Investigation of the creep behavior of graphene oxide nanoplatelet-reinforced adhesively bonded joints

In this paper, the effect of adding graphene oxide nano-platelets (GONPs) into the adhesive layer was investigated on the creep behavior of adhesively bonded joints. The neat and GONP-reinforced adhesive joints were manufactured and tested under creep loading with different stress and temperature levels. 0.1?wt% GONPs revealed the highest improvement on the adhesive joint creep behavior amongst the studied weight percentages. Furthermore, the effect of GONPs on the creep behavior of adhesive joints was more significant at higher temperatures. It was found that adding 0.1?wt% of GONPs into the adhesive layer imposed reductions of 21%, 31% and 34% in the elastic shear strains and reductions of 24%, 31% and 37% in the creep shear strains of SLJs under testing temperatures of 30, 40 and 50?°C, respectively. The Burgers rheological model was employed for simulating the creep behavior of the neat and GONP-reinforced adhesive joints. The Burgers model parameters were obtained as functions of testing temperature, creep shear stress and GONP weight percentage using a response surface methodology. Reasonable agreement was obtained between the modeled and experimental creep behaviors of the adhesive joints.     

Compression creep behaviour of precursor-derived SiCN Ceramics

The creep behaviour of SiCN materials derived from polyvinylsilazane (PVS) and polyhydridomethylsilazane (PHMS) precursors was investigated in the temperature range between 1200 and 1550°C at compressive stresses between 30 and 250 MPa in air. Both materials show very similar creep behaviour. Decreasing strain rates with time were observed. Even after 4×10⁶ s creep deformation, stationary creep was not observed. Temperature dependence of the creep behaviour of such materials is very low. Dense passivating oxide layers were found on the surface of creep specimens tested in the temperature range up to 1500°C. At 1550°C active oxidation was observed.     

Scanning electron fractography of lap-shear joints

Fracture surfaces of Epon 901/B-3 bonded aluminum alloy joints in the lap-shear configuration were studied using scanning electron microscopy. Major differences in the appearance of the fracture surface from those reported (8) for tensile loaded joints at 23°C are produced either by cyclic loading at 23°C or a change in test temperature to ?196°C. Fracture in tensile loaded joints at ?196°C is a brittle single step process in the opening mode in which rapid crack extension occurs throughout the joint with very little adhesive flow. Tensile fatigue fracture at 23°C is in the opening mode but crack extension is complicated by extensive adhesive flow throughout the entire joint.     

Effect of temperature on the joint strength of a silyl-modified polymer-based adhesive

Temperature is a very important factor that must be fully considered in the study on the adhesive joint strength. In this paper, a silyl-modified polymer-based adhesive ISR 70-08 which is widely used in engineering was studied. Dog-bone specimens were fabricated and tested at ?40°C, room temperature (RT), and 90°C. Results show a decrease in the main mechanical properties with increasing temperature. Butt joints (BJs), single-lap joints (SLJs), and Scarf joints (SJs) were fabricated and tested at different temperatures. A quadratic polynomial expression was an ideal choice to express the joint strength as a function of temperature which was obtained using the least-squares method. Temperature combinations of ?40°C, 0°C, and 90°C were obtained to study the effect of temperature on the joint strength more easily for this adhesive. A three-dimensional surface, consisting of temperature, adhesive angle, and joint strength was presented to facilitate the application of bonding structures in engineering     

EFFECT OF TEMPERATURE ON HOMOGENIZING RATE OF SODA-LIME-SILICA GLASS*

Density-spread determinations were made on a series of melts of a soda-lime-silica glass prepared at temperatures ranging from 1232° to 1454°C. for a four-hour period in the absence of furnace refractory and under conditions of minimum convection mixing. A sharp drop in density spread in the range 1232° to 1288°C., a minimum at about 1325°C., and a slowly increasing density spread at temperatures above 1325°C. were observed. The portion of glass responsible for the major part of the density spread was found to be concentrated in the top half of the glass at both 1232° and 1454°C. At the higher temperature, the improvement in the homogeneity of the bottom layer was more marked than that observed in the top layer as compared with the results obtained on the lower-temperature melt. The density spread of the glass in the bottom layer in the case of the high-temperature melt was in the range of that observed for commercial soda-lime-silica glass of good quality. A possible explanation for the observed increase in density spread at higher temperatures (above 1325°) is offered on the basis of more rapid initial segregation during melting at higher temperature as inferred from the density-spread data and from chemical analyses of the glass from the top and bottom portions of melts made at 1232° and 1454°C. Loss in weight of the glass due to volatilization was determined at 1232° and at 1454°C. and was found to amount to less than 0.01% for a four-hour melting period at both temperatures. Moderate mixing, achieved by repeated cracking and remelting of the glass and by melting in a rotating tilted crucible, had a marked effect in lowering the density spread. The data afforded by these experiments lend further emphasis to the view that convection currents in commercial tank operation are highly significant in improving the homogeneity of a soda-lime-silica glass.     

