Cover Picture: Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane) (Adv. Mater. 5/2007)

Flexible metallic wires embedded in poly(dimethylsiloxane) are produced with microscale dimensions by injecting heated, liquid solder into microfluidic channels and cooling, as reported by George Whitesides and co‐workers on p. 727. This approach is used to fabricate complex, metallic microstructures that are twisted (as shown), rolled, or woven into fabrics. The structures can be rigid or flexible, depending on the type of solder used, and breaks in the metal can be “healed” by reheating the device. This method of fabrication may find applications in flexible electronic circuits, 3D metallic microstructures, and hybrid electronic–microfluidic devices.     

Inside Front Cover: Direct Printing of 3D and Curvilinear Micrometer‐Sized Architectures into Solid Substrates with Sub‐micrometer Resolution (Adv. Mater. 15/2006)

The inside cover shows a hexagonal array of convex microlenses etched directly into glass using a reaction‐diffusion process initiated from a hydrogel stamp. The technique, reported by Grzybowski and co‐workers on p. 2004, allows for direct printing of complex microarchitectures into a variety of materials with sub‐micrometer resolution. The images were generated by longtime exposure of slowly rotating patterns. Cover design by Christopher J. Campbell.     

Cover Picture: Fabrication of Elastomeric Wires by Selective Electroless Metallization of Poly(dimethylsiloxane) (Adv. Mater. 1/2008)

Tricia Carmichael and co‐workers employ a simple, low‐cost method for the fabrication of patterned metal films on elastomeric poly(dimethylsiloxane) (PDMS) substrates, as described on p. 59. The metal/PDMS composites are electrically conductive and mechanically flexible, making them suitable for use in the fabrication of lightweight, flexible devices such as wearable electronics, biocompatible sensors, and artificial nerves, skins, and muscles. Copper wires on PDMS remain conductive when subjected to linear strains of up to 52 %. The utility of these wires is demonstrated by using them as laminated top contacts in an organic light‐emitting device.     

Bulk Micromachining of Si by Metal‐assisted Chemical Etching

Bulk micromachining of Si is demonstrated by the well‐known metal‐assisted chemical etching (MaCE). Si microstructures, having lateral dimension from 5 μm up to millimeters, are successfully sculpted deeply into Si substrate, as deep as >100 μm. The key ingredient of this success is found to be the optimizations of catalyst metal type and its morphology. Combining the respective advantages of Ag and Au in the MaCE as a Ag/Au bilayer configuration leads to quite stable etch reaction upon a prolonged etch duration up to >5 h. Further, the permeable nature of the optimized Ag/Au bilayer metal catalyst enables the etching of pattern features having very large lateral dimension. Problems such as the generation of micro/nanostructures and chemical attacks on the top of pattern surface are successfully overcome by process optimizations such as post‐partum sonication treatment and etchant formulation control. The method can also be successful to vertical micromachining of Si substrate having other crystal orientations than Si(100), such as Si(110) and Si(111). The simple, easy, and low‐cost nature of present approach may be a great help in bulk micromachining of Si for various applications such as microelectromechanical system (MEMS), micro total analysis system (μTAS), and so forth.