H等离子体处理对Si中He注入空腔引起的效应

室温下分别采用40,160和1550 keV的He离子注入单晶Si样品到相同的剂量5×10¹⁶cm^-2,部分经He注入过的样品然后再分别接受高密度H等离子体处理.利用透射电子显微镜分析比较了随后800°C高温退火引起的空腔形成.结果表明,附加的H等离子体处理对空腔生长所产生的效应明显地依赖于He离子的能量.对于40 keV He离子注入,空腔的形成和热生长似乎不受H等离子体处理的影响,而对于160 keV He离子注入,附加的等离子体处理则促进了空腔的生长并伴随着空腔分布区域的变窄.对于1550keV He离子注入,H等离子体处理对空腔产生的效应介于40和160 keV注入情况之间.结合H等离子体处理在Si中所引起的缺陷的产生及其热演变过程对实验结果进行了讨论.     

B和H离子顺次注入单晶Si 引起的缺陷及其热演变(英文)

室温下将130 keV,5x1014 cm-2 B离子和55 keV,1x1016 cm-2 H离子单独或顺次注入到单晶Si中,采用横截面试样透射电子显微镜(XTEM)和慢正电子湮没技术(SPAT) 研究了离子注入引起的微观缺陷的产生及其热演变。XTEM观测结果显示,B 和H 离子顺次注入到单晶Si 可有效减少(111) 取向的H板层缺陷,并促进了(100) 取向的H板层缺陷的择优生长。SPAT 观测结果显示,在顺次注入的样品中,B 离子平均射程处保留了大量的空位型缺陷。以上结果表明,B离子本身及B 离子注入所产生的空位型缺陷对板层缺陷的生长起到了促进作用。Abstract:Cz n-type Si (100) wafers were singly or sequentially implanted at room temperature with 130 keV B ions at a fluence of 5x1014 cm-2 and 55 keV H ions at a fluence of 1x1016 cm-2. The implantation-induced defects were investigated in detail by using cross-sectional transmission electron microscopy (XTEM) and slow positron annihilation technique (SPAT). XTEM results clearly show that sequential implantation of B and H ions into Si could eliminate the (111) platelets and promote growth of (100) platelets during annealing. SPATmeasurements demonstrate that in B and H sequentially implanted and annealed Si, more vacancy-type defects could remain in sample region around the range of B ions. These results indicat e that the promotion effect shouldbe attributed to the role of both B and B implanted induced vacancy-type defects.     

He注入单晶Si表面形貌的变化研究

沿Si的（100）面注入He离子, 能量为30 keV、 剂量为5×1016 ions/cm2。 注入后样品切成几块, 在真空炉中分别做退火处理, 退火温度从600 ℃到1 000 ℃, 退火时间均为30 min。 利用原子力显微镜研究了各个样品表面形貌的演化。 发现样品表面形貌与退火温度相关联。 假设在气泡中He原子与空位的比值很高, 导致样品内部存在高压的He泡, 从而使样品表面形貌发生变化。 探讨了在Si中He泡随退火温度的演化和He原子在材料中的释放机制及其对表面的影响。     

等离子体浸没离子注入过程中离子质谱测量

用一个取样离子源－Ｅ×Ｂ质谱系统测定了等离子体浸没离子注入中氮等离子体的质谱，测量出的氮等离子体的离子比率作为计算机模拟ＴＡＭＩＸ程序的输入参数，以预测原子的浓度－深度分布曲线，氮注入的Ｔｉ６Ａｌ４Ｖ样品用扫描俄歇微探针（ＳＡＭ）分析，获得了原子浓度－深度分布的试验数据，理论预测和用俄歇分析的结果比较，显示出很好的一致性．     

离子辐照对单晶Si中预注入B原子扩散的影响

室温下使用MeV能量级Si,F和O离子对5keV B离子预注入后的n-型单晶Si(100)进行了辐照,应用二次离子质谱仪测试分析了掺杂物B原子的分布剖面及其变化.结果表明,高剂量Si,F和O离子的附加辐照可以抑制热激活退火中B原子发生的瞬间增强扩散.在相同的辐照条件下,Si近表面区域中SiO₂层的存在更有助于限制B原子的瞬间增强扩散.结合卢瑟福沟道背散射分析和DICADA程序计算对实验结果进行了讨论.     

离子辐照单晶Si损伤效应的研究

回顾了低能离子注入单晶Si经由核弹性碰撞引起的损伤特征及其常规的研究方法,介绍了快重离子辐照单晶Si经由电子能损引起的损伤特点及研究现状,并对该领域的研究作了展望. The radiation damage in silicon induced by low energy ion implantation was briefly reviewed together with a short introduction to the common techniques in the area. The damage characteristics of swift heavy ion irradiation in silicon and its investigations were introduced with emphasis on the effects induced by processes of electronic energy losses. It is shown that swift heavy ion can induce defects far beyond the projected range and up to 28 MeV/μm the electronic energy ...     

