球形钨粉的制备及应用

球形钨粉以其良好的流动性、高的松装密度和振实密度广泛应用于喷涂、增材制造等材料制备领域。本文以不规则形状钨粉颗粒为原料,采用射频等离子球化技术制备球形钨粉,并对球形钨粉进行铺粉及成形实验效果评价。在射频等离子球化过程中,研究球化工艺参数（送粉速率、送粉位置）和原料粉末形态对球化结果的影响。在铺粉实验方面,研究粉末特征和铺粉层厚对铺粉效果的影响。采用扫描电子显微镜、激光粒度分析仪和BT-100粉体综合特性测试仪对球化处理前后粉末的形貌、粒度、流动性、松装密度和振实密度进行测试和分析。结果表明：经过球化处理后,钨粉颗粒呈规则球形,表面光滑,球化率可达100%,流动性、松装密度和振实密度得到明显提高。球化率高的粉末流动性好,铺粉效果好;随着层厚的增加,铺粉效果逐渐得到改善;采用合适粒径的球形钨粉打印的钨薄壁件表面相对光洁,尺寸精度高。     

射频等离子体制备球形钨粉的研究

通过射频等离子体球化处理工艺,以不规则形状钨粉为原料,制备了球形钨粉,并研究了加料速率和粉末粒度对粉末球化率的影响。采用扫描电子显微镜、X射线衍射和激光粒度分析仪对球化处理前后粉末的形貌、物相和粒度分布进行了测试和分析。结果表明：粒度在5.5~26.5 μm范围的不规则形状钨粉,经等离子球化处理后得到表面光滑、分散性好、球化率可达100%的球形钨粉。球化处理后,粉末的粒度略微增大。随加料速率的增加,钨粉的球化率降低。随着钨粉球化率的提高,粉末的松装密度和流动性得到显著改善。松装密度由6.80 g/cm3 提高到11.5 g/cm3,粉末流动性由14.12 s/50 g提高为6.95 s/50 g     

粉末粒形对钡钨阴极多孔钨基体孔隙的影响

采用粉末注射成形工艺制备钡钨阴极多孔钨基体，定量表征钨粉的粉末粒度和粒形，重点研究粉末粒形对多孔钨基体孔隙特性的影响。通过对比粉末的球形度、形状因子、圆润度、粗糙度、赘生物指数和凹度等特征参数，发现球形钨粉比商品还原钨粉和窄粒度钨粉具有更好的球形度、表面光滑度以及分散度。当粉末粒度相差不多时，通过改善钨粉的颗粒形状，粉末分散度得到提高，SW粉末经注射成形得到的多孔钨基体(P_SW)的孔隙结构均匀性最佳，其平均孔隙度、平均开孔孔隙度、平均孔径和孔隙总容积分别为24.0%、23.9%、1.17μm、0.0206 mL/g。     

简化预处理辅助化学镀制备Cu包覆TiC复合粉末

研究了一种简化预处理辅助化学镀工艺制备Cu包覆TiC复合粉末.利用场发射扫描电子显微镜和能谱仪分析了原始TiC粉末,预处理之后的TiC粉末,Cu包覆TiC复合粉末的表面形貌和成分,同时也阐述了Cu镀层的生长机理.结果表明,经过简化预处理之后的TiC出现了很多表面缺陷,Cu能够均匀的包覆在TiC颗粒表面.其生长机理如下:经过预处理之后的TiC出现很多表面缺陷,成为化学镀过程中的活性点;化学镀过程中,Cu在TiC表面的各个缺陷处形核长大;Cu与Cu之间相互接触相互作用形成密集的网状结构最终形成致密的Cu镀层.     

简化预处理辅助化学镀制备Cu包覆TiC复合粉末（英文）

研究了一种简化预处理辅助化学镀工艺制备Cu包覆Ti C复合粉末。利用场发射扫描电子显微镜和能谱仪分析了原始Ti C粉末,预处理之后的Ti C粉末,Cu包覆Ti C复合粉末的表面形貌和成分,同时也阐述了Cu镀层的生长机理。结果表明,经过简化预处理之后的Ti C出现了很多表面缺陷,Cu能够均匀的包覆在Ti C颗粒表面。其生长机理如下:经过预处理之后的Ti C出现很多表面缺陷,成为化学镀过程中的活性点;化学镀过程中,Cu在Ti C表面的各个缺陷处形核长大;Cu与Cu之间相互接触相互作用形成密集的网状结构最终形成致密的Cu镀层。     

等离子体球化处理和放电等离子烧结制备钡钨阴极多孔钨基体

采用等离子体球化处理和放电等离子烧结(SPS)相结合的方法制备了钡钨阴极多孔钨基体。研究了等离子体球化处理工艺参数对钨粉的球化率和性能的影响规律,以及SPS制备的多孔钨基体的微观组织和相应钡钨阴极的发射性能。结果表明:当喂粉速率和载气流量分别为2.4 g/min和4.0 L/min时,可得到球化率大于98%,且表面光滑、球形度高的球形钨粉;经球化处理后,钨粉的松装密度和流动性显著提高。与原料钨粉相比,采用球形钨粉制备得到的多孔钨基体的孔隙结构和分布均得到显著改善,且开孔率由18.3%提高至19.7%;相应的钡钨阴极在1050℃下的饱和脉冲发射电流密度由8.7 A/cm~2提高至11.2 A/cm~2。     

