稀土元素对SnAgCu焊点内部组织的影响机制

随着人们环保意识的逐渐增强,新型无铅钎料的研究成为电子工业中的研究热点,而稀土元素的添加可以显著改善钎料的性能,基于含稀土Ce无铅钎料的钎焊试验,采用扫描电镜和能谱仪研究稀土元素Ce对SnAgCu焊点内部组织的影响机制。结果表明,稀土元素在SnAgCu焊点内部以CeSn3的形式存在,且稀土相形态各异。采用化学亲和力来表征稀土元素Ce与Sn、Ag、Cu之间的内在联系,从理论上证明Ce的“亲Sn性”。采用乌尔夫原理研究稀土元素的吸附现象,解释稀土元素Ce对SnAgCu焊点内部金属间化合物的细化作用。由SnAgCuCe焊点组织分析,发现基体组织中颗粒尺寸大小排序为CeSn3>Cu6Sn5>Ag3Sn,从理论上证明纳米Ag3Sn颗粒在SnAgCuCe焊点强化中发挥着主要的作用。研究结果可以为新型无铅钎料的研究提供理论支撑。     

电-热-力耦合载荷下非均匀组织Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究

电子封装微焊点往往在电、热、力等多种载荷共同作用下服役,且具有鲜明的组织不均匀特征.研究电-热-力耦合载荷下电流密度和温度对电子封装组织不均匀线型Cu/Sn-58Bi/Cu微焊点拉伸力学性能及其尺寸效应的影响.结果 表明,较低温度和较低电流密度情况下,随焊点高度降低,Cu基底对钎料的力学约束增强,焊点拉伸强度提高,断裂...     

铝合金焊点疲劳性能及其影响因素分析

研究了铝合金AA5754和AA6111-T4焊点的疲劳性能,获得了不同厚度及试件类型的焊点疲劳数据;研究了试件类型不同时焊点的疲劳失效模式,讨论了焊点疲劳裂纹的扩展形式;分析了铝合金焊点疲劳寿命的影响因素。结果表明:焊点疲劳失效模式主要有两种,分别是母材“眉状”裂纹断裂和焊点熔核界面断裂;母材对焊点疲劳寿命影响不大;循环载荷比对焊点寿命有一定的影响,增大载荷比导致焊点疲劳寿命略有下降;试件类型对焊点寿命有很大的影响,应在设计中避免焊点承受剥离载荷。     

微量钕对Sn-6.5Zn/铜焊点界面组织与性能的影响

采用SEM、EDS和拉伸-剪切试验等方法研究了微量稀土元素钕对Sn-6.5Zn-xNd(x=0,0.1,0.5)钎料/铜焊点界面组织,重点是界面金属间化合物(IMC)特征及结合性能的影响。结果表明:在Sn-6.5Zn合金中添加微量钕具有明显的变质作用,能够促进界面形成均匀细密的Cu5Zn8IMC层;钕添加量的增加对界面IMC尺寸与分布没有产生明显影响;钕添加量为0.1%(质量分数,下同)时能显著改善钎料/铜焊点结合性能,而当添加量为0.5%时,界面处稀土化合物的聚集会导致焊点结合性能下降。     

304/304L不锈钢TIG焊两种搭接接头的组织及力学性能

搭接接头焊缝在实际工况中存在受拉力和剪切力两种受力状态,其力学性能的差异对工程应用中选取焊缝形式有重要意义。对不锈钢304及304L进行钨极惰性气体保护焊(TIG焊),研究了两种样件焊接接头的显微组织、硬度、拉伸性能和疲劳特性。结果表明:两种搭接形式下的焊接接头从母材到焊核,可根据晶粒类型和大小分为7个区域。焊缝受拉力样件的断裂延伸率为19.3%,在接头区域两种组织过渡处断裂;受剪切力样件的断裂延伸率为12.7%,在材料尺寸变化、应力集中处断裂。焊缝受拉力样件断裂韧性、抗拉强度和疲劳性能更强,结构尺寸变化和应力集中对受剪切力样件力学性能的影响较大。     

