A dismantlable photoadhesion system fabricated by an anionic UV curing of epoxy resins with a base amplifier having a disulfide bond

A base amplifier (BA) that autocatalytically generates a diamine having a disulfide bond has been developed. Diamines generated from this BA are integrated into cross‐linked networks of epoxy resins that also have disulfide bonds. Anionic UV curing is performed using a photobase generator, the BA and the epoxy resins, and cured films are obtained after UV irradiation and subsequent heating at 160 °C. Furthermore, this curing system is applied successfully to adhesion of two stainless substrates, which is cancelled with gentle heating and a shear force. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 237–241     

Synthesis and healing properties of poly(arylether sulfone)–poly(alkylthioether) multiblock copolymers containing disulfide bonds

Thermoplastic elastomers composed of soft and hard segments are important elastic and processable synthetic polymers. The microphase‐separated soft domains show low glass transition temperature and possess sufficient chain mobility at room temperature. In this study, we report the synthesis and healing properties of multiblock copolymers containing disulfide bonds as dynamic covalent bonds. The multiblock copolymers composed of poly(arylether sulfone) and poly(alkylthioether) segments were synthesized by oxidative coupling polymerization of the corresponding thiol‐terminated oligomers. Atomic force microscopy phase images, differential scanning calorimetry, and dynamic mechanical analysis curves indicated the microphase‐separated morphology of the multiblock copolymer. Self‐healing properties of the polymer were evaluated by changes in the elongation at break of the cut/adhered samples. The elongation recovery increased with UV irradiation time, and the multiblock copolymer showed a 93% recovery after UV irradiation for 5 h. The healing efficiency induced by UV irradiation, determined by subtracting the recovery without UV irradiation, was calculated to be 51%. According to the UV spectra and solubility changes after UV irradiation, the main healing factor in this study was the crosslinking reactions caused by thiyl radicals generated from UV irradiation instead of disulfide exchange reactions. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 3545–3553     

Reaction of epoxy resin and hyperbranched polyacids

The condensation reaction between two different epoxy resins and a hyperbranched polyester (MAHP) [poly(allyloxy maleic acid‐co‐maleic anhydride)] was studied. We compared two kinds of diglycidyl ether bisphenol A type of epoxy resins with different molecular weights, that is, epoxy resin GY240 (M = 365 g/mol) and GT6064 (M = 1540 g/mol) in this reaction. The results showed a marked difference in their reaction pattern in terms of ability to form crosslinked polymer networks with MAHP. For the former low‐molecular‐weight epoxy resin, no crosslinking could be observed in good solvents such as THF or dioxane within the set of reaction conditions used in this study. Instead, polymers with epoxide functional degrees between 0.34 and 0.5 were formed. By contrast, the latter high‐molecular‐weight epoxy resin, GT6064, rapidly produced highly crosslinked materials with MAHP under the same reaction conditions. The spherical‐shape model of hyperbranched polymer was applied to explain this difference in reaction behavior. Hence, we have postulated that low‐molecular‐weight epoxy resins such as GY240 are unable to crosslink the comparatively much bigger spherically shaped MAHP molecules. However, using high‐molecular‐weight epoxy resins greatly enhances the probability of crosslinking in this system. Computer simulations verified the spherical shape and condensed bond density of MAHP in good solvents, and submicron particle analysis showed that the average MAHP particle size was 9 nm in THF. Furthermore, the epoxy‐functionalized polyesters were characterized by ¹H NMR and FTIR, and the molecular weights and molecular‐weight distributions were determined by size‐exclusion chromatography. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4457–4465, 2000     

Morphology and dielectric properties of an epoxy network modified by end‐functionalized liquid polybutadiene

