石墨烯/NiAu复合透明导电层在GaN LED的应用

通过溅射方法制备Ni/Au层,用作石墨烯和p型GaN之间的插入层来减小接触电势。研究了Ni和Au的厚度比与GaN LED性能的关系。结果表明,在1.5 nm总厚度的条件下,Ni与Au厚度比为1 nm/0.5 nm时为最佳,可同时兼顾透光性能和良好欧姆接触,此时,石墨烯/NiAu复合透明导电层可以明显地降低GaN LED的工作电压,同时在蓝光波段具有很高的透光率,因而提高了GaN LED的发光性能。     

多层氧化物复合阴极透明OLED器件

制备了一种采用多层氧化物复合阴极的透明OLED,器件结构为:ITO/MoO3(10nm)/NPB(60nm)/Alq3(65nm)/Al(1nm)/MoO3(1nm)/Al(Xnm)/MoO3(30nm)。所采用的复合阴极结构为MoO3/Al/MoO3(MAM),同时在复合阴极(MAM)与电子传输层(Alq3)中间插入一层厚度为1nm的Al中间层,该薄Al层一方面提高了电极与有机层间界面的平整度,同时增强了电极的导电性;另一方面,在电子传输层与中间层Al薄膜之间形成了良好的欧姆接触,提高了电子的注入能力。改变MAM结构中Al的厚度,获得该透明OLEDs的最佳性能,在Al的厚度为18nm时器件亮度最高,为2 297cd/cm2。     

三氧化钼修饰银透明电极的光电性能及其应用研究

银(silver,Ag)纳米薄膜具有优异的导电性、延 展性、易制备等优点,是极具潜力的柔性透明电极材 料。通过真空热蒸镀制备不同厚度的银薄膜(6 nm、10 nm、14 nm、18 nm、20 nm、24 nm),由于光散射和 光吸收的共同作用, 其透过率随厚度的增加呈先减小、再增加、再减小的趋势,厚度为18 nm时最优,最高透过率约60%; 而面电阻则随厚度的增加逐渐减小。为提升银膜的透过率,引入高折射率(2.1)电介质三氧化钼(m olybdenum trioxide,MoO₃)对银膜进行修饰,制备了MoO₃/Ag/MoO₃(MAM)多层膜。结 果表明:引入MoO₃可以平滑 银膜表面,降低面电阻,并改善电导率;更重要的是“MoO₃/Ag”界面处会发生折射率耦合 ,大大提升多 层膜的整体透过率,透过率普遍增加至少10%。当银层的厚度为14 nm时,MAM多层膜的透过率最优, 可接近70%。最后,以银作为透明阴极,成功制备了双侧发光的绿光 有机发光二极管(organic light-emitting diode,OLED)。     

MoO3修饰氧化石墨烯作为空穴注入层影响研究

研究了MoO₃修饰氧化石墨烯(GO)作为空穴注入层的影响。采用旋涂的方法制备了GO, 再真空蒸镀修饰层MoO₃,得到了空穴注入能力强和透过率高的复合薄膜。MoO₃的厚分 别采用0、3、5和8nm。通过优化MoO₃的厚度发现,当MoO₃的厚为5nm时,复合薄膜 的透过率达到最大值,在 550nm的光波长下透光率为88%,且此时采用 复合薄膜作为空穴注入层制备的结构为 ITO/GO/MoO₃(5nm)/NPB(40nm)/Alq₃(40nm)/LiF(1nm)/Al(100nm)的有机电致发光器件(OLED)性能 最佳。通过对OLED进一步的优化,改变Alq₃的厚度,分别取50、60和70nm,测量其电压 、电流、亮度、色坐标和电致发光(EL)光谱等参数发现,当Alq₃的厚为50nm时器件性能最 佳。最终制备了结构为ITO/GO/MoO₃(5nm)/NPB(50nm)/Alq₃(50nm)/LiF(1nm)/Al(100 nm)的OLED,在电压为10V时,最大电流效率达到5.87cd/A,与GO单独作为空穴注入层制备的器件相比,提高了50%。     

基于Alq3光耦合层的新型顶发射蓝光有机电致发光器件

研制了一种结构为Ag/Glass/ITO/TAPC/mCP/mCP∶Firpic/TPBi/LiF/Al/Ag/Alq₃的顶发射有机电致发光器件,通过在ITO玻璃衬底背面生长一层Ag反射膜,使器件发出的蓝光被反射膜反射到顶电极出射。利用顶电极表面的Alq₃光耦合层有效地提升了金属复合阴极的透射率,降低了器件的微腔效应。实验结果表明,当光耦合层厚度为30nm时,获得了最大电流效率和最大亮度分别为8.91cd/A和5758cd/m²的蓝光顶发射有机电致发光器件(TEOLED);同时,在10V电压下,其色坐标为(0.157,0.320),当亮度从1cd/m²变化到5000cd/m²时,其色坐标仅漂移(0.002,0.010),表现出良好的色稳定性。     

