5,5′-二甲基乙内酰脲体系电沉积金(英文)

开发了以5,5′-二甲基乙内酰脲(DMH)为配位剂的无氰电镀金工艺。利用扫描电镜(SEM)和线性扫描伏安曲线对电镀时间和添加剂(由丁炔二醇、糖精和十二烷基硫酸钠组成)对镀金层表面、断面形貌和镀液性能的影响进行了测试,结果表明随着电镀时间的延长镀金层表面形貌几乎没有发生变化,光亮剂的加入增大了阴极极化同时使镀金层结晶变得细致均匀,在由HAuCl4,DMH,K3PO4和KH2PO4组成的基础镀液中金的沉积速度可达0.3μm.min-1,镀液中添加剂的加入没有影响金的沉积速度。利用X射线衍射技术(XRD)和X射线光电子能谱技术(XPS)对镀金层性能进行了测试,结果表明镀金层沿着(111)晶面择优生长并且由纯金组成。利用循化伏安曲线和旋转圆盘电极对Au(Ⅲ)在镀液中的电化学还原机制进行了研究,结果表明当研究电极为玻碳电极(GCE),镀液温度为45℃时,镀液中金的电沉积过程是受扩散控制的不可逆的过程。同时利用循环伏安曲线对镀金液的稳定性进行了分析。     

Ni-W纳米结构梯度镀层的制备、表征及热应变特性

采用电沉积方法并调节镀液温度、电流密度等工艺参数制备Ni-W纳米结构梯度镀层.SEM能谱测试及X射线衍射测试表明,沿镀层生长方向,钨含量逐渐增加,晶粒尺寸由10.9 nm递减到1.5 nm,晶格畸变度逐渐增大,镀层由纳米晶逐步过渡到非晶结构.结构呈连续梯度分布.热应变特性研究表明,沿镀层厚度方向,热应变变化平缓,有效地缓解了界面处材料热失配,从而缓和了材料的热应力.     

DMDMH镀液体系中金的电沉积

在以1,3-二羟甲基-5,5′-二甲基乙内酰脲(DMDMH)为配位剂的镀液体系中研究了金的电沉积工艺和电结晶行为。循环伏安曲线测试中,在-0.88 V附近出现了金的阴极还原峰,在一定的正向电势扫描区间内没有阳极氧化峰出现。计时电流法研究表明,金在玻碳电极上的电结晶过程符合三维连续成核生长模式。SEM和AFM观察表明,在DMDMH体系中获得的镀金层比DMH体系获得的镀金层结晶更为细小,平整性更好。XRD测试表明,在两种镀液体系中获得的镀金层都沿着(111)晶面择优生长。DMDMH镀液体系稳定性能良好。     

酸性溶液化学镀Ni-P-B合金及结构性能表征(英文)

联用次亚磷酸钠和硼氢化钠两种还原剂 ,从酸性镀液中沉积出不同硼含量的Ni_P_B镀层 ,并用原子力显微镜、X_射线衍射、透射电镜、动电位扫描等实验技术对其镀态结构及性能进行了表征。实验表明 ,镀液中硼氢化钠含量对沉积速度影响不大 ,但能显著影响镀层的化学组成。硼的共沉积使镍晶格点阵产生扭变 ,导致镀层晶粒增大 ,表面粗糙 ,颗粒分布不均匀 ,并使镀层由非晶态向微晶结构转变 ,且微晶成分随镀层中硼含量的增加而增多。Ni_P_B镀层的硬度随镀层中硼含量的增加而增大 ,热处理能显著提高镀层的硬度 ,且服从沉淀硬化机理。在 3.5wt%NaCl和 40wt%NaOH两种介质中 ,Ni_P_B合金的耐腐蚀能力优于Ni_P合金。镀层中硼含量越高 ,其耐腐蚀能力越强。     

