自组装Si量子点阵中室温共振隧穿及微分负阻特性

报道了自组装Si量子点（Si-QDs）阵列在室温下的共振隧穿及其微分负阻特性. 在等离子增强化学气相沉淀系统中,采用layer-by-layer的淀积技术和原位等离子体氧化方法制备了Al/SiO2/Si-QDs/SiO2/Substrate双势垒结构. 通过原子力显微镜和透射电子显微镜检测,证实所获得的Si-QDs阵列中Si量子点平均尺寸为6nm,并具有较好的尺寸均匀性（小于10%). 在对样品的室温I-V和C-V特性的测量中,直接观测到由于Si量子点中分立能级而引起的共振隧穿和充电效应：I-V特性表现出显著的“微分负阻特性(NDR)" ;而C-V特性中也同样观测到位置相对应、结构相似的峰结构,从而证实了I-V和C-V特性中的峰结构都同样来源于电子与Si量子点阵列中分离能级之间的共振隧穿和充电过程. 进一步研究发现,Si量子点阵列中共振隧穿和NDR特性所特有“扫描方向”和“速率”依赖性及其机制,与量子阱的情况有所不同. 通过所建立的主方程数值模型,成功地解释并重复了Si量子点阵中共振隧穿所特有的输运特性.     

MIM隧道结的电子输运特性和发光研究

论述作为一种新型发光器件的ＭＩＭ隧道结的发光机理，报告了该器件的发光现象和Ｉ－Ｖ特性曲线中负阻现象的实验观察。数据显示，结中表面等离极化激元（ＳＰＰ）与粗糙度的耦合是引起光发射的主要方面，ＳＰＰ对隧穿电子的阻塞作用导致了电子输运中的负阻现象。此外，还观察到了直接辐射的紫外峰。     

双势垒隧道发光结Ⅰ-Ⅴ特性中的负阻现象

制备了含两层绝缘层的双势垒结构隧道发光结,介绍了其结构特点,分析了电子在结中的共振隧穿特性。结合电子隧穿特性及结的发光机理,对结I-V特性中负阻现象的产生及其与表面等离极化激元激发发光的关系进行了研究。     

自组装Si量子点阵中室温共振隧穿及微分负阻特性

报道了自组装Si量子点(Si-QDs)阵列在室温下的共振隧穿及其微分负阻特性.在等离子增强化学气相沉淀系统中,采用layer-by-layer的淀积技术和原位等离子体氧化方法制备了Al/SiO2/Si-QDs/SiO2/Substrate双势垒结构.通过原子力显微镜和透射电子显微镜检测,证实所获得的Si-QDs阵列中Si量子点平均尺寸为6nm,并具有较好的尺寸均匀性(小于10%).在对样品的室温I-V和C-V特性的测量中,直接观测到由于Si量子点中分立能级而引起的共振隧穿和充电效应:I-V特性表现出显著的"微分负阻特性(NDR)";而CV特性中也同样观测到位置相对应、结构相似的峰结构,从而证实了I-V和C-V特性中的峰结构都同样来源于电子与Si量子点阵列中分离能级之间的共振隧穿和充电过程.进一步研究发现,Si量子点阵列中共振隧穿和NDR特性所特有"扫描方向"和"速率"依赖性及其机制,与量子阱的情况有所不同.通过所建立的主方程数值模型,成功地解释并重复了Si量子点阵中共振隧穿所特有的输运特性.     

