UV固化炉反光罩及风冷系统的研究

主要介绍UV固化设备制作的反光罩系统及冷却系统。通过合理设计UV反光罩系统及风冷系统来实现低温高光强的UV固化,着重分析了反光罩结构、风路设计等关键因素,提供实现高温固化的解决方案,对UV固化工艺及设备开发具有很好的参考价值。     

晶圆切割中背面崩裂问题的分析

半导体技术不断发展,越来越多的新材料、新工艺应用在晶圆制造中。这对封装核心工序的划片工艺提出了很大挑战。在划片工艺中背面崩裂的控制是一个难点。文章主要是从工艺材料、工艺条件、划片刀以及设备四方面分析产生背面崩裂的主要因素以及优化方法。同时介绍了两种控制背面崩裂较有效的切割工艺：减少应力的开槽切割工艺和DBG工艺。     

缓冲光纤的制造开发

业已开发出缓冲光纤生产线部件，以便于现有工厂设备的升级，生产出各种结构的新型缓冲光纤。开发有效制造工艺的关键是部件的设计，其中包括大型加热进料容器和软管、确保优异同心度的刀具、高速固化厚壁涂层的UV容量以及快速启动和快速变换颜色技术。结果证明，丙稀酸盐涂层／UV固化工艺可以提供改进的产品性能，并且能补充普通挤出工艺。在某些情况下，它甚至可以取代较低速度的挤出工序。     

工程中光纤脱色现象的分析

1 光纤的着色工艺及纤序 成品光纤一般为无色(自然色)紫外光(UV)固化涂覆光纤.在制备松套管或骨架式光纤单元时,进入松套管或骨架槽道内的光纤一般为2～12根.为了在光纤接续、成端、使用时能识别其纤序,光纤成缆前要在一次涂覆光纤上进行着色,着色层的厚度约为3 μm.一次涂覆光纤的固化着色工艺有热固化和光固化两种.热固化着色工艺对温度较敏感,易出现着色固化程度不够;而UV固化工艺,只要控制好UV的强度和固化时间就可很好地完成光纤的着色.因此,一些著名企业基本上都采用UV固化着色工艺.     

硅晶圆复合划片工艺研究

砂轮划片和激光划片是硅晶圆的两种主要划片方式,从理论和工艺试验两个层面,分析了两种划片工艺的优缺点,提供了一种适合硅晶圆划片的砂轮与激光复合划片工艺方案,给出工艺参数和测量数据,具有很好的工程应用价值。     

圆片等离子划片工艺及其优势

等离子划片是近年来兴起的一项新型圆片划片工艺。与传统的刀片划片、激光划片等工艺不同,该工艺技术可以同步完成一张圆片上所有芯片的划片,生产效率明显提升,是对现有划片工艺的一个颠覆。介绍了圆片划片工艺的工作原理、技术特点及其优势,并对其在解决圆片划片应用中的典型问题和不足之处进行了讨论。     

硅片划片加工

<正> 硅片制备后经过一系列半导体工艺,制成规则排列的器件。最后采用划片工艺,将器件切割分离,供线焊封装。划片方法有划裂、激光划片、金刚石划片。古老的划裂法无法得到整齐切缝,致使高速粘片机无法准确取放,并常常伴有裂纹倾向。划裂后还要作第二步裂片,生产率低。激光划片速度很快,但是设备投资、维修费用很高,划片中     

划片机视觉识别系统设计原理分析

自动对准技术是集成电路后封装设备中的一项重要单元技术,是全自动划片机与普通划片机的最大区别之一。国际上主要划片机制造商的全自动设备都配有实时高效的图像识别对准单元。作为提高其设备性能的一种有力手段,长期以来在划片机的研制过程中我们已逐渐形成了适合划片机应用的视觉识别技术,取得了显著的阶段性成果。     

高速光纤着色的最新进展

为了提高生产能力和提供生产各种各样优质产品的灵活性，耐世隆公司开发了一种高速着色／上引涂敷生产线。该论文旨在叙述生产线关键部件的设计以实现3000米／分钟的着色工艺。即坚固的机械和电气设计，结合优化的着色模具、改进的UV固化灯系统、UV监测仪器以及增加后的纤盘尺寸，得以完成快速启车、生产长长度光纤。其结果显示具有明显的生产能力提高。     

HumiSeal推出创新型可固化敷形涂料

HumiSeal宣布推出其性能范围超越了现有紫外（UV）可固化产品的新型UV40UV可固化敷形涂料。UV40是诸如汽车和消费类电子制造商等要求UV产品具备快速固化能力，但又要求其当前涂料具备易处理性的高产量用户的理想选择。UV40保留了当今电子制造所需的固化速度和环境友好的化学品，并提供了现有UV可固化产品所不具备的优势。     

A wafer-level hermetic encapsulation for MEMS manufacture application

In order to simplify the processing complexity and cut down the manufacturing cost, a new wafer bonding technique using ultraviolet (UV) curable adhesive is introduced here for microelectromechanical systems (MEMS) device packaging and manufacturing applications. UV curable adhesive is cured through UV light exposure without any heating process that is suitable for the packaging of temperature-sensitive materials or devices. A Pyrex 7740 glass is chemically wet etched to form microcavities and utilized as the protection cap substrate. After a UV-curable adhesive is spin-coated onto the glass substrate, the substrate is then aligned and bonded through UV light exposure with a device substrate below. Electrical contact pad opening and die separation are done simultaneously by dicing. Two different testing devices, a dew point sensor and capacitive accelerometer, are built to evaluate the package strength and hermeticity. After the dicing process, no structural damage or stiction phenomenon is found in the packaged parallel capacitor. The acceleration test results also indicate that the package using the Loctite 3491 UV adhesive with 150 /spl mu/m bond width can survive more than 300 days at a 25/spl deg/C and 100% relative humidity working environment.     

