钨及其合金超精密抛光研究进展

钨及其合金是当今高新技术产业重要的基础材料.近年来,科技的发展对材料表面质量提出了更高的要求,因此在特定条件下有必要对钨及其合金进行超精密抛光.聚焦高效、高质量、低损伤抛光,结合国内外相关研究,对适用于钨及其合金的超精密抛光方法如化学机械抛光(CMP)、电化学抛光(ECP)、磁流变抛光(MRF)、电流变抛光(ERP)、...     

金刚石化学机械抛光研究现状

金刚石由于其独特的性质成为未来科技的重要材料,但较差的表面质量会影响其在高科技领域的应用,因此实现金刚石超精密加工是提高金刚石应用的关键。化学机械抛光(CMP)是集成电路中获得全局平坦化的一项重要工艺,能够实现金刚石的超精密加工。介绍了现有的金刚石加工方法和金刚石化学机械抛光的研究现状,并与其他的加工方法(机械抛光、摩擦化学抛光、热化学抛光等)进行了对比,其他加工方法存在加工后表面损伤严重、加工表面粗糙度无法满足需要等问题。金刚石的化学机械抛光工艺经历了由高温抛光向常温抛光的发展过程,该加工方法设备简单、成本低、抛光后的表面粗糙度(Ra)可以达到亚纳米级别。此外,金刚石的分子动力学模拟(MD)使人们从原子尺度对金刚石抛光过程中纳米粒子的相互作用和抛光机理有了深入了解。虽然金刚石化学机械抛光还存在着许多亟待解决的问题,但是其发展前景依旧十分乐观。     

碳化硅晶体电化学机械抛光工艺研究

针对碳化硅晶体抛光效率低的问题,研究碳化硅晶体的电化学机械抛光工艺,对比NaOH、NaNO₃、H₃PO₄ 3种电解液电化学氧化碳化硅晶体的效果。选用0.6 mol/L的NaNO₃作为电化学机械抛光过程的电解液,使用金刚石–氧化铝混合磨粒,通过正交试验研究载荷、转速、电压、磨粒粒径对电化学机械抛光碳化硅晶体的表面质量和材料去除率的影响。采用优选的试验参数进行抛光试验,结果表明:在粗抛阶段可实现20.259 μm/h的高效材料去除,在精密抛光阶段可获得碳化硅表面粗糙度S_a为0.408 nm的光滑表面。      

Investigation on the Electrochemical-Mechanical Polishing of NiP Substrate of Hard Disk

利用自制的抛光液和改造的抛光机对NiP基板进行电化学机械抛光,研究了抛光电压、抛光台转速、抛光压力和抛光液流速对材料去除速率的影响,对电化学机械抛光的机理做了初步的分析。研究结果表明, NiP基板可以用低压力 (3.5 kPa)抛光, 材料的去除速率可以通过调整抛光电压, 抛光台转速和抛光液流速进行控制     

LiTaO3晶片CMP过程工艺参数研究

采用不同抛光条件抛光LiTaO3晶片,通过测量其加工表面粗糙度和材料去除率,探讨了化学机械抛光去除机理,分析了抛光垫材料和状态、抛光压力、抛光盘转速等因素对LiTaO3晶片抛光表面质量和材料去除率的影响规律,并获得了LiTaO3晶片CMP加工的有效工艺参数.实验表明,为获得LiTaO3晶片超精密表面,可采用沥青和平绒布抛光垫进行粗抛和精抛,然后采用旧无纺布(抛光垫)进行终抛,获得较大工件去除率和较光滑表面,得到良好的综合抛光效果.在修正环型超精密抛光机上,理想的LiTaO3工艺参数为:抛光压力为7.25 kPa,抛光盘转速为60rpm.     

电解抛光新技术

当前模具抛光要求日益提高 ,常规的手工和超声波抛光远跟不上模具行业的需要 ,研究一种电化学抛光新装备是模具行业的急切需求。介绍了电化学—机械抛光的原理、工具及特点。     

EBSD技术在大塑性变形制备超细晶与纳米材料中的应用：试样制备、参数优化与数据分析

在场发射扫描电镜的帮助下,电子背散射技术（EBSD）能用来研究大小低达几十纳米的晶粒（或亚晶粒）,其角分辨率达~0.5°。EBSD 技术的快速发展（电子衍射花样的采集速度已高达1100点/s）使其相关领域的科技论文发表数量迅速增加。本文评述了 EBSD 的试样制备、参数优化和数据分析,特别是在大塑性变形（SPD）制备超细晶和纳米材料方面的应用。总结了电化学抛光、二氧化硅乳液机械抛光和离子束抛光等EBSD试样制备技术的优缺点和实用参数。结果表明,离子束抛光技术是一项通用的、几乎适用于所有EBSD试样的有效抛光方法。随着EBSD扫描步长的变化,花样的标定率存在一个极大值。最优化的EBSD扫描步长取决于试样图片的放大倍数和数据采集板的分辨率（或电子步长）。对晶粒和亚晶粒、织构和晶界结构等进行分析是EBSD的基本功能。EBSD也可对塑性变形的应变和存储能等进行分析。     