High temperature performance of soy-based adhesives

We studied the high temperature performance of soy meal processed to different protein concentrations (flour, concentrate, and isolate), as well as formulated soy-based adhesives, and commercial nonsoy adhesives for comparison. No thermal transitions were seen in phenol-resorcinol-formaldehyde (PRF) or soy-phenol-formaldehyde (SoyPF) or in as-received soy flour adhesive during differential scanning calorimetry scans heating at 10?°C/min between 35 and 235?°C. Heat flow rates decreased in the order soy flour (as received)?>?SoyPF?>?PRF?>?emulsion polymer isocyanate (EPI). In thermogravimetric analysis (TGA) scans from 110 to 300?°C at 2?°C/min, total weight loss decreased in the order soy flour (as-received)>SoyPF?>?PRF?>?casein?>?maple?>?EPI. For bio-based materials, the total weight loss (TGA) decreased in the order soy flour (as-received) > concentrate, casein?>?isolate. Dynamic mechanical analysis from 35 to 235?°C at 5?°C/min of two veneers bonded by cured adhesive showed 30–40% decline in storage modulus for maple compared to 45–55% for the adhesive made from soy flour in water (Soy Flour) and 70–80% for a commercial poly(vinyl acetate) modified for heat resistance. DMA on glass fiber mats showed thermal softening temperatures increasing in the order Soy Flour?<?casein?<?isolate?<?concentrate. We suggest that the low molecular weight carbohydrates plasticize the flour product. When soy-based adhesives were tested in real bondlines in DMA and creep tests in shear, they showed less decrease in storage modulus than the glass fiber-supported specimens. This suggests that interaction with the wood substrate improved the heat resistance property of the adhesive. Average hot shear strengths (ASTM D7247) were 4.6 and 3.1?MPa for SoyPF and Soy Flour compared to 4.7 and 0.8?MPa for PRF and EPI and 4.7 for solid maple. As a whole, these data suggest that despite indications of heat sensitivity when tested neat, soy-based adhesives are likely to pass the heat resistance criterion required for structural adhesives.     

Effect of high loading rate and low temperature on mode I fracture toughness of ductile polyurethane adhesive

The mode I fracture toughness of an adhesive at low temperatures under high loading rates are studied experimentally. Typical R-curves of the polyurethane adhesive under different loading rates (0.5?mm/min, 50?mm/min, 500?mm/min) at different temperatures (room temperature, ?20?°C, ?40?°C) respectively are obtained. From the experimental results, the mode I fracture toughness of this adhesive is extremely sensitive to the high loading rates and low temperatures. With the increase of the loading rate and decrease of temperature, the mode I fracture toughness of this adhesive decreases significantly. Under the loading rate of 500?mm/min at ?40?°C, the mode I fracture toughness of adhesive is 15% of the value at room temperature (RT) under quasi-static conditions. Through the experiment, the relationship between mode I fracture toughness of this adhesive, nominal strain rate and temperature is obtained.     

Application of recycled polyol and benzimidazole to the enhancement of antifungal activity of polyurethane

Recycled polyol and benzimidazole were both grafted onto polyurethane (PU) to enhance the surface hydrophilicity and antifungal activity, respectively. The two grafted groups affected the viscosity, crosslink density, soft segment glass transition, breaking stress, flexibility at freezing temperature, shape recovery at ?10 °C, surface hydrophilicity, and antifungal activity. The glass transition temperature increased from ?67.5 °C for plain PU up to ?60.8 °C after the grafting of polyol. The breaking stress and shape recovery of the grafted PU increased up to 425% and 200%, respectively, relative to plain PU because of the chemical linking by the grafted polyol. The hydrophilicity of PU, evaluated by the water contact angle and water swelling ratio, increased with increasing polyol content. A PU sample demonstrated excellent low‐temperature flexibility in comparison to plain PU and control sample. Finally, the PUs modified with grafted polyol and benzimidazole completely suppressed fungal growth. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46600.     