二次退火对Au/Ni/Au/Ni/p-AlGaN欧姆接触组织结构的影响

在蓝宝石衬底上,利用金属-有机物化学气相沉 积(MOCVD)方法制备p-i-n结构AlGaN基体,采 用常规工艺制作台面型紫外探测器。电子束蒸发蒸镀Ni/Au/Ni/Au(20nm/20 nm)结构制备 p 电极。经空气中550℃/3min一次退火和N₂气氛中750℃/30s二次退火后得到欧姆接触。利用高分 辨透射电镜(HRTEM)和能谱(EDS)研究不同退火条件下p 电极接触的组织结构演变。结果 表明:一 次退火p电极金属层出现明显扩散,但仍维持初始的分层状态,金属/半导体接触界面产生 厚约4nm 的非晶层;二次退火后,金属电极分层现象和界面非晶层消失。金/半界面结构表现为半共 格关系,界面结 构有序性提高。Ni向外扩散,Au向内扩散,Ga扩散至金属电极,造成界面附近金属层富 集Au、Ga元素,导致p电极欧姆接触的形成。     

p型GaN上Pd/NiO/Al/Ni反射电极欧姆接触的热稳定性研究

研究了p型GaN上Pd/NiO/Al/Ni反射电极欧姆接触的比接触电阻率、热稳定性,以及光学反射率。与传统Pd/Al/Ni电极相比,Pd/NiO/Al/Ni电极的欧姆接触在氮气环境中经300℃下热处理10min后,仍保持低比接触电阻率(小于5×10-4Ω·cm2)和高反射率(大于80%@365nm)。研究获得的优化Pd/NiO层厚度为1nm/2nm,此时的Pd/NiO/Al/Ni反射电极既能形成良好的欧姆接触,拥有低比接触电阻率,又能减少对紫外光的吸收,保持高反射率。研究表明适当的NiO层厚度能够有效地防止热处理过程中上层Al金属向p-GaN表面层的渗入,对于制备高质量的Al基反射电极至关重要。     

垂直结构GaN基LED用Ni/Ag反射镜电极

Ni/Ag/Ti/Au金属系反射镜电极广泛用于GaN基垂直结构发光二极管(LED)的传统制造工艺.这种电极需要进行高温长时间整体退火才能获得高质量的欧姆接触,但对电极的反射率和器件性能影响较大.介绍了一种新工艺方法,该方法将电极分解为接触层和反射层,降低反射层经历的退火温度和时间,获得了拥有良好的欧姆接触特性和高反射率的反射镜电极,解决了传统电极光学性能和电学性能相互制约的问题.首先生长极薄的Ni/Ag作为接触层,对接触层进行高温长时间退火后再生长厚层Ag作为反射层,之后再进行一次低温退火.使得对反射起主要作用的反射层免于高温长时间退火,相较于传统Ni/Ag/Ti/Au电极,该方法在获得更优良的欧姆接触的同时,提升了电极的反射率.在氧气氛围下进行500℃接触层退火3 min,400℃整体退火1 min后,电极的比接触电阻率为1.7×l0-3Ω·cm2,同时在450 nm处反射率为93％.     

电极耦合层对GaN基蓝光LED出光特性的影响

光提取效率的提高对GaN基蓝光LED的广泛应用有重要的影响.计算了以Ni/Au基金属化方法形成的p型GaN电极的折射率,通过分析电极层中的能流传输情况在电极上设计高折射率的耦合层来减少电极层对光的吸收以及提高光的透射,耦合层通过采用圆台结构来减少光在空气/耦合层界面上的全反射以提高GaN基蓝光LED的光提取效率.应用传输矩阵法计算的结果表明,光学厚度为π/2,折射率为2.02的ITO耦合层能使450 nm的蓝光在膜系上的透射率提高到75%.     

载流子复合机制对不同发光波长InGaN基LED调制带宽的影响

传统的ABC模型主要用于研究InGaN量子阱中载流子的复合动态过程.使用传统的ABC模型计算载流子的复合速率和复合寿命,研究不同发光波长InGaN基LED的3 dB调制带宽与载流子复合机制的关系.计算分析结果表明,在相同的注入电流下,随着有效有源区厚度和量子阱层厚度的减小,400 nm近紫外、455 nm蓝光以及525 nm绿光三种发光波长LED的3 dB调制带宽均明显增大;在100 A/cm2的注入电流密度下,400,455,525 nm三种发光波长LED的3 dB调制带宽分别为62,88,376 MHz;在相同的电流密度下,LED的3 dB调制带宽随着In组分(In元素的原子数分数占In元素与Ga元素的原子数分数总和的比)的增加而增大;由于525 nm波长LED的In组分高,有效有源区厚度薄,所以源区载流子浓度高,在大电流密度下525 nm绿光LED的3 dB调制带宽达到376 MHz.     