铒离子注入绝缘体上Si的射程分布研究

利用离子注入掺杂技术设计、制作半导体集成器件时,了解离子注入半导体材料的射程分布和横向离散规律等是很重要的.用200—500 keV能量的铒(Er)离子注入SOI(silicon-on-insulator,绝缘体上的硅)样品中,利用卢瑟福背散射(RBS)技术研究了剂量为2×1015cm-2的Er离子注入SOI的平均投影射程Rp和射程离散△Rp,把测出的实验值和SRIM软件得到的理论计算值进行了比较,发现平均投影射程Rp的实验值跟理论计算值符合较好,射程离散△Rp的实验值和理论计算值差别大一些.     

空心圆管端点附近等离子体源离子注入过程中鞘层的时空演化

等离子体源离子注入过程中，鞘层的演化规律直接影响到离子注入到材料中的深度进而影响材料表面的性质和结构，对材料的不同部位这种影响是不同的.利用无碰撞两维流体动力学模型，研究了有限上升时间的电压脉冲作用下，共轴放置附加零电极的半无限空心圆管端点附近等离子体源离子注入过程中，鞘层的时空演化规律.通过计算得到了鞘层内随时间变化的电势分布和离子密度分布，计算了端点附近材料表面处的离子流密度分布和注入剂量分布随时间的变化规律.计算机模拟结果显示了空心圆管内部、外部及端点表面处的离子流密度分布和注入剂量分布存在很大差异.     

等离子体源离子注入过程中半圆形碗状样品的两维温度分布

等离子体源离子注入过程(PSII)中样品温度是一个非常重要的参量。由于注入到样品上的能量很大，导致样品温度很高，所以在实验中获知样品的温度分布有着很重要的意义。本文利用热传导方程建立了半圆形碗状样品内部温度升高模型，研究样品内温度演化过程。以注入离子束流作为能量输入项，热辐射为能量损失项，并考虑了热辐射过程中样品的形状因子的影响。考察了离子注入过程中样品上所施加负偏压的脉冲宽度和频率对样品温度分布的影响。研究结果显示，脉冲频率达到一定值后，样品温度不再随频率增加而升高。     

He离子注入单晶Si纳米气泡形成生长及其应用探讨

首先简述了He离子注入单晶Si引起的气泡形成、生长以及其它缺陷对其生长的影响,介绍了Si中He气泡生长的可能微观机制以及它们在现代半导体技术中潜在的应用前景,提出了该领域研究有待解决的关键问题.He ion implantation induced bubbles or cavities in silicon have been paid more and more attentions due to their potential applications in modern semiconductor technology. In this paper, He ion implantation induced formation and growth of bubbles in silicon together with their interactions with other defects were first briefly reviewed. Then the possible growth mechanisms of He bubbles in silicon and their potential applications in modern semiconductor technology were described. Finally, we presented the ke...     

离子辐照产生的空位型缺陷对Si中B原子热扩散的影响

使用二次离子质谱仪分析了附加的空位型缺陷对单晶Si中注入B原子热扩散的影响. Si中B原子是通过30keV B离子室温注入而引入的, 注入剂量为2×10¹⁴cm^－2. Si中附加的空位型缺陷通过两种方式产生: 一是采用40或160keV He离子注入单晶Si到剂量5×10¹⁶cm^－2,并经800°C退火1h; 二是采用0.5MeV F或O离子辐照单晶Si到剂量5×10¹⁵cm^－2.结果显示, 不同方式产生的附加的空位型缺陷均能抑制注入的B原子在随后热激活退火中发生瞬间增强扩散效应, 并且抑制的效果依赖于离子的种类和离子的能量. 结合透射电子显微镜和卢瑟福背散射分析结果对以上抑制效应进行了定性的讨论.     

Roles of local He concentration and Si sample orientation on cavity growth in amorphous silicon

(111)- and (100)-oriented Si samples were implanted with Si⁺ ions at 1 MeV to a dose of 1?×?10¹⁶?cm^?2 and with 5?×?10¹⁶ He⁺ cm^?2 at 10?keV or 50?keV and eventually annealed in the 800–1000°C temperature range. Sample characterisation was carried out by cross-section transmission electron microscopy, positron annihilation spectroscopy and nuclear reaction analysis. In addition to the formation of He bubbles at the projected range of He, bubbles were observed after solid-phase epitaxial growth (SPEG) of the embedded amorphous Si layer. The He threshold concentration required to obtain thermally stable bubbles in amorphised Si is between one and four orders of magnitude lower than in c-Si. Since bubble formation and growth take place in the a-Si phase, the interaction with SPEG during annealing was studied by considering (100) and (111) Si. Both the SPEG velocity and the resulting defects play a role on bubble spatial distribution and size, resulting in bigger bubbles in (111) Si with respect to (100) Si.     

