金刚石工具用Ni-Co合金粉末的制备及表征

在金刚石工具领域,纯钴基以及钴基金刚石工具具有优良的使用性能,但钴价格很高,使纯钴基以及钴基金刚石工具的使用受到了限制,所以代钴研究具有重大的实际意义.镍和钴同属于过渡族元素,两者物理和化学性质非常接近,故镍代钴有一定的可行性.采用草酸盐共沉淀法得到前驱体,然后将前驱体煅烧还原的工艺制得Ni-Co预合金粉末;对前驱体进行了X射线、热(差热和热重)分析,结果表明,通过共沉淀法得到的前驱体是固溶体;对预合金粉末进行了性能表征,所制得的Ni-Co预合金粉末氧含量低,形貌近似球形,粒度均匀;通过共沉淀反应前的成分设计,可制备出成分含量连续变化的预合金粉末;通过改变制备工艺参数,可制取不同粒径的粉末.本实验的粉末成分设计是70Ni-30Co(wt%).     

50Mn2V金刚石锯片激光焊接过渡层粉末的研制(下)

介绍了自主研发的A激光焊接过渡层粉末的设计性能指标、制备方法和基本参数,测试了A粉末烧结试样块的机械性能,检测了A过渡层、国外某公司过渡层与50M n2V钢基体的激光焊接强度。焊接强度测试结果表明:在780℃~880℃常用烧结温度范围内,A过渡层可以与不同的工作层配合使用,比国外某公司过渡层具有更高的安全性和稳定性,焊接强度达到并超过BS En13236:2001安全标准。A激光焊接过渡层粉末可以替代国外进口的激光焊接过渡层粉末。     

50Mn2V金刚石锯片激光焊接过渡层粉末的研制(上)

介绍了自主研发的A激光焊接过渡层粉末的设计性能指标、制备方法和基本参数,测试了A粉末烧结试样块的机械性能,检测了A过渡层、国外某公司过渡层与50M n2V钢基体的激光焊接强度。焊接强度测试结果表明:在780℃~880℃常用烧结温度范围内,A过渡层可以与不同的工作层配合使用,比国外某公司过渡层具有更高的安全性和稳定性,焊接强度达到并超过BS En13236:2001安全标准。A激光焊接过渡层粉末可以替代国外进口的激光焊接过渡层粉末。     

激光焊接锯片过渡层配方的选择与研究

从激光焊接锯片的工艺特点出发,探讨了影响过渡层配方选择的有关因素,结合激光焊接锯片生产实践,研制出几种在生产上行之有效的过渡层配方,促进了我国激光焊接锯片技术的发展.     

铁铜类预合金粉末应用于热压金刚石钻头的试验研究

介绍铁铜类预合金粉末应用于金刚石钻头胎体中的试验研究,通过一些基础试验验证其可行性,并经过试制钻头进行钻进试验,证明加入FeCuNi、FeCuCo类预合金粉末的钻头综合性能得到很大提高,为预合金粉末应用于钻头胎体提供了借鉴。     

预合金粉末对金刚石石材锯片性能的影响

分别使用预合金粉末和单质粉末作为胎体制成锯片,使用公司切割平台测试二种胎体的锯片,分别切割红色花岗岩和黑色花岗岩.预合金胎体的锯片锋利度和寿命都要好于单质粉末胎体的锯片,基本提高10％以上,寿命也基本提高15％以上.通过光学显微镜和扫描电子显微镜观察锯片刀头侧面和胎体断口,可见使用预合金粉末的胎体金刚石出露充分,断口微...     

添加组分对LFP全预合金粉末性能的影响

文章以合金粉末烧结体的密度、硬度、抗弯强度为判据,进行烧结曲线实验,分别研究添加还原铁粉、铁铜合金粉、磷铁、锌粉对LFP全预合金粉末性能的影响,探讨不同方法生产的粉末在金刚石工具胎体配方中的协同作用,为更好使用预合金粉末提高金刚石工具性能提供了一些有益的实验支持.     

预合金粉末在冷压烧结制品中的应用

旨在探索预合金粉末在冷压金刚石烧结锯片中的应用。通过实验来证明预合金粉末的加入可以提高锯片胎体的致密性和抗弯性能，从而提高锯片的安全性能，使锯片切割更锋利，寿命更长。     

超硬材料工具用金属预合金粉末的国内发展现状及趋势

文章概要总结了超硬材料工具用金属预合金粉末的种类、制备方法、性能特点、应用范围、存在不足及发展趋势.金属预合金粉末的推广应用是行业的发展趋势,今后将向着多元化、细颗粒、高活性、低松比、高弹性模量的方向发展.     

并流共沉淀法制备铜锡镧复合预合金粉末的研究

文章研究了Cu2+,Sn2+,La3+,OH-,C2O24-,Cl-,H2O体系中金属离子的分布特点、变化规律及pH值对Cu-Sn-La共沉淀过程的影响。本次实验的目标是制备Cu84.5Sn15La0.5预合金粉末。通过ICP-AES法测定了Cu-Sn-La预合金粉末前驱体的沉淀率。在空气气氛中铜锡镧复合氢氧化物煅烧成铜锡镧复合金属氧化物;在氢气还原气氛中,铜锡镧复合金属氧化物被还原为Cu84.5Sn15La0.5预合金粉末。用X射线衍射仪(XRD)分析其物相组成,扫描电子显微镜(SEM)观察其形貌特征。结果表明,通过共沉淀反应前的设计,可以控制预合金粉末的成分。     

深孔钻头激光焊接基体材料的优选研究

以NEXT300粉冶结块与几种基体材料在相同参数下对焊的形式,进行了金刚石工具激光焊接模拟实验.根据接头失效分析,对四种基体材料焊件进行了抗拉、抗弯与冲击试验,对比试验结果进行优选.实验结果表明,在相同焊接工艺条件下,四种基体材料（S136、30CrMo、45MnMoB、45#钢）中,30CrMo同NEXT300结块激光焊接与综合力学性能最好.     