无铅微互连焊点力学行为尺寸效应的试验及数值模拟

采用高精度微拉伸试验和有限元数值模拟方法研究不同微尺度的Sn-Ag-Cu无铅钎料模拟互连焊点力学行为和性能演变的尺寸效应。结果表明,当焊点高度恒定(225μm)而焊点直径逐渐减小(475～200μm)时,拉伸断裂强度显著提高且远高于体钎料的抗拉强度,断裂应变也逐渐增加;焊点的断裂位置及模式由较大直径时的界面低延性断裂转变为小直径时焊点中间部位的大变形颈缩断裂。模拟结果表明,由于焊点内力学拘束水平的不同,小直径焊点的界面应力较低且最大应力分布在焊点中间部分,易导致断裂发生在焊点中部,接头强度应较高;而大直径焊点中最大应力处于焊点界面,易导致界面金属间化合物层在较低外加应力下起裂,焊点断裂强度应较低。     

电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为

对比研究三明治结构线形Cu/Sn-3.0Ag-0.5Cu/Cu微焊点在拉伸、电-拉伸和电迁移后电-拉伸三种加载模式下的力学行为和断裂特性,并基于电流引发的焦耳热效应和电迁移效应,从电流对原子和空位扩散、空位浓度及位错滑移与攀移的影响等方面,探讨电-力耦合载荷对焊点拉伸断裂行为的影响。结果表明,焊点在电-拉伸时应力-应变曲线呈现快速变形、线性变形和加速断裂三阶段,其中快速变形阶段是以焦耳热引起的热弹性变形为主,而拉伸和电迁移后电-拉伸时应力-应变曲线只存在线性变形和加速断裂阶段;电迁移后电-拉伸时焊点断裂强度和断裂应变最小而等效模量最大,拉伸加载时焊点断裂强度和断裂应变最大而等效模量最小;电-拉伸时β-Sn相趋于沿电、力加载方向排列;三种加载模式下焊点断裂均发生在钎料体内,呈韧性断裂。     

BGA结构无铅微焊点的低周疲劳行为研究

基于塑性应变能密度概念提出微焊点低周疲劳裂纹萌生、扩展和寿命预测模型,阐明其与连续介质损伤力学的联系,评估应力三轴度对预测模型的影响,并通过试验和数值计算相结合的方法确定出微米尺度球栅阵列(Ball grid array,BGA)结构单颗Sn3.0Ag0.5Cu无铅焊点(高度为500～100 μm,焊盘直径为480 μm)疲劳裂纹萌生和扩展模型中的相关常数。研究结果表明,疲劳裂纹萌生和扩展循环数与每个循环所产生的塑性应变能密度均呈幂函数关系;应力三轴度会影响疲劳裂纹扩展速率,并最终影响焊点的疲劳寿命;应力三轴度与加载方式有关,拉伸载荷下焊点的应力应变行为受异种材料界面和封装结构力学约束作用的影响,应力三轴度随焊点高度降低而明显升高;而剪切载荷作用下焊点中的力学约束十分有限,焊点高度变化对应力三轴度的影响非常小;测得的高度为100 μm焊点的疲劳裂纹扩展相关常数可以很好地用于预测其他不同高度焊点的疲劳寿命,表明所提出的预测模型可以有效地减小由几何结构和体积变化造成的塑性应变能集中现象对焊点疲劳寿命的影响。     

钎焊工艺对Au-Sn/Ni焊点组织及力学性能的影响*

通过回流焊技术制备Au-Sn/Ni焊点,通过扫描电子显微镜和能谱检测分析钎焊接头的微观组织及其相组成,利用疲劳试验机对焊点的剪切强度进行检测,研究不同钎焊工艺对Au-Sn/Ni焊点组织和力学性能的影响。结果表明,在310 ℃钎焊1 min的Au-Sn/Ni焊点经过水冷或空冷后,焊料内部均形成镶嵌有离散分布的(Ni,Au)₃Sn₂相的(Au₅Sn+AuSn)共晶组织,焊料/Ni界面处形成(Ni,Au)₃Sn₂金属间化合物(intermetallic compound,IMC)层;钎焊后炉冷的焊点,由于冷却速度过慢,导致焊料中Ni质量分数增大,(Ni,Au)₃Sn₂相异常长大消耗共晶组织中的(Au,Ni)Sn相,焊料共晶组织消失。随着钎焊时间的延长,基板中的Ni原子不断往焊料扩散,界面处的IMC层厚度均有不同程度的增加。随钎焊时间延长焊点的剪切强度逐渐下降,而剪切断裂模式为脆性断裂,发生在焊料与金属间化合物层的界面处。Au-Sn/Ni焊点在310 ℃下钎焊1 min,并采用水冷方式时得到的力学性能最佳。     

