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1.
2.
A 5 Gb/s adaptive equalizer with a new adaptation scheme is presented here by using 0.13μm CMOS process.The circuit consists of the combination of equalizer amplifier,limiter amplifier and adaptation loop.The adaptive algorithm exploits both the low frequency gain loop and the equalizer loop to minimize the inter-symbol interference (ISI) for a variety of cable characteristics.In addition,an offset cancellation loop is used to alleviate the offset influence of the signal path.The adaptive equalizer core occupies an area of 0.3567 mm2 and consumes a power consumption of 81.7 mW with 1.8 V power supply.Experiment results demonstrate that the equalizer could compensate for a designed cable loss with 0.23 UI peak-to-peak jitter.  相似文献   

3.
An 8-Gb/s 0.3-μm CMOS transceiver uses multilevel signaling (4-PAM) and transmit preshaping in combination with receive equalization to reduce intersymbol interference due to channel low-pass effects. High on-chip frequencies are avoided by multiplexing and demultiplexing the data directly at the pads. Timing recovery takes advantage of a novel frequency acquisition scheme and a linear phase-locked loop that achieves a loop bandwidth of 35 MHz, phase margin of 50°, and capture range of 20 MHz without a frequency acquisition aid. The transmitted 8 Gb/s data are successfully detected by the receiver after a 10-m coaxial cable. The 2×2 mm2 chip consumes 1.1 W at 8 Gb/s with a 3-V supply  相似文献   

4.
A 10-20 Gb/s PAM2-4 transceiver in 65 nm CMOS   总被引:1,自引:1,他引:0  
This paper presents the design of a 10 Gb/s PAM2, 20 Gb/s PAM4 high speed low power wire-line transceiver equalizer in a 65 nm CMOS process with 1 V supply voltage. The transmitter occupies 430 × 240 μm2 and consumes 50.56 mW power. With the programmable 5-order pre-emphasis equalizer, the transmitter can compensate for a wide range of channel loss and send a signal with adjustable voltage swing. The receiver equalizer occupies 146 × 186μm^2 and consumes 5.3 mW power.  相似文献   

5.
This paper describes the design and implementation of a quad high-speed transceiver cell fabricated in 0.13-/spl mu/m CMOS technology. The clocking circuit of the cell employs a dual-loop architecture with a high-bandwidth core phase-locked loop (PLL) and low-bandwidth digitally controlled interpolators. To achieve low jitter while maintaining low power consumption, the dual-loop PLL uses two on-chip linear regulators of different bandwidths, one for the core and the other for the interpolator loop. The prototype chip operates from 400 Mb/s to 4 Gb/s with a bit error rate of <10/sup -14/. The quad cell consumes 390 mW at 2.5 Gb/s (95 mW/link) under typical operating conditions with a 400-mV output swing driving double terminated links.  相似文献   

6.
本文提出了65纳米CMOS工艺下的一种 10Gb/s PAM2, 20Gb/s PAM4高速低功耗的有线电互连发送和接收端。发送端面积为430μm × 240μm,功耗为 50.56mW。通过集成可编程的 5阶预加重均衡器,发送端可以在宽范围区间内补偿各种不同的信道损失,并且针对信道特点的不同采用相应的发送电压幅度从而降低信号发送功耗。接收端均衡器面积为146μm × 186μm,功耗为5.3mW。  相似文献   

7.
This paper presents the design of a 10 Gb/s PAM2, 20 Gb/s PAM4 high speed low power wire-line transceiver equalizer in a 65 nm CMOS process with 1 V supply voltage. The transmitter occupies 430×240 μm2 and consumes 50.56 mW power. With the programmable 5-order pre-emphasis equalizer, the transmitter can compensate for a wide range of channel loss and send a signal with adjustable voltage swing. The receiver equalizer occupies 146×186 μm2 and consumes 5.3 mW power.  相似文献   

8.
In this paper, a serial link design that is capable of 4.8-6.4-Gb/s binary NRZ signaling across 40' of FR4 copper backplane traces and two connectors is described. The transmitter features a programmable two-tap feed forward equalizer and the receiver uses an adaptive four-tap decision feedback equalization to compensate for the losses in the channel at 6.4 Gbps. The transceiver core is built in LSI's 0.13-/spl mu/m standard CMOS technology to be integrated into ASIC designs that require serial links. The transceiver consumes 310 mW per duplex channel at 1.2 V and 6.4 Gb/s under nominal conditions.  相似文献   