半导体加工用金刚石工具现状

总结分析了国内半导体加工用金刚石工具的发展现状.指出了国产与进口半导体加工用金刚石工具的差距,分析了产生差距的主要原因.认为需要国内企业从人员、设备、原料、环境、工艺等多个角度系统性提高产品质量和稳定性,也需要加强半导体产业上下游企业的沟通、配合,加强产学研合作,逐步提高我国半导体产业金刚石工具的整体技术水平,突破半导...     

Adhesion measurements of non-crystalline diamond films prepared by a laser plasma discharge source

Films of amorphic diamond can be deposited with a laser plasma discharge source of multiply-charged carbon ions in an ultrahigh vacuum (UHV) environment without the use of any catalyst in the growth mechanism. The beam from a pulsed Nd-YAG laser is focused at very high power densities onto a graphite feedstock and the resulting plasma ejects carbon ions carrying keV energies through a discharge space to the substrates to be coated. The high energies of condensation produce interfacial layers between the films and substrate materials, resulting in levels of adhesion which can support the protection of fragile and sensitive substrates subjected to harsh environmental conditions. Coatings of 2-5 μm thicknesses have extended the lifetimes of substrate materials such as Si, Ti, Ge, ZnS, and stainless steel against the erosive wear from high-speed particles and droplets by factors of tens to thousands. In this paper, we give details of the adhesion and mechanical properties of amorphic diamond films. Emphasis is placed on the quantitative methods to assess and measure the adhesion of films to a variety of substrates. Parameters such as the bonding of the films are examined by Rutherford backscattering spectrometry and nanoindentation techniques. Resistances to wear and debonding are estimated with a modified sand blaster which simulates erosive environments.     

Novel pretreatment of hard metal substrate for better performance of diamond coated cutting tools

A surface engineering approach for a novel pretreatment of hard metal tool substrate for optimum adhesion of diamond coatings is presented. Firstly, an alkaline solution was used to etch the WC grains to generate a rough surface for better mechanical interlocking. Subsequently, surface Co was removed by etching in acid solution. Then the hard metal substrate was boronized to form a compound interlayer which acted as an efficient diffusion barrier to prevent the outward diffusion of Co. Novel nano-microcrystalline composite diamond film coatings with a very smooth surface was deposited on the surface engineering pretreated hard metal surface. Promising results of measurement in adhesion strength as well as field cutting tests have been obtained.     

原料预合金化对微波无压烧结金刚石工具性能的影响

以Fe₆₀Cu₄₀预合金粉和单质粉为基础原料,利用微波无压烧结在850 ℃制备了FeCu/WC基金刚石复合材料刀头。通过探讨物料在微波场中的升温特性设计了微波无压烧结制度。采用扫描电子显微镜（SEM）、万能试验机、激光拉曼光谱等表征手段,对比研究了预合金粉和单质粉微波烧结样品的组织形貌等微结构信息,并获得了样品的硬度、致密度、横向断裂强度等力学性能。结果表明,与常规烧结方法相比,微波强化烧结可将温度降低至900 ℃以下,金刚石颗粒没有出现石墨化转变;FeCu/WC基配方在850 ℃微波烧结样品的洛氏硬度、相对致密度、横向断裂强度分别达到102.7 HRB、98.5%、1 035 MPa。并对微波烧结的强化机制和原料预合金化对于基体的增强机理进行了初步探讨,微波无压烧结对于预合金粉体金刚石刀头的制备表现出良好的应用前景。     

Grain boundary effect on the superconducting transition of microcrystalline boron-doped diamond films

Microcrystalline boron-doped diamond (BDD) films were prepared on silicon substrates by hot-filament chemical vapor deposition method. Different grain sizes of the boron-doped diamond films with nearly the same boron concentration were obtained by changing the nuclei concentration on the silicon substrates. The electrical transport behaviors of as-prepared boron-doped diamond films were measured, and the results revealed that with the increase of the grain sizes on the BDD films, the superconducting transition temperature was evidently increased. This phenomenon indicates that the superconducting transition of microcrystalline BDD films is influenced by the inhomogeneity aroused by the grain boundary effect. Our results could expand our understanding of the superconducting mechanism of microcrystalline BDD films, and are also significant to conventional applications of BDD materials.     

关于金刚石微粉强度问题探讨

拉曼光谱通过测定金刚石微粉颗粒的晶体结构及内部缺陷和杂质含量评价微粉强度品级,是一种科学、有效、能快速检测金刚石微粉强度品级的方法.根据拉曼光谱测定金刚石微粉强度品级,研究了金刚石微粉强度与金刚石单晶原料强度、金刚石原材料的合成时间、微粉生产工艺和微粉表面处理工艺之间的关系.结果表明,金刚石微粉的强度虽然与原材料强度品...     

金刚石地质钻头制造工艺新技术的应用与发展

分析了金刚石有序排列与激光焊接新工艺技术的特点,在此基础上,就其如何用于制造新型金刚石地质钻头做了具体的阐述。包括,调整产品结构尺寸、革新工艺流程,确定工艺参数（并列迷新旧工艺对比）以及使用性能考核,等等。研制实践及结果表明,采用新工艺技术,不仅提高了新型地质钻头的综合使用性能与生产效率,并可获得节能、省材与降低成本等综合技术经济效益。