基于RCM的丝杆轴承周期维修策略

建立加工中心丝杆轴承Weibull寿命分布模型,并利用其寿命分布模型给出轴承最佳周期维修策略,该策略能够应用于轴承等耗损型零部件。对周期模型进行了数学推导,同时也证明了周期维修策略不适用于早期和偶然失效型零部件。     

化学机械抛光垫的研究进展

化学机械抛光(CMP)作为一种超精密加工技术,在集成电路制造、计算机硬盘、微机电系统、光学元件加工等领域得到了广泛的应用。抛光垫设计制备、抛光垫磨损、抛光垫修整均会对化学机械抛光产生影响。首先从抛光垫基体、抛光垫表面纹理、抛光垫结构等3个方面对抛光垫设计制备相关研究进行了综述,重点介绍了不同基体材质抛光垫的抛光性能,指出了各材质抛光垫的优缺点。其次,介绍了抛光和修整过程中的抛光垫磨损,对比了各研究者建立的抛光垫磨损模型,概述了抛光垫磨损监测技术的研究现状,并指出目前抛光垫磨损状态的监测手段较为单一,采用融合多传感器信号对抛光垫磨损状态进行监测,可以提高其监测精度。为了进一步探究抛光垫修整对抛光性能的影响,归纳了修整器的结构参数,以及修整参数对修整效果的影响,介绍了几种新型修整器结构,并综述了抛光垫自修整技术的研究进展。最后,总结了目前关于研究抛光垫设计制备、抛光垫磨损、抛光垫修整等方面存在的问题,并对其发展前景进行了展望。     

GCr15钢轴承残留奥氏体、尺寸精度及疲劳寿命试验研究

对7205C/P5精密轴承和7205C/P4超精密轴承进行了工艺试验,并对不同的轴承热处理工艺,其残留奥氏体含量对尺寸精度稳定性及轴承疲劳寿命的影响进行试验研究,提出了GCr15钢制超精密轴承残留奥氏体的控制量.     

磁流变抛光技术的研究进展

磁流变抛光技术具有加工面形精度高、表面粗糙度小、加工过程易于控制、表面损伤小、加工过程中不产生新的损伤等优秀特点,因此多应用于加工要求高的精密和超精密领域,最常应用于光学加工方面。综述了磁流变抛光技术材料去除数学模型的建立进展,论证了该模型的正确性,总结出该基本模型具有通用性,模型能够适用于平面和凸球面等形面加工中,此外,对实现计算机控制抛光过程的准确性具有指导意义。概述了磁流变抛光工艺实验进展,总结磁流变抛光影响抛光效果的主要因素是磁场强度和磁场发生装置,在优化工艺参数组合下能够达到纳米级表面,能够消除亚表面损伤,还能够用以加工各种复杂形面等。就目前磁流变抛光技术的发展新方向作以总结,包括集群磁流变抛光技术、组合磁流变抛光技术以及磁流变-超声复合抛光技术,介绍这几种加工方法的工作原理以及能够达到的实验效果。最后对现阶段磁流变抛光技术中存在的问题做出总结,并针对各个问题提出相对应的思考和展望。     

Ultra-precision polishing of electroless nickel molding dies for shorter wavelength applications

Electroless nickel is one of the best materials for making optical molding dies, because of its machinability with both single-point diamond turning and polishing, as well as its suitable hardness and durability. This paper deals with the ultra-precision polishing of aspheric molding dies for next-generation hard X-ray telescope mirrors, which require a super smooth surface with a roughness below 0.3 nm root-mean-square (rms). The material was machined using various methods, and a surface roughness of 0.23 nm rms was obtained on aspheric molding dies of 300 mm in diameter. A surface roughness of 0.16 nm rms was achieved on platinum/carbon multilayer mirrors, replicated from plano dies.     

Development of monitoring system on the diamond tool wear

Recently, ultra-precision machining using a single crystal diamond tool has been developing very rapidly, especially in the fields of production processes for optical or magnetic parts such as magnetic discs, laser mirrors, polygon mirrors and copier drums. As a result, it has been successfully extended to machine various soft materials, generating mirror-like surfaces to sub-micron geometric accuracy with the ultra-precision CNC machine and the single crystal diamond tool. With the real cutting operation, the geometric accuracy and the surface finish attainable in machined surfaces are mainly determined by both of the sharpness of a cutting tool and stability of the machine vibration. In this study, for monitoring the progress of machining state for assuring the machining accuracy and the surface quality, a new monitoring method of machining states in face-cutting with diamond tool is proposed, using the frequency response of multi-sensors signal, which includes wear state of tool in terms of the energy within the specific frequency band. A magnetic disc is machined on the ultra-precision lathe.     