Highly Reliable High-Brightness GaN-Based Flip Chip LEDs

The properties of indium-tin-oxide (ITO)/Ni films as transparent ohmic contacts of nitride-based flip chip (FC) light emitting diodes (LEDs) were studied. It was found that 300degC rapid thermal annealed (RTA) ITO(15 nm)/Ni(1 nm) could provide good electrical and optical properties for FC LED applications. It was also found that 20-mA operation voltage and output power of the 465-nm FC LEDs with ITO/Ni/Ag reflective mirror were 3.16 V and 21 mW, respectively. Furthermore, it was found that output intensity of the proposed LED only decayed by 5% after 1200 h under 30-mA current injection at room temperature.     

Highly Stable Ni‐Based Flexible Transparent Conducting Panels Fabricated by Laser Digital Patterning

A novel simple laser digital patterning process to fabricate Ni‐based flexible transparent conducting panels using solution‐processed nonstoichiometric nickel oxide (NiO_x) thin films and their applications for flexible transparent devices are reported in this study. A large‐scale synthesis route to produce NiO_x nanoparticle (NP) ink is also demonstrated. A low‐power continuous‐wave laser irradiation photothermochemically reduces and sinters selected areas of a NiO_x NP thin film to produce Ni electrode patterns. Owing to the innovative NiO_x NP ink and substantially lowered applied laser power density, Ni conductors can be fabricated, for the first time to the best of the authors' knowledge, even on a polyethylene terephthalate substrate, which is known to have one of the lowest glass‐transition temperatures among polymers. The resultant Ni electrodes exhibit a high‐temperature oxidation resistance up to approximately 400 °C, and high corrosion resistance in tap water and even in seawater. Moreover, a superior mechanical stability of the Ni conductors is confirmed by tape‐pull, ultrasonic‐bath, bending/twisting, and cyclic bending (up to 10 000 cycles) tests. Finally, flexible transparent touch screen panels and electrical heaters are fabricated with mesh‐type Ni conductors to demonstrate possible applications.     

High brightness InGaN green LEDs with an ITO on n/sup ++/-SPS upper contact

Indium tin oxide (ITO) (260 nm) and Ni (5 nm)/Au (10 nm) films were deposited onto glass substrates, p-GaN layers, n/sup +/-InGaN/GaN short-period-superlattice (SPS), n/sup ++/-SPS and nitride-based green light-emitting diodes (LEDs). It was found that ITO could provide us an extremely high transparency (i.e., 95% at 520 nm). It was also found that the 1.03/spl times/10/sup -3/ /spl Omega/cm/sup 2/ specific contact resistance of ITO on n/sup ++/-SPS was reasonably small. Although the forward voltage of the LED with ITO on n/sup ++/-SPS upper contacts was slightly higher than that of the LED with Ni/Au on n/sup ++/-SPS upper contacts, the 20 mA output power and external quantum efficiency of the former could reach 4.98 mW and 8.2%, respectively, which were much larger than the values observed from the latter. The reliability of ITO on n/sup ++/-SPS upper contacts was also found to be reasonably good.     

Iridium-based semi-transparent current spreading layer on short-period-superlattice (SPS) tunneling contact of InGaN/GaN LEDs

Iridium-containing and Ni(4 nm)/Au(6 nm) films were evaporated separately on the n⁺-InGaN–GaN short-period-superlattice (SPS) structure of light-emitting diodes (LEDs). The collective deposition of iridium and other metals as an ohmic contact induces the formation of highly transparent IrO₂, which helps to enhance the light output and decrease the series resistance of LEDs. By comparing different metal films used as current spreading contact layer, Ir/Ni film annealed at 500 °C for 20 min in O₂ ambient renders devices with lowest turn-on voltage at 20 mA and highest luminous intensity. Moreover, we also analyzed films using atomic force microscopy (AFM) with an emphasis on studying how the surface quality of Ir/Ni and Ni/Au films influences the current spreading and luminosity of LEDs.     

大功率倒装结构GaN LED p电极研究

从接触电阻、反射率、电流扩展等方面对Ni/Au/Ag,ITO/Ag,Ag等多种倒装结构p电极金属体系进行分析比较，给出了实现倒装结构大功率GaN LED p电极的多种设计方案. 指出Ni/Au金属化体系在大功率LED应用中存在的热稳定性问题及Ru,Ir等新型金属体系实现GaN p电极接触的潜在优势.     

