Ni-P-CeO2化学复合镀层的XPS和AES分析

运用 SEM、AES和 XPS分析了 Ni- P- Ce O2 的镀层表面形貌及镀层组成。研究显示 ,Ni-P- Ce O2 镀层表面光滑、均匀、光洁度好 ,其相对原子摩尔分数分别为 Ni75.51 %、P1 3.37%、Ce2 .71 %、O6.81 %和 Fe1 .38%。镀层厚度为 6.0 μm,耐 1 0 0 g·L- 1 Na Cl溶液和 1 % (体积分数 ) H2 S气体的腐蚀能力较强。     

稀土对电沉积Ni-P合金镀层耐蚀性的影响

研究了稀土对电沉积Ｎｉ－Ｐ合金度层耐蚀性及组织的影响,通过浸泡实验和极化曲线的测定。得出在镀液中添加一定量的稀土元素能显著改善镀层的耐蚀性能。ＸＲＤ,ＴＥＭ,ＥＤＳ结果表明,稀土元素具有促进Ｎｉ－Ｐ合金形成非晶组织的作用,由于稀土的加入,在远低于８％的Ｐ含量下,获得了以非晶态为主的组织。     

Ni-P-CeO2化学复合镀层的XPS和AES分析

运用SEM、AES和XPS分析了Ni-P-CeO     

稀土对电沉积Ni-P合金镀液性能的影响

通过在电镀Ni P合金的镀液中加入一定量的镧和铈的氯化物 ,用赫尔槽实验、远近阴极实验等方法探讨了稀土元素对Ni P合金镀液性能的影响规律。结果表明 :CeCl3 ,LaCl3 以及它们的混合物的最佳添加量均为 2g·L- 1 。稀土元素的加入 ,能够显著增加Ni P合金镀液的光亮区范围 ,而且 ,这种作用在低电流密度范围内更显著。稀土元素加入到镀液中能够显著增大Ni P合金镀液的电流效率 ,并且导致电流效率随电流密度的变化趋势发生变化。实验结果还表明 ,稀土元素能够使镀液的分散能力有所提高。根据这一结果 ,从理论上推断稀土元素能够促进电沉积Ni P合金阴极过程的极化度。这一推断与阴极极化曲线的测量结果是一致的     

二溴基苯基荧光酮光度法测定化学镀Ni-W-P合金镀层中钨

化学镀Ｎｉ Ｗ Ｐ是利用化学的方法在基体表面镀上一层合金镀层[1] 。近年来 ,化学镀已成为国内外迅速发展的表面技术之一 ,90年代起 ,国内开始化学镀Ｎｉ Ｗ Ｐ合金工艺与性能方面的研究。Ｎｉ Ｗ Ｐ镀层具有良好的耐蚀耐磨性和高温抗氧化性。在强度允许的情况下 ,普通碳钢表面镀层后可代替高合金钢和不锈钢 ,用于油田采油系统、汽车零部件加工及一些工具、量具、模具的加工与修复。是一种市场应用前景良好的表面处理技术。对合金镀层中钨的含量测定 ,可采用吸光光度法。硫氰酸盐吸光光度法是测定含钨样品中钨含量的一种经典方法。这种方…     

低磷化学镀镍层的组成和结构

用SEM、XPS、AES和X-射线衍射法研究了低磷化学镀镍层的形貌、结晶状态、组成元素及其价态和深度分布。结果表明,低磷化学镀镍磷合金层为层状结构,镀态的镀层由低晶态的Ni和Ni_2P组成,350℃热处理1小时后转化为完全晶态的Ni和Ni_3P。镍和磷均为零价态,它们的结合能分别为129.1ev和852.3eV。镀层的真实组成(相对原子百分浓度)为:Ni 85.4%,P 10.1%,O 4.5%。     

化学复合镀Ni-P-TiO2纳米颗粒涂层功能特性

化学复合镀Ni-P-TiO2纳米颗粒涂层功能特性;纳米材料;化学复合镀;光催化     

吸光光度法测定化学镀Ni-P层成分

二元化学镀Ni-P镀层及该系列三元或多元的镀层的优异性能在国内外越来越受到多种行业的重视,其应用范围逐年递增。而镀层的性能主要取决于该镀层的结构和成分,成分的分析有多种方法,如能谱法、原子吸收光度法等。但对于工业化生产的在线检测、对于不具有该类大型设备的实验     

