有线通话系统技术原理及其在新闻演播室的应用

介绍了内部通话系统的技术原理、分析了其线路配置及其通道特点、设备的电气特性,比较了常见的RTS系统、ClearCom系统和Audiocom系统三种有线系统的优劣,并结合笔者工作实践,详细讲解了内部通话系统在新闻演播室中的应用。并指出作为技术人员要熟悉该系统设备的原理和特点,能够灵活的应用,才能做到有的放矢,在出现问题的时候及时、准确地排除。     

一种基于微程序的FIR滤波系统

在分析基本FIR滤波器原理的基础上,设计了基于微程序的FIR滤波系统的硬件架构,并采用自顶向下的设计方法,利用硬件描述语言Verilog HDL实现了该系统,最后在Xilinx软件开发工具vivado2016.1上进行了仿真,并在Matlab软件中进行了验证。结果表明,设计的基于微程序的FIR滤波系统硬件架构可行,软件可靠,并具有阶数可扩展、可重构、可移植、占有资源少、功耗低的优点。     

有线电视网管系统的设计及其在智能网络系统中的作用

简要论述了有线电视网管系统建设的必要性,提出了“智能网络系统”概念,并阐述了网管系统在“智能网络系统”中的地位和作用,并简要说明了有别于传统网管系统的实现方法和机理。网管系统是实现整个网络“智能”和各个系统联动、提高网络自适应能力的关键。     

电子器件性能检测与控制系统

机器视觉系统在图像处理时耗费系统大量资源,导致系统实时性、稳定性和精确性度差,这影响了机器视觉在高端产品中的应用。本文详细介绍了一种Windows环境下基于视觉识别的自动测试与控制系统,该系统采用了高精度定时器、多线程编程来解决系统对于实时性的要求。并将图像处理和视觉识别技术应用到了工程实例,实现了系统的自动化,并满足了系统稳定性和精确性的要求。     

基于Zigbee的船舶状态监控系统的设计与实现

针对现有的船舶监控系统布线复杂、成本较高、维护困难等问题,并结合Zigbee无线通信特点,提出并设计了一种基于Zigbee技术的船舶状态监控系统。采用CC2530为硬件核心,并基于Z-stack协议栈进行软件开发。阐述了系统的整体构架,设计了节点的硬件组成及软件流程等关键技术问题。实验结果表明,该系统在数据采集传输、功耗等方面的性能达到了系统设计的基本要求,可广泛在船舶监控等方面推广应用。     

基于JBPM的公文流转系统的研究与实现

本文首先介绍了工作流和工作流管理系统的概念,提出了如何基于JBPM的公文流转系统的解决方案。并基于工作流和JBPM平台设计了高效、快速、稳定的公文流转系统的开发架构。最后在吉林省某事业单位公文流转系统的需求分析基础上,对公文流程进行分析,抽象出系统模型,并对应用系统加以实现。     

转播车级联系统的设计与应用

本文介绍了河南电视台八讯道数字转播车的外部级联系统概况,并根据在转播中的应用,对视频系统、音频系统、告示系统、通话系统以及同步系统的级联设计进行了全面阐述。     

高可靠度小型EFP系统方案在会议全媒体直播中的应用

本文研究了高可靠度小型EFP(Electronic Field Production)系统方案在会议全媒体直播中的应用。首先,对小型EFP系统和高可靠度设计原则进行了概述,分析了会议全媒体直播系统的需求。并提出了一种高可靠度小型EFP系统设计方案,包括系统架构、功能模块和应急处理方案。在此基础上,将该系统应用于会议全媒体直播系统设计中并进行了测试和评估。     

无线车辆管理调度系统的设计与实现

首先介绍了无线车辆管理调度系统中所涉及的无线通信、定位、嵌入式系统等技术,在此基础上提出了无线车辆管理调度系统的设计方案,并实现了系统的硬软件。该系统的车载终端在车辆行驶过程中可以实时地获得准确的定位和时间信息,并选择通过WLAN(无线局域网)和GPRS(通用分组无线电业务)两种方式与管理调度中心交互,实现管理调度中心对车辆实时信息的掌握并随时进行调度。     

