W/Cu和W/C涂层的循环热负荷实验

用等离子体喷涂和热压方法制作了W /Cu梯度功能材料和W /C涂层 ,其中W/C涂层具有多层的钨 (W )、铼 (Re)扩散阻挡势垒。为了试验这些复合材料能否经受聚变等离子体破裂时的高热负荷 ,用大功率ND :YAG激光进行了模拟实验。结果表明 :在 1 0 0～ 4 0 0MW /m2 的瞬时 (脉冲宽度为 4ms)热负荷作用下 ,经过 2 0 0～ 70 0次热循环 ,未发现W /Cu复合体的开裂。其中在 1 2 3MW /m2 的功率密度下作用70 0次后 ,发现等离子体喷涂试样表面的再结晶现象和严重的晶界腐蚀 ,由于激光的冷效应 ,晶粒生长的趋势并不明显 ,再结晶层的晶粒呈垂直于表面的柱状结构。W/C试样的退火实验表明 ,钨涂层的再结晶温度稍高于 1 4 0 0℃。在更高的功率密度下 (3 98MW /m2 )出现了明显的腐蚀坑 ,坑内呈疏松的蜂窝结构 ,坑的边缘形成了沉积区 ,能谱分析表明沉积区集聚了大量的金属杂质。等离子体喷涂试样比热压试样更易产生晶界的断裂和裂纹。在同等的热负荷条件下 ,W /CuFGM的质量损失低于石墨材料     

Design and evaluation of an optimized W/Cu interlayer for W monoblock components

Divertor plasma-facing components of future fusion reactors should be able to withstand heat fluxes of 10-20 MW/m² in stationary operation. Tungsten blocks with an inner cooling tube made of CuCr1Zr, so-called monoblocks, are potential candidates for such water-cooled components. To increase the strength and reliability of the interface between the W and the cooling tube of a Cu-based alloy (CuCr1Zr), a novel advanced W-fibre/Cu metal matrix composite (MMC) was developed for operation temperatures up to 550 °C. Based on optimization results to enhance the adhesion between fibre and matrix, W fibres (W_f) were chemically etched, coated by physical vapour deposition with a continuously graded W/Cu_PVD interlayer and then heated to 800 °C. The W_f/Cu MMC was implemented by hot-isostatic pressing and brazing process in monoblock mock-ups reinforcing the interface between the plasma-facing material and the cooling channel. The suitability of the MMC as an efficient heat sink interface for water-cooled divertor components was tested in the high heat flux (HHF) facility GLADIS. Predictions from finite element simulations of the thermal behaviour of the component under loading conditions were confirmed by the HHF tests. The W_f/Cu MMC interlayer of the mock-ups survived cyclic heat loads above 10 MW/m² without any damage. One W block of each tested mock-up showed stable thermal behaviour at heat fluxes of up to 10.5 MW/m².     

Atomic Diffusion Behavior in W/Cu Diffusion Bonding Process

Tungsten and copper are critical materials which are used in the nuclear fusion reactor, however thermal stresses would produce at the bonding interface during W/Cu bonding and service. Diffusion layer of diffusion bonding is similar to functionally graded materials, so the thermal stresses of W/Cu bonding can be reduced by the diffusion bonding. The process of W/Cu diffusion bonding was simulated by molecular dynamics, atomic diffusion behavior of W/Cu diffusion bonding was studied, diffusion coefficient and radial distribution function were obtained. Diffusion mechanism of W/Cu diffusion bonding is that diffuses along the defects surface of crystal, thickness of diffusion layer and disordered degree of atoms rose when the temperature and diffusion time are increased.     

Preparation and properties of CVD-W coated W/Cu FGM mock-ups

Tungsten was coated on a W/Cu functionally graded material (FGM) by chemical vapor deposition technique (CVD), and then the tungsten coated tile was brazed on the CuCrZr heat sink with a cooling channel. The thickness of CVD-W was 2 mm deposited by a fast rate of about 0.7 mm/h. The features of the CVD-W coating including morphology, element composition and thermal properties were characterized. A tungsten coating with high density, purity and thermal conductivity is achieved. The bonding strength between the CVD-W layer and FGM was measured using bonding tensile tests. Thermal screening and fatigue tests were performed on the CVD-W mock-ups under fusion relevant conditions using an electron beam device. Experimental results showed that the CVD-W mock-up failed by melting of Cu beneath the tungsten layer under a high heat load of 14.5 MW/m² and 30 s pulse duration. Thermal fatigue tests showed that the CVD-W mock-up could sustain 1000 cycles at a heat load of 11.7 MW/m² absorbed power density and 15 s pulse duration without visible failure.     