甲基磺酸亚锡溶液中不同稳定剂的作用机制及电化学性质

研究了对苯二酚、邻苯二酚、间苯二酚和抗坏血酸4种稳定剂对甲基磺酸亚锡电镀液稳定性、电极极化及镀层表面形貌的影响.采用循环伏安法探究了镀液稳定性与稳定剂电化学性质的关系,通过交流阻抗和计时电位考察了稳定剂对镀液阴极极化性能的影响,分析了对苯二酚在电镀过程中的循环使用原理及对苯二酚的最佳使用浓度.结果表明,镀液的稳定性与稳定剂自身的还原能力及电化学活性之间存在重要联系,4种稳定剂对镀液稳定作用的大小顺序为对苯二酚邻苯二酚抗坏血酸间苯二酚,稳定效果最好的对苯二酚可以将镀液的储存时间延长一倍;苯二酚类稳定剂可以提高锡沉积的阴极极化程度,使晶粒细化,而抗坏血酸对锡沉积起到去极化作用;对苯二酚在电镀锡过程中兼具抗氧化剂、光亮剂和整平剂的作用,镀层的耐蚀性能测试结果表明,对苯二酚的最佳浓度为1.0 g/L.     

CO2-3对羟基乙叉二膦酸镀铜液的影响

研究羟基乙叉二膦酸(HEDPA)镀铜液中CO2-3含量对电沉积时阴、阳极过程及镀层的择优取向的影响. 通过分析阴、阳极的动电位极化曲线, 发现镀液中逐渐加入的CO2-3提高了阴极的极化, 使电结晶晶粒细化, 直至达到稳定; 同时促进了铜阳极的溶解. 而X射线衍射(XRD)结果表明, 铜镀层的晶面择优取向从(222)逐渐向(111)转变. 通过镀液中固体络合物的红外光谱分析表明, CO2-3的加入以第二配体的方式进入该镀液的放电络合离子结构中, 参与Cu2+的络合, 形成更稳定的络合物, 从而导致铜沉积电位负移, 镀层(111)晶面取向增强.     

CO3^2-对羟基乙叉二膦酸镀铜液的影响

研究羟基乙叉二膦酸（HEDPA）镀铜液中CO3^2-含量对电沉积时阴、阳极过程及镀层的择优取向的影响.通过分析阴、阳极的动电位极化曲线,发现镀液中逐渐加入的CO23-提高了阴极的极化,使电结晶晶粒细化,直至达到稳定;同时促进了铜阳极的溶解.而X射线衍射（XRD）结果表明,铜镀层的晶面择优取向从（222）逐渐向（111）转变.通过镀液中固体络合物的红外光谱分析表明,CO3^2-的加入以第二配体的方式进入该镀液的放电络合离子结构中,参与Cu2＋的络合,形成更稳定的络合物,从而导致铜沉积电位负移,镀层（111）晶面取向增强.     

CO2-3对羟基乙叉二膦酸镀铜液的影响

研究羟基乙叉二膦酸(HEDPA)镀铜液中CO32-含量对电沉积时阴、阳极过程及镀层的择优取向的影响.通过分析阴、阳极的动电位极化曲线,发现镀液中逐渐加入的CO32-提高了阴极的极化,使电结晶晶粒细化,直至达到稳定;同时促进了铜阳极的溶解.而X射线衍射(XRD)结果表明,铜镀层的晶面择优取向从(222)逐渐向(111)转变.通过镀液中固体络合物的红外光谱分析表明,CO32-的加入以第二配体的方式进入该镀液的放电络合离子结构中,参与Cu2+的络合,形成更稳定的络合物,从而导致铜沉积电位负移,镀层(111)晶面取向增强.     

