Interaction of charge carriers with the localized magnetic moments of manganese atoms in <Emphasis Type="Italic">p</Emphasis>-GaInAsSb/<Emphasis Type="Italic">p</Emphasis>-InAs:Mn heterostructures

Transport properties of p-Ga_1?xIn_xAs_ySb_1?y/p-InAs:Mn heterostructures with undoped layers of solid solutions similar in composition to GaSb (x?0.22) grown by liquid-phase epitaxy on substrates with a Mn concentration of (5–7)×10¹⁸ cm^?3 are studied. It is ascertained that there is an electron channel at the interface (from the InAs side). The anomalous Hall effect and negative magnetoresistance are observed at relatively high temperatures (77–200) K. These phenomena can be attributed to the s-d-exchange interaction between Mn ions of the substrate and s electrons of the two-dimensional channel. The effective magnetic moment of Mn ions was evaluated as μ=200µ_B at T=77 K.     

Increase in the electron mobility in the inversion channel of a Si-MOS transistor in the case of ion polarization of the gate oxide

The effective mobility of electrons μ* in the inversion n-type channel of a field-effect transistor increases appreciably (as a result of space-charge ion polarization of the gate oxide) from the typical values of ?820 cm² V^?1 s^?1 to the values of ?2645 cm² V^?1 s^?1, which exceed the electron mobility in bulk silicon. After polarization, the sheet concentration of Na⁺ ions at the SiO₂/Si interface exceeds 6 × 10¹³ cm^?2. The ions are almost completely neutralized by electrons in the inversion channel. As temperature T is decreased in the range from 293 to 203 K, μ* increases according to the law μ* ∝ T ^?0.82. Apparently, the observed dependence μ*(T) is caused by the combined scattering of electrons by roughness of the Si/SiO₂ interface surface, phonons, and the interface states. Depolarization of the oxide reverts μ* to the initial value. Anomalously large values of μ* are assumed to be either a consequence of the origination of pronounced structural stresses in the surface Si layer due to the oxide polarization or a result of a phase reconstruction of the inversion-channel region due to hybridization of the wave functions of electrons localized at the Na⁺ ions with the wave functions of electrons in the inversion channel.     

Conductivity of Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>–GaAs Heterojunctions

The effect of annealing in argon at temperatures of T_an = 700–900°C on the I–V characteristics of metal–Ga₂O₃–GaAs structures is investigated. Samples are prepared by the thermal deposition of Ga₂O₃ powder onto GaAs wafers with a donor concentration of N _d = 2 × 10¹⁶ cm^–3. To measure theI–V characteristics, V/Ni metal electrodes are deposited: the upper electrode (gate) is formed on the Ga₂O₃ film through masks with an area of S _k = 1.04 × 10^–2 cm² and the lower electrode in the form of a continuous metallic film is deposited onto GaAs. After annealing in argon at T_an ≥ 700°C, the Ga₂O₃-n-GaAs structures acquire the properties of isotype n-heterojunctions. It is demonstrated that the conductivity of the structures at positive gate potentials is determined by the thermionic emission from GaAs to Ga₂O₃. Under negative biases, current growth with an increase in the voltage and temperature is caused by field-assisted thermal emission in gallium arsenide. In the range of high electric fields, electron phonon-assisted tunneling through the top of the potential barrier is dominant. High-temperature annealing does not change the electron density in the oxide film, but affects the energy density of surface states at the GaAs–Ga₂O₃ interface.     

Effect of Dislocation-related Deep Levels in Heteroepitaxial InGaAs/GaAs and GaAsSb/GaAs <Emphasis Type="Italic">p</Emphasis>–<Emphasis Type="Italic">i</Emphasis>–<Emphasis Type="Italic">n</Emphasis> Structures on the Relaxation time of Nonequilibrium Carriers

The results of an experimental study of the capacitance–voltage (C–V) characteristics and deep-level transient spectroscopy (DLTS) spectra of p⁺–p⁰–i–n⁰ homostructures based on undoped dislocationfree GaAs layers and InGaAs/GaAs and GaAsSb/GaAs heterostructures with homogeneous networks of misfit dislocations, all grown by liquid-phase epitaxy (LPE), are presented. Deep-level acceptor defects identified as HL2 and HL5 are found in the epitaxial p⁰ and n⁰ layers of the GaAs-based structure. The electron and hole dislocation-related deep levels, designated as, respectively, ED1 and HD3, are detected in InGaAs/GaAs and GaAsSb/GaAs heterostructures. The following hole trap parameters: thermal activation energies (E _t ), capture cross sections (σ _p ), and concentrations (N _t ) are calculated from the Arrhenius dependences to be E _t = 845 meV, σ _p = 1.33 × 10^–12 cm², N _t = 3.80 × 10¹⁴ cm^–3 for InGaAs/GaAs and E _t = 848 meV, σ _p = 2.73 × 10^–12 cm², N _t = 2.40 × 10¹⁴ cm^–3 for GaAsSb/GaAs heterostructures. The concentration relaxation times of nonequilibrium carriers are estimated for the case in which dislocation-related deep acceptor traps are involved in this process. These are 2 × 10^–10 s and 1.5 × 10^–10 s for, respectively, the InGaAs/GaAs and GaAsSb/GaAs heterostructures and 1.6 × 10^–6 s for the GaAs homostructures.     

