Yield Stress Measurement of Silicon Nitride Suspensions

Yield stress values of silicon nitride suspensions were measured via a novel slotted plate device and a constant stress rheometer and the results were compared. Test platform velocity, associated with the slotted plate method, was found to have a substantial effect on dynamic yield stress but not on static yield stress. The effects of suspension concentration and temperature on yield stress values were investigated. Yield stress measurements on mixtures of silicon nitride and alumina particles, as well as creep tests were performed.     

Si3N4及其复合材料强韧化研究进展

简述了氮化硅陶瓷的结构、性能和制备工艺，并分别通过自增韧补强、纤维／晶须强韧化、层状结构强韧化、相变强韧化以及颗粒弥散强韧化等方法对氮化硅陶瓷的强韧化研究进行了分类叙述。     

Effect of Wear Damage on the Strength of Hot Isostatically Pressed Silicon Nitride

Bending tests have been used to characterize the effect of wear damage of hot isostatically pressed silicon nitride in contact with waspaloy at 600°C. The problem arises at the junction between turbine blades and disks where wear may result in premature fatigue cracking of the blade root. The tests show that wear always results in a reduction of strength, whereas the Weibull modulus may decrease or remain unchanged, depending on the amount of surface damage.     

Strength of Silicon Nitride after Thermal Shock

A water-quenching technique was used to evaluate the thermal-shock strength behavior of silicon nitride (Si₃N₄) ceramics in an air atmosphere. When the tensile surface was shielded from air during the heating and soaking process, the quenched specimens showed a gradual decrease in strength at temperatures above 600°C. However, the specimens with the air-exposed surface exhibited a ∼16% and ∼29% increase in strength after quenching from 800° and 1000°C, respectively. This is because of the occurrence of surface oxidation, which may cause the healing of surface cracks and the generation of surface compressive stresses. As a result, some preoxidation of Si₃N₄ components before exposure to a thermal-shock environment is recommended in practical applications.     

Reactivity of Aluminum Nitride Powder in Aqueous Silicon Nitride and Silicon Carbide Slurries

The reactivity of AlN powder with water in supernatants obtained from centrifuged Si₃N₄ and SiC slurries was studied by monitoring the pH versus time. Various Si₃N₄ and SiC powders were used, which were fabricated by different production routes and had surfaces oxidized to different degrees. The reactivity of the AlN powder in the supernatants was found to depend strongly on the concentration of dissolved silica in these slurries relative to the surface area of the AlN powder in the slurry. The hydrolysis of AlN did not occur if the concentration of dissolved silica, with respect to the AlN powder surface, was high enough (1 mg SiO₂/(m² AlN powder)) to form a layer of aluminosilicates on the AlN powder surface. This assumption was verified by measuring the pH of more concentrated (31 vol%) Si₃N₄ and SiC suspensions also including 5 wt% of AlN powder (with respect to the solids).     

Spherical-Impact Damage and Strength Degradation in Silicon Carbide Whisker/Silicon Nitride Composites

The silicon carbide (SiC) whisker reinforcement of silicon nitride (Si₃N₄) improves fracture strength and toughness, hardness, and Young's modulus, resulting in higher resistance of the composites to sphere penetration and crack initiation at spherical impact. Sintered Si₃N₄ shows an elastic/plastic response and initiates median/radial cracks at 100 m/s impact velocity. SiC-whisker/Si₃N₄ composites, on the other hand, demonstrate an elastic response, with Hertzian cone crack initiation, only when impact velocity exceeds 280 m/s. The SiC-whisker/Si₃N₄ composites thus exhibit improved strength degradation versus critical impact velocity characteristics because of improved mechanical properties provided by the SiC whiskers.     

Machinability of Silicon Nitride/Boron Nitride Nanocomposites

The machinability and deformation mechanism of Si₃N₄/BN nanocomposites were investigated in the present work. The fracture strength of Si₃N₄/BN microcomposites remarkably decreased with increased hexagonal graphitic boron nitride ( h -BN) content, although machinability was somewhat improved. However, the nanocomposites fabricated using the chemical method simultaneously had high fracture strength and good machinability. Hertzian contact tests were performed to clarify the deformation behavior by mechanical shock. As a result of this test, the damage of the monolithic Si₃N₄ and Si₃N₄/BN microcomposites indicated a classical Hertzian cone fracture and many large cracks, whereas the damage observed in the nanocomposites appeared to be quasi-plastic deformation.     

氮化硅轴承球表面层残余应力的形成机理及试验研究

本文论述了烧结热应力及研磨加工对氮化硅轴承球表面残余应力的影响机理.通过比容积测定,对氮化硅轴承球表面残余应力分布进行了分析计算,并就研磨加工对氮化硅轴承球表面残余应力的影响进行了试验研究.     