Behavior of Brazed W/Cu Mockup Under High Heat Flux Loads

In order to transfer the heat from the armor to the coolant, tungsten has to be connected with a copper heat sink. The joint technology is the most critical issue for manufacturing plasma facing components. Consequently, the reliability of the joints should be verified by a great number of high-heat-flux （HHF） tests to simulate the real load conditions. W/Cu brazed joint technology with sliver free filler metal CuMnNi has been developed at Southwestern Institute of Physics （SWIP）. Screening and thermal fatigue tests of one small-scale fiat tile W/CuCrZr mockup were performed on a 60 kW electron-beam Material testing scenario （EMS-60） constructed recently at SWIP. The module successfully survived screening test with the absorbed power density （Pabs） of 2 MW/m2 to 10 MW/m2 and the following 1000 cycles at Pabs of 7.2 MW/m2 without hot spots and overheating zones during the whole test campaign. Metallurgy and SEM observations did not find any cracks at both sides and the interface, indicating a good bonding of W and CuCrZr alloy. In addition, finite element simulations by ANSYS 12.0 under experimental load conditions were performed and compared with experimental results.     

Radiation induced Be segregation in the alloy Cu/182 At ppm Be

By 3 MeV electron irradiation at 410 K the Be atom distribution in Cu/182 at ppm Be has been changed, from measurements of the interaction of self-interstitials with the Be atoms at 80 K before and after the 410 K irradiation it is concluded that this irradiation causes Be segregation. The required Be atom transport is accomplished by only one to two Frenkel defects per segregated Be atom. The amount of segregation indicates a much lower solubility than follows from thermal equilibrium data in the literature.     

Size dependent enhancement of helium ion irradiation tolerance in sputtered Cu/V nanolaminates

We have investigated the evolution of radiation damage and changes in hardness of sputter-deposited Cu/V nanolaminates upon room temperature helium ion irradiation. As the individual layer thickness decreases from 200 to 5 nm, helium bubble density and radiation hardening both decrease. The magnitude of radiation hardening becomes negligible for individual layer thickness of 2.5 nm or less. These observations indicate that nearly immiscible Cu/V interface can effectively absorb radiation-induced point defects and reduce their concentrations.     

Modeling of heat deposition on the W/Cu movable limiter in HT-7

The thermal behavior of a directly water-cooled W/Cu movable poloidal limiter was investigated in HT-7, a medium-sized superconducting tokamak with limiter configuration, major radius R = 1.22 m, and minor radius a = 0.27 m. The W/Cu movable limiter (ML) was exposed to the plasma at various radial positions at r < a. The surface and bulk temperatures were monitored by an IR-camera and the thermocouples, respectively. The heat flux deposited on the limiter was evaluated by an ANSYS code using the measured surface temperatures as boundary conditions. It was found that the maximum heat flux incident on the ML was less than 1 MW/m² in the Ohmic discharges, but reached up to 5-7 MW/m² in the discharges with lower hybrid current drive (LHCD). A simple model was developed to understand heat transport to the W/Cu ML, taking into account the “funnel effect”.     

Design optimization of plasma facing component with functional gradient material Cu/W interlayer

In the current water cooled divertor concept, tungsten is an armor material and CuCrZr is a structural material. The difference in thermal expansion coefficient between tungsten and copper alloy causes a thermal mismatch between them resulting in accumulation of stresses which would yield failure of the joint. To reduce such stresses, a functionally graded material or a graded layer is introduced between tungsten and copper alloy. A fabrication via a powder metallurgy process such as SPS (Spark Plasma Sintering) is proposed. In this work, an actively cooled component composed of a functionally graded W/Cu is simulated under high heat flux using the finite element modeling method. Thermo-mechanical behaviors, due to the existence of temperature gradient, are analyzed by a modification of the layer compositions and the number of layers. Such behaviors are evaluated to determine the optimal water cooled divertor design. It appears that the copper concentration in the interlayer defines the mechanical response. We suggest, as a conclusion, to use three layers having an optimized copper concentration to fabricate them using SPS technology.     