含稀土元素的HPb60—2合金高温塑性的研究

通过高温拉伸试验,研究稀土元素对HPb60-2合金高温性能的影响。结果表明:在HPb60-2合金中添加微量稀土元素,可以显著提高该合金的高温延伸率,最大流动应力略有增加。此外,文中还就稀土元素的作用机理进行了探讨。     

Anand Parameters Determination for SnAgCu Solder Bearing Micro-amounts Rare Earth Ce

SnAgCu solder system with the addition of rare earth Ce,which has better thermo-mechanical properties compared to those of SnPb solder,is regarded as one of the promising candidates for electronic assembly.Moreover,the SnAgCuCe solder alloys can provide good quality joints with Cu substrates.However,there is few report of the constitutive model for SnAgCu solder beating micro-amounts rare earth Ce.In this paper,the unified viscoplastic constitutive model,Anand equations,is used to represent the inelastic deformation behavior for SnAgCu and SnAgCuCe solders.In order to obtain the acquired data for the fitting of the material parameters of this unified model,a series of experiments of constant strain rate test were conducted under isothermal conditions at different temperatures.The Anand parameters of the constitutive equations for SnAgCu and SnAgCuCe solder were determined from separated constitutive relations and experimental results.Nonlinear least-square fitting was selected to determine the model constants.And the simulated results were then compared with experimental measurements of the stress-inelastic strain curves:excellent agreement was found.The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from 25℃ to 150℃,and the strain rate ranges from 0.01 s-1 to 0.001 s-1.It is concluded that the Anand model can be applied for representing the inelastic deformation behavior of solders at high homologous temperature and can be recommended for finite element simulation of the stress-strain response of lead free soldered joints.Based on the Anand model,the investigations of thermo-mechanical of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by finite element code were done under thermal cyclic loading,it is found that the reliability of SnAgCu soldered joints can be improved remarkably with addition of rare earth Ce.The results may provide a theory guide for developing constitutive model for lead-free solders.     

Mechanical Properties of QFP Joints Soldered with SnAgCu and SnPb Solders

With the development of lead-free solder alloys, the investiagtion focusing on the relibility of lead-free solders are essential. Since the reliability database of lead-free solder joints needs to be further supplied, the creep behavior of SnAgCu soldered joints on Quad Flat Package (QFP) devices under thermo cycling load are studied in this paper, compared to conventional SnPb solder, by finite element simulation based on Garofalo-Arrhenius creep model. Meanwhile, the mechanical properties of SnAgCu and SnPb soldered joints in the pitches of QFP devices are also carried out by means of tensile test. The results indicate that the values of strain and stress of SnAgCu soldered joints were all smaller than those of SnPb under thermal cycling, and the tensile strength of the joints soldered with SnAgCu solder was higher than that of SnPb, which means the reliability of the joints soldered with SnAgCu solder is better than SnPb soldered joints. As the fracture surface morphology of the soldered joints compared, SnAgCu soldered joint presented ductile fracture, while the fracture mechanism of SnPb solder joints displayed both brittle and ductile fracture. Above all, the experimental results is in accord with that of simulation, which will provide guidance for reliability study and application of lead-free solders.     

倒装芯片封装结构中SnAgCu焊点热疲劳寿命预测方法研究

由于焊点区非协调变形导致的热疲劳失效是倒装芯片封装（包括无铅封装）结构的主要失效形式.到目前为止,仍无公认的焊点寿命和可靠性的评价方法.文中分别采用双指数和双曲正弦本构模型描述SnAgCu焊点的变形行为,通过有限元方法计算焊点累积蠕变应变和累积蠕变应变能密度,进而据此预测倒装芯片封装焊点的热疲劳寿命.通过实验验证,评价上述预测方法的可行性.结果表明,倒装芯片的寿命可由芯片角焊点的寿命表征;根据累积蠕变应变能密度预测的焊点热疲劳寿命比根据累积蠕变应变预测的焊点热疲劳寿命更接近实测数据;根据累积蠕变应变预测的热疲劳寿命比根据累积蠕变应变能密度预测的热疲劳寿命长;采用双指数本构模型时,预测的焊点热疲劳寿命也较长.     

