硅片传输单元洁净系统的研制

在集成电路制造的硅片传输过程中,硅片传输机器人等机械设备的运动会产生尘埃粒子污染硅片.为解决这一问题,设计并研制了硅片传输单元的洁净系统,分析了该洁净系统的设计方案和结构设计,计算了它的送回风管直径,并用计算流体力学的方法,对洁净系统内部的硅片传输机器人区域进行了流场的模拟分析.该洁净系统已达到设计要求.     

双磁悬浮泵串联技术在超精细清洗机中的应用

化学药液供给系统是晶片清洗机的重要功能单元。其特殊的使用环境,要求动力泵应该具备耐化学腐蚀、不产生污染颗粒、外形尺寸小、而且输出的压力较高和流量较大等特性。重点介绍了磁悬浮泵在65 nm超精细清洗机化学药液供给系统中的使用情况,包括磁悬浮泵的结构特点、性能参数、控制方式、双泵串联的控制方法以及自主开发的压力-速度闭环控制器,避免了因为环境电磁干扰对速度信号(0~5 V)采集引入的误差。结果显示,药液压力建立快速、无超调,到达目标压力后泵转速稳定,压力闭环控制精度小于工艺压力设定值的1%。     

GPS信号在极区中层顶PMSE尘埃层的衰减分析

极区中层夏季回波(PMSE,Polar Mesosphere Summer Echoes)是通过雷达在高纬当地夏季中层顶附近探测到的异常强大雷达回波,发生PMSE现象的区域属于尘埃等离子体范畴,现在已经在1290 MHz处用雷达观测到PMSE现象。GPS系统卫星的L2频率为1227.60 MHz,容易受到PMSE尘埃层的影响。GPS信号穿越极区中层顶时,其中的尘埃等离子体区域必然对信号产生影响。利用分层媒质方法结合ECT-02实验数据研究GPS系统L2载波信号经过尘埃层的吸收系数和信号的衰减程度,证实PMSE尘埃层能影响GPS通信。     

尘埃粒子光散射信号传输特性的研究

提出了尘埃粒子光散射粒径信号幅度响应矩阵的概念 ,详细讨论了粒径信号幅度响应矩阵的基本特性 ,建立了描述单分散粒子群散射光信号传输系统特性的数学模型。揭示出尘埃粒子光散射系统信号传输过程的本质是粒子群结构特性的等价描述方式之间的变换     

中国带电清洗技术的突破

一、电路故障的成因 通常,由于空气的污染和设备所处的环境及管理条件不同,空气中的灰尘、油污、酸碱及其气体、盐分、潮气、炭渍、金属尘埃、各种机械杂质等污染物质,不可避免地吸附在电路表面及其它部位,加之静电累积和在电场力的作用下,污秽的累积不断加重和变得牢固,各种污秽牢牢附着在线路表面,深层及各部位。灰尘、油污、酸碱及其气体、盐分、潮气、炭渍、金属尘埃、各种     

分体式空调器的维护与保养

随着人们生活水平的提高,空调已步入了广大城乡家庭。空调器使用日久将会降低性能,还可能散发异味,同时尘埃可能污染排水软管,使其运转不畅,所以应遵循科     

基于动力论的尘埃等离子体充电方程研究

尘埃等离子体与一般等离子体最大的不同源于尘埃粒子的充电问题,尘埃粒子充电方程是描述尘埃等离子体充放过程的基本方程,充电频率(电荷驰豫速率)是描述这一物理过程的基本物理量。在研究尘埃等离子体微波散射、尘埃等离子体介电张量及尘埃等离子体中各种纵波问题时,不同的文献引入了不同的充电频率表达式。在动力论基础上研究了尘埃粒子的充电问题,用动力论方法推导了尘埃粒子充电方程,给出了充电频率表达式。对两种不同形式的充电频率表达式做了分析,阐明它们是不同近似条件下给出的结果。     

尘埃等离子体的谐振问题研究

基于尘埃等离子体的色散关系,在不考虑高/低频近似的情况下,推导了尘埃等离子体谐振频率和增长率的表达式,讨论了尘埃质量、尘埃密度和载波频率对谐振过程的影响,给出了尘埃等离子体谐振过程的基本物理规律.典型火箭喷焰等离子体参数条件下,考察了高速尘埃粒子组分的引入对谐振过程的影响.仿真结果表明,尘埃速度在1 km/s的条件下即可激发谐振过程,谐振频率约为3 kHz.尘埃等离子体谐振机理模型和高速组分影响机制的得出对深入理解尘埃等离子体的物理过程和火箭喷焰的异常衰减机制具有重要意义.     