High-Temperature Toughness and Tensile Strength of Whisker-Reinforced Silicon Nitride

The R -curve behavior of hot-pressed silicon nitride reinforced with silicon carbide whiskers is investigated from room temperature to 1300°C using the chevron-notch bend test. The bridging stress, estimated from increment of fracture resistance in the rising R -curve, is discussed in relation to tensile strength measured with various displacement rates at 1300°C. The reinforcing whiskers provide most of the tensile strength in the creep-deformation range at 1300°C. The whiskers appear to bear a great deal of the applied tensile stress during slow crack growth.     

Fabrication and Microstructure of Silicon Nitride/Boron Nitride Nanocomposites

A chemical process for fabrication of Si₃N₄/BN nanocomposite was devised to improve the mechanical properties. Si₃N₄/BN nanocomposites containing 0 to 30 vol% hexagonal BN ( h -BN) were successfully fabricated by hot-pressing α-Si₃N₄ powders, on which turbostratic BN ( t -BN) with a disordered layer structure was partly coated. The t -BN coating on α-Si₃N₄ particles was prepared by reducing and heating α-Si₃N₄ particles covered with a mixture of boric acid and urea. TEM observations of this nanocomposite revealed that the nanosized hexagonal BN ( h -BN) particles were homogeneously dispersed within Si₃N₄ grains as well as at grain boundaries. As expected from the rules of composites, Young's modulus of both micro- and nanocomposites decreased with an increase in h -BN content, while the fracture strength of the nanocomposites prepared in this work was significantly improved, compared with the conventional microcomposites.     

Temperature Dependence of Interfacial Shear Strength in SiC-Fiber-Reinforced Reaction-Bonded Silicon Nitride

The interfacial shear strength of AVCO SCS-6 SiC-fiber-reinforced reaction-bonded Si₃N₄ (RBSN) composites was studied as a function of temperature. Fiber "push-through" experiments were conducted with a diamond indenter and a high-temperature microhardness tester. The interfacial shear strength was variable and depended mostly on interfacial bonding at low temperatures (5 to 18 MPa at room temperature) and frictional forces at high temperatures (12 to 32 MPa at 1300°C). The frictional component is attributed to the surface roughness of the fibers. The interfacial shear strength increased with temperature, because of the relief of residual stresses arising from the thermal expansion mismatch between fiber and matrix. Because of the composite nature of these fibers, a number of interfaces were tested in each experiment. The interface which debonded and slid was not always the same. Interfacial fracture took place either between the two outermost carbon layers of the SCS-6 fibers, or between the SiC core and the innermost of the two outer carbon layers. The outermost carbon layer of the fiber always stayed bonded to the Si₃N₄ matrix.     

High-Temperature Strength of Sinter-Forged Silicon Nitride with Lutetia Additive

A sinter-forging technique was successfully applied to fabricate a silicon nitride with a lutetia (Lu₂O₃) additive. The sinter-forged specimen had a strongly anisotropic microstructure where rodlike silicon nitride grains preferentially aligned perpendicular to the forging direction. The specimen exhibited superior strength of ∼700 MPa at 1500°C. This strength was highest when compared with previous silicon nitrides at temperatures >1400°C. Such superior high-temperature strength was attributed to grain alignment as well as to the refractory grain-boundary glassy phase and the existence of glass-free grain boundaries.     

Texture in Silicon Nitride Seeded with Silicon Nitride Whiskers of Different Sizes

Silicon nitride ceramics seeded with 3 wt%β-Si₃N₄ whiskers of two different sizes were prepared by a modified tape casting and gas pressure sintering. The fine whiskers had a higher aspect ratio than the coarse whiskers. Quantitative texture analysis including calculation of the orientation distribution function (ODF) was used for obtaining the degrees of preferred orientation of sintered samples. The maximum multiples of random distribution (mrd) values of samples seeded with the fine and coarse whiskers were large, greater than 15 and 9, respectively. Meanwhile, the mrd value of a sample seeded with fine whiskers was only 9 when it was prepared by conventional tape casting. The microstructures and the XRD data revealed that the well-aligned whiskers grew significantly after sintering and dominated the texture. Differences among the degrees of preferred orientation of the samples were explained using Jeffrey's model on rotation of elliptical particles carried by a viscous fluid.     

Impact Damage and Strength Degradation in a Silicon Carbide Reinforced Silicon Nitride Composite

Adding SiC particles to Si₃N₄ and subjecting the mixture to a sinter-hot-isostatic-pressing process increases both the strength and elastic modulus. It also decreases the hardness but maintains the fracture toughness, which results in a higher resistance to crack initiation and propagation during spherical particle impact. Sinter-hot-isostatically-pressed composites exhibit elastic response as their dominant behavior. They also display a high resistance to Hertzian cone crack initiation and extension. This is due to the increased degree of inelastic deformation of sinter-hot-isostatically-pressed composites.     

