The study on interfacial bonding strength of Ag-Ni, Ag-Cu in cold pressure welding

The area of combination actually is a kind of interfacial phenomena that exist on the surface or thin film. The properties of interface have important effect on the whole welded joint, even decide directly the interfacial bonding strength.The bonding strength of metals in cold pressure welding such as Ag-Ni (they are hardly mutual soluble ) and Ag-Cu( they are limited soluble ) are discussed in this paper. The results of the tensile test suggest that two kinds of welded joints have enough strength to satisfy with the demand for being used. Moreover, thermodynamics, crystal logy, physics and metal electronic microscopic analysis etc are adopted to further calculate the bonding strength. The results of test and theoretical analyses prove that Ag-Ni, Ag-Cu, especially, for Ag-Ni can .form strong welded joint which is higher than that of the relative soft base metals in cold pressure welding.     

Laser brazing of alloy 600 with precious filler metals

Abstract

The diode laser brazing of Ni base heat resistant alloy with precious filler metals has been conducted using the tandem beam for preheating and brazing. A couple of 1 mm thick plates of alloy 600 (Inconel 600) were butt brazed using Au–18Ni, Ag–10Pd and Ag–21Cu–25Pd filler metals of 0·5 mm diameter with a brazing flux. Sound butt joints which were free from brazing defects such as porosity and lack of penetration could be obtained at brazing clearances of 0·1–1·5 mm. The tensile strength of the braze joint produced using Ag–Pd filler metal increased with decreasing brazing clearance and reached ～70% of the base metal strength at a brazing clearance of 0·1 mm while those obtained by using Au–Ni and Ag–Cu–Pd filler metals were comparable with the base metal strength at any clearances between 0·1 and 1·5 mm. The laser brazing technique could be successfully applied to the brazing of Ni base superalloy to attain a joint with high performance and reliability.     

填充金属对钛合金与不锈钢电子束焊接的影响(英文)

采用Ni、V、Cu等填充材料进行钛合金与不锈钢的电子束焊接实验。采用光学显微镜、扫描电镜及X射线衍射对接头的微观组织进行分析。通过抗拉强度和显微硬度评价接头的力学性能,分析讨论填充材料对钛/钢电子束焊接接头微观组织和力学性能的影响。结果表明:填充材料有助于抑制Ti-Fe金属间化合物的产生。所有接头均由固溶体和界面化合物组成。对于不同的填充材料,固溶体和界面化合物种类取决于填充材料与母材之间的冶金反应。对于Ni、V及Cu填充材料,界面化合物分别为Fe2Ti+Ni3Ti+NiTi2,TiFe和Cu2Ti+CuTi+CuTi2。接头抗拉强度主要取决于金属间化合物的脆性。采用Cu填充金属的接头抗拉强度最高,约为234 MPa。     

TiAl基合金与Ti合金的真空钎焊

采用Ag-Cu钎料与Ti-Zr-Ni-Cu钎料,对TiAl与Ti合金进行了真空钎焊试验,主要研究了采用两种钎料时的界面反应以及钎焊温度对界面组织及性能的影响.研究发现,采用Ag-Cu钎料时界面结构为:Ti/Ti(Cu,Al)2/TiCux Ag(s,s)/Ag(s,s)/Ti(Cu,Al)2/TiAl,当钎焊温度T=1 223 K,保温时间t=10 min时接头的剪切强度达到223.3 MPa;采用Ti-Zr-Ni-Cu钎料时在界面出现了Ti2Ni,Ti(Cu,Al)2等多种金属间化合物,当钎焊温度T=1 123 K,保温时间t=10 min时接头的剪切强度达到139.97 MPa.     

铜/镀镍钢微电阻点焊接头形成机理

采用微电阻点焊对纯铜和镀镍钢片异种金属进行了点焊连接,通过拉剪试验、光学显微镜、扫描电镜和能谱分析,研究了镀层金属镍在铜/镀镍钢片微电阻点焊冶金过程中对接头形成和接头强度的影响. 结果表明,铜/镀镍钢片微电阻点焊接头的形成机理包括固相连接和熔化连接,其形成过程为: 铜和镀层镍在锻压力和析出热量下,形成固相连接;在铁和镀层镍之间开始熔化;镀层镍被熔化的金属向边缘处挤压,镍在边缘处与铁、铜形成了新的组织;熔核的形成. 在两种不同的接头形成机理下,其拉伸断口都有呈抛物线状或拉长的韧窝出现.     