战栗城市

有“贫民的核弹”之称的脏弹会给世界造成怎样的灾难呢？《战栗城市》假恐怖袭击之名进行了一次逼真的描述。故事讲述恐怖分子引爆了毒气弹，有毒尘埃在洛杉矶四处蔓延，全城进入戒严状态，布拉德也封闭门窗呆在家里。不久，被有毒尘埃逃脱厄运。污染的妻子莱西回来了，布拉德无力救助，两人只能隔门对望。最终莱西被搜救人员抓住而布拉德也没能改变这一切。     

275有机硅超高真空扩散泵油废油的回收利用

275有机硅超高真空扩散泵油是一种价格昂贵而用量又大的原材料。为保证真空系统的真空度和显象管正常工作时管内的良好气氛,我们规定:扩散泵在连续工作500小时以后,必须清洗泵体,更换泵液。对更换下来的废油,一向是不作处理,一倒了之,这样做,既浪费了资财,又污染了环境。为此,在1983年10月开始对回收利用废硅油进行了调研。     

Behavior of Particles Reflected by Turbo Molecular Pump in Plasma Etching Apparatus

The behavior of particles that are reflected in a turbo molecular pump is investigated by measuring particle trajectories and the number of particles that fall on a wafer in a plasma etching apparatus. Some scattered particles collide with the wafer at high velocity, which damage fine patterns of the photoresist on the wafer. Particle contamination can be reduced by supplying carrier gas to form a down-flow when the etching plasma is not discharged. During plasma discharge, the number of particles that fall on the wafer decreases because particles are trapped near the plasma-sheath boundary. The down-flow gas reduces particle contamination by 90% through the etching sequence, including wafer transfer.      

空调通风系统清洗效果的实验研究

中央空调通风系统送风中的污染物是室内空气的主要污染源之一,主要的污染物是可吸入颗粒物和微生物.通过实验分析空调通风系统清洗前后积尘、可吸入颗粒物和微生物的变化情况,研究了空调通风系统清洗的效果.     

Requirements for contamination control in the gigabit era

The effect of contamination, especially particles and organic materials in cleanrooms, on future device manufacturing was estimated. The number of particles deposited on wafer surfaces was calculated based on particle size distribution in real cleanrooms and the reported data on particle deposition velocity. DRAM yield trend was then calculated taking only particles from the cleanroom environment into account. Killer particle size is assumed to be one-third of the feature size according to the SIA roadmap. In the Gigabit era, a class 0.1-0.01 level environment will be necessary even with a shortened TAT (turn around time). The lower limit of particle density in conventional cleanroom air was estimated to be class 0.1-1 Level by particle generation by people, suggesting the use of a mini-environment fab system to produce high-grade cleanliness. A mini-environment system is also preferable for eliminating other contaminants such as organic compounds. However, box material and additions must be reexamined from the viewpoint of organic contamination control because some organic materials generated from wafer box easily adsorb on silicon surfaces and change the surface conditions     

溶胶-凝胶膜光学表面激光清洗工艺研究

为了解决光学元件表面的颗粒污染问题，在单发次激光干式清洗的基础上，提出了气流置换系统辅助的激光清洗方法，使用波长为355nm的Nd:YAG激光器，针对镀溶胶-凝胶SiO₂薄膜熔石英光学表面粒径为1μm~50μm的典型SiO₂颗粒污染物，进行了理论分析和清洗实验，取得了可用于激光清洗的工艺参量。结果表明，对于镀溶胶-凝胶膜熔石英样品的单发激光干式清洗，最佳激光能量密度为2.29J/cm2，与未镀膜石英的激光清洗工艺参量存在一定差异；在最佳工艺参量下，单发次激光清洗对于粒径1μm以上的SiO₂颗粒清洗效果明显，移除率可达82.96%；当污染密度过高时会导致清洗效果的减弱及对基底的损伤，而气流置换系统辅助的激光清洗方法可进一步增强对光学表面颗粒污染的去除效果。该研究对大型高功率固体激光装置中的光学元件在线清洗及清洗装备的设计具有重要的研究意义与实用价值。     

