LED电源设计优化的功率器件考虑事项

LED照明应用中的开关电源在输入级越来越多地采用有源功率因数校正(PFC)设计,以期满足国际谐波规范要求。非连续导通模式(DCM)中的升压拓扑是功率额定值小于300W转换器的最适合PFC方法。在这种拓扑中,升压开关的开通功率损耗可以忽略,而主要的功率损耗是关断损耗和导通损耗。在引入了超级结器件之后,超级结器件通常被看作一种针对有源PFC而优化的开关,因为它们具有极低的导通阻抗和     

一种最小电压应力的软开关无桥PFC技术研究

针对传统桥式整流升压功率因数校正(PFC)电路效率较低的缺点,提出了一种最小电压应力的软开关无桥PFC电路拓扑.在理论分析和仿真验证的基础上,研制了一台300 W的实验样机.结果表明,改进的无桥PFC电路拓扑具有通态损耗低、电流采样简单,能实现开关管零电压关断和零电流开通,同时实现整流二极管零电压导通和接近零电流软关断...     

六阶带通非对称扬声器系统研究

本文给出六阶带通扬声器系统的响应函数，在此基础上详细讨论了系统的特性（包括频率、相位、群延迟和脉冲特性），并与四阶带通扬声器系统的特性作了比较。最后描述了泄漏声阻对系统特性的影响且给出系统有损耗响应函数。     

让高功率电源获得96％效率的交错式PFC控制器

如今很多大尺寸平板电视、高清电视,以及高端PC和入门级服务器的电源功率都超过300W,而以前具有高效率和低成本的BCMFPC转换器的最大功率约为300W。传统的临界导通模式（BCM）PFC控制器采用可变的开关频率,将电磁辐射分散到整个开关频率范围内,从而减小了EMI。MOSFET是零电流导通,不会在整流二极管上产生反向恢复损耗,所需的电感器较小,在检流电阻上的损耗也更少。     

Cirrus Logic公司推出首批数字PFC控制器

Cirrus Logic公司推出行业首批数字功率因数校正（PFC）控制器IC—CS1500和CS1600。该控制器是数字控制的具有不连续导通模式（DCM）的有源功率因数校正IC，主要应用于额定功率高达300W的电源。相比传统模拟PFC产品，CS1500和CS1600可使消费电子产品电源和照明镇流系统设计具有更高的性能和更简化的设计。     

改进型无桥Boost PFC软开关技术的研究

在分析无源无损缓冲电路拓扑结构的基础上,为了降低开关损耗,进一步提高效率,提出了在改进型无桥Boost PFC(Power Factor Correction,PFC)的基础上增加非最小电压应力电路网络。在理论分析和仿真验证的基础上,研制了一台300W的实验样机。结果表明改进后的无桥PFC电路拓扑具有通态损耗低、电流采样简单,不仅能实现开关管的零电压关断和零电流导通,同时续流二极管实现零电压导通和零电流软关断。     

ADI推出首款交错式数字功率因数校正控制器

11月26日,ADI推出首款交错式数字功率因数校正（PFC）控制器ADP1048（http：//.analog.com/zh/pr1126/adp1048）,该器件具有高度精确的交流功率计量功能。与单相数字PFC控制器ADP1047（2011年3月发布）相似,交错式（或双相）ADP1048采用传统的连续导通模式PFC技...     

R2A20114系列：功率因数校正控制IC

瑞萨科技推出R2A20114系列功率因数校正控制IC（PFC控制IC）,它利用连续导通模式交错功能为计算机服务器和空调等大功率产品实现小型、高效、低噪声电源装置设计。R2A20114系列整合了多种保护电路,用于提高电源系统的可靠性减少元件的总量,进而达到简化系统的目的。     

运用无桥式整流电路实现高效率的PFC设计

引言 近来，不使用桥式电路的功率因数校正(PFC)电路成为人们注意的焦点。设计人员去掉了转换器输入端的常规桥式整流电路，可以减少开关损耗，进一步提高效率。在这样的电路中，不存在由于导通损耗而降低效率的问题，且设计比较简单，需要的元件数量较少。     

R2A20116：交错功率因数校正控制IC

Renesas推出R2A20116临界导通模式交错功率因数校正（PFC）控制IC。它具有改善所有负载区域高功率转换效率的特点,可用于PC、服务器、数字家电等的PFC电源单元中。     

Static and dynamic characterization of large-areahigh-current-density SiC Schottky diodes

The static and dynamic characteristics of large-area, high-voltage 4H-SiC Schottky barrier diodes are presented. With a breakdown voltage greater than 1200 V and a forward current in excess of 6 A at 2 V forward bias, these devices enable for the first time the evaluation of SiC Schottky diodes in practical switching circuits. These diodes were inserted into standard test circuits and compared to commercially available silicon devices, the results of which are reported here. Substituting SiC Schottky diodes in place of comparably rated silicon PIN diodes reduced the switching losses by a factor of four, and virtually eliminated the reverse recovery transient. These results are even more dramatic at elevated temperatures. While the switching loss in silicon diodes increases dramatically with temperature, the SiC devices remain essentially unchanged. The data presented here clearly demonstrates the distinct advantages offered by SiC Schottky rectifiers, and their emerging potential to replace silicon PIN diodes in power switching applications     

碳化硅MPS:新一代功率开关二极管

碳化硅MPS(Merged PiN Schottky diode)具有很好的开关特性，并具有PiN二极管高阻断电压、低漏电流和SBD小开启电压，大导通电流以及高开关速度的优点，是最有希望的新一代功率开关二极管。文章系统地介绍了碳化硅MPS的结构和性能。理论和实验分析表明，碳化硅材料的优异性能与MPS结构的优势相结合，是当今功率开关管发展的趋势。     

Low noise wide bandgap SiC based IMPATT diodes at sub-millimeter wave frequencies and at high temperature

We have presented a comparative account of the high frequency prospective as well as noise behaviors of wide-bandgap 4H-SiC and 6H-SiC based on different structures of IMPATT diodes at sub-millimeter-wave frequencies up to 2.18 THz. The computer simulation study establishes the feasibility of the SiC based IMPATT diode as a high power density terahertz source. The most significant feature lies in the noise behavior of the SiC IMPATT diodes. It is noticed that the 6H-SiC DDR diode shows the least noise measure of 26.1 dB as compared to that of other structures. Further, it is noticed that the noise measure of the SiC IMPATT diode is less at a higher operating frequency compared to that at a lower operating frequency.     