单晶SiC基片的化学机械抛光技术研究进展

单晶SiC因其优异的物理化学性质而成为重要的外延衬底材料,广泛应用于卫星通信、集成电路和消费电子等领域。衬底外延生长需要单晶SiC具有较低的加工表面损伤和残余应力的超光滑平坦表面,其表面质量决定了后续的外延层质量并最终影响器件的性能。化学机械抛光(CMP)是目前实现单晶SiC基片超精密加工的一种常用且有效方法。我们综述了单晶SiC基片化学机械抛光加工的研究现状,根据加工原理进行归类并分析了各种类别的优缺点及运用局限,指出了其在化学机械抛光领域的发展前景。      

5-axis Control Ultra-precision Machining of Complex-shaped Mirrors for Extreme Ultraviolet Lithography System

The study deals with the manufacture of novel mirrors, an arc-shaped fly-eye mirror and a rectangular fly-eye one, for an extreme ultraviolet lithography system. Both mirrors have a complex reflective surface consisting of many small spherical mirror elements. A method is proposed to accurately realize such mirrors, using ultra-precision 5-axis control machining. The method enables to manufacture spherical surfaces with any radius, without changing the tool shape. Furthermore, another advantage of the method is that the sphericity of the resulting surfaces is independent of tool shape accuracy. By using this method, two kinds of fly-eye mirror with sixteen mirror elements are successfully fabricated.     

基于ELID磨削WC-Co硬质合金表面机械研抛研究

本文采用ELID磨削和机械研磨抛光复合技术,对WC-Co硬质合金表面进行了超精密加工实验研究。首先采用ELID磨削对WC-Co硬质合金表面进行预加工,获得表面粗糙度Ra18 nm的精密加工表面。在此基础上对其进行机械研磨抛光加工,研抛盘转速设定为150～200 r/min,研抛压力控制在0.2～0.5 N/cm2范围;机械研抛时,首先采用含W1金刚石磨粒的研抛液,对ELID磨削后的表面进行加工100min左右,以达到快速去除的目的。再用含W0.5金刚石磨粒的研抛液,进行机械研抛约100 min,最后获得Ra4 nm的超精密表面。同时,针对机械研磨抛光过程,本文深入研究了磨料种类、粒度、抛光液溶剂、研抛压力、研抛加工时间等因素对加工表面粗糙度的影响。     

增材制造金属零件抛光加工技术研究进展

金属增材制造在航空航天、医用植入等领域有良好的应用前景,但成型表面质量差,未经后处理加工无法满足高使役性要求,抛光加工是高性能金属增材制造技术链中的关键环节。概述了增材制造金属零件应用现状和生长过程固有的阶梯效应、球化效应、粉末粘附等特性,以及成型表面高粗糙度等形貌特征。在此基础上,重点综述了增材制造金属零件抛光加工中应用较广的电化学、激光、磨料流三种抛光技术的研究进展,以不同制造工艺、不同金属粉末材质、不同结构形式(多孔结构、高长径比流道等)的增材制造样件为主线,通过表面粗糙度、材料去除、表层残余应力、廓形精度保持性等技术指标,对增材制造金属零件抛光加工研究成果进行了归纳总结。最后展望了增材制造金属零件抛光技术的发展方向。     

Modeling of dynamic characteristic of the aerostatic bearing spindle in an ultra-precision fly cutting machine

Axis orientation stability of aerostatic bearing spindles has great influence on machining precision of ultra-precision fly cutting machines used for processing ultra-precision optical components of large diameter. Mid-spatial frequency errors (amplitude<0.1 μm, wavelength about 100 nm) always existed on the machined surfaces along feeding direction. Generally, the waviness errors on processed surfaces will impact the performance of workpiece used as optical components greatly, and the tilting motions of spindles were believed to be the main source which produced the waviness errors. In this paper, to study the tilting motions of spindles, the Euler dynamic equations of angular displacements of spindles were proposed, and analytic solutions of the equations were also presented. At the same time, the 3D surface profile simulations of workpieces based on analytic solutions of Euler equations were achieved. The simulation results have been verified by lots of experiments on an ultra-precision fly cutting machine. At last, the inertia tensor criterion which can decrease the waviness errors of machining surface was represented, and it can be applied to instruct the structure design of aerostatic bearing spindles.     

Semi-active joint for ultra-precision positioning using sliding/rolling bearings

A novel semi-active joint for connecting mechanical (i.e., sliding/rolling) bearings or guideways to an ultra-precision motion stage is presented. The semi-active joint enables the benefits of bearing/guideway friction on in-position stability while avoiding its adverse effects on rapid ultra-precision positioning. The joint is equipped with solenoids that switch its stiffness from low, during settling, to high once the stage gets into position. A two-step scheme is implemented to mitigate adverse effects of switching on positioning performance. Experiments demonstrate up to 81% and 60% improvements in settling time and in-position stability, respectively, compared to cases with solely low- or high-stiffness joints.