在离子液体[BMIm][BF4]中电沉积光亮金镀层

在离子液体1-丁基-3-甲基咪唑四氟硼酸盐（[BMIm][BF₄]）中以HAuCl₄·3H₂O为主盐、通过添加5,5-二甲基乙内酰脲（DMH）和胞嘧啶可得到色泽光亮、厚度达1.5 μm的金镀层,沉积过程中阴极电流效率可达到100%。SEM和XRD测试结果表明,DMH和胞嘧啶具有细化晶粒、平整镀层的作用。电化学测试结果表明,DMH可分别与Au³⁺、Au⁺形成配合物Au（DMH）₄^-、Au（DMH）₂^-,抑制了还原过程的表面转化步骤,从而增加了阴极极化,起到光亮镀层、细化晶粒的作用;胞嘧啶可在金核表面吸附,从而可以进一步光亮镀层、细化晶粒,与DMH有协同作用。循环伏安测试研究了镀液的电化学行为,研究表明在此体系中Au³⁺的还原为两步还原过程,分别为Au³⁺→ Au⁺和Au⁺→ Au。此外DMH和胞嘧啶的添加不会带来副反应。     

氟硼酸镀液二氧化铅电沉积

研究了在氟硼酸或其掺杂镀液中于Pt基底电沉积PbO2镀层的电化学和结构性质.循环伏安测试、XRD分析和SEM形貌观察表明,BF4-可提高二氧化铅电沉积速率;电沉积的PbO2晶型为β-PbO2;F-、Fe3+共掺杂影响晶体生长的择优取向及镀层形貌,电沉积的FB/F-Fe-PbO2镀层整齐致密;电沉积过程增大电流密度可改变生长晶面取向.     

镍离子对中磷镍基体氯化胆碱无氰浸金表面的改善

本文通过加入氯化镍解决了作者实验室之前开发的新型氯化胆碱（ChCl）无氰浸金液不适用于中磷镍基底上的问题. 氯化镍的加入不会对镀速产生明显影响,500 mg·L^-1的六水合氯化镍可以有效缓解浸金液对镍基底的过度腐蚀,并能改善镀金层的表面质量. 改良后的氯化胆碱体系镀液对中磷镍基底有良好的适用性,同时对所用的添加剂镍离子具有较高的承载能力（六水合氯化镍2000 mg·L^-1）,因此该镀液体系具备了应用于工业生产的潜力.     

Microbalance study of gold dissolution in alkaline sulfite-thiocarbamide electrolytes

It is shown that gold does not virtually dissolve in alkaline (pH 12.5) solutions containing either thiocarbamide or sodium sulfite. Gold dissolves in alkaline solutions simultaneously containing thiocarbamide (0.1 M) and sodium sulfite (0.5 M). The gold dissolution rate increases with the increase in the contents of thiocarbamide and sodium sulfite. The methods of microbalance and voltammetry are used in studying the mechanism of gold dissolution in a solution containing 0.5 M sodium sulfite, 0.1 M thiocarbamide, and 0.03 M KOH. The found relationships are explained based on the assumption that the gold dissolution in alkaline sulfite-thiocarbamide electrolytes affords gold sulfite complexes.     

Coupled radiotracer and voltammetric study of the adsorption of 1-hydroxy-ethane-1,1-diphosphonic acid on polycrystalline gold

Coupled application of a version of the in-situ radiotracer ‘foil’ method and voltammetry provided information on the time-, potential-, concentration- and pH-dependent adsorption of 1-hydroxy-ethane-1,1-diphosphonic acid (HEDP) on a polycrystalline gold electrode, and on the effect of Zn²⁺ ions on the adsorption phenomena. Adsorption processes on the oxide-free surface of gold were observed to be potential-dependent in the potential range 0.05–1.00 V (versus RHE), while formation and irreversible accumulation of oxidation products of HEDP could be detected at E>1.00 V. The relative adsorption strength of HEDP (its dissociation and/or oxidation products) was found to be higher on an oxide-free gold surface than on an oxide-covered one. The surface excess of HEDP increased with increasing pH. Addition of Zn²⁺ ions to the solution exerted a substantial effect on the HEDP accumulation. Namely, significant differences in the surface coverage, as well as in the kinetics and mechanism of HEDP adsorption could be detected in the potential regions below and above E=0.2 V. Reduction of Zn(II) species at E≤0.1 V is probably coupled with the induced adsorption of HEDP on an Au electrode, leading to the formation of a polymolecular HEDP–Zn surface complex layer.     