用于MEMS加工的双面深度光刻机对准系统设计

比较了光刻机中几种常用的对准方式,并分析了其优缺点,在此基础上对双面深度光刻机底面对准系统的设计原理、结构及对准过程做了详细阐述,并进行了对准系统的精度分析,最后介绍了为系统实现所采取的其他技术措施。实践证明,该对准系统应用于深紫外双面深度光刻机中,系统运行稳定、可靠,完全能满足系统的精度要求。     

人小肠粘膜免疫酶的定位研究—光镜和电镜免疫组织化学染色法

本文对免疫酶组织化学的样品制备程序和染色方法做了详细的阐述。用直接法、间接法和ABC法,对人小肠免疫酶的定位,进行了光镜和电镜的观察,染色阳性反应显著,获得了满意的效果。并对染色技巧做了分析和探讨。     

聚对苯撑苯并双(口恶)唑发光及其器件制备

采用光谱技术,研究了聚对苯撑苯并双(口恶)唑(PBO)溶液的光敏发光特性,并用相对法估算出溶液发光效率在50%范围.结合光谱技术、半导体电学和电化学等研究手段,具体研究了以PBO为发光层的单层电致发光器件,研究结果显示,电致发光与薄膜的光致发光有具有相同的发光中心,峰值位于510 nm左右.同时发现,由于存制备过程中不同处理条件使得不同厚度薄膜残留的掺杂物质浓度不同,从而引起薄膜的导电性的不同.使得器件的阈值场强随PBO厚度的减小而逐渐增加.     

Emerging interconnects: a state-of-the-art review and emerging solutions

Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor??????? delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that multiwalled CNTs, multilayer GNR and mixed CNT bundles are promising candidates and are ultimate choice that can strongly address the problems faced by copper but on integration basis copper would last for coming years.     

Joint estimation of TOA and DOA in IR-UWB system using a successive propagator method

Impulse radio ultra-wideband (IR-UWB) ranging and positioning require accurate estimation of time-of-arrival (TOA) and direction-of-arrival (DOA). With receiver of two antennas, both of the TOA and DOA parameters can be estimated via two-dimensional (2D) propagator method (PM), in which the 2D spectral peak searching, however, renders much higher computational complexity. This paper proposes a successive PM algorithm for joint TOA and DOA estimation in IR-UWB system to avoid 2D spectral peak searching. The proposed algorithm firstly gets the initial TOA estimates in the two antennas from the propagation matrix, then utilises successively one-dimensional (1D) local searches to achieve the estimation of TOAs in the two antennas, and finally obtains the DOA estimates via the difference in the TOAs between the two antennas. The proposed algorithm, which only requires 1D local searches, can avoid the high computational cost in 2D-PM algorithm. Furthermore, the proposed algorithm can obtain automatically paired parameters and has better joint TOA and DOA estimation performance than conventional PM algorithm, estimation of signal parameters via rotational invariance techniques algorithm and matrix pencil algorithm. Meanwhile, it has very close parameter estimation to that of 2D-PM algorithm. We have also derived the mean square error of TOA and DOA estimation of the proposed algorithm and the Cramer-Rao bound of TOA and DOA estimation in this paper. The simulation results verify the usefulness of the proposed algorithm.     

Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C

The interfacial microstructure and shear strength of Sn3.8Ag0.7Cu-xNi (SAC-xNi, x = 0.5, 1, and 2) composite solders on Ni/Au finished Cu pads were investigated in detail after aging at 150 °C for up to 1000 h. The interfacial characteristics of composite solder joints were affected significantly by the weight percentages of added Ni micro-particles and aging time. After aging for 200 h, the solder joints of SAC, SAC-0.5Ni and -1Ni presented duplex intermetallic compound (IMC) layers regardless of the initial interfacial structure on as-reflowed joints, whose upper and lower IMC layers were comprised of (CuNi)₆Sn₅ and (NiCu)₃Sn₄, respectively. Only a single (NiCu)₃Sn₄ IMC layer was ever observed at the SAC-2Ni/Ni interface on whole aging process. Based on the compositional analysis, the amount of Ni within the IMC regions increased as the proportion of Ni addition increased. The IMC (NiCu)₃Sn₄ layer thickness on the interface of SAC and SAC-0.5Ni grew more slowly when compared to that of SAC-1Ni and -2Ni, while for the (CuNi)₆Sn₅ layer the reverse is true. Except the IMCs sizes are increased with increased aging time, the interfacial IMCs tended to transfer their morphologies to polyhedra. In all composite joints testing, the shear strengths were approximately equal to non-composite joints. The fracturing observed during shear testing of composite joints occurred in the bulk solder, indicating that the SAC-xNi/Ni solder joints had a desirable joint reliability.     

盲多用户检测技术中的恒模算法分析

恒模算法（CMA）是一种广泛应用于阵列处理、均衡和多用户检测中的盲算法。现对恒模算法及其在盲多用户检测技术中的应用进行了分析,并指出其研究方向。     

BNBST无铅压电陶瓷的制备工艺研究

设计了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3（BNBST[100x-100a／100b]）无铅压电陶瓷新体系。该体系压电陶瓷具有工艺特性及压电响应好，压电常数高的特点，且有实际应用前景的新型压电陶瓷材料体系。采用传统的陶瓷工艺制备了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3无铅压电陶瓷，研究了制备工艺参数对其物化结构性能的影响。生料的热重-差热（TGA-DTA）分析表明，粉料合成过程中，先是SrTiO3、BaTiO3的形成，然后是（Bi0．5Na0．5）Tio，的形成，同时三者形成固溶体；密度测试表明，陶瓷的体积密度随烧结温度的升高而增大，可较易获得理论密度94％的陶瓷；X-射线能谱分析（EDAX）研究表明，陶瓷的Bi、Na的挥发随着烧结温度的升高而加剧。研究结果表明，要制备性能优良的无铅压电陶瓷，需要精确控制制备工艺。     

全光波长转换技术的原理及应用

详细介绍了多种全光波长转换(AOWC)的方法、原理、特性以及性能比较,分类介绍了目前常用的全光波长转换器(AOWC)的实现方案,并对其发展提出了几点看法.     

Maskless pendeo-epitaxial growth of GaN films

High-resolution x-ray diffraction (XRD) and atomic force microscopy (AFM) of pendeo-epitaxial (PE) GaN films confirmed transmission electron microscopy (TEM) results regarding the reduction in dislocations in the wings. Wing tilt ≤0.15° was due to tensile stresses in the stripes induced by thermal expansion mismatch between the GaN and the SiC substrate. A strong D°X peak at ≈3.466 eV (full-width half-maximum (FWHM) ≤300 μeV) was measured in the wing material. Films grown at 1020°C exhibited similar vertical [0001] and lateral [11 0] growth rates. Increasing the temperature increased the latter due to the higher thermal stability of the GaN(11 0). The (11 0) surface was atomically smooth under all growth conditions with a root mean square (RMS)=0.17 nm.     

系统级封装新型埋入式电源滤波结构的研究

在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题.这种电压抖动所占频带相当宽,几百MHz到几个GHz的中频电源噪声普通方法很难去除.结合埋入式电容和电源分割方法的特点,提出一种新型高性能埋入式电源低通滤波结构直接替代电源/地平面.研究表明,在0.65～4GHz的频带内隔离深度可达-40～75 dB,电源阻抗均在0.25ohm以下,实现了宽频高隔离度的高性能滤波作用.分别用电磁场和广义传输线两种仿真器模拟,高频等效电路模型分析这种低通滤波器的工作原理以及结构对隔离性能的影响,并进行了实验验证.