自组装Si量子点阵中室温共振隧穿及微分负阻特性

报道了自组装Si量子点(Si-QDs)阵列在室温下的共振隧穿及其微分负阻特性.在等离子增强化学气相沉淀系统中,采用layer-by-layer的淀积技术和原位等离子体氧化方法制备了Al/SiO2/Si-QDs/SiO2/Substrate双势垒结构.通过原子力显微镜和透射电子显微镜检测,证实所获得的Si-QDs阵列中Si量子点平均尺寸为6nm,并具有较好的尺寸均匀性(小于10%).在对样品的室温I-V和C-V特性的测量中,直接观测到由于Si量子点中分立能级而引起的共振隧穿和充电效应:I-V特性表现出显著的"微分负阻特性(NDR)";而CV特性中也同样观测到位置相对应、结构相似的峰结构,从而证实了I-V和C-V特性中的峰结构都同样来源于电子与Si量子点阵列中分离能级之间的共振隧穿和充电过程.进一步研究发现,Si量子点阵列中共振隧穿和NDR特性所特有"扫描方向"和"速率"依赖性及其机制,与量子阱的情况有所不同.通过所建立的主方程数值模型,成功地解释并重复了Si量子点阵中共振隧穿所特有的输运特性.     

双势垒隧道发光结的结构特点及其性能分析

成功地制备了Cu-Al2O3-MgF2-Au及Si-SiO2-Al-Al2O3-Au两种结构双势垒隧道发光结。由于双势垒结中第二栅存在着不同的分立能级,电子存在共振隧穿效应,使双势垒隧道结发光光谱的波长范围及谱峰位置比普通单势垒隧道结均向短波方向发生了移动。对双势垒隧道发光结的I-V特性测试表明,I-V曲线中存在着明显的负阻区,分析表明,负阻现象与电子的隧穿特性、表面等离极化激元(SPP)的激发及SPP的耦合发光之间相互关联。     

硅基隧穿二极管

隧穿二极管是一种很有前途的基于带隙工程的异质结构量子器件,其电流电压(I-V)曲线中所呈现的微分负阻特性能够用于开发多种不同的电路功能。在最近的研究中,空穴型双势垒单势阱共振隧穿二极管得到了实现,为Si1-xGex/Si异质结隧穿二极管器件的改进和电路应用打下了良好的基础。     

新型电子器件和光学器件的共振隧穿结构

描述了一种新型共振隧穿结构器件，这种器件包含了通过可变间隙超晶格能量滤波器（ＶＳＳＥＦ）中的耦合量子附态的隧穿过程．论证了通过ＡｌＡｓ／ＧａＡｓＶＳＳＥＦ器件高能态和ＡｌＧａＡｓ／ＧａＡｓ超晶格受激态的共振隧穿，描述了这种器件作为较高功率微波源和共振隧穿晶体管的应用，并讨论了共振隧穿结构作为雪崩探测器和红外发射器等光学器件的潜在应用．     

共振隧穿二极管的力电耦合特性

报道了微结构中共振隧穿二极管（RTD）的压阻效应. 分析并加工了四梁结构,其中RTD置于应力敏感区. 沿［110］晶向和［110］晶向的应力导致RTD电流-电压曲线的改变,即介观压阻变化,尤其是在微分负阻（NDR）区. 采用不同测试方法,研究了RTD的力电耦合特性,并获得了较相近的压阻系数为1E-9Pa-1.     

双量子环的隧穿电导和隧穿磁电阻

研究了双量子环的隧穿电导和隧穿磁电阻,研究结果表明:隧穿电导和隧穿磁电阻都随半导体环增大做周期性等幅振荡。δ势垒、Rashba自旋轨道耦合、AB磁通对隧穿电导或隧穿磁电阻的影响各不相同。隧穿磁电阻随AB磁通增强发生周期性等幅振荡,并随φ0角的减小而增大。两电极磁矩方向反平行时,隧穿磁电阻恒为零。     

MIM隧道发光二极管的电子输运研究

本文报道了MIM隧道二极管的发光和负阻现象,用梯形势垒计算了电流-电压特性。结果显示,由于SPP波对电子的阻挡和束缚作用引起的势垒平均宽度的增加所导致的负阻现象与实验结果相符合。     

Compact multiple-valued multiplexers using negative differentialresistance devices