ADT7100划片机的使用和维护

划片是电子器件封装工艺中重要的工艺之一,是将一整片晶圆切割成每个独立的个体,芯片切割的质量直接影响封装的质量和器件的性能。划片机有SAW类型的划片机,还有激光划片机。作者多年以来一直从事划片工艺,现对在用的ADT7100机器的结构、维修和维护作介绍,同时简单分析划片工艺。     

晶圆划切工艺与优化

在研究晶圆划片机划切工艺的基础上,分析了划切的质量缺陷和划切质量评估矩阵,阐述了影响划切质量的诸多因素。介绍了划片刀、承载薄膜、划切模式、划切冷却水的添加剂和划切参数的选择对划切质量的影响,通过对以上5个方面的优化来达到优化工艺的目的,同时还提出了将砂轮划片和微水导激光划片相结合的新划切工艺。     

浅析砂轮划片机划切工艺

介绍了砂轮划片机的划切原理以及砂轮刀具的构成,并对影响划切品质的因素进行了分析,结合以往实验结果,得到了砂轮划片机的常规划切工艺,既通过优化划切参数和对刀片的选择,达到减小崩裂,提高划切品质的效果。     

紫外激光在精细加工中的应用研究

论述了紫外激光加工原理,分析了其优缺点.并使用紫外脉冲激光对LTCC生瓷片、蓝宝石晶圆片、太阳能单晶硅片等材料进行了初步的激光划切工艺实验,得到了对这些不同材料加工的一些工艺参数.     

Analytical stress characterization after different chip separation methods

Synchrotron white beam X-ray topography (SXRT) and photoelastic stress measurements were used to characterize resulting strain fields after mechanical dicing and laser grooving of bare silicon wafers. The distribution and propagation of the strain fields can be characterized by both methods. In contrast to mechanical dicing, the laser grooving process creates an inhomogeneous strain field. The influenced area is three times larger compared to mechanical dicing. The effect of the dicing procedure on the resulting mechanical fracture strength of the silicon chips was investigated by 3-point bending tests. The fracture strength of samples with an additional laser grooving process was significantly reduced under tensile load. The fracture pattern of the samples indicated that the strain field generated by the separation process causes initial points for μ-cracks propagation under mechanical load. This analysis can help to optimize dicing processes in order to attain a better reliability of chips with regard to process yields.     

金刚刀划片过程中的崩缺问题应对方案

本文针对金刚刀划片崩缺问题,对比双刀划片和单刀划片试验,分析了崩缺产生的原因,提出了窄划片槽晶圆金刚刀划片崩缺问题的应对方案。金刚刀划片采用双刀划片降低崩缺风险优于单刀划片工艺,双刀划片刀宽度越窄有利于降低崩缺,第一刀切深1/3厚度有利于降低崩缺风险。     

乙醇辅助激光烧蚀切割硅晶圆工艺

为了减小激光切割硅晶圆时的热效应,选择去离子水作为辅助液体进行激光切割实验,研究了水下切割时激光烧蚀激发气泡对硅片表面造成的不良影响。为解决水下激光切割进程中诱导气泡大面积粘结在硅片表面的问题,提出了去离子水混入乙醇溶液的实验方案,分析了水下激光切割中激光参数和乙醇浓度对切割质量的影响。实验结果表明,采用乙醇溶液作为辅助介质能明显减少粘结气泡的数量,减轻气泡破溃冲击带来的负面影响。实验采用乙醇浓度5 wt.%时切割得到的硅片比纯水中切割得到的硅表面影响区减小50%以上、切缝宽减幅约20%,有效提升了激光切割质量。     

300-mm Low-${hbox {k}}$ Wafer Dicing Saw Development

With the further shrinking of IC dimensions, low- material has been widely used to replace the traditional SiO interlayer dielectric (ILD) in order to reduce the interconnect delay. The introduction of low- material into silicon imposed challenges on dicing saw process. ILD and metal layers peeling and its penetration into the sealing ring of the die during dicing saw are the most common defects. In this paper, the low- material structure and its impact on wafer dicing were elaborated. A practical dicing quality inspection matrix was developed to assess the cutting process variation. A 300-mm CMOS90-nm dual damascene low- wafer was chosen as a test vehicle to develop a robust low- dicing saw process. The critical factors (dicing blade, index speed, spindle speed, cut in depth, test pattern in the saw street, etc.) affecting cutting quality were studied and optimized. The selected C90 Dual damascene low- device passed package reliability tests with the optimized low- dicing saw recipe and process. The further improvement and solutions in eliminating the low- dicing saw peeling were also explored.