Determination of Sulfite in Hair Waving Products Using Oxygen‐Incorporated Gold‐Modified Screen‐Printed Electrodes

An electrodeposition oxygen‐incorporated gold‐modified screen‐printed carbon electrode (AuOSPE) was fabricated to determine the sulfite content in hair waving products. The AuOSPE showed an electrocatalytic current for sulfite at +0.4 V (vs. Ag/AgCl). Compared with a gold screen‐printed electrode (AuSPE), the AuOSPE showed a higher electrocatalytic current. The increase in the electrocatalytic current was ascribed to the increase of the oxygen incorporated with gold atom on AuOSPE. The AuOSPE coupled with a flow injection analysis (FIA) system showed excellent oxidation current for sulfite in a 0.1 mol L^?1 phosphate buffer solution (PBS), pH 6.0. The linear working range for determining the sulfite content was 0.05 to 1200 mg L^?1 (0.625 µmol L^?1 to 15.00 mmol L^?1) with a calculated detection limit of 0.03 mg L^?1 (0.375 µmol L^?1) (DL, S/N=3). Relative standard deviations (RSD) of 3.03 %, 2.30 % and 4.26 % were calculated for consecutive injections (n=12) of 20, 300 and 900 mg L^?1 sulfite, respectively. The amount of sulfite in two hair waving products was determined by the proposed method and a standard iodometric method. The recoveries ranged from 96.18 % to 105.61 %. The AuOSPE showed high sensitivity, selectivity, stability and reproducibility for sulfite.     

Fe-Ni-S软磁薄膜的电沉积

酸性镀液中以硼酸为缓冲剂、柠檬酸三钠为配合剂,在紫铜箔上电沉积得到非晶Fe-Ni-S合金薄膜。 采用扫描电子显微镜和能谱分析技术(EDS)研究了镀液组成和沉积条件对镀层表面形貌和组成的影响。 结果表明,在镀液中加入2 g/L C7H5O3NS（糖精）和0.4 g/L 1,4-丁炔二醇可获得表面平整无裂缝和较小内应力的合金镀层;电流密度和镀液pH值对镀层组成影响较小,但施镀温度对镀层组成影响较大。 获得了理想的镀液组成和沉积条件,所得Fe73Ni9.5S17.5薄膜的X射线衍射表明其为非晶结构,在室温下具有较高的饱和磁化强度(Ms约为876.25 kA/m)和较低的矫顽力(Hc约为4.96 kA/m),具有良好的软磁性能。 循环伏安曲线和阴极极化曲线均表明,镀液中CS(NH2)2会促进Fe-Ni-S共沉积。     

New dialkyldithiophosphinic acid self-assembled monolayers (SAMs): influence of gold substrate morphology on adsorbate binding and SAM structure

We report the fabrication and characterization of new self-assembled monolayers (SAMs) formed from dihexadecyldithiophosphinic acid [(C(16))(2)DTPA] molecules on gold substrates. In these SAMs, the ability of the (C(16))(2)DTPA headgroup to chelate to the gold surface depends on the morphology of the gold substrate. Gold substrates fabricated by electron-beam evaporation (As-Dep gold) consist of ～50-nm grains separated by deep grain boundaries (～10 nm). These grain boundaries inhibit the chelation of (C(16))(2)DTPA adsorbates to the surface, producing SAMs in which there is a mixture of monodentate and bidentate adsorbates. In contrast, gold substrates produced by template stripping (TS gold) consist of larger grains (～200-500 nm) with shallower grain boundaries (<2 nm). On these substrates, the low density of shallow grain boundaries allows (C(16))(2)DTPA molecules to chelate to the surface, producing SAMs in which all molecules are bidentate. The content of bidentate adsorbates in (C(16))(2)DTPA SAMs formed on As-Dep and TS gold substrates strongly affects the SAM properties: Alkyl chain organization, wettability, frictional response, barrier properties, thickness, and thermal stability all depend on whether a SAM has been formed on As-Dep or TS gold. This study demonstrates that substrate morphology has an important influence on the structure of SAMs formed from these chelating adsorbates.     