Epoxy resin networks modified with different functionalized liquid polybutadiene were characterized by scanning electron microscopy, atomic force microscopy (AFM), and dielectric thermal analysis techniques. Different morphologies were observed for these different systems, which were attributed to different interaction degrees between the components. Hydroxyl‐terminated polybutadiene (HTPB) and carboxyl‐ terminated polybutadiene (CTPB) resulted in epoxy networks with two‐phase morphology that differed in rubber particle size. The use of isocyanate‐terminated polybutadiene (NCOTPB) resulted in transparent thermoset material, whose rubber domains were in the nanoscale dimension, only detected by the AFM technique. The different morphological aspects in these epoxy systems also affected the dielectric properties. The epoxy–HTPB network exhibited two low temperature relaxation peaks corresponding to two different phases present in the system, whereas the epoxy–CTPB or epoxy–NCOTPB systems, whose rubber particles are well adhered to the epoxy matrix by chemical bonds, displayed only one single low temperature relaxation peak. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4053–4062, 2004     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005     

Contributions of side groups to the water diffusion in cured epoxy resins (2) study on physical aging

Novolac epoxy resins cured with novolac resin, novolac acetate resin, novolac butyrate resin, and novolac phenylacetate resin named as EP, EPA, EPB, and EPP, respectively, were prepared. Their physical aging behavior at a T_g‐30 °C (30 °C below glass‐transition temperature) was examined by positron annihilation lifetime spectroscopy and differential scanning calorimetry. The ortho‐positronium annihilation lifetime τ₃ variation extent of EP is less apparent than that of the other three esterified samples during physical aging. The time dependence of ops intensity I₃ agreed with the Kohlrausch‐Williams‐Watts (KWW) equation. The relaxation time (τ₀) and nonexponential parameter were calculated. The free volume and enthalpy relaxation rate characterized by the reciprocal of τ₀ and ?ΔH/?logt, respectively, exhibit the same order—EPP > EPB > EPA > EP. These results suggest that the extend and rate of relaxation are not only related to the frozen free volume produced by quenching but also significantly influenced by segmental mobility of the network that attributed to the side‐group flexibility and their interaction with networks. This work also supports the fact that side‐group flexibility and the free‐volume fraction and distribution act in concert to control the water‐diffusion behavior in epoxy networks. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1135–1142, 2003     

Physical aging of epoxy polymers and their composites

Exposure to extended periods of sub‐T_g temperatures causes physical changes in the molecular structure of epoxy resins and epoxy‐based materials to occur. These physical aging mechanisms include the reduction in free volume and changes to the molecular configuration. As a result, mechanical, thermodynamical, and physical properties are affected in ways that can compromise the reliability of epoxy‐based engineering components and structures. In this review, the physical changes in the molecular structure of epoxies are described, and the influence of these changes on the bulk‐level response is detailed. Specifically, the influence of physical aging on the quasistatic mechanical properties, viscoelasticity, fracture toughness, thermal expansion coefficient, volume relaxation, enthalpy relaxation, endothermic peak temperature, fictive temperature, and moisture/solvent absorption capability is reviewed. Also discussed are relationships between relaxation functions, crosslink density, composite reinforcement, and epoxy/copolymer blending and the physical aging response of epoxies. Finally, the concepts of thermal and mechanical rejuvenation are discussed. © 2011 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2011     

Relationships between molecular structure and thermomechanical properties of bio‐based thermosetting polymers

Molecular dynamics simulations are used to study highly cross‐linked epoxy networks comprised of furanyl epoxy monomer, 2,5‐bis[(2‐oxiranylmethoxy)methyl]‐furan (BOF), that is cross‐linked by two furanyl amine hardeners, 5,5'‐methylenedifurfurylamine (DFDA) and 5,5'‐ethylidenedifurfirylamine (CH₃‐DFDA). Important properties of these fully furan‐based systems, including room temperature density, glass transition temperature, and Young's modulus are found to agree with previous experimental results. We also compare the simulated and experimental values of four fully furan‐based thermosetting materials to those using the conventional resin diglycidyl ether of bisphenol A (DGEBA) cured with the two furanyl hardeners. Our simulation results predict a slight decrease in density and Young's modulus, but no impact on the glass transition temperature, upon adding the methyl group in DFDA. Detailed analyses of the MD trajectories reveal the underlying mechanisms responsible for the observed structure/property relations, which center on the lack of collinear covalent bonds in the BOF molecular structure. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 285–292     

Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Epoxy resin curing reaction studied by proton multiple‐quantum NMR

This study demonstrates that the curing reaction of thermosetting polymers, in particular, epoxy resins cured with aliphatic amines, can be characterized by different multiple‐quantum (MQ) NMR experiments performed in low‐field spectrometers. Measurements of the curing reaction at 40 °C, 70 °C, and 100 °C are carried out to obtain the kinetic parameters like induction time, vitrification time, polymerization rate, and activation energy being consistent with data obtained by other traditional and complementary techniques. Besides, it is demonstrated that ¹H MQ‐NMR spectroscopy is a successful approach to overcome the experimental challenge arising from the characterization of high dipolar‐coupled polymers to study the network structure and segmental dynamics of thermosetting polymer networks. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2015 , 53, 1324–1332     

A fully coupled thermo‐viscoelastic finite element model for self‐folding shape memory polymer sheets

The thermo‐mechanical response of heat activated shape memory polymers (SMPs) has been investigated using a thermo‐viscoelastic finite element analysis that accounts for external and internal heat sources. SMPs can be thermally stimulated by external heat sources, such as temperature and surface heat flux, or from internal viscous heating. Viscous heating can significantly affect the response of SMP sheets by increasing the temperature during pre‐strain, which accelerates stress relaxation. This stress relaxation results in a slower shrinking rate when the SMP is reheated. Viscous heating also causes an increase in temperatures during unconstrained recovery. The predicted results elucidate how the coupled thermo‐mechanical loading conditions affect folding and unfolding of SMP sheets in response to localized heating in a hinged region. A parametric study of sheet thickness, hinge width, degree of pre‐strain, and hinge surface temperature is also conducted. The validated results can provide guidelines for the design of functional, self‐folding structures. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1207–1219     

基于多重动态共价键的环氧类玻璃网络的制备与性能

以三羟甲基丙烷三缩水甘油醚(TTE)为基体, 2,2′-(1,4-亚苯基)-双[4-硫醇1,3,2-二氧杂戊烷](BDB)和3,3-二硫代二丙酸(DTDPA)为交联剂, 通过环氧-巯基“点击”反应和环氧-羧酸酯化反应, 制备了基于多重动态共价键(硼酸酯键、 二硫键和酯键)的环氧类玻璃网络. 利用红外光谱和拉曼光谱对其结构进行了表征, 结果表明, 环氧类玻璃中不仅存在硼酸酯键、 二硫键和酯键, 还存在可逆氢键, 并且大量氢键的存在能提高环氧类玻璃的交联度. 对所得环氧网络的热稳定性、 热机械性能和力学性能进行了测试, 并对基于多重动态共价键环氧网络进行了自修复、 焊接、 形状记忆和再加工能力测试. 结果表明, 在80 ℃下可实现网络的完全自修复、 再加工与焊接, 且焊接后样品的力学性能(拉伸强度)恢复率在80%以上, 具有优异的功能性.     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Synthesis and properties of multifunctional thiol crosslinked gels containing disulfide bond in the network structure

Joint crosslinked gels containing disulfide linkage have been synthesized by oxidation reaction of multi‐functional thiol monomers, trimethylolpropane tris(3‐mercaptopropionate), tris‐[3‐mercaptopropionyloxy‐ethyl]‐isocyanurate, pentaerythritol tetrakis (3‐mercaptopropionate), and dipenta‐erythritol hexakis (3‐mercaptopropionate) in dimethyl sulfoxide (DMSO). Both the oxidation reactions with DMSO at 85 °C and Albright‐Goldman oxidation in the presence of acetic anhydride at 50 °C yielded the corresponding gels. The oxidation reaction with DMSO showed higher reaction conversion than that with Albright‐Goldman oxidation. Network structure of the gels was quantitatively characterized by means of a scanning microscopic light scattering. The reactions formed homogeneous network structure with about 0.5 nm of mesh in the gels. Mechanical properties of the obtained gels were investigated by compression test. Increasing of the crosslinking density with increasing of the monomer concentration, number of thiol group of the monomer or reaction conversion, raised Young's modulus, and breaking stress of the gels. Cogelation of the tri‐, tetra‐, of hexa‐thiol monomer and dithiol monomers yielded soft and flexible gels. Reduction of the disulfide bonds in the gels by dithiothreitol turned the gel into solution. Heating of the resulting solution induced the regelation by reforming of the disulfide bonds. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 3749–3756     

