一种适用于无铅BGA的返修方法

随着高密度电子组装的发展,BGA的面积越来越大,引脚数不断增加,广泛地应用到PCB的组装中,从而对电子组装工艺提出了更高的要求,特别是对于无铅BGA的返修.因为BGA返修台是一个相对开放的系统,而且无铅焊接需更高的温度,因此需要更高的工艺要求才能保证BGA的返修质量.从无铅焊接工艺和BGA返修台结构的角度,介绍了一种适用于BGA返修的方法.     

OK国际的全新先进返修解决方案超越行业期望

生产组装领域焊接工具及设备的全球领先供应商OK International公司近日宣布,其全新的Metcal Scorpion返修系统自上市以来受到了行业的广泛好评和高度关注,并荣膺了2012年EM Asia返工/返修系统类创新奖。模块化Metcal Scorpion返修系统自2011年Productronica电子展首次亮相以来,得到了全球业内人士的广泛好评。     

红外返修系统应对返修新挑战

电子元器件的返修依然是现代工厂生产管理人员必须要面对的事情,即使通过高精度机器和良好质量保证手段获得了稳定提升的生产质量,但这也无法完全消除返修。因此,让返修更可靠安全将会是非常关键的。红外返修系统选择了波长范围在2μm-8μm的暗红外辐射器,辐射器的吸收/反射率专门为PCB装配和返修优化设计过,因此温度差几乎接近于零。在回流过程中,小元件和大元件的热分布都是一致的。通过选择合适的温度曲线和优化的预热时间降低大尺寸BGA元件和一个相邻小尺寸片式元件的温度差。红外返修系统采用了能完全保护热敏感器件的先进技术。红外辐射器能被热阻带或者铝薄片屏蔽,因此能确保相邻片式元件的焊点温度低于它的熔点。正因为红外返修系统具有这么多优点,因此可以确信红外返修系统将被更多采用以保证电子元器件的返修质量。     

Finetech参展NEPCON China 2011——在德国展团展示其高端返修设备

<正>德国老牌高端返修设备制造商Finetech公司,将在NEPCON China 2011展示两款用于专业返修应用的返修系统。     

BGA的返修工艺与技术

随着BGA封装的发展和广泛应用,其将成为高密度、高性能、多功能封装的最佳选择.由于BGA特殊的封装形式,焊点位于封装体底部,需要专门的返修设备进行返修.以PBGA和CBGA为例,结合实际返修过程中的经验,对返修过程中应注意的问题进行分析,以提高BGA的返修质量.     

OK国际全新MRS-1000模组返修系统致力提高生产力

<正>OK国际已推出其新的MRS-1000模组返修系统。作为BGA/CSP和SMT元件拆除和置放的对流返修系统,该模组返修系统结合最先进的装配技术,扩充应用能力并进一步提高生产力。     

BGA返修和返修工作站

介绍了BGA的返修内容和一种BGA返修工作站.对BGA返修工作站的技术特点、温度控制、热风控制进行了较详细的介绍.作为电子装联生产线的末端设备,能够安全地对产品进行返修是最关键的,从返修的过程分析了如何提高返修操作的安全性,保证这项工作的意义,在保证安全的同时提供最大的方便性.     

热耗散组件的通孔返修

当较大的热耗散组件上的通孔元件需要返修时，现有的手工返修方法极易损坏这些昂贵组件上的易碎的孔壁，掩膜和焊盘。为此开发了一种新的返修方法，计算机控制温度、时间、焊料和预加热器的返修方法。一个热气系统用来在拆焊前从孔壁上去除焊料，用这种新的方法成功地进行通孔元件的返修需要四个步骤：预热，元件去除，元件插装和重焊，本文对这一新的返修技术进行了详细的介绍。     

OK国际推出全新的MRS-1000系统升级版

OK国际日前宣布推出全新的MRS-1000模块化返修系统升级版，在原有的基础上进行了多重升级。这个MRS-1100A新系统增添了独立的电路板支架，并配备可伸缩的工具支架，提升了整个返修系统的生产力优势，更有效地在电路板上拆除和更换BGA／CSP和SMT元件。     