Influence of multi-walled carbon nanotubes on creep behavior of adhesively bonded joints subjected to elevated temperatures

Polymeric materials are prone to creep loading. This paper is aimed to study the effect of multi-walled carbon nanotubes (MWCNTs) on creep behavior of adhesively bonded joints. Neat and MWCNTs-reinforced adhesively bonded joints were manufactured and tested under creep loading at elevated temperatures. Two MWCNT weight percentages of 0.1 and 0.3 were used for reinforcing the single lap joints (SLJs) and the joints were tested at different temperature and load levels. The results showed that 0.1 wt% of MWCNTs resulted maximum improvements in creep behavior of adhesive joints. Adding 0.1 wt% of MWCNTs into the adhesive layer caused maximum reductions of 57%, 60% and 47% in the steady-state creep rates of the joints tested at 30, 40 and 50°C, respectively. Furthermore, 0.1 wt% of MWCNTs resulted maximum reductions of 29%, 33% and 37% in the creep strains corresponding to a specific creep loading time and maximum reductions of 23%, 45% and 49% in the elastic strains corresponding to the time at which creep loading started.     

Feasibility study on cubic boron nitride coated glass press molds

We report the feasibility of glass press molds using high-quality, thick cubic boron nitride (cBN) films prepared in a plasma jet by chemical vapor deposition. A press test using a cBN film for an optical glass is carried out at a high temperature (≥ 650 °C), above the glass transition temperature. Surface morphology, chemical composition, and optical transparency of the glass after a press test are examined by atomic force microscopy, X-ray photoelectron spectroscopy, energy dispersion X-ray spectroscopy, and ultraviolet-visible-near-infrared (UV-VIS-near-IR) and IR spectroscopy. The B and N concentrations at the top several nanometers of the glass increase by several at.% after a press test. This is attributed to diffusion of B and N from the film into the glass. The UV-VIS-near-IR transparency of the glass in a short wavelength range (≤ 900 nm) decreases by several % due to light scattering at the roughened glass surface. In contrast, the IR transparency of the glass remains constant despite an increase in the surface roughness.     

Effect of Temperature on the Joints Strength of an Automotive Polyurethane Adhesive

In this paper, the performance of an automotive polyurethane adhesive was studied through adhesive joints tests. Butt joints and single lap joints were fabricated and tested at seven temperature measuring points (TMPs). It is shown that both the tensile strength and lap shear strength decrease with the increasing of temperature. Quadratic polynomial expression obtained by the least square method can represent the tensile and lap shear strength as a function of temperature very well. ?40°C, 0°C, and 90°C were selected as the most ideal TMPs for this adhesive through the comparison of the residual sums of squares of 35 fitting curves with different combination of TMPs. Scarf joints with adhesive angles of 60° and 30° were fabricated and tested at ?40°C, 0°C, and 90°C. It also showed a decrease in joint strength with the increasing temperature. Joint strength as a function of adhesive angle is presented. It was found to closely follow a linear behaviour. A three-dimensional surface, consisting of temperature, adhesive angle, and joint strength, is presented finally to facilitate the design of automotive bonding structures.     

Effects of Temperature and Loading Rate on the Mechanical Properties of a High Temperature Epoxy Adhesive

The variation of the mechanical properties of adhesives with temperature and strain rate is one of the most important factors to consider when designing a bonded joint due to the polymeric nature of adhesives. It is well known that adhesive strength generally shows temperature dependence. Moreover, in many structural applications, the applied loads can be dynamic and the design of the joint requires the knowledge of the high loading rate mechanical behaviour of the adhesive. In this study, the combined effect of the temperature and test speed on the tensile properties of a high temperature epoxy adhesive was investigated. Tensile tests were performed at three different test speeds and various temperatures (room temperature (RT) and high temperatures (100, 125 and 150°C)). The glass transition temperature (T _g) of the epoxy adhesive investigated is approximately 155°C. The ultimate tensile stress decreased linearly with temperature (T) while increased logarithmically with the loading rate, which is in the accord with the Airing's molecular activation model.     