9.
张锋  邱玉松 《半导体学报》2015,36(1):015003-8
采用 65nm工艺,实现了一款16位并行收发器的IP核,它在5pf的负载及HBM 2000V的ESD保护下,其速率为3Gb/s。为了减小延时,均衡器、时钟数据恢复电路、CRC检测电路以及8b/10b编码电路在设计中均没有使用,所以整个电路在没有电缆的情况的延时为7ns。根据收发器在工艺、电压和温度下的鲁棒特性,在设计中采用了自动频率校正的锁相环电路,低偏移的差分时钟树及具有共模反馈的稳定电流模驱动器电路。该收发器在3Gbps速度下误码率小于10-15,可以在不同的工艺角和极端温度下正常工作,并且能够容忍20%电压的偏差变化,在100nm下的具有低延时和高稳定性的高性能处理器中能够得到很好的应用。  相似文献   

10.
A 4-Gbit/s serial link transceiver is fabricated in a MOSIS 0.5-μm HPCMOS process. To achieve the high data rate without speed critical logic on chip, the data are multiplexed when transmitted and immediately demultiplexed when received. This parallelism is achieved by using multiple phases tapped from a PLL using the phase spacing to determine the bit time. Using an 8:1 multiplexer yields 4 Gbits/s, with an on-chip VCO running at 500 MHz. The internal logic runs at 250 MHz. For robust data recovery, the input is sampled at 3× the bit rate and uses a digital phase-picking logic to recover the data. The digital phase picking can adjust the sample at the clock rate to allow high tracking bandwidth. With a 3.3-V supply, the chip has a measured bit error rate (BER) of <10-14  相似文献   

11.
A novel multifunctional transceiver for chip-to-chip optical interconnects operating at 2.5 Gbit/s is proposed, which shares a common block between a receiver and a transmitter. This transceiver provides four conversion functions - electrical-to-optical, optical-to-optical, optical-to-electrical, and electrical-to-electrical - depending on the selection switch on a single chip. The whole chip integrated in 0.18 /spl mu/m CMOS occupies an area measuring 0.82/spl times/0.82 mm/sup 2/.  相似文献   

12.
This paper describes a backplane transceiver, which uses pulse amplitude modulated four-level (PAM-4) signaling and continuously adaptive transmit-based equalization to move 2.5-GBd/s symbols totalling 5 Gb/s across typical FR-4 backplanes for total distances of up to 50 inches through two sets of backplane connectors. The 17-mm/sup 2/ device is implemented in a 0.25-/spl mu/m CMOS process, operates off of 2.5- and 3.3-V supply voltages, and consumes 1 W.  相似文献   

13.
This paper describes a 2.5-3.125-Gb/s quad transceiver with second-order analog delay-locked loop (DLL)-based clock and data recovery (CDR) circuits. A phase-locked loop (PLL) is shared between receive (RX) and transmit (TX) chains. On each RX channel, an amplifier with user-programmable input equalization precedes the CDR. Retimed data then goes to an 1:8/1:10 deserializer. On the TX side, parallel data is serialized into a high-speed bitstream with an 8:1/10:1 multiplexer. The serial data is introduced off-chip through a high-speed CML buffer having single-tap pre-emphasis. Proposed DLL-based CDR can tolerate large frequency offsets with no jitter tolerance degradation due to its second-order PLL-like nature. Also, this study introduces an improved charge-pump and an improved phase-interpolator. Fabricated in a 0.15-/spl mu/m CMOS process, the 1.9-mm/sup 2/ transceiver front-end operates from a single 1.2-V supply and consumes 65-mW/channel of which 32 mW is due to the CDR. CDR jitter generation and high-frequency jitter tolerance are 5.9 ps-rms and 0.5 UI, respectively, for 3.125 Gb/s, 2/sup 23/-1 PRBS input data with 800-ppm frequency offset.  相似文献   