钢铁表面Ni-Sn-P合金镀层组成及其耐蚀性

化学镀;钢铁表面Ni-Sn-P合金镀层组成及其耐蚀性     

纳米化学复合镀Ni-P-TiO2(金红石型)及其耐蚀性能的研究

目前关于纳米化学复合镀Ni-P-TiO2,成为研究的热点,主要是研究TiO2具有光催化降解活性[1,2],以及通过对纳米TiO2进行掺杂能够增强它的光催化降解性能。本文以45#碳钢为基体,进行了纳米化学复合镀Ni-P-TiO2(金红石型),并对该镀层的耐腐蚀性能进行了研究。1实验部分1·1仪器及试剂LK98C(电化学综合测试系统,天津),磁力测厚仪(德国);试剂均为分析纯。纳米TiO2(金红石型)(上海正美亚公司);45#碳钢(圆柱形R5mm,矩形25·0×50·0×2·8mm)。1·2工艺流程45#铁基试样打磨→除油→水洗→除锈→水洗→活化→水洗→施镀。①除油配方工艺:20g/L…     

Preparation and thermal treatment of Pd/Ag composite membrane on a porous alumina tube by sequential electroless plating technique for H2 separation

Pd/Ag/α-Al2O3 composite membranes were prepared by sequential electroless plating technique. The prepared membranes were characterized by X-ray diffraction （XRD）, scanning electron microscopy （SEM）, energy dispersive spectroscopy, and inductively coupled plasma atomic emission spectroscopy techniques （ICP-AES）. Effects of annealing time, Ag content, and air treatment on the hydrogen permeation flux and morphology of the alloys were investigated. The results of the investigation showed that the prepared type of tube had a good potential as substrate for membrane preparation. In addition, a uniform defect-free alloy was prepared by annealing at 550 ℃ in H2 atmosphere. The permeation results showed an increase in H2 permeation flux by increasing the Ag content and the annealing time. In addition, the air treatment of the prepared membranes at 400 ℃ for 1 h changed the morphology of the alloy and substantially enhanced the hydrogen flux.     

Corrosion behavior of electroless Ni–P/TiO2 nanocomposite coatings

Composite Ni–P/nano‐TiO₂ coatings were prepared by simultaneous electroless deposition of Ni–P and nano‐TiO₂ on a low carbon steel substrate. The deposition was carried out from stirred solutions containing suspended nano‐TiO₂ particles. The Ni–P and Ni–P/nano‐TiO₂ coatings before and after heat treatment were characterized by X‐ray diffraction, scanning electron microscopy and energy dispersive X‐ray spectroscopy. The micro‐structural morphologies of the coatings significantly varied with the nano‐TiO₂ content. The corrosion resistance of as‐plated and heat‐treated Ni–P and Ni–P/nano‐TiO₂ coatings was investigated by anodic polarization, Tafel plots and electrochemical impedance spectroscopic (EIS) studies in 3.5% NaCl solution. Ni–P/nano‐TiO₂ coating exhibited superior corrosion resistance over Ni–P coating. Copyright © 2015 John Wiley & Sons, Ltd.     

Effect of Cu in electroless Ni–Cu–P coating on passivation process

Electroless Ni–P and Ni–Cu–P coatings were passivated by chromate conversion treatment respectively. The anticorrosive performances of passivated coatings were investigated by potentiodynamic polarization and electrochemical impedance spectroscopy measurements. The passivated Ni–Cu–P coating exhibited a high corrosion resistance with the i_corr of 0.236 μA/cm,² while the value of passivated Ni–P coating was only 1.030 μA/cm,² indicating the passive film could improve the corrosion resistance of Ni–Cu–P coating to a significant extent. High‐resolution X‐ray photoelectron spectroscopy was used to determine the chemical states of elements detected in the passive film. Compared with passivated Ni–P coating, the passive film on Ni–Cu–P coating exhibited a higher ratio of Cr₂O₃ to Cr(OH)₃ with the value of 72:28, which was the main factor for passivated Ni–Cu–P coating showing excellent corrosion resistance. The effect of Cu in electroless Ni–Cu–P coating on passivation process was discussed by the contrast experiment. Copyright © 2016 John Wiley & Sons, Ltd.     