The potential of diamond and SiC electronic devices for microwaveand millimeter-wave power applications

The potential of SiC and diamond for producing microwave and millimeter-wave electronic devices is reviewed. It is shown that both of these materials possess characteristics that may permit RF electronic devices with performance similar to or greater than what is available from devices fabricated from the commonly used semiconductors, Si, GaAs, and InP. Theoretical calculations of the RF performance potential of several candidate high-frequency device structures are presented: the metal semiconductor field-effect transistor (MESFET), the impact avalanche transit-time (IMPATT) diode, and the bipolar junction transistor (BJT). Diamond MESFETs are capable of producing over 200 W of X-band power as compared to about 8 W for GaAs MESFETs. Devices fabricated from SiC should perform between these limits. Diamond and SiC IMPATT diodes also are capable of producing improved RF power compared to Si, GaAs, and InP devices at microwave frequencies. RF performance degrades with frequency and only marginal improvements are indicated at millimeter-wave frequencies. Bipolar transistors fabricated from wide bandgap material probably offer improved RF performance only at UHF and low microwave frequencies     

A comparative study of the passivation films on AlGaAs/GaAsheterojunction diodes and bipolar transistors

A series of Si-based thin films, including amorphous Si, SiC, as well as the conventional SiO_x and SiN_x, was investigated in terms of the electrical characteristics of GaAs/Al_0.3Ga_0.7As heterostructure diodes and heterojunction bipolar transistors (HBTs). All the films were found effective in reducing the leakage current and long term degradation. Less size-dependence of the current gain was found for the HBTs passivated by amorphous Si and SiC. In addition, the devices passivated by amorphous Si and SiC films exhibited better performance during high power operation. This is attributed to the high thermal conductivity of these two materials     

Silicon carbide high-power devices

In recent years, silicon carbide has received increased attention because of its potential for high-power devices. The unique material properties of SiC, high electric breakdown field, high saturated electron drift velocity, and high thermal conductivity are what give this material its tremendous potential in the power device arena. 4H-SiC Schottky barrier diodes (1400 V) with forward current densities over 700 A/cm² at 2 V have been demonstrated. Packaged SITs have produced 57 W of output power at 500 MHz, SiC UMOSFETs (1200 V) are projected to have 15 times the current density of Si IGBTs (1200 V). Submicron gate length 4H-SiC MESFETs have achieved f_max=32 GHz, f_T=14.0 GHz, and power density=2.8 W/mm @ 1.8 GHz. The performances of a wide variety of SiC devices are compared to that of similar Si and GaAs devices and to theoretically expected results     

Performance evaluation of a Schottky SiC power diode in a boost PFC application

The performance of a 600 V, 4 A silicon carbide (SiC) Schottky diode (Infineon SDP04S60) is experimentally evaluated. A 300 W boost power factor corrector (PFC) with average current mode control is considered as a key application. Measurements of overall efficiency, switch and diode losses, and conducted electromagnetic interference (EMI) are performed both with the SiC diode and with two ultra-fast, soft-recovery, silicon power diodes, namely the RURD460 and the presented STTH5R06D. The paper compares the results to quantify the impact of the recovery current reduction provided by SiC diode on these key aspects of the converter behavior. Based on the experimental results, the paper shows that the use of SiC diodes in PFC designs may only be justified in high switching frequency applications.     

一种改进结构的GaAs微波PIN二极管

设计并制作了高性能GaAs微波PIN二极管.分析了GaAsPIN二极管的结构对其性能的影响,并根据分析结果改进了GaAsPIN二极管的结构.制作了常见结构和改进结构的GaAsPIN二极管,比较了不同结构的GaAsPIN二极管的测试数据,从而验证了理论分析的结果.改进后的GaAsPIN二极管制作工艺更为简单,具有良好的高频特性,截止频率达到1520.5GHz.这种改进结构的GaAs微波PIN二极管在微波电路中具有良好的应用前景.     

高性能U波段砷化镓体效应二极管

介绍了一种新型的高性能毫米波砷化镓体效应二极管,通过对材料、参数、工艺的优化与设计,较好地解决了高工作频率与高输出功率之间的矛盾,实现了器件性能的提升与突破。在U波段,最大连续波输出功率达180mW,最高转换效率约5%。     

GaAs TUNNETT Diodes

The tunnel-injection-transit-time (TUNNETT) diode is operated at a high frequency and has a low-noise level compared to the IMPATT diode. The tunnel injection in a thin carrier generating region of the TUNNETT depends strongly on the electric-field intensity over 1000 kV/cm where the ionization of carriers can be neglected, leading to a higher efficiency performance than that of the IMPATT. GaAs TUNNETT diodes with p+-n and p+-n-n+ structures have been fabricated by a new LPE method (the temperature-difference method under controlled vapor pressure). The fundamental oscillation at frequencies from about 100 up to 248 GHz has been obtained from the pulse-driven p+-n-n+ diodes. This paper describes the details of the oscillation characteristics of GaAs TUNNETT diodes.