Study of RF transistor with submicron T-shaped gate fabricated by nanoimprint lithography

The results devoted to the development of a method for creating an RF transistor, in which a T-shaped gate is formed by nanoimprint lithography, are presented. The characteristics of GaAs p-HEMT transistors have been studied. The developed transistor has a gate “foot” length of the order of 250 nm and a maximum transconductance of more than 350 mS/mm. The maximum frequency of current amplification f _t is 40 GHz at the drain-source voltage V _DS = 1.4 V and the maximum frequency of the power gain f _max is 50 GHz at V _DS = 3 V.     

Photoluminescence of electron-hole plasma in semi-insulating undoped GaAs

The dependence of the photoluminescence spectrum of electron-hole plasma in semi-insulating undoped GaAs on the concentration of the background carbon impurity N_C(3×10¹⁵ cm^?3≤N_C≤4×10¹⁶ cm^?3) is studied at 77 K. It is established that the density of the electron-hole plasma, which is equal to n _e?h ≈1.1×10¹⁶ cm^?3 in crystals with the lowest impurity concentration at an excitation intensity of 6×10²² photons/(cm² s), decreases considerably as the value of N_C increases in the range mentioned above. A decrease in the density of the electron-hole plasma with increasing N_C is attributed to the effect of fluctuations in the carbon concentration N_C, which give rise to a nonuniform distribution of interacting charge carriers and to localization of holes in the tails of the density of states of the valence band.     

Diffusion of implanted sodium in oxygen-containing silicon

The effect of oxygen on diffusion of sodium implanted into silicon is studied for the first time in the temperature range from 500 to 850°C. A high-resistivity p-Si (ρ > 1 kΩ cm) grown by the Czochralski method in a magnetic field (mCz) with the oxygen concentration ～3 × 10¹⁷ cm^?3 was used. For comparison, we used silicon grown by the crucibleless floating zone method (fz). Temperature dependences of the effective diffusion coefficient of sodium in the mCz-Si and fz-Si crystals were determined and written as D _mCz[cm²/s] = 1.12exp(?1.64 eV/kT) cm²/s and D _fz[cm²/s] = 0.024exp(?1.29 eV/kT) cm²/s, respectively. It is assumed that larger values of diffusion parameters in oxygen-containing silicon are caused by formation of complex aggregates that contain sodium and oxygen atoms.     

Decrease in effective electron mobility in the channel of a metal-oxide-semiconductor transistor as the gate length is decreased

Effective electron mobility μ_eff in channels of metal-oxide-semiconductor transistors with a gate length L in the range of 3.8 to 0.34 μm was measured; the transistors were formed on wafers of the silicon-oninsulator type. It was found that μ_eff decreases as L is decreased. It is shown that this decrease can be accounted for by the effect of series resistances of the source and drain only if it is assumed that there is a rapid increase in these resistances as the gate voltage is decreased. This assumption is difficult to substantiate. A more realistic model is suggested; this model accounts for the observed decrease in μ_eff as L is decreased. The model implies that zones with a mobility lower than that in the middle part of the channel originate at the edges of the gate. An analysis shows that, in this case, the plot of the dependence of 1/μ_eff on 1/L should be linear, which is exactly what is observed experimentally. The use of this plot makes it possible to determine both the electron mobility μ₀ in the middle part of the channel and the quantity A that characterizes the zones with lowered mobility at the gate’s edges.     

Effective electron mass in a Mn<Subscript>x</Subscript>Hg<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Te system

The reflection spectra of n-Mn_xHg_1?xTe single crystals and epitaxial layers were measured at 300 K. The effective electron mass was determined for the samples with x=0.06–0.10 and an electron concentration N>6×10¹⁶ cm^?3. The calculated values of effective electron mass are close to experimental values.     