硝酸铈及热处理对化学镀Ni-W-P合金的性能影响

为提高化学镀Ni-W-P镀层的耐蚀性和耐磨性,拓宽其应用,采用电化学方法和热处理等手段,研究了镀液中添加剂硝酸铈(Ce(NO3)3)的质量分数和热处理对化学镀Ni-W-P镀层的沉积速度、孔隙率、失重腐蚀速度、腐蚀电位、腐蚀电流、交流阻抗、显微硬度、摩擦系数等性能的影响。结果表明:添加1.0 wt%Ce(NO3)3时,所得镀层的沉积速度最大(36.5 g/m2·h),孔隙率最低(0.8个/cm2),耐腐蚀性能最好。镀层的组织均匀、致密、无缺陷和非晶态结构是其耐蚀性能高的重要原因。100~600℃热处理后,镀层硬度和耐磨性有所提高,而400℃热处理之后,合金显微硬度高达1100 HV,是镀态的1.8倍。     

Mechanism of electroless deposition of Ni–W–P alloys by adding surfactants

This paper describes an electroless deposition method for the formation of a thin metallic film containing mainly nickel with significant amounts of tungsten (up to 25%) and phosphorus (5–10%). The film was deposited from an aqueous electrolyte that contained sodium tungstate as a source of tungsten, nickel sulphate as a source of nickel and hypophosphite as the reducing agent and a source of phosphorus. The surfactants were p‐hexyloxy‐p‐sodium sulphonate azobenzene (HSA) with the formula H₁₃C₆OC₆H₄N₂ C₆H₄SO₃Na and p‐hexylbenzyltriethanol ammonium chloride (HBC) with the formula H₁₃C₆H₄CH₂N⁺ (C₂H₄OH)₃Cl^?, added as stabilizers. In this study the process parameters of typical solutions, such as temperature, pH and concentration of tungstate salt and the concentration of different surfactants, were presented and discussed. Adsorption of the surfactants on a metal surface was dependent, among other things, on the structure of their hydrophobic and hydrophilic portions. The effect of adsorption of these surfactants on a metal surface was examined above and below the critical micelle concentration (CMC). The deposition process involves several reactions that occur simultaneously and are described in detail in this work. The mechanism for interaction of the surfactants with the steel surface was proposed through the isotherm for adsorption from aqueous solution. Furthermore, the surface properties of the surfactants were measured, particularly the CMC, the surface tension reduction and the maximum surface excess Γ_max. The tungsten percentage in the deposit layer was strongly influenced by the plating conditions and the critical concentration of each surfactant. The results were discussed according to the surface properties of the additive. The thin film of Ni–W–P achieved high crystal refinement and high hardness, it was smooth and uniform and it exhibited superior corrosion resistance. Copyright © 2003 John Wiley & Sons, Ltd.     

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization of glycidyl methacrylate and its relevance to the electroless deposition of copper

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and deposition of glycidyl methacrylate (GMA) was carried out. The effects of glow‐discharge conditions on the chemical structure and composition of the deposited GMA polymer were analyzed by X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy. XPS and FTIR results revealed that the epoxide groups in the plasma‐polymerized GMA (pp‐GMA) layer had been preserved to various extents, depending on the plasma deposition conditions. The morphology of the modified PTFE surface was investigated by atomic force microscopy (AFM). The pp‐GMA film with well‐preserved epoxide groups was used as an adhesion promotion layer to enhance the adhesion of the electrolessly deposited copper on the PTFE film. The T‐peel adhesion test results showed that the adhesion strength between the electrolessly deposited copper and the pp‐GMA‐modified PTFE (pp‐GMA‐PTFE) film was much higher than that between the electrolessly deposited copper and the pristine or the Ar plasma‐treated PTFE film. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3498–3509, 2000     

Process aspects of electroless deposition for nickel–zinc–phosphorous alloys

Electroless deposition of Ni–Zn–P thin film was considered as a barrier film on a galvanic Zn or Ni–Zn sacrificial layer in a multicomponent corrosion protective coating on steel. The incorporation of zinc on the chemical composition of electroless Ni–Zn–P coating was studied. The effect of operating conditions such as temperature, pH value and concentration of zinc sulphate was investigated. Some physical characteristics such as morphology, structure, corrosion properties of Ni–Zn–P coatings were assessed in parallel with those of Ni–P. Inclusion of Zn to Ni–P is accompanied by the transformation of the coating structure from amorphous to crystalline. The effect of adding nonionic surfactant to the plating solution on the composition and surface morphologies was also investigated. The results indicate that nonionic surfactant has no effect on the Zn % in the deposit layer, but it affects the surface morphology and improves the corrosion resistance of Ni–Zn–P layers. Copyright © 2005 John Wiley & Sons, Ltd.