AgAuPd中熵合金力学、热力学和电学性质的第一性原理研究

在微电子封装领域,键合Ag线具有较好的电学性能优势被广泛应用,但纯银线因存在强度低、高温易失效等缺点不能满足大功率器件的使用,因此本工作拟通过设计等原子比AgAuPd中熵合金作为替代纯Ag线的新型键合材料。本文通过SQS模型构建了等原子比AgAuPd中熵合金晶体模型,利用第一性原理计算了AgAuPd中熵合金在不同压力下的弹性性质(弹性常数、弹性模量、剪切模量)、热力学性质和电子结构。预测出AgAuPd中熵合金随压力的增加具有较好的结构稳定性、良好的塑性、高温稳定性以及优良的导电性,具有成为键合材料的潜力。利用第一性原理计算AgAuPd中熵合金加压下的力学、热力学和电学性质,对开发新型键合Ag基丝具有一定的理论指导意义。     

Microstructures and Mechanical Properties of Electron Beam-Welded Titanium-Steel Joints with Vanadium,Nickel, Copper and Silver Filler Metals

Electron beam welding experiments of titanium alloy to stainless steel with V, Ni, Cu and Ag filler metals were carried out. The interfacial microstructures of the joints were examined by optical microscopy, scanning electron microscopy, and x-ray diffraction analysis. Mechanical properties of the joints were evaluated according to tensile strength and microhardness. The results showed that all the filler metals were helpful to restrain the Ti-Fe intermetallics formed in the Ti/Fe joint. The welds with different filler metals were all characterized by solid solution and interfacial intermetallics. And the type of solid solution and interfacial intermetallics were depended on the metallurgical reactions between the filler metals and base metals. The interfacial intermetallics were Fe₂Ti + Ni₃Ti + NiTi₂, TiFe, Ti₂Ag, and Cu₂Ti + CuTi + CuTi₂ in the joints welded with Ni, V, Ag, and Cu filler metals, respectively. The tensile strengths of the joints were primarily determined by the hardness of the interfacial intermetallics. The highest tensile strength was obtained in the joint welded with silver filler metal, which is about 310 MPa.     

Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze (ZQSn10-10) with Ni and Ni Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that when the interlayer is Ni or Ni Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds (Cu3Ti, CuTi etc.). But the Ni-Ti intermetallic compounds (NiTi, Ni3Ti) are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830℃/10 MPa/30min. And when the interlayer is Ni Cu, the optimum bonding parameters are 850℃/10MPa/20min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni Cu interlayer both are 155.8MPa, which is 65 percent of the strength of ZQSn10-10 base metal.     

镍对Ag20CuZnSnP钎料铺展润湿性和接头抗剪强度的影响

通过在Ag20CuZnSnP钎料合金的基础上添加不同含量的元素Ni,研究并分析了不同含量的Ni元素对钎料铺展性能和钎焊接头抗剪强度的影响。结果表明,当钎料合金中Ni元素的含量超过2．0％时,钎料在1Cr18Ni9Ti不锈钢上的铺展面积可大大提高;当钎料中Ni元素含量为2．0％时,同种和异种母材钎焊接头的抗剪强度均达到最大值。对钎料微观组织分析表明,在钎料合金中加入元素Ni可以明显细化钎料合金中粗大树枝晶状的锡青铜组织,而元素Ni会夺取金属间化合物Cu3P中的P元素,在钎料中主要以金属间化合物Ni3P的形式存在。     

Re与Ru合金化对Ni/Ni3Al相界电子结构影响的第一原理研究

采用第一原理赝势平面波方法研究了Re与Ru合金化前γ-Ni/γ'-Ni3Al相界的电子与能态结构.断裂功计算结果显示:Re置换γ-Ni相区中的Ni或Ru置换γ'-Ni3Al相区中的Al,均可提高Ni/Ni3Al相界的断裂强度;Re与Ru在相界区复合合金化时,当Re与Ru分别占据共格(002)γ/γ'原子层邻近(001)γ原子层上的Ni原子位与(001)γ'原子层上的Al原子位时,γ-Ni/γ'-Ni3Al相界的断裂强度可进一步提高,若其中的Ru置换γ'-Ni3Al相区内层Al,刚复合合金化Ni/Ni3Al相界的断裂强度不仅没有提高,反而比Ru单独合金化时Ni/Ni3Al相界的断裂强度还低.电子态密度与电子密度分布图的分析表明:Re与Ru合金化对γ-Ni/γ'-Ni3Al相界断裂强度的影响可归因于Re和Ru与其最近邻Ni原子间强烈的电子相互作用引起的相界区域层间原子成键相互作用的改变.     