Resonance modulation of the intersubband electron-electron interaction in an AlSb(δ-Te)/InAs/AsSb(δ-Te) quantum well by magnetic field

The amplitude-frequency modulation of oscillations of the magnetoresistance of 2D electrons in an AlSb(δ-Te)/InAs/AsSb(δ-Te) quantum well is studied. In the dependence of the amplitude of the oscillations δ(1/B) _{T = const}, regions of negative Dingle temperature are observed. The anomalies in the dependence δ(1/B) _{T = const} are attributed to the fact that the quantizing magnetic field resonantly induces intersubband electron-electron interaction between the 2D electrons of the ground size-quantization subband and excited subband. The resonance fields B and the times corresponding to the collision-related broadening of the Landau levels are estimated. The concentration threshold of filling of the excited size-quantization subband is established at a level of n _s ≈ 8 × 10¹¹ cm^?2.     

Dielectric waveguide for middle and far infrared radiation

The possibility of using the normal skin effect in dielectric waveguides for long-wavelength radiation is analyzed. A design of a waveguide integrated with a heterolaser is suggested, in which an undoped layer of GaAs is clad between heavily-doped n- and p-Al _x Ga_{1 ? x} As alloy layers, reflecting radiation because of the normal skin effect. It is shown that an efficient waveguide can be formed using n-Al _x Ga_{1 ? x} As layers with x < 0.45 and the electron concentration N > 5 × 10¹⁸ cm^?3 and p-Al _x Ga_{1 ? x} As layers of any composition with the hole concentration P ≥ 3 × 1019 cm^?3.     

Method for optimizing the parameters of heterojunction photovoltaic cells based on crystalline silicon

An approach is proposed to calculate the optimal parameters of silicon-based heterojunction solar cells whose key feature is a low rate of recombination processes in comparison with direct-gap semiconductors. It is shown that at relatively low majority-carrier concentrations (N_d ～ 10¹⁵ cm^–3), the excess carrier concentration can be comparable to or higher than N_d. In this case, the efficiency η is independent of N_d. At higher N_d, the dependence η(N_d) is defined by two opposite trends. One of them promotes an increase in η with N_d, and the other associated with Auger recombination leads to a decrease in η. The optimum value N_d ≈ 2 × 10¹⁶ cm^–3 at which η of such a cell is maximum is determined. It is shown that maximum η is 1.5–2% higher than η at 10¹⁵ cm^–3.     

Electrical properties of silicon layers implanted with erbium and oxygen ions in a wide dose range and thermally treated in different temperature conditions

The electrical properties of silicon implanted with Er and O ions in a wide dose range have been studied. The dependence of electron mobility on the concentration of electrically active centers is determined for Si:Er layers with Er concentrations in the range of 9×10¹⁵–8×10¹⁶ cm^?3. Sharp bends related to specific features of Er segregation in solid-phase epitaxial recrystallization are observed in the concentration profiles of electrically active centers, n(x), and Er atoms, C(x), at Er ion implantation doses exceeding the amorphization threshold. The n(x) and C(x) profiles virtually coincide near the surface. A linear rise in the maximum concentration of electrically active centers at approximately constant effective coefficient of their activation, k, is observed at Er implantation doses exceeding the amorphization threshold. At an Er concentration higher than 7×10¹⁹ cm^?3, the concentration of electrically active centers levels off and k decreases.     

Low-temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

The impact ionization of acceptors in aluminum-doped 4H-SiC epitaxial films (Al concentration 2 × 10¹⁵ cm^?3) at a temperature of 77 K is studied. It is found that the impact-ionization coefficient exponentially depends on the reverse electric field: α _p = α*_pexp(?F*/F). The largest ionization coefficient is α* _p = 7.1 × 10⁶ cm^?3 s^?1, and the threshold field is F* = 2.9 × 10⁴ V/cm.     

Increase in the rate and discretization of the kinetics of isothermal surface generation of minority charge carriers in metal-insulator-semiconductor structures with a planar-inhomogeneous insulator

Surface generation of minority charge carriers in silicon metal-oxide-semiconductor (MOS) structures is efficient only at the initial recombinationless stage. Quasi-equilibrium between surface generation centers and the minority-carrier band is established in a time t ～ 10^?5 s. In the absence of other carrier generation channels, an equilibrium inversion state at 300 K would need t = t_∞ > 10³ years to become established. In fact, the time t ∞ is much shorter, due to excess-carrier generation via centers located at the SiO₂/Si interface over the gate periphery. This edge-related generation can easily be simulated in an MOS structure with a single gate insulated from Si by oxide layers of various thicknesses. At gate depleting voltages V _g , the role of the periphery is played by a shallow potential well under a thicker oxide, and the current-generation kinetics becomes unconventional: two discrete steps are observed in the dependences I(t), and the duration and height of these steps depend on V _g . An analysis of the I(t) curves allows determination of the electric characteristics of the Si surface in the states of initial depletion (t = 0) and equilibrium inversion (t = t_∞), as well as the parameters of surface lag centers, including their energy and spatial distributions. The functionally specialized planar inhomogeneity of a gate insulator is a promising basis for dynamic sensors with integrating and threshold properties.     