Oxetane‐terminated telechelic epoxy‐functional polyesters as cationically polymerizable thermoset resins: Tuning the reactivity with structural design

A series of epoxy‐functional telechelic oligomers containing oxetane end groups have been synthesized. The precursor monomer, extracted from outer Birch bark, was first polymerized through enzyme‐catalyzed esterification to form oligomers having epoxy and/or oxetane groups in the structures. The oligoesters were subsequently crosslinked through cationic polymerization either by epoxy or oxetane homopolymerization or copolymerization when both functionalities were present. A study of the polymerizations of the resins was performed “in situ” using real‐time Fourier transform infrared spectroscopy revealing a preferred copolymerization when compared with the homopolymerization. By tailoring the different structures, it was possible to control the final mechanical properties of the networks. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 2258–2266     

Recyclable polybutadiene elastomer based on dynamic imine bond

Catalyst‐free recyclable polybutadiene (PB) elastomer cross‐linked by dynamic imine bonds is prepared by the reaction between amine functionalized PB and aldehyde cross‐linkers. The dynamic nature of imine bond is investigated by rheometry and creep‐recovery experiments. The cross‐linking degrees are regulated by incorporating different amount of aldehyde, and their influence on the cross‐linked elastomers is investigated in detail. The temperature‐induced imine exchange reactions enable recycling of the cross‐linked PB elastomers and their mechanical properties are almost unchanged after several cycles. It is important to note that the elastomers also show excellent solvent resistance even at high temperature. The good mechanical properties, solvent resistance and recycling ability of the resultant PB elastomer demonstrate the superiority of the imine bonds in the design of recyclable polymers. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 2011–2018     

Development of novel phosphorus‐containing epoxy resins from renewable resources

Novel biobased epoxy resins were prepared from two fatty acid derivatives; epoxidized 10‐undecenoyl triglyceride and epoxidized methyl 3,4,5‐tris(10‐undecenoyloxy)benzoate, with 4,4′‐diaminodiphenylmethane as a crosslinking agent. The flame retardancy of these epoxy resins was improved by the addition of 10‐[2′, 5′‐bis(9‐oxiranyl‐nonayloxy)phenyl]‐9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and by crosslinking with a phosphorus‐containing curing agent, bis(m‐aminophenyl)methylphosphine oxide. The thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured with differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, and the limiting oxygen index. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6717–6727, 2006     

Synthesis and properties of biobased epoxy resins. part 1. Glycidylation of flavonoids by epichlorohydrin

Biobased epoxy resins were synthesized from a catechin molecule, one of the repetitive units in natural flavonoid biopolymers also named condensed tannins. The reactivity of catechin toward epichlorohydrin to form glycidyl ether derivatives was studied using two model compounds, resorcinol and 4‐methylcatechol, which represent the A and B rings of catechin, respectively. These model molecules clearly showed differences in reactivity upon glycidylation, explaining the results found with catechin monomer. The reaction products were characterized by both FTIR and NMR spectroscopy and chemical assay. The glycidyl ether of catechin (GEC) was successfully cured in various epoxy resin formulations. The GECs thermal properties showed that these new synthesized epoxy resins displayed interesting properties compared to the commercial diglycidyl ether of bisphenol A (DGEBA). For instance, when incorporated up to 50% into the DGEBA resin, GEC did not modify the glass‐transition temperature. Epoxy resins formulated with GEC had slightly lower storage moduli but induced a decrease of the swelling percentage, suggesting that GEC‐enhanced crosslinking in the epoxy resin networks. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011