Rapid pressure-less and spark plasma sintering of (Ba0.85Ca0.15Zr0.1T0.9)O3 lead-free piezoelectric ceramics

This work shows for the first time the possibility to sinter BCZT powder compacts by rapid heating rates within one hour of sintering, while achieving good piezoelectric properties. The sintering was performed by rapid (heating rates 100 and 200 °C/min) pressure-less sintering (PLS) at 1550 °C/5-60 min and by SPS sintering (100 °C/min, 1450 °C/5?60 min and 1500 °C/15?45 min). The rapid PLS samples reached a relative density up to 94 % and grain sizes of 17–36 μm acquiring d₃₃ up to 414 pC/N. Although the SPS samples reached full density at 1450 °C, their piezoelectric properties worsened due to smaller grains (10?15 μm) as well as formation of cracks at dwell times > 30 min. At elevated SPS temperature of 1500 °C/30 min, the d₃₃ increased to 360 pC/N sustaining full density. Even higher increase in d₃₃ (424 pC/N) of SPS samples was achieved by post-rapid PLS at 1550 °C/60 min resulting from further expansion in grain size.     

Polyurethane adhesives containing functionalized nanoclays

The development and commercialization of nanoclays (NCs) offers new possibilities to tailor adhesives on the nanoscale range. Three types of functionalized nanoclays were included in the current study, two novel ones and one commercial nanoclay. The novel ones were based on aminosilane and amidoamine hyperbranched polymer, and the commercial nanoclay possessed hydroxyl functionality. All the three functionalities were expected to react with the polyurethane (PU) based thermoset adhesive. Fourier transform infrared (FT-IR) spectroscopy was used to follow the disappearance of the isocyanate group of the polyurethane thermoset adhesive. Thermo-mechanical properties were studied using dynamic mechanical analysis (DMA). Shear and peel properties of adhesively-bonded joints were evaluated using the appropriate test standards. Atomic force microscopy (AFM) was used to analyze the nanoscale morphology of cryogenically fractured surfaces. DMA measurements indicated that the glass transition temperature (T _g) of neat PU was 32°C. Incorporation of nanoclays in concentrations of 1, 3 and 5 wt% affected the glass transition temperature significantly. The functionalized nanoclays increased the T _g gradually to the range of 60 to 62°C for 5 wt% loading. The incorporation of functionalized nanoclays into PU improved the shear strength by 170, 160 and 195% for the hydroxyl-, aminosilane- and hyperbranched-treated NCs, respectively. The functionalized nanoclays exhibited higher peel strength compared to the neat PU by 30% for the hydroxyl modified clay and by 40% for aminosilane-modified clay (at 1 wt% concentration) and almost no change for the hyperbranched modified one. AFM analysis indicated that different fracture mechanisms occurred with respect to the type and concentration of nanoclay used.     

Nanotailoring of polyurethane adhesive by polyhedral oligomeric silsesquioxane (POSS)

The development and commercialization of nanoparticles such as nanoclays (NCs), carbon nanotubes (CNTs) and polyhedral oligomeric silsesquioxanes (POSS) offers new possibilities to tailor adhesives at the nanoscale. Four types of POSS, with reactive mono-functional groups of isocyanatopropyl, glycidoxypropyl, aminoethyl and non-reactive octaphenyl, were incorporated in concentrations of 1, 3 and 5 wt% into a polyurethane (PU)-based adhesive. Thermo-mechanical bulk properties were studied using dynamic mechanical analysis (DMA). Adhesive properties were characterized in shear and peel modes. Atomic force microscopy (AFM) was used to study the nanoscale morphology. DMA measurements indicated that the neat PU possessed a glass transition temperature (T _g) of ≈ 30°C. The T _g of PU/POSS-glycidoxypropyl nanocomposite adhesive increased gradually with POSS concentration to 50°C for 5 wt%. PU/POSS-octaphenyl nanocomposite adhesive exhibited an increased T _g by 10°C for 5 wt%. The incorporation of POSS-isocyanatopropyl in the PU had no effect on the T _g. With respect to shear properties of POSS-octaphenyl-, POSS-isocyanatopropyl- and POSS-glycidoxypropyl-based PU nanocomposite adhesives, shear strength improved by 230, 178 and 137%, respectively, compared to neat PU. POSS-aminoethyl exhibited lower shear and peel strengths, while POSS-isocyanatopropyl provided the best balance of both higher shear and peel strengths compared to neat PU. It was concluded that the grafted functional group on the POSS and its reactivity with the PU network components were the decisive factors with respect to the thermo-mechanical, morphological and adhesive properties of the resulting nanocomposite adhesives. Consequently, the POSS/polyurethane based nanocomposite adhesives could be tailored for a large range of applications.     