Numerical Simulation on Subcooled Boiling Heat Transfer Characteristics of Water-Cooled W/Cu Divertors

In order to realize safe and stable operation of a water-cooled W/Cu divertor under high heating condition,the exact knowledge of its subcooled boiling heat transfer characteristics under different design parameters is crucial.In this paper,subcooled boiling heat transfer in a water-cooled W/Cu divertor was numerically investigated based on computational fluid dynamic(CFD).The boiling heat transfer was simulated based on the Euler homogeneous phase model,and local differences of liquid physical properties were considered under one-sided high heating conditions.The calculated wall temperature was in good agreement with experimental results,with the maximum error of 5%only.On this basis,the void fraction distribution,flow field and heat transfer coefficient(HTC)distribution were obtained.The effects of heat flux,inlet velocity and inlet temperature on temperature distribution and pressure drop of a water-cooled W/Cu divertor were also investigated.These results provide a valuable reference for the thermal-hydraulic design of a water-cooled W/Cu divertor.     

Thermal analysis and tests of W/Cu brazing for primary collimator scraper in CSNS/RCS

To the transverse beam collimation system in a rapid cycling synchrotron,an important component is the primary collimator,which improves emittance of the beam halo particles such that the particles outside the predefined trajectory can be absorbed by the secondary collimators.Given the material properties and power deposition distribution,the beam scraper of the primary collimator is a0.17 mm tungsten foil on a double face-wedged copper block of 121.5 mm x 20 mm.The heat is transferred to the outside by a φ34 mm copper rod.In this paper,for minimizing brazing thermal stress,we report our theoretical analysis and tests on brazing the tungsten and copper materials which differ greatly in size.We show that the thermal stress effect can be controlled effectively by creating stress relief grooves on the copper block and inserting a tungsten transition layer into the copper block.This innovation contributes to the successful RD of the primary collimator.And this study may be of help for working out a brazing plan of similar structures.     

钨/铜界面处氢原子与空位相互作用的第一性原理计算

钨/铜界面是聚变堆偏滤器的重要连接界面,在高热流密度和强中子辐照下会成为氢同位素渗透滞留的高速通道和捕获陷阱。本文利用第一性原理方法研究了钨/铜界面处氢原子与点缺陷的相互作用,考察了氢原子的滞留行为和空位在界面处的形成行为,分析了氢原子的优先占据位置及氢原子与空位的作用机理。结果表明：在钨/铜界面中,氢原子稳定存在于钨/铜界面中间及铜晶格中;对于空位,界面附近的铜空位不稳定,会自发移动到钨/铜界面的顶端表面,而钨空位相对稳定存在;相比于铜空位,钨空位吸引氢原子的能力更强。氢原子的存在会抑制铜空位的迁移现象,从而可能形成氢泡。     

Numerical Calculation of the Peaking Factor of a Water-Cooled W/Cu Monoblock for a Divertor

In order to accurately predict the incident critical heat flux (ICHF, the heat flux at the heated surface when CHF occurs) of a water-cooled W/Cu monoblock for a divertor, the exact knowledge of its peaking factors (fp) under one-sided heating conditions with different design parameters is a key issue. In this paper, the heat conduction in the solid domain of a water-cooled W/Cu monoblock is calculated numerically by assuming the local heat transfer coefficients (HTC) of the cooling wall to be functions of the local wall temperature, so as to obtain fp. The reliability of the calculation method is validated by an experimental example result, with the maximum error of 2.1% only. The effects of geometric and flow parameters on the fp of a water-cooled W/Cu monoblock are investigated. Within the scope of this study, it is shown that the fp increases with increasing dimensionless W/Cu monoblock width and armour thickness (the shortest distance between the heated surface and Cu layer), and the maximum increases are 43.8% and 22.4% respectively. The dimensionless W/Cu monoblock height and Cu thickness have little effect on fp. The increase of Reynolds number and Jakob number causes the increase of fp, and the maximum increases are 6.8% and 9.6% respectively. Based on the calculated results, an empirical correlation on peaking factor is obtained via regression. These results provide a valuable reference for the thermal-hydraulic design of water-cooled divertors.     

Radiation tolerance tests of components for the FERMI microchip module

A project has been in progress to provide information on radiation hardness properties of components to be used in the Front End Readout MIcrosystem (FERMI) collaboration. Neutron activation studies as well as neutron and γ radiation tolerance tests have been carried out on digital circuit components, prepared with different (partly radiation hardened) technologies, using 3.7 MeV average energy neutron and ⁶⁰Co γ radiation. The test board and the irradiation conditions as well as the data acquisition and evaluation program are described.     