化学镀镍诱发过程的研究 I:金属催化活性的鉴别和反应机理

Electroless plating is known to be an autocatalytic process. For the reaction to start, the substrate metall should be either catalytic or activated by a suitable catalyst. For example, steel and nickel can be plated directly, but in the case of copper or brass, catalytic metal inducing is need. In this paper, the catalytic activity of different metals and their inducing effects were in vestigated by measuring stationary potentials nd stationary potential-time curves. Experimental results showed: (1) The stationary potential of metal provides a simple parameter to estimate the catalytic activity of metals in electroless nickeling. When 1-hydroxyethylidenediphosphonic acid (HEDP) aelectroless nickeling bath containing NaH2PO2 as reducing agent is used, electrolessnickeling may proceed spontaneously, if the stationary potential of metal is more nagative than -0.60V, no matter whether nickel (autocatalytic active) or other metals(non-autocatalytic active) is used as substrate. (2)When an autocatalytic meta is in contact with the substrate metal in the bath, a sudden decrease of stationary potential is observed. The whole inducing process could be finished within 0.5-2 sec. (3) The stationary potential of electroless nickeling coating in HEDP bath at 80`C is-0.72V, consequently nickel coating itself is a catalytic active metal. Once an electroless nickeling coating is deposited on a substrate metal, electroless nickeling reaction can then proceed continuously. (4) The sufficient conditions of electroless nickeling in HEDP bath containing NaH2PO2 are that the stationary potential of substrate metal must be more nagative than -0.60V and that the temperature of electroless nickeling bath should be higher than 50`C. (5) Inducing mechanism of electroless nickeling can be explained with chemical cell consisting of substrate metal and catalytic metal. Electrons from catalytic metal would suddenly decrease the stationary potential of substrate metal, H+ and Ni2+ complex ion would be reduced on the substrate me     

Inhibitor effect of sodium benzoate on the corrosion behavior of nanocrystalline pure iron metal in near-neutral aqueous solutions

Nanocrystalline iron coating was produced on carbon steel surface by pulse electrodeposition using citric acid bath. The grain size of a nanocrystalline surface was analyzed by X-ray diffractometry and scanning electron microscopy. The electrochemical behavior of nanocrystalline iron coating in the presence of sodium benzoate was evaluated in 30 mg l^-1 NaCl + 70 mg l^-1 Na₂SO₄ aqueous solution using potentiodynamic polarization curves and electrochemical impedance spectroscopy. The results were compared with that of the coarse-grained iron surface. The thermodynamic properties of the inhibitor adsorption were also determined. The results indicated that corrosion inhibition of sodium benzoate in near-neutral aqueous solution was increased as the grain size of iron was decreased from micro- to nanocrystalline surface. This was reported in terms of excess free energy of nanocrystalline surface.     

Influence of bath composition and deposition parameters on nanostructure and thermal stability of gold

Nanocrystalline gold is electrodeposited from a stable nontoxic bath, in which Au⁺ is stabilized by complex formation with 3-mercapto-1-propanesulfonic acid sodium salt. Nanoscaling is achieved by pulse techniques. The crystallite size is strongly dependent on physical and chemical process parameters, such as pulse duration, current density, bath temperature, type, and amount of additives; especially, we observe a decrease of the crystallite size down to 16 nm by the proper choice of current density and temperature, and down to 7 nm by the use of additives. The thermal stability of nanocrystalline gold is investigated by in situ high-temperature X-ray diffraction; nanogold exhibits a thermal stability up to 673 K. An activation energy of 37 kJ mol⁻¹ is determined for the grain-growth kinetics.Paper presented at the “Jahrestagung der Fachgruppe Angewandte Electrochemie der Gesellschaft Deutscher Chemiker, Düsseldorf, 11.–14.06.2005”