Quantum electronic devices with negative differential resistance (NDR) characteristics have been used to design compact multiplexers. These multiplexers may be used either as analog multiplexers where the signal on a single select line selects one out of four analog inputs, or as four-valued logic multiplexers where the select line and the input lines represent one of four quantized signal values and the output line corresponds to the selected input. Any four-valued logic function can be implemented using only four-valued multiplexers (also known as T-gates), and this T-gate uses just 13 devices (transistors) as compared to 44 devices in CMOS. The design of the T-gate was done using a combination of resonant tunneling diodes (RTD's) and heterojunction bipolar transistors (HBT's) with the folded I-V characteristic (NDR characteristic) of the RTD's providing the compact logic implementation and the HBT's providing the gain and isolation. The application of the same design principles to the design of T-gates using other NDR devices such as resonant tunneling hot electron transistors (RHET's) and resonant tunneling bipolar transistors (RTBT's) is also demonstrated     

CMOS负阻单元逻辑电路及其发展前景

在回顾了多值逻辑(MVL)电路的优点、分析了共振隧穿器件(RTD)电路的特点和比较了各种类型负阻器件性能的基础上,提出了利用CMOS型负阻单元作为基础性器件设计并实现CMOS型逻辑电路的新概念,并指出了此研究领域的几个重点研究内容和方向。     

Controlling Phase-Coherent Electron Transport in III-Nitrides: Toward Room Temperature Negative Differential Resistance in AlGaN/GaN Double Barrier Structures

Resonant tunneling of electrons is important for the manufacture of high-speed electronic oscillators and the electron injection control in quantum cascade lasers. In this work, room temperature negative differential resistance (NDR) in AlGaN/GaN double barrier structure with AlN/GaN digital alloy (DA) barriers is demonstrated. The peak-to-valley current ratio (PVCR) ranges from 1.1 to 1.24 at room temperature and becomes 1.5 to 2.96 at low temperatures, whereas no NDR is observed in double barrier structures with conventional ternary AlGaN barriers. The room temperature NDR together with the high PVCR at low temperature is attributed to the suppression of alloy disorder scattering by introducing AlN/GaN DA barriers. This work presents the successful control of phase-coherent electron transport in III-nitride heterostructures and is expected to benefit the future design of nitride-based resonant tunneling structures and high-speed electronic devices.     

Multiple-input logic circuit design using BiCMOS-based negative differential resistance circuits

We first propose an inverter circuit design using the negative differential resistance (NDR) circuit composed of the standard Si-based n-channel metal-oxide-semiconductor field-effect-transistor (NMOS) and SiGe-based heterojunction bipolar transistor (HBT). By suitably designing the MOS width/length parameters, we can obtain the ??-type NDR current?Cvoltage (I?CV) characteristic. Expanding the inverter circuit operation, the two-input and four-input NOR logic gates are demonstrated. Especially, the design and fabrication of the logic circuit is based on the standard SiGe BiCMOS process. Compared to the traditional NDR device like resonant tunneling diode (RTD), our MOS?CHBT?CNDR-based applications are much easier to be combined with some Si-based or SiGe-based devices on the same chip.     

A flexible logic circuit based on a MOS-NDR transistor in standard CMOS technology

A MOS-NDR (negative differential resistance) transistor which is composed of four n-channel metaloxide-semiconductor field effect transistors (nMOSFETs) is fabricated in standard 0.35 μm CMOS technology.This device exhibits NDR similar to conventional NDR devices such as the compound material based RTD (resonant tunneling diode) in current-voltage characteristics.At the same time it can realize a modulation effect by the third terminal.Based on the MOS-NDR transistor,a flexible logic circuit is realized in this work,which can transfer from the NAND gate to the NOR gate by suitably changing the threshold voltage of the MOS-NDR transistor.It turns out that MOSNDR based circuits have the advantages of improved circuit compaction and reduced process complexity due to using the standard IC design and fabrication procedure.