The Effects of Nonuniform Thermal Boundary Condition on Thermal Stress Calculation of Water-Cooled W/Cu Divertors

The thermal boundary condition has very important effects on the accuracy of thermal stress calculation of a water-cooled W/Cu divertor. In this paper, phase-change heat transfer was simulated based on the Euler homogeneous phase model, and local differences of liquid physical properties were considered under one-sided high heating conditions. The steady-state temperature field and thermal stress field under nonuniform thermal boundary conditions were obtained through numerical calculation. By comparison with the case of traditional uniform thermal boundary conditions, the results show that the distribution of thermal stress under nonuniform thermal boundary conditions exhibits tbe same trend as that under uniform thermal boundary conditions, but is larger in value. The maximum difference of maximum von Mises stress is up to 42% under the highest heating conditions. These results provide a valuable reference for the thermal stress caleulat.ion of water-cooled W/Cu divertors.     

Axial strain localization of CuCrZr tubes during manufacturing of ITER-like mono-block W/Cu components using HIP

Two forms of axial strain localization of CuCrZr tubes, i.e., cracking and denting, were observed during the manufacturing of ITER-like mono-block W/Cu components for EAST employing hot isostatic pressing (HIP). Microscopic investigations indicate that the occurrence of axial strain localization correlates to the heavily deformed Cu grains and elongated Cr-rich precipitates as well as highly anisotropic microstructures, which impair the circumferential ductility. Annealing the as-received tubes at 600 °C alleviates cracking due to partial recrystallization of Cu grains. However, the annealed tubes are still sensitive to wall thinning (caused by non-uniform polishing or tube bending), which results in denting. Denting may cause bonding flaws at CuCrZr/Cu interfaces and the underlying mechanisms are discussed. To some extent, denting seems do not affect the high heat flux performance of components. In this paper, we demonstrate that testing only the axial mechanical properties is not enough for manufacturers who use HIP or hot radial pressing technologies, especially for those anisotropic tubes.     

High heat load tests on W/Cu mock-ups and evaluation of their application to EAST device

Tungsten has been considered as the primary candidate plasma-facing materials (PFM) for the EAST device. Three actively cooled W/Cu mock-ups with an interlayer made of tungsten-copper alloy (1.5 mm) were designed and manufactured. The tungsten armors, pure sintered tungsten plate (1 mm) and plasma-sprayed tungsten coatings (0.3 and 0.9 mm), were bonded to the interlayer by brazing and depositing respectively. All mock-ups can withstand high heat flux up to 5 MW/m² and no obvious failure was found after tests. The thermal performance experiments and microstructure analyses indicated the structure of mock-ups possess good thermal contact and high heat transfer capability. WCu alloy as an interlayer can largely reduce the stress due to the mismatch and improve the reliability. The mock-up with 0.9 mm coating had the highest surface temperature than the other two mock-ups, delaminations of this mock-up were found in the near surface by SEM. The primary results show that pure sintered tungsten brazed to WCu alloy is a possible way, and thick plasma-sprayed coating technique still need to be improved.     

Radiation tolerance in a nanostructure: Is smaller better?

While previous experimental studies suggest that the presence of nanostructure is detrimental to the phase-transition resistance under an irradiation environment, we have recently found an opposite effect - nanostructure enhances phase-transition resistance. Here we analyze the change in free energy of an irradiated single-phase nanocrystalline material and explain the radiation tolerance (characterized by the resistance to phase-transition) in terms of two competing effects: (i) a smaller grain size tends to lower the free energy because the accumulation of point defects (mainly vacancies) in the grain interior is suppressed and (ii) a smaller grain size tends to increase the free energy because the area fraction of grain boundary is larger. For a two-phase nanocrystalline material, the heat of mixing between the two-phases often needs to be sufficiently positive so that the ion-beam mixing is avoided. Our analysis explains all previous experimental results where a nanostructure is found to either enhance or lower the phase-transition resistance.     

Radiation tolerance of fluorite-structured oxides subjected to swift heavy ion irradiation

Fluorite-structured materials are known to exhibit an excellent structural stability under irradiation. The radiation stability of urania and yttria-stabilised cubic zirconia single crystals submitted to intense electronic excitations induced by 944-MeV Pb⁵³⁺ ions was investigated. Various analytical tools (TEM, AFM, RBS/C, XRD) were employed to examine the modifications induced at the surface and in the crystal bulk. At low fluence irradiation leads to the formation of localised ion tracks whose centre is hollowed in the surface region over a depth of ～100 nm and to the formation of nanometer-sized hillocks. Both features are interpreted as resulting from an ejection of matter in the wake of the projectile. Track overlapping at high fluence results in the formation of micrometer-sized domains (～50 nm) in the crystal bulk characterised by a slight disorientation (～0.2°) with respect to the main crystallographic orientation of the crystal.