Research on Laser Cladded Nickel Based Nanometer Tungsten Carbide Composite Coating

CO2 laser is adopted on the surface of austenitic stainless steel (1Cr18Ni9) to clad nickel based nanometer WC/Co composite coating. SEM, EDAX, XRD, AFM and Scratch Testers are adopted to conduct analysis and research on the microstructure, composition, phase and bonding strength of the coating. Results indicate that the microstructure of coating is metallurgically bonded with stainless steel base, eliminating porosities and cracks. The coating has a considerable quantity of nanometer particles visible with a granularity ≤ 100nm under a nanoscope atomic microscope. The bonding strength of the laser cladded coating is remarkably improved respectively compared with conventional hot-sprayed coating and spray welding. The nanometer effect of nanometer WC/Co introduced into the coating plays an important role in the laser cladding processes.     

连接工艺参数对镍基高温合金TLP连接接头组织和性能的影响(英文)

以BNi-2为中间层对镍基合金进行过渡液相连接,研究连接工艺参数对接头组织和力学性能的影响。随着连接温度的升高或连接时间的延长,沉淀区的富镍和富铬硼化物数量减少,同时沉淀区晶粒尺寸减小。较高的连接温度或较长的连接时间,有利于降熔元素(B和Si)由沉淀区向母材中的扩散和母材与连接接头间的原子互扩散。当连接温度为1170℃、连接时间为24h时,可以获得与母材化学成分及组织基本相当的连接接头。剪切试验结果表明:室温和高温拉剪强度均随着保温时间的延长而增加,但连接时间对高温拉剪强度的影响要大于对室温拉剪强度。     

INTERFACIAL ATOMIC-REACTION MODEL FOR DIFFUSION BONDING OF METALS

According to probability theory and atomic activation on bonding interface of metals,a mathematical model was developed for the atomic interfacial reaction during diffusionbonding.The effect of parameters of bonding processing and material on the bondingstrength was then gained.It was suggested that the activation centre of atomic interfacialreaction of bonding may be,in situ,the boundary dislocation and its elastic stress field.A substantial agreement about the quantitative prediction of the model was made withthe results of diffusion bonding experiments for 7075Al alloy     

金属扩散焊接的原子反应模型

本文根据概率理论和金属扩散焊接过程中焊接面上原子激活的特点,建立了接合面上原子成键反应的数学模型,从而给出了焊接工艺参数和材料参数对接合强度的影响规律,模型中采用了界面上原子反应激活中心是界面位错及其弹性应力场的假设。文中以7075Al合金扩散焊接实验为基础,对模型进行了定量计算,计算结果与实验结果基本一致。     

Characterization of diffusion-bonded joint between Al and Mg using a Ni interlayer

Aluminum and magnesium were joined through diffusion bonding using Ni interlayer. The microstructure and mechanical performance of the Al/Ni/Mg joints at different temperatures was investigated by means of scanning electron microscope(SEM), electro-probe microanalyzer(EPMA), X-ray diffraction(XRD), Vickers hardness testing, and shear testing. The results show that the addition of Ni interlayer eliminates the formation of Mg–Al intermetallic compounds and improves the bonding strength of the Al/Mg joints. The Al/Ni/Mg joints are formed by the diffusion of Al, Ni and Mg, Ni. The microstructure at the joint interface from Al side to Mg side is Al substrate/Al–Ni reaction layer/Ni interlayer/Mg–Ni reaction layer/Mg substrate multilayer structure. The microhardness of the Mg–Ni reaction layer has the largest value of HV 255.0 owing to the existence of Mg_2Ni phase.With the increase of bonding temperature, the shear strength of the joints increases firstly and then decreases.The Al/Ni/Mg joint bonds at 713 K for 90 min, exhibiting the maximum shear strength of 20.5 MPa, which is greater than that of bonding joint bonded directly or with Ag interlayer. The fracture of the joints takes place at the Mg–Ni interface rather than the Al–Ni interface, and the fracture way of the joints is brittle fracture.     