CMP抛光液供给及分布系统的研究

从整体结构及硬件设计方面介绍了小批量生产及隔膜泵系统,分析隔膜泵的工作原理,循环机理及硬件控制和驱动电路,同时指出在湿度较大的生产厂里面产生的漂移及解决措施;从整体结构分析集中式抛光液供给系统,分析其抛光液混合中心具备的温度控制、无轴承磁悬浮泵工作机理及循环机制;对比隔膜泵与无轴承磁悬浮泵对颗粒凝聚的影响,并分析这种系统适用范围。     

基于粒子群优化算法的双向多泵浦光纤拉曼放大器增益研究

基于石英光纤作为增益介质,采用龙格-库塔法、打靶法求解多波长双向泵浦光纤拉曼放大器的功率耦合波方程,得到拉曼放大器的增益带宽,平均增益,增益平坦度以及泵浦光和信号光沿光纤的分布。再通过粒子群优化算法对同一数量泵浦光不同排列双向系统进行逐个优化分析,在14种双向泵浦结构中选出性能较优的三种结构,再对它们优化参数设置,最终得到性能最优的双向泵浦结构BBFF。研究结果表明:在仅有四个泵浦光的情况下,双向多泵浦结构BBFF具有最优的平均增益和增益平坦度,并且得到了开关增益为23.1665 dB,增益平坦度为0.794 dB的双向泵浦结构。     

Contamination issues in gas delivery for semiconductor processing

The contamination contribution from two functionally similar gas delivery systems supplying a process tool is quantified in this investigation. The conventional gas delivery system consists of single-melt stainless steel tubing (~20 Ra), elastomer components, and the ultraclean gas delivery system consists of double-melt stainless steel (~5 Ra), all metal components. Moisture, oxygen, and hydrocarbon impurities desorbing from the wetted surfaces of the gas delivery system are analyzed using an atmospheric pressure ionization mass spectrometer (APIMS). Particle contamination from components in the gas delivery system is characterized with a condensation nucleus counter (CNC) using static and dynamic testing. Corrosion-induced particulate occurring in the heat-affected-zone (HAZ) near welded portions in tubing is also studied. The moisture contribution of the conventional gas delivery system is a factor of six greater than that from the ultraclean gas delivery system and the oxygen contamination is a factor of three greater. The particle shedding (0.01 μm) in the static mode from the conventional manifold is 20 times greater than that from the ultraclean manifold. The HAZ of the conventional weldment shows aggressive corrosion-induced particulate and loss of the electropolished surface compared to the HAZ of the ultraclean weldment. The effect of the choice of material, components and manufacturing techniques is correlated to the extent of contamination contributed by the gas delivery system     

Failure mechanism of COF based Line Driver IC for Flat Panel Display by contamination

This study is about the field failure and mechanism of Chip on Film (COF) based Line Driver IC (LDI) for FPD. Due to LDI failure, there is vertical line defect on Flat Panel Display (FPD). Contamination is detected in bumps of LDI which is packaged by Resin. Chemical and physical method has applied for analyzing the elements and the isolation of contamination. The first detected contamination type is Gold (Au). The second contamination type is the mixed material of metal particle and organic material like Aluminum (Al), Iron (Fe), Chrome (Cr). It is found that all contamination is getting in during the Inner Layer Bonding (ILB) process. In case of Au contamination, remained Au particle is getting into the surface of collet (Rubber) which is used for Chip pick-up with collet particle. Fe, Cr, Al contamination is floating dust inside of the equipment and getting into with all kinds of dust. Dust inside is getting energy from temperature, moisture, Bias, catalyst. As a result, each contamination could cause short in bumps in LDI due to Au migration and by changing the characteristic from high resistor to low resistor.     

生物洁净室的污染控制

生物洁净室的目的是控制细菌污染。通过对细菌特性、来源及污染途径的分析,确定了全方位、全过程控制的基本思想,即污染源控制,污染传播过程控制和交叉污染控制,通过分析微粒的运动特性,提出了空气途径污染的主要手段是气流流动控制和表面污染控制,最后分析了交叉污染的形成原因及其防治措施。     

Impact of particles in ultra pure water on random yield loss in IC production

The influence of environmental particle contamination on offline measured defects and manufacturing yield in integrated circuits is discussed. One of the sources of particle contamination is ultra pure water used in different production tools at different stages of processing. Particle count data measured in ultra pure water is compared with the offline defects caused by process tools and the relation has been statistically confirmed. Particle count data is also compared with the defect density of large size products. An impact of particle contamination on yield of 4-6% has been found. In this study, fundamentals are provided to define the meaningful specifications of ultra pure water for wafer fabrication.