Influence of Stress Ratio on the Elevated-Temperature Fatigue of a Silicon Carbide Fiber-Reinforced Silicon Nitride Composite

The influence of stress ratio on the tensile fatigue behavior of a unidirectional SiC-fiber/Si₃N₄-matrix composite was investigated at 1200°C. Tensile stress ratios of 0.1, 0.3, and 0.5 were examined. Fatigue testing was conducted in air, at a sinusoidal loading frequency of 10 Hz. For peak fatigue stresses below the proportional limit of the composite (approximately 195 MPa at 1200°C) specimens survived 5 × 10⁶ cycles, independent of stress ratio. At peak stresses above the proportional limit, fatigue failures were observed; fatigue life decreased significantly as the stress ratio was lowered from 0.5 to 0.1. Creep appears to be the predominant damage mechanism which occurs during fatigue below the proportional limit. Both mechanical cycle-by-cycle fatigue damage and creep contribute to specimen failure at peak stresses above the proportional limit.     

Some New Perspectives on Oxidation of Silicon Carbide and Silicon Nitride

This study provides new perspectives on why the oxidation rates of silicon carbide and silicon nitride are lower than those of silicon and on the conditions under which gas bubbles can form on them. The effects on oxidation of various rate-limiting steps are evaluated by considering the partial pressure gradients of various species, such as O₂, CO, and N₂. Also calculated are the parabolic rate constants for the situations when the rates are controlled by oxygen and/or carbon monoxide (or nitrogen) diffusion. These considerations indicate that the oxidation of silicon carbide and silicon nitride should be mixed controlled, influenced both by an interface reaction and diffusion.     

Effect of Microstructure on High-Temperature Compressive Creep of Self-Reinforced Hot-Pressed Silicon Nitride

An experimental self-reinforced hot-pressed silicon nitride was used to examine the effects of microstructure on high-temperature deformation mechanisms during compression testing. At 1575–1625°C, the as-received material exhibited a stress exponent of 1 and appeared to deform by steady-state grain-boundary sliding accommodated by solution-reprecipitation of silicon nitride through the grain-boundary phase. The activation energy was 610 ± 110 kJ/mol. At 1450–1525°C for the as-received material, and at 1525–1600°C for the larger-grained heat-treated samples, the stress exponent was >1. Damage, primarily in the form of pockets of intergranular material at two-grain junctions, was observed in these samples.     

Raman Microprobe Evaluation of Bridging Stresses in Highly Anisotropic Silicon Nitride

The microscopic bridging stress distribution developed behind the crack tip of a highly anisotropic silicon nitride has been measured along the crack profile using Raman microprobe spectroscopy with a micrometer spatial resolution. The near-tip rising R -curve behavior and the crack-opening displacement (COD) profile of the material were also determined and discussed in comparison with the Raman microstress data. A comparison with the fracture behavior of a previously investigated silicon nitride material with a three-dimensional random microstructure is also proposed. According to this set of micro/macroscopic fracture characterizations, a self-consistent view of toughening behavior in silicon nitride ceramics is obtained, and the role on toughness of anisotropically oriented acicular grains clarified. In agreement with previous studies, it is confirmed that crack-face bridging is the most effective mechanism for toughening silicon nitride ceramics.     

氮化硅浆料的胶体特性研究

本文研究了Si3N4浆料的胶体特性,结果表明:Si3N4悬浮粒子的等电点(isoelectric point,简称IEP)在pH=4.2处.分散介质的离子强度影响Si3N4粒子的Zeta电位.分散剂的引入有效地提高Si3N4粒子的Zeta电位,并引起IEP的位移.粉体经不同工艺的预处理后IEP均发生不同程度的位移.X光电子能谱(XPS)分析表面组成发现其IEP的位移与Si3N4粉体表面的氧化程度有关.同时,对Si3N4浆料在不同条件下的分散性进行了考察,表明其分散性与胶体特性具有很好的一致性.     

Elevated-Temperature Mechanical Properties of Silicon Nitride/Boron Nitride Fibrous Monolithic Ceramics

A unique, all-ceramic material capable of nonbrittle fracture via crack deflection and delamination has been mechanically characterized from 25° through 1400°C. This material, fibrous monoliths, was comprised of unidirectionally aligned 250 μm diameter silicon nitride cells surrounded by 10 to 20 μm thick boron nitride cell boundaries. The average flexure strengths of fibrous monoliths were 510 and 290 MPa for specimens tested at room temperature and 1300°C, respectively. Crack deflection in the BN cell boundaries was observed at all temperatures. Characteristic flexural responses were observed at temperatures between 25° and 1400°C. Changes in the flexural response at different temperatures were attributed to changes in the physical properties of either the silicon nitride cells or boron nitride cell boundary.