Finetech参展NEPCONChina2010-在德国展团展示其高端返修设备

Finetech，德国老牌高端返修设备制造商，将在NEPCONChina2010西馆二层德国展团2D13-A号展位展示用于专业返修应用的热风返修系统。     

无铅BGA返修工艺方法

总结了无铅BGA返修的工艺特点、技术要求和温度曲线设置方法;介绍了一种暗红外返修系统的结构与性能特点;结合实际工作详细描述了某航天产品无铅BGA返修的实施工艺,重点阐述了返修时高可靠性的实现方法;从而验证了基于此设备的工艺方法对于无铅BGA返修的有效性。     

Development of reworkable underfills, materials, reliability andprocessing

The rework of packages is a standard practice in surface mount technology (SMT) assembly. The reasons for rework include process yields, failed parts, and field returns. The implementation of flipchip has been hindered by the lack of reworkability following underfill cure. Current commercial underfills do not allow for the rework of the flipchip. The development of a reworkable underfill is described in this paper. The materials selection process, information on the process for rework as well as pertinent reliability data are described     

CCGA器件的可靠性返修

介绍了CCGA器件返修过程中需要注意问题及其原因,有助于规范CCGA器件的返修过程,减少对单板和器件的损伤,从而提高产品的长期可靠性.     

成功的BGA返修

本文主要叙述了BGA封装返修工艺过程及其在返修过程中需要注意的一些问题,诸如热循环数目、预热、热风回流焊、粘附热电偶、热特性、工艺过程改进、BGA封装的构造及操作者的经验等。从而说明恰当地使用返修设备和履行工艺过程对成功的BGA返修的重要性。     

Forensic Project Management: An Exploratory Examination of the Causal Behavior of Design-Induced Rework

The determination as to why projects fail to meet planned schedule, cost, and quality parameters is a leitmotiv within the construction, engineering, and project management literature. Yet, the interrelatedness and behavior of key factors that influence these project performance indicators, particularly regarding design-error-induced rework, have received limited academic examination. Design-induced rework has been reported to contribute more than 70% of the total amount of rework experienced in construction and engineering projects. To address this situation, a forensic management approach to determining how and why rework occurred in a commercial construction project is undertaken. Using findings from this case study along with knowledge from the literature, a systemic causal model for design-error-induced rework is developed. Underlying behavioral dynamics that contributed to design errors (principally related to the management of the design documentation process) were modeled and simulated using system dynamics. The results of such an analysis yield insights about architectural and engineering professionalspsila decision-making and work practices that can influence the occurrence of design errors. The mitigation of design-induced errors would significantly reduce the amount of rework that architectural and engineering firms experience. This would bring with it greater profitability for such firms and improved project performance parameters (schedule, cost, and quality).     

BGA返修工艺

表面组装技术(SMT)的应用是电子装联时代的一场革命,随着电子装联的小型化、高密度化的发展,随着无铅焊接工艺的应用,相关的焊接工艺和返修工艺受到了越来越多的挑战.对BGA的种类和封装材料特性做简要说明,重点阐述BGA的返修步骤以及各步骤的具体操作方法.特别介绍了返修工艺中BGA的植球方法以及BGA重整锡球技术的应用.对BGA的返修有针对性地施加一些措施,对相关的返修工艺制程进行改良,寻求一种最佳的工艺方案,有效地抑制缺陷的产生.     

Reliable Lead-Free Rework Process for Stacked CSP Components

Memory module manufacturers face an ongoing challenge to incorporate more functionality and superior performance with each new generation of product offering. The growth in demand for memory capacity is surpassing the pace at which memory component manufacturers are able to cost-effectively produce the next generation of monolithic memory devices. This drives the need for utilizing stacked components for memory module assemblies. The complex nature of stacked chip-scale package (CSP) components coupled with a lead-free process presents unique rework challenges that needed to be studied and addressed. Reworking a CSP is complicated as the solder joints are hidden underneath the component. The process window available for the lead-free rework process is very narrow. There are number of other critical factors, which complicate and affect the repeatability of the rework process. The complications only increase with the use of stacked CSP devices. The rework of package stacked CSP components, which are complex in nature, is a daunting task. The key issues and observations with regard to the issues and challenges associated with the lead-free rework of mirror-imaged package stacked CSP components has been presented in this paper. In addition, the paper also provides a recipe for reliably reworking these packages.