Optically transparent polycarbonate/clay nanocomposites with improved performance using phosphonium modified organoclay: Preparation and characterizations

The present work focuses on the morphology and properties of polycarbonate (PC)/clay nanocomposites prepared through melt blending and solution blending at two different loadings of organoclay (0.5 and 1 phr). The oraganoclay was prepared by incorporating thermally 2‐oxopropyl triphenyl phosphonium ion (OTPP) into the clay gallery with an intention to preserve the optical transparency of PC in the PC/clay nanocomposites. An increase in gallery height from 1.24 to 1.86 nm along with the extraordinary thermal stability (∼1.34% wt loss at 280°C, after 20 min) of the OTPP modified montmorillonite (OTPP‐MMT) made it suitable for retention of optical transparency of PC and delamination of the clay platelets in the nanocomposites. The morphological analysis revealed that the clay platelets were randomly dispersed into the PC matrix. An increase in glass transition temperature (T_g) as well as thermal stability of the PC in the nanocomposites was evident from thermal analysis. The strength and modulus of PC increased extensively with increase in OTPP‐MMT loading in the nanocomposites. The nanocomposites were found to retain optical transparency of PC without generation of any color in both the blending technique. POLYM. COMPOS., 199–212, 2016. © 2014 Society of Plastics Engineers     

Ultra-high temperature deformation in TaC and HfC

TaC and HfC bars were thermo-mechanically tested up to 2900?°C using a non-contact loading method based on the Lorentz force. It was observed that HfC deflected more than TaC up to 2300?°C, which has been contributed to a difference in grain size facilitating diffusional creep, either Nabarro-Herring or Coble creep. Above 2500?°C, TaC continued to deflect more with temperature whereas HfC showed a reduced deflection. This reduced deflection was found to be an artifact of a preload plastic deformation response. Though both sets of samples were identified to have a prevalence of <110>{110} slip, at elevated temperatures, it appears that mass transport and diffusional creep mechanisms dominate evident by porosity in the grain boundaries. The activation energies of TaC were found to be 946?±?157?kJ/mol (between 2500–2700?°C) and HfC to be 685?±?54?kJ/mol (between 2100–2300?°C).     

The Effect of Temperature on the Strength of Adhesively-Bonded Composite-Aluminium Joints

Different materials have different coefficients of thermal expansion, which is a measure of the change in length for a given change in temperature. When different materials are combined structurally, as in a bonded joint, a temperature change leads to stresses being set up. These stresses are present even in an unloaded joint which has been cured at say 150°C and cooled to room temperature. Further stresses result from operations at even lower temperatures.

In addition to temperature-induced stresses, account also has to be taken of changes in adhesive properties. Low temperatures cause the adhesive to become more brittle (reduced strain to failure), while high temperatures cause the adhesive to become more ductile, but make it less strong and more liable to creep.

Theoretical predictions are made of the strength of a series of aluminium/CFRP joints using three different adhesives at 20°C and 55°C. Various failure criteria are used to show good correlation with experimental results.     

Morphology and properties of stearate‐intercalated layered double hydroxide nanoplatelet‐reinforced thermoplastic polyurethane

In the past few years, layered double hydroxides (LDHs) with monolayer structure have been much studied for the development of polymer nanocomposites. LDHs with intercalated stearate anions form a bilayer structure with increased interlayer spacing and are expected to be better nanofillers in polymers. In the work reported, thermoplastic polyurethane (PU)/stearate‐intercalated LDH nanocomposites were prepared by solution intercalation and characterized. X‐ray diffraction and transmission electron microscopy confirmed the exfoliation at lower filler loading followed by intercalation at higher filler loading in PU matrix. As regards mechanical properties, these nanocomposites showed maximum improvements in tensile strength (45%) and elongation at break (53%) at 1 and 3 wt% loadings. Maximum improvements in storage and loss moduli (20%) with a shift of glass transition temperature (15 °C) and an increase in thermal stability (32 °C) at 50% weight loss were observed at 8 wt% loading in PU. Differential scanning calorimetry showed a shift of melting temperature of the soft segment in the nanocomposites compared to neat PU, possibly due to the nucleating effect of stearate‐intercalated LDH on the crystal structure of PU. All these findings are promising for the development of mechanically improved, thermally stable novel PU nanocomposites. Copyright © 2011 Society of Chemical Industry     

The creep of kevlar-29 fibers

Single Kevlar-29 fibers have been subjected to creep loading over a temperature range of 23 to 400°C for which the applied load was 50 percent that of tensile strength at each temperature considered and also subjected to a range of loads at 23°C. It has been shown that strain expressed as a logarithmic function of time describes the experimental results obtained. Up to 70 percent of breaking load, a primary creep mechanism dominates and at higher loads a secondary creep process becomes increasingly important.