14.
In this paper, a serial link for AS-memory systems fabricated in a 0.25-μm standard CMOS technology is presented. This serial link utilizes a pulsewidth modulation (PWM) technique. By transmitting the PWM-encoded signal with periodic rising edges, the clock can be implicitly embedded in the data stream and the associating overhead needed in clock/data recovery circuits can, be mitigated. The symbol rate is 200 Mb/s and the equivalent data rate is 400 Mb/s. The PWM transceiver dissipates 66.5 mW at a 2.5-V supply voltage. It is suitable for the AS-memory systems in which the pin count is limited and elaborate clock/data recovery circuits are not required  相似文献   

15.
We describe a CMOS multichannel transceiver that transmits and receives 10 Gb/s per channel over balanced copper media. The transceiver consists of two identical 10-Gb/s modules. Each module operates off a single 1.2-V supply and has a single 5-GHz phase-locked loop to supply a reference clock to two transmitter (Tx) channels and two receiver (Rx) channels. To track the input-signal phase, the Rx channel has a clock recovery unit (CRU), which uses a phase-interpolator-based timing generator and digital loop filter. The CRU can adjust the recovered clock phase with a resolution of 1.56 ps. Two sets of two-channel transceiver units were fabricated in 0.11-/spl mu/m CMOS on a single test chip. The transceiver unit size was 1.6 mm /spl times/ 2.6 mm. The Rx sensitivity was 120-mVp-p differential with a 70-ps phase margin for a common-mode voltage ranging from 0.6 to 1.0 V. The evaluated jitter tolerance curve met the OC-192 specification.  相似文献   

16.
This paper presents a single-chip SONET OC-192 transceiver (transmitter and receiver) fabricated in a 90-nm mixed-signal CMOS process. The transmitter consists of a 10-GHz clock multiplier unit (CMU), 16:1 multiplexer, and 10-Gb/s output buffer. The receiver consists of a 10-Gb/s limiting input amplifier, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. Both transmit and receive phase-locked loops employ a 10-GHz on-chip LC voltage-controlled oscillator (VCO). This transceiver exceeds all SONET OC-192 specifications with ample margin. Jitter generation at 10.66-Gb/s data rate is 18 mUI/sub pp/ (unit interval, peak-to-peak) and jitter tolerance is 0.6 UI/sub pp/ at 4-MHz jitter frequency. This transceiver requires 1.2V for the core logic and 1.8 V for input/output LVDS buffers. Multiple power supply domains are implemented here to mitigate crosstalk between receiver and transmitter. The overall power dissipation of this chip is 1.65 W.  相似文献   

17.
Today's data communication systems are demanding increasing off-chip data rates. To satisfy this demand, high-speed serial links are used, saving area and power dissipation compared to highly parallel buses. However, power dissipation and noise generated by this system is still a critical issue. In this article, a novel approach using differential current mode is presented, which combines low power dissipation with low noise generated due to the reduced power transmission.  相似文献   

18.
许多网络应用都采用10Gb/s接口来减小通信瓶颈。例如,用户对低成本千兆以太网(GbE)接入和VPLS需求的不断高涨,推动着运营商投入巨大力量建设10GbE城域网。这些网络是对已经向10Gb/s SDH(STM-64)和DWDM(密集波分复用)发展的现有传输网络的补充。另外,这些网络所传输的内容一般缘于一个大的数据中心,而这些数据中心都是考虑用通过10Gb/s光纤通道接口连接到光通道交换机,进而和服务器联系在一起,并依次连接交换机和存储子系统。  相似文献   

19.
2.5Gb/Scmos光接收机跨阻前置放大器   总被引:6,自引:0,他引:6  
给出了一种利用0.35μm CMOS工艺实现的2.5Gb/s跨阻前置放大器。此跨阻放大器的增益为59 dB*Ω,3dB带宽为2GHz,2GHz处的等效输入电流噪声为0.8×10-22 A2/Hz。在标准的5V电源电压下,功耗为250mW。PCML单端输出信号电压摆幅为200mVp-p。整个芯片面积为1.0mm×1.1mm。  相似文献   

20.
2.5Gb/s和3.125Gb/s速率级0.35μmCMOS限幅放大器   总被引:1,自引:0,他引:1  
采用了TSMC0.35μm CMOS工艺实现了可用于SONET/SDH2.5Gb/s和3.125Gb/s速率级光纤通信系统的限幅放大器。通过在芯片测试其最小输入动态范围可达8mVp—p,单端输出摆幅为400mVp-p,功耗250mW,含信号丢失检测功能,可以满足商用化光纤通信系统的使用标准。  相似文献   

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