Behaviors of interfacial elements during the brazing of SiO2 glass ceramic to Ti-6Al-4V with AgCu/Ni interlayer

AgCu/Ni composite interlayer was used to join SiO₂ glass ceramic to Ti-6Al-4V alloy successfully, obtaining the largest joint shear strength 110MPa. Ag, Cu and Ni in the interlayer and Ti in the Ti-6Al-4V alloy affect the joint formation and interfacial products significantly. To understand the joint formation process better, behaviors of elements Ag, Cu, Ni and Ti during the brazing of SiO₂ glass ceramic to Ti-6Al-4V alloy were investigated in the present work. Active element Ti is the most important component in the joining, realizing the metallurgical bonding of SiO₂ glass ceramic to braze alloy. Cu together with Ni reacts to Ti in the base material by Ti-Cu-Ni ternary eutectic reaction, which is beneficial for reducing the massive Ti-Cu and/or Ti-Ni brittle intermetallic compounds on the joint interface. Dispersion of Ag decreases the brittleness of the whole joint effectively.     

Influence of diffusion bonding conditions on bonding strength of damping copper alloy to stainless steel

The experimental investigation of different tran sition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless stee l (1Cr18Ni9Ti). The microstructure of the joint was analyzed with microscopic examination, SEM, EPMA and X-ray diffraction. Following conclusions have been draw n: (1) The joint strength with the Ni interlayer was higher than that with Cu in terlayer when the welding parameters were same;(2)When Ni interlayer was thinner ,Al could interact with Ni and Fe,and the intermetallic compounds,such as Fe3A letc,were formed in the interface,which decreased the strength of the joints;(3 ) When the bonding temperature was higher,because of the diffusion of Cu in Ni being faster than Ni in Cu,a Kirkendall effect was produced,which also decreased the strength of the joints.     

Bonding phenomena of transient liquid phase bonded joints of a Ni base single crystal superalloy

The bonding phenomena of Ni base single crystal superalloy CMSX-2 during transient liquid phase (TLP) bonding have been investigated using MBF-80 and F-24 insert metals. TLP bonding of the superalloy was carried out at 1373-1548K for 0-19.6ks in vacuum and the (100) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. After homogenization treatment, the microstructure, distributions of hardness and alloying elements in the bonded interlayer become similar to those of the base metal.     

Behavior and mechanism of the bonding interface of 0Cr18Ni9/16MnR by explosive welding

In order to investigate the bonding behavior and mechanism of the interface prepared by explosive welding,the bonding interfaces of OCr18Ni9/16MnR were observed and analyzed by means of optical microscope(OM),scanning electron microscope(SEM)and electron probe microanalysis(EPMA).It is found that the welding interfaces are wavy due to the wavy explosive loading.There are three kinds of bonding interfaces i.e.big wave,small wave and micro wave.There are a few seam defects and all elements contents are less than both of the base and flyer plate in the transition zone of big wavy interface.Moreover,some"holes"result in the lowest bonding strength of big wavy interface nearby the interface in the base plate.All elements contents of the small wavy interface are between two metals,and there are few seam and hole defects,so it is the higher for the bonding strength of small wavy interface.There is no transition zone and defects in the micro wavy interface,so the interface is the best.To gain the high quality small and micro wavy bonding interface the explosive charge should be controlled.     

Bonding of Al2O3 ceramic and Nb using transient liquid phase brazing

The brazing of Al2O3 to Nb was achieved by the method of transient liquid phase (TLP) bonding. Ti foil and Ni-5V alloy foil were used as interlayers for the bonding. The base materials were brazed at 1423-1573 K for 1-120 min. The results show that the shear strength of the joint first increases and then decreases with increasing holding time and brazing temperature. The joint interface microstructure and elements distribution were investigated. It can be concluded that a composite structure, in which the base metals are solid solution Nb(V) and Nb(Ti) reinforced by Ni3Ti, is formed when the brazing temperature is 1473 K and holding time 15 min, and a satisfactory joint strength can be achieved. The interaction of Ti foil and Ni-5V foil leads to the formation of liquid eutectic phase with low melting point, at the same time the combination of Ti come from the interlayer with O atoms from Al2O3 results in the bonding of Al2O3 and Nb.