粉末粒形对钨粉末注射成形喂料流变性能的影响

本文采用图像法定量表征了钨粉的粒形与粒度,研究了粉末粒形对钨粉末注射成形喂料流变性能的影响。结果表明：窄粒径钨粉（NPW）与球形钨粉（SW）粒度基本一致;SW比NPW具有更好的球形度、表面光滑度以及分散度。采用相同的有机粘结剂,SW的粉末装载量为64%,高于NPW的59%。与NPW相比,SW喂料表现出更优异的流动性能,具有更低的流动行为指数和粘流激活能,更适合注射成形。粉末粒形影响钨MIM喂料的流变性能主要源于粘结剂与粉末颗粒以及颗粒与颗粒之间的相互作用特性。     

感应等离子工艺参数对制备纳米球形钨粉的影响

利用感应等离子设备,实现了钨粉的球化、细化和致密化,制备出球形纳米钨粉,同时研究了感应等离子工艺参数对处理后钨粉形貌和粒度的影响.结果表明,等离子体处理后产品形状由不规则变为球形,颗粒平均粒径大大降低,振实密度明显提高.得出制备纳米球形钨粉的最佳工艺参数为等离子功率65 kW,等离子体中部送粉,等离子气氛中边气成分为Ar (2.8 m3/h)+ H2(0.8 m3/h).     

塑料表面化学镀铜的生长过程

采用化学活化预处理对PC塑料基体进行化学镀前预处理,然后通过化学镀在预处理后的PC塑料基体上成功获得了铜镀层。通过场发射扫描电子显微镜(FE-SEM)研究分析了PC塑料活化预处理前后表面形貌、化学镀过程中不同时间所获得的铜镀层、化学镀后的铜镀层的表面形貌,探讨了化学镀PC塑料表面镀铜层生长机理。结果表明:采用化学活化预处理对PC塑料基体进行活化处理,预处理后的塑料基体直接进行化学镀铜处理,铜镀层均匀致密良好;Cu颗粒的形核、长大和聚集过程为:化学镀溶液中的反应物在PC表面缺陷(台阶或凹坑)处吸附,发生氧化-还原反应沉积出Cu颗粒;先沉积的Cu粒子以线型方式长大,其长大过程为纳米级Cu粒子聚集过程,并不断重复,形成物理团聚的Cu胞;最后Cu胞与Cu胞之间融合,从而形成紧密结合、致密的铜镀层。     

热化学共还原法制备W包覆Cu纳米复合粉体(英文)

采用两种粒径的氧化铜粉末和粒径为1.5μm的三氧化钨粉末来制备高纯度的CuWO4粉末,分别通过控制CuWO4粉末在360和750℃两个阶段的氢气还原作用,制备出钨包覆铜纳米复合粉体。复合粉体的微观形貌,组织结构与颗粒尺寸采用扫描电子显微镜(SEM),X线衍射分析仪(XRD)和透射电子显微镜(TEM)进行测试,激光粒度测试仪(LPSA)用来测试CuWO4粉末的粒度。由小粒度CuWO4粉末制备出的钨包覆铜纳米复合粉体的钨包覆层厚度小,氢气还原制备的钨包覆铜复合粉体的平均粒径约50nm。     

石墨表面无敏化及活化的化学镀铜法

由于石墨表面具有特殊性,具备自动催化的功能,因此无需敏化、活化等工艺,可直接在石墨表面进行化学镀铜,获得的铜镀层光滑致密,镀液的稳定性好,同时对石墨表面化学镀铜的机理进行了探讨,分析了镀液能稳定进行镀覆反应的原因,并利用SEM对反应初期以及后期的复合粉末进行了观察,证明反应时石墨表面能直接生成大量均匀分布的铜微晶,生长至彼此侧面相连时就得到完整镀层,并且石墨颗粒越小,化学镀铜的活性越高,因而非常适合用于制备高性能的金属石墨复合材料.     

化学镀法制备铜包覆SiC颗粒的研究

采用化学镀法制备了镀铜SiC粉体,研究了预处理、镀液成分、pH值和装载量对SiC化学镀铜的影响,并比较了主盐含量和装载量对复合粉体中铜含量变化的影响。利用XRD,SEM和EDS对粉体的物相、形貌、成分进行了分析,得到了最佳施镀工艺。结果表明:用于预处理的活化敏化液要放置一段时间后使用,才能成功地实施化学镀铜;随着pH值和主盐含量的升高,镀速呈上升趋势,但粉体的包覆完整性和均一性下降;通过改变装载量来控制复合粉体中的铜含量可行。     

化学镀法制备Cu/Al2O3复合粉体及其烧结行为

为了解决颗粒增强铜基复合材料中颗粒与铜基体相容性的问题,采用化学镀法使得颗粒表面金属化,通过XRD、SEM、EDS等技术研究了Al2O3纳米粉化学镀铜的工艺,并对Cu/Al2O3复合粉体的烧结行为做了初步探讨.结果表明:Al2O3粉前处理工艺、镀液的各种成分都对粉体表面铜的含量有影响,通过改变装载量可有效控制粉体表面Cu含量.实验中确定了最佳的镀覆工艺,并得到了颗粒较为弥散的Cu/Al2O3复合粉体烧结体.     

Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment

In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.     

石墨颗粒表面化学镀铜研究

为了充分利用Cu的导电性能，碳石墨的润滑性能，改善Cu/C的润湿性，用化学镀铜的方法成功地对石墨颗粒表面进行镀覆，详细地研究了镀铜液组分及工艺与石墨颗粒表面镀铜层厚度、沉积速率的关系，并得出较好的组分工艺方案，采用优化工艺可以得到平均厚度约7．1μm的镀铜层。同时应用X射线、金相显微镜、扫描电镜及电子探针对镀铜层的厚度、表面形貌、镀铜层与基体的界面进行了全面观察。分析表明，Cu/C界面存在过渡层，界面成锯齿状，机械冶金结合的特征十分明显，改善了铜碳界面的相溶性。     

含镀铜石墨颗粒铜基复合材料研究

采用化学镀铜工艺在石墨颗粒表面镀上一层金属铜,通过粉末冶金方法制备了铜/石墨复合材料,研究了石墨颗粒表面铜镀层在不同处理温度下的球化问题和改善复合材料界面结合的作用效果.结果表明,石墨颗粒表面铜镀层有利于改善铜基石墨复合材料的界面结合,使复合材料力学性能提高;处理温度较高时,表面铜镀层有熔融球化的趋势,当复合材料烧结温度超过石墨镀铜层的完全球化温度时,镀铜石墨粉改善界面结合的效果逐渐降低,直至消失.     

Improvement of physical properties of Cu-infiltrated W compacts via electroless nickel plating of primary tungsten powder

In the present research, tungsten particles were coated using nickel/nickel-phosphorus electroless plating technique. The coated tungsten powders were pressed under constant pressure to achieve compact material of cylindrical shape with same porosity. Then, attained compacts were infiltrated/penetrated by liquid copper under the hydrogen atmosphere in order to obtain W-15 wt.% Cu composites. The coated/uncoated powders as well as its infiltrated compacts were characterized by optical microscopy (OM) as well as scanning electron microscopy (SEM), EDS and XRD methods. The microstructure, relative density and specific resistivity of composites were compared. The microstructural observations revealed that the infiltration behavior can be improved in the compacts prepared by both nickel and nickel-phosphorus coated tungsten powders, in comparison with uncoated ones. In addition, it was found that relative density may be raised from < 85% to > 95% by nickel electroless plating, that leads to decrease specific resistivity from 6 to 4 µΩ cm. Enhancement of electrical conductivity of infiltrated W-15 wt.% Cu compacts prepared by electroless nickel coated tungsten powders was related to its higher density.     

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

Molybdenum powders with a diameter of approximately 3 μm were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃.The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature.The optimized values of pH and temperature were found to be 12.5 and 60℃,respectively,which attributes to the bright maroon color of the coating with an increase in weight of 46%.The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-ray diffraction (XRD).An attempt was made to understand the growth mechanism of the coating.The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.     

Preparation of nickel-coated tungsten carbide powders by room temperature ultrasonic-assisted electroless plating

In this paper nickel (Ni)-coated tungsten carbide (WC) composite powders have been synthesized by ultrasonic-assisted electroless plating with a simplified pretreatment at room temperature as the conventional sensitization and activation steps have not been employed. The growth mechanism of Ni layers and surface morphologies and composition of initial WC powders, pretreated WC powders and Ni-coated WC powders were analyzed by field emission scanning electron microscopy, and energy dispersion spectrometry. The results shows that uniform Ni-coated WC composite powders were successfully synthesized without conventional sensitization and activation steps by ultrasonic-assisted electroless plating at room temperature. The growth mechanism of Ni layers appears as follows: the surfaces of pretreated WC powders appear step-like defects which act as activated sites. Nucleation and the growth of nickel grains take place on the activated sites of pretreated WC powder, and the process repeats continuously on the lath particles with reticulate structure on the as-coated surfaces of previously deposited Ni-cells, finally Ni cells grow up and merge into a layer.     

表面镀钨层对金刚石/铜复合材料热导率的影响

采用真空微蒸发-扩散镀技术,在金刚石表面镀覆不同厚度的钨层,并结合真空熔渗法制备金刚石铜复合材料。通过X射线衍射分析镀覆层相结构,采用扫描电镜观察镀覆层表面微观形貌和复合材料中金刚石与铜界面结合形貌,分析金刚石表面镀钨层组织、结构及厚度对金刚石/铜复合材料热导率的影响。结果表明:金刚石表面镀覆钨能改善与基体的润湿性;随着镀覆层均匀性和厚度增加,复合材料热导率先增加后减小;完整均匀的镀覆层可以获得较高界面热导。