采用硅离子注入改进SIMOX埋氧的抗总剂量辐射性能研究

采用硅离子注入工艺对注氧隔离(SIMOX)的绝缘体上硅(SOI)材料进行改性, 在改性材料和标准SIMOX材料上制作了部分耗尽环型栅NMOS/SOI晶体管, 并对其进行⁶⁰Co γ射线总剂量辐照试验. 通过背栅的I-V特性表征晶体管的总剂量辐照特性. 结果表明, 在埋氧层注硅可以降低NMOS/SOI受辐照引起的背栅阈值电压漂移, 提高埋氧层的抗总剂量能力.     

梯形管内壁等离子体离子注入鞘层扩展MATLAB-PIC数值模拟

基于MATLAB利用Particle-in-cell模型,对梯形管内壁等离子体离子注入过程,进行了二维数值模拟.计算结果表明在中心电极附近出现了"阳极鞘层",该鞘层内部不存在离子,而且在鞘层边缘离子密度最高.在上下管壁上的离子注入剂量呈现"m"形分布.通过对注入过程中等离子体密度分布和不同时间段管壁不同位置离子注入剂量的跟踪,发现"阳极鞘层"扩展行为是导致"m"形分布的原因.由于梯形管形状的不对称性,"阳极鞘层"的边缘向梯形长底方向扩展较快.在注入初始时刻离子注入的能量很低,随着时间延长离子能量逐渐升高,这是由离子初始位置决定的.可见梯形管自身形状决定了鞘层形状和最终的离子注入能量和剂量分布.     

Synthesis of Silver Nanoparticles by the Ion Implantation Method and Investigation of their Optical Properties

We have investigated the process of metal nanoparticle (NP) synthesis in SiO₂ by implanting Ag₊ ions with an energy of 30 keV depending on the dose ((2–8)·10¹⁶ cm⁻²) and the ionic current density (4–15 µA/cm²). Analysis of the composite materials formed was performed with the use of optical spectroscopy and atomic-force microscopy (AFM). The NPs synthesized in the glass demonstrate a characteristic absorption line associated with the surface plasma resonance effect. A correlation of the spectral shift of the lines caused by a change in the NP size with the diameter of the hemispherical asperities on the SiO₂ surface registered by the AFM method has been revealed. It has been found that for the case of a fixed current density in the ion beam the silver NP sizes remain practically unaltered with increasing ion dose up to a certain value (6·10¹⁶ cm⁻²), and only an increase in the concentration of NPs is observed thereby. However, a further increase in the dose causes a decrease in both the NP density and size. On the other hand, at a fixed high dose an increase in the ionic current density leads to a gradual enlargement of the NPs. We have considered the mechanisms explaining the change in the NP sizes with increasing dose and ionic current density and evaluated the possibilities of carrying out controlled synthesis by varying the implantation conditions.__________Translated from Zhurnal Prikladnoi Spektroskopii, Vol. 72, No. 2, pp. 218–223, March–April, 2005.     

热处理对富硅氧化硅薄膜中硅纳米晶形成的影响

采用磁控溅射法制备了富硅氧化硅薄膜, 然后分别经过一步热处理、两步热处理和快速热处理制备了镶嵌有硅纳米晶的氧化硅薄膜. 实验结果表明, 在硅含量为～ 42.63 at.%的富硅氧化硅薄膜中, 三种热处理均能形成10¹²/cm²量级的硅纳米晶. 其中在两步热处理中, 硅纳米晶的密度最高, 达到2.2× 10¹²/cm², 并且尺寸均匀、结晶完整性好; 一步热处理后的样品中, 硅纳米晶密度较低, 并且部分纳米晶结晶不充分; 快速热处理后的样品中, 硅纳米晶密度最低、尺寸分布不均匀, 并且存在孪晶结构. 分析认为, 热处理初始阶段的形核过程对纳米晶的密度及微观结构有着重要的影响, 两步热处理中的低温段促进了纳米晶的成核, 有助于形成高密度高质量硅纳米晶.     

Variations of Plasma Parameters and Sheath Thickness Due to the Extraction of Ion and Electron Flux in a Double Plasma Device

Influence of charged particle extraction on plasma parameters and on ion sheath has been investigated in a double plasma device. When ions are extracted from the plasma, the plasma density as well as the positive ion flux into the sheath increases. As a result a sheath contraction takes place. Again, in case of electron extraction, it is found that the plasma density as well as the positive ion flux into the sheath decreases. As a result a sheath expansion takes place. Furthermore, it is observed that the floating potential of a plate can be controlled by extracting charged particles from the plasma. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)