Fabrication of Ag nanoparticle/ZnO thin films using dual-plasma-enhanced metal-organic chemical vapor deposition (DPEMOCVD) system incorporated with photoreduction method and its application

We report a novel method to grow silver nanoparticle/zinc oxide (Ag NP/ZnO) thin films using a dual-plasma-enhanced metal-organic chemical vapor deposition (DPEMOCVD) system incorporated with a photoreduction method. The crystalline quality, optical properties, and electrical characteristics of Ag NP/ZnO thin films depend on the AgNO₃ concentration or Ag content and annealing temperature. Optimal Ag NP/ZnO thin films have been grown with a AgNO₃ concentration of 0.12 M or 2.54 at%- Ag content and 500 °C- rapid thermal annealing (RTA); these films show orientation peaks of hexagonal-wurtzite-structured ZnO (002) and face-center-cubic-crystalline Ag (111), respectively. The transmittance and resistivity for optimal Ag NP/ZnO thin films are 85% and 6.9×10⁻⁴ Ω cm. Some Ag NP/ZnO transparent conducting oxide (TCO) films were applied to InGaN/GaN LEDs as transparent conductive layers. The InGaN/GaN LEDs with optimal Ag NP/ZnO TCO films showed electric and optical performance levels similar to those of devices fabricated with indium tin oxide.     

Ni层厚度对p-GaN/Ni/Au欧姆接触特性的影响

对p-GaN/Ni/Au欧姆接触特性与Ni金属层厚度之间的相关性进行了对比实验研究,利用XRD衍射结果与表面金相显微分析手段对Ni/Au双层金属电极在合金退火过程中的行为特性进行了细致探讨。分析结果表明:在Ni/Au电极结构中,由双层互扩散机制与NiO氧化反应机理决定,Ni层与Au层之间的厚度比率对p型GaN欧姆接触特性的优劣有重要影响,在Ni、Au层厚度相当时可获得最佳的p型欧姆接触。     

Nitride-based light-emitting diodes with Ni/ITO p-type ohmic contacts

The optical and electrical properties of Ni(5 nm)-Au(5 nm) and Ni(3.5 nm)-indium tin oxide (ITO) (60 nm) films were studied. It was found that the normalized transmittance of Ni/ITO film could reach 87% at 470 nm, which was much larger than that of the Ni-Au film. It was also found that the specific contact resistance was 5 /spl times/ 10/sup -4/ /spl Omega/ /spl middot/ cm/sup 2/ and 1 /spl times/ 10/sup -3/ /spl Omega/ /spl middot/ cm/sup 2/, respectively, for Ni-Au and Ni/ITO on p-GaN. Furthermore, it was found that the 20 mA output power of light-emitting diode (LED) with Ni-Au p-contact layer was 5.26 mW. In contrast, the output power could reach 6.59 mW for the LED with Ni/ITO p-contact layer.     

Influence of growth temperature and growth rate of p-GaN layers on the characteristics of green light emitting diodes

We investigated the electrical and structural qualities of Mg-doped p-type GaN layers grown under different growth conditions by metalorganic chemical vapor deposition (MOCVD). Lower 300 K free-hole concentrations and rough surfaces were observed by reducing the growth temperature from 1,040°C to 930°C. The hole concentration, mobility, and electrical resistivity were improved slightly for Mg-doped GaN layers grown at 930°C with a lower growth rate, and also an improved surface morphology was observed. In_0.25Ga_0.75N/GaN multiple-quantum-well light emitting diodes (LEDs) with p-GaN layers grown under different conditions were also studied. It was found from photoluminescence studies that the optical and structural properties of the multiple quantum wells in the LED structure were improved by reducing the growth temperature of the p-layer due to a reduced detrimental thermal annealing effect of the active region during the GaN:Mg p-layer growth. No significant difference in the photoluminescence intensity depending on the growth time of the p-GaN layer was observed. However, it was also found that the electroluminescence (EL) intensity was higher for LEDs having p-GaN layers with a lower growth rate. Further improvement of the p-GaN layer crystalline and structural quality may be required for the optimization of the EL properties of long-wavelength (∼540 nm) green LEDs.     

Nitride-based flip-chip LEDs with transparent Ohmic contacts and reflective mirrors

Nitride-based flip-chip light-emitting diodes (LEDs) with various transparent ohmic contacts and reflective mirrors were fabricated. At 470 nm, it was found that Ni could provide 92% transmittance while Ag could provide 92.4% reflectively. It was also found that the 20-mA forward voltages measured from LEDs with Ni+Ag, Ni+Al, and Ni+Pt were 3.15, 3.29, and 3.18 V while the output powers were 16, 13.3, and 11.6 mW, respectively. Furthermore, it was found that lifetimes of the fabricated flip-chip LEDs were good.