Electron mobility in the inversion layers of fully depleted SOI films

The dependences of the electron mobility μ_eff in the inversion layers of fully depleted double–gate silicon-on-insulator (SOI) metal–oxide–semiconductor (MOS) transistors on the density N _e of induced charge carriers and temperature T are investigated at different states of the SOI film (inversion–accumulation) from the side of one of the gates. It is shown that at a high density of induced charge carriers of N _e > 6 × 10¹² cm^–2 the μeff(T) dependences allow the components of mobility μ_eff that are related to scattering at surface phonons and from the film/insulator surface roughness to be distinguished. The μ_eff(N _e ) dependences can be approximated by the power functions μ_eff(N _e) ∝ N _e ^?n . The exponents n in the dependences and the dominant mechanisms of scattering of electrons induced near the interface between the SOI film and buried oxide are determined for different N _e ranges and film states from the surface side.     

Effect of the magnetic phase transition on the charge transport in layered semiconductor ferromagnets TlCrS<Subscript>2</Subscript> and TlCrSe<Subscript>2</Subscript>

TlCrS₂ and TlCrSe₂ crystals were synthesized by solid-state reaction. X-ray diffraction analysis showed that TlCrS₂ and TlCrSe₂ compounds crystallize in the hexagonal crystal system with lattice parameters a = 3.538 Å, c = 21.962 Å, c/a ≈ 6.207, z = 3; a = 3.6999 Å, c = 22.6901 Å, c/a ≈ 6.133, z = 3; and X-ray densities ρ _x = 6.705 and 6.209 g/cm³, respectively. Magnetic and electric studies in a temperature range of 77–400 K showed that TlCrS₂ and TlCrSe₂ are semiconductor ferromagnets. Rather large deviations of the experimental effective magnetic moment of TlCrS₂ (3.26 μ_B) and TlCrSe₂ (3.05 μ_B) from the theoretical one (3.85 μ_B) are attributed to two-dimensional magnetic ordering in the paramagnetic region of strongly layered ferromagnets TlCrS₂ and TlCrSe₂. The effect of the magnetic phase’s transition on the charge transport in TlCrS₂ and TlCrSe₂ is detected.     

Mobility of minority charge carriers in <Emphasis Type="Italic">p</Emphasis>-HgCdTe films

Temperature dependences of electron mobility in p-Hg_1?xCd_xTe films (x=0.210–0.223) grown by molecular beam epitaxy are investigated. In the temperature range 125–300 K, mobility was found by the mobility-spectrum method, and for the range 77–125 K, it was found using a magnetophotoconductivity method suggested in this study. The method is based on the measurement of the magnetic-field dependence of photoconductivity. The magnetic field is parallel to the radiation and normal to the sample surface. The electron mobility is determined using the simple expression μ _n [m²/(V s)]=1/B _H [T]. Here, B _H is the induction of the magnetic field corresponding to a half-amplitude of the photoconductivity signal under zero magnetic field. In the temperature range 100–125 K, the results obtained by the magnetophotoconductivity and mobility-spectrum methods coincide. For the samples investigated, the electron mobility at 77 K is in the range 5–8 m²/(V s).     

High-voltage MIS-gated GaN transistors

Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the material making it possible to achieve high breakdown voltages. For use in power switching devices, normally off GaN transistors operating in the enrichment mode are required. To create normally off GaN transistors, the subgate region on the basis of p-GaN doped with magnesium is more often used. However, optimization of the p-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to V _th = +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in p-GaN transistors results in an increase in the threshold voltage for the on-mode to V _th = +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors.     

Effective electron mass in heavily doped GaAs in the ordering of impurity complexes

Spectra of edge photoluminescence (PL) at 300 K have been studied in a set of Czochralski-grown Te-doped GaAs single crystals with a free carrier density of n₀=10¹⁷–10¹⁹ cm^?3. The carrier density dependences of the chemical potential and band gap narrowing are obtained by analyzing the PL spectral line profiles. The dependence of the effective mass of electrons at the bottom of the conduction band on their density, m ₀ ^* (n₀), is calculated. It is shown that the nonmonotonic m ₀ ^* (n₀) dependence correlates with data on electron scattering in the material under study and results from the ordering of impurity complexes.