MECHANICAL PROPERTIES OF FINE PITCH DEVICES SOLDERED JOINTS BASED ON CREEP MODEL

Nonlinear analyses of quad flat package （QFP） on printed circuit board （PCB） assemblies subjected to thermal cycling conditions are presented. Two different solders are considered, namely, Sn37Pb and Sn3.5Ag. The stress and strain response of fine pitch devices soldered joints was investigated by using finite element method based on Garofalo-Arrheninus model. The simulated results indicate creep distribution of soldered joints is not uniform, the heel and toe of soldered joints, the area between soldered joints and leads are the creep concentrated sites. The similar phenomena of stress curves simulated based on Garofalo-Arrheninus model and Anand equations is confirmed, and the creep strain value of Sn3.5Ag soldered joints is lower than that of Sn37Pb soldered joints. Thermal cycling results show that Sn3.5Ag strongly outperforms Sn37Pb for QFP devices under the studied test condition. This is well matched with the experimental outcome analyzed. In addition, the soldered devices were tested by micro-joints tester, the tensile strength of Sn3.5Ag soldered joints is found to be higher than that of Sn37Pb soldered joints. By analyzing the fracture microstructure of soldered joints, it is found that fracture mechanism of Sn3.5Ag soldered joints is toughness fracture, while fracture mechanism of Sn37Pb soldered joints includes brittle fracture and toughness fracture. The results of this study provide an important basis of understanding the mechanical properties of fine pitch devices with traditional Sn37Pb and Sn3.5Ag lead-free soldered joints.     

电子封装SnPb钎料和底充胶的材料模型及其应用

采用统一型粘塑性Anand模型描述SnPb钎料的非弹性力学行为,基于试验数据和弹塑性蠕变本构模型,确定了92.5Pb5Sn2.5Ag和60Sn40Pb两种钎料Anand模型的材料参数。采用线性粘弹性Maxwell模型,描述了一种倒装焊底充胶U8347-3材料的模量松弛和体积松弛,得到了相应的松弛参数,研究对所给出的材料模型和参数进行了验证。另外,利用有限元法模拟了倒装焊在热循环条件下的应力应变行为,分析了SnPb焊点的塑性应变和热循环寿命。结果表明,采用上述材料模型和参数,可以合理描述SnPb钎料和底充胶的力学本构,并可应用于电子封装的可靠性模拟和分析。     

Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package

The wafer level chip scale assembly (WLCSP) has increasingly become popular due to its compact, wafer scale assembly. In a WLCSP assembly, the under bump metallurgy (UBM) connecting the solder joints and the chip is crucial for the assembly reliability. This study focuses on a WLCSP with 96.5Sn3.5Ag/95.5Sn3.8Ag0.7Cu solder joints and Ti/Cu/Ni UBM on a 2–layer microvia build-up electric board. Furthermore, the Garofalo-Arrhenius creep model in finite element analysis ANSYS 6.0 is used for simulations on the WLCSP assembly under thermal cycling to investigate the deformations of the assembly with different thickness of nickel layer, the maximum equivalent strain and maximum equivalent stress of microvias/joints. Finally, the Coffin-Manson equation is applied to predict the fatigue lives of four combinations of solder joints with different eutectic alloy and thickness of nickel layer.     

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Along with the development of the astronautic industry, more and more SMT solder joints have been used in missile, rocket and other important equipments where the environment of astronautic equipments is more serious and complex than that in normal conditions. In this present paper, reliability of a kind of astronautic PBGA256 assembly sample is considered under the successive-high acceleration shock condition. During the test, the thickness of InterMetal Compounds (IMCs) is considered and calculated by an equation to compare with each other. It is found that the growth rate of the phase of Cu₆Sn₅/Cu₃Sn and Ag₃Sn is larger that other phases. So in the finial micrographs the phase of Cu₆Sn₅/Cu₃Sn and Ag₃Sn is easy to observed. After 3 hours’ successive-high acceleration (7g) shock, although the sample PBGA solder joints are still in good condition and have no obvious crack by SEM, in the micrograph of the solder joint there are some special phenomena that is not the same as that in normal condition or thermal fatigue load.     

Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

One of major reasons for the failure of solder joints is thermal fatigue. Also, the failure of solder joints under thermal fatigue loading is influenced by varying boundary conditions such as the material of the solder joint, the materials of substrates(related to the difference in CTE), the height of solder, the distance of the solder joint from the neutral point (DNP), the temperature variation and the dwell time. In this paper, first, the experimental results obtained from thermal fatigue test are compared to the outcomes from theoretical thermal fatigue life equations. Second, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using probabilistic methods such as the first order reliability method (FORM) and Monte Carlo simulation (MCS).