as a part of a thermal SiO₂/SiN stack proves to be the best alternative by realizing very low dark saturation current densities of <20 fA/cm² on textured solar‐grade FZ silicon wafers and this is further improved to <10 fA/cm² after the anneal step. Optical and electrical film characterizations have also been carried out on these SiN layers in order to study the behavior of the SiN before and after the thermal treatment. Copyright © 2008 John Wiley & Sons, Ltd.     

Laser‐fired contact for n‐type crystalline Si solar cells

Laser‐fired contacts to n‐type crystalline silicon were developed by investigating novel metal stacks containing Antimony (Sb). Lasing conditions and the structure of metals stacks were optimized for lowest contact resistance and minimum surface damage. Specific contact resistance for firing different metal stacks through either silicon nitride or p‐type amorphous silicon was determined using two different models and test structures. Specific contact resistance values of 2–7 mΩcm² have been achieved. Recombination loss due to laser damage was consistent with an extracted local surface recombination velocity of ~20 000 cm/s, which is similar to values for laser‐fired base contact for p‐type crystalline silicon. Interdigitated back contact silicon heterojunction cells were fabricated with laser‐fired base contact and proof‐of‐concept efficiencies of 16.9% were achieved. This localized base contact technique will enable low cost back contact patterning and innovative designs for n‐type crystalline solar cell. Copyright © 2014 John Wiley & Sons, Ltd.     

8% Efficient thin‐film polycrystalline‐silicon solar cells based on aluminum‐ induced crystallization and thermal CVD

A considerable cost reduction could be achieved in photovoltaics if efficient solar cells could be made from polycrystalline‐silicon (pc‐Si) thin films on inexpensive substrates. We recently showed promising solar cell results using pc‐Si layers obtained by aluminum‐induced crystallization (AIC) of amorphous silicon in combination with thermal chemical vapor deposition (CVD). To obtain highly efficient pc‐Si solar cells, however, the material quality has to be optimized and cell processes different from those applied for standard bulk‐Si solar cells have to be developed. In this work, we present the different process steps that we recently developed to enhance the efficiency of pc‐Si solar cells on alumina substrates made by AIC in combination with thermal CVD. Our present pc‐Si solar cell process yields cells in substrate configuration with efficiencies so far of up to 8·0%. Spin‐on oxides are used to smoothen the alumina substrate surface to enhance the electronic quality of the absorber layers. The cells have heterojunction emitters consisting of thin a‐Si layers that yield much higher V_oc values than classical diffused emitters. Base and emitter contacts are on top of the cell in interdigitated finger patterns, leading to fill factors above 70%. The front surface of the cells is plasma textured to increase the current density. Our present pc‐Si solar cell efficiency of 8% together with the fast progression that we have made over the last few years indicate the large potential of pc‐Si solar cells based on the AIC seed layer approach. Copyright © 2007 John Wiley & Sons, Ltd.     

Techno‐economic analysis of three different substrate removal and reuse strategies for III‐V solar cells

The high cost of wafers suitable for epitaxial deposition of III‐V solar cells has been a primary barrier to widespread use of these cells in low‐concentration and one‐sun terrestrial solar applications. A possible solution is to reuse the substrate many times, thus spreading its cost across many cells. We performed a bottom‐up techno‐economic analysis of three different strategies for substrate reuse in high‐volume manufacturing: epitaxial lift‐off, spalling, and the use of a porous germanium release layer. The analysis shows that the potential cost reduction resulting from substrate reuse is limited in all three strategies––not by the number of reuse cycles achievable, but by the costs that are incurred in each cycle to prepare the substrate for another epitaxial deposition. The dominant substrate‐preparation cost component is different for each of the three strategies, and the cost‐ranking of these strategies is subject to change if future developments substantially reduce the cost of epitaxial deposition. Copyright © 2016 John Wiley & Sons, Ltd.     

Autodiffusion: a novel method for emitter formation in crystalline silicon thin‐film solar cells

The in situ formation of an emitter in monocrystalline silicon thin‐film solar cells by solid‐state diffusion of dopants from the growth substrate during epitaxy is demonstrated. This approach, that we denote autodiffusion, combines the epitaxy and the diffusion into one single process. Layer‐transfer with porous silicon (PSI process) is used to fabricate n‐type silicon thin‐film solar cells. The cells feature a boron emitter on the cell rear side that is formed by autodiffusion. The sheet resistance of this autodiffused emitter is 330 Ω/□. An independently confirmed conversion efficiency of (14·5 ± 0·4)% with a high short circuit current density of (33·3 ± 0·8) mA/cm² is achieved for a 2 × 2 cm² large cell with a thickness of (24 ± 1) µm. Transferred n‐type silicon thin films made from the same run as the cells show effective carrier lifetimes exceeding 13 µs. From these samples a bulk diffusion length L > 111 µm is deduced. Amorphous silicon is used to passivate the rear surface of these samples after the layer‐transfer resulting in a surface recombination velocity lower than 38 cm/s. Copyright © 2006 John Wiley & Sons, Ltd.     

Full‐wave optoelectrical modeling of optimized flattened light‐scattering substrate for high efficiency thin‐film silicon solar cells

The flattened light‐scattering substrate (FLiSS) is formed by a combination of two materials with a high refractive index mismatch, and it has a flat surface. A specific realization of this concept is a flattened two‐dimensional grating. When applied as a substrate for thin‐film silicon solar cells in the nip configuration, it is capable to reflect light with a high fraction of diffused component. Furthermore, the FLiSS is an ideal substrate for growing high‐quality microcrystalline silicon (µc‐Si:H), used as bottom cell absorber layer in most of multijunction solar cell architectures. FLiSS is a three‐dimensional structure; therefore, a full‐wave analysis of the electromagnetic field is necessary for its optimal implementation. Using finite element method, different shapes, materials, and geometrical parameters were investigated to obtain an optimized FLiSS. The application of the optimized FLiSS in µc‐Si:H single junction nip cell (1‐µm‐thick i‐layer) resulted in a 27.4‐mA/cm² implied photocurrent density. The absorptance of µc‐Si:H absorber exceeded the theoretical Yablonovitch limit for wavelengths larger than 750 nm. Double and triple junction nip solar cells on optimal FLiSS and with thin absorber layers were simulated. Results were in line with state‐of‐the‐art optical performance typical of solar cells with rough interfaces. After the optical optimization, a study of electrical performance was carried out by simulating current–voltage characteristics of nip solar cells on optimized FLiSS. Potential conversion efficiencies of 11.6%, 14.2%, and 16.0% for single, double, and triple junction solar cells with flat interfaces, respectively, were achieved. Copyright © 2012 John Wiley & Sons, Ltd.