Si/SiGe/Si-SOI异质结构的同步辐射双晶貌相术和高分辨三轴晶X射线衍射

运用同步辐射双晶貌相术结合高分辨三轴晶X射线衍射对经原位低温热处理的Si/SiGe/Si-SOI异质结构进行研究，发现Si层（004）衍射峰两侧半高宽（FWHMs）处同步辐射双晶形貌像特征存在明显差异．对同步辐射双晶摇摆曲线中Si层（004）衍射峰的不对称性给予了解释，同时阐明了高分辨三轴晶X射线衍射2θ-ω扫描曲线中Si层（004）衍射双峰与Si层衍射结构的对应关系．     

色散对GaN和ZnO的XRD摇摆曲线的影响

在用X射线双晶衍射研究GaN和ZnO结晶性能的实验中,观察到(102)非对称衍射摇摆曲线的半峰宽比(002)对称衍射更窄以及ZnO(002)摇摆曲线分裂的现象.经研究证实,这是由于Kα2线参与衍射引起的.通过计算Kα1和Kα2线在不同晶面衍射的分离角并与实验现象对比,阐明了GaN样品(102)半峰宽比(002)小以及ZnO(002)衍射峰分裂的原因.在此基础上,进一步分析了在使用不同参考晶体的双晶衍射系统中,GaN和ZnO的各晶面被X射线色散展宽的情况,并提出,在使用Si,Ge或GaAs的(220)面为参考晶面的双晶衍射仪中,GaN和ZnO的(002)和(102)面摇摆曲线的半峰宽受色散效应的影响小;而在使用Si,Ge或GaAs的(004)面为参考晶面的双晶衍射系统中,(002)和(102)面摇摆曲线的半峰宽受色散效应影响较大,此时(004)和(103)受色散影响小,因此用来表征晶体质量将更可靠.     

色散对GaN和ZnO的XRD摇摆曲线的影响

在用X射线双晶衍射研究GaN和ZnO结晶性能的实验中,观察到(102)非对称衍射摇摆曲线的半峰宽比(002)对称衍射更窄以及ZnO(002)摇摆曲线分裂的现象．经研究证实,这是由于Kα2线参与衍射引起的．通过计算Kα1和Kα2线在不同晶面衍射的分离角并与实验现象对比,阐明了GaN样品(102)半峰宽比(002)小以及ZnO(002)衍射峰分裂的原因．在此基础上,进一步分析了在使用不同参考晶体的双晶衍射系统中,GaN和ZnO的各晶面被X射线色散展宽的情况,并提出,在使用Si,Ge或GaAs的(220)面为参考晶面的双晶衍射仪中,GaN和ZnO的(002)和(102)面摇摆曲线的半峰宽受色散效应的影响小;而在使用Si,Ge或GaAs的(004)面为参考晶面的双晶衍射系统中,(002)和(102)面摇摆曲线的半峰宽受色散效应影响较大,此时(004)和(103)受色散影响小,因此用来表征晶体质量将更可靠．     

MBE GaAs/GaP(001)异质外延层结构参数的X射线双晶衍射研究

本文利用X射线双晶衍射方法,研究了分子束外延(MBE)GaAs/CaP(001)异质外延层的结构参数——晶格常数、晶胞体积.根据X射线衍射动力学理论和运动学理论分别对双晶衍射摇摆曲线的峰角位置进行了修正,二者吻合很好.修正后的结果表明:X射线双晶衍射测量中会引入一定的晶胞体积缩小量,修正后外延层的晶胞体积略大于自由状态GaAs单晶的晶胞体积,这里根据Poisson关系对 GaAs/GaP外延层晶胞体积的增大进行了解释.     

应变硅结构的高分辨X射线衍射及其图谱分析

运用高分辨X射线双晶衍射(DCD)、三轴晶衍射(TAD)和TAD图谱对绝缘体上Si/SiGe/Si异质结构进行表征.利用TAD结合DCD(TAD-DCD)对称和非对称衍射测定了体Si衬底和外延层以及外延层之间的取向关系、SiGe外延层的Ge含量及其弛豫度等异质外延生长的重要参数.TAD倒易空间图谱能够给出全面的晶体结构信息.高分辨率TAD倒易空间图谱可实现对应变Si层应变量的测定.     

应变硅结构的高分辨X射线衍射及其图谱分析

运用高分辨X射线双晶衍射(DCD)、三轴晶衍射(TAD)和TAD图谱对绝缘体上Si/SiGe/Si异质结构进行表征.利用TAD结合DCD(TAD-DCD)对称和非对称衍射测定了体Si衬底和外延层以及外延层之间的取向关系、SiGe外延层的Ge含量及其弛豫度等异质外延生长的重要参数.TAD倒易空间图谱能够给出全面的晶体结构信息.高分辨率TAD倒易空间图谱可实现对应变Si层应变量的测定.     

应变硅结构的高分辨X射线衍射及其图谱分析

运用高分辨X射线双晶衍射（DCD) 、三轴晶衍射（TAD）和TAD图谱对绝缘体上Si/SiGe/Si异质结构进行表征. 利用TAD结合DCD (TAD-DCD）对称和非对称衍射测定了体Si衬底和外延层以及外延层之间的取向关系、SiGe外延层的Ge含量及其弛豫度等异质外延生长的重要参数. TAD倒易空间图谱能够给出全面的晶体结构信息. 高分辨率TAD倒易空间图谱可实现对应变Si层应变量的测定.     

Ge_xSi_(1-x)/Si应变层超晶格X-射线双晶衍射的运动学研究

本文利用X射线双晶衍射对应变层超晶格进行了研究.我们从超晶格的台阶模型出发,运用运动学理论,推导出了X射线衍射强度的表达式,清楚地揭示了合金成分x,应变,层厚比与迴摆曲线强度分布的关系.对Ge_xSi_(1-x)/Si超晶格双晶X射线衍射强度的模拟结果与实验结果符合很好.     

X射线在超晶格材料衍射中的相干性分析

X射线双晶衍射仪系统中受参考晶体分辨率等因素的影响,X射线的相干长度不超过1 μm.X射线在异质外延晶体材料内衍射时,不超过相干长度范围内厚度外延层中的衍射波会产生相干叠加,否则,产生非相干叠加.分子束外延(MBE)生长了短周期InGaAs/GaAs超晶格,在其摇摆曲线中观察到显示X射线在超晶格结构中衍射相干特征的多级卫星峰及Pendell(o)song干涉条纹,并利用相干光理论对超晶格结构信息诸如周期及"0"级峰位置等进行了分析.     

MBE生长RTD材料的X射线双晶衍射研究

用分子束外延技术(MBE)生长了GaAs基共振隧穿二极管(RTD)的材料结构,利用X射线双晶衍射(XRD)方法对材料进行了测试分析.结果表明,材料的双晶衍射峰半峰宽达到16.17",GaAs层与In0.1Ga0.9As层的相对晶格失配率仅为0.015 6%.对实验样品进行了双晶衍射回摆曲线的模拟,模拟结果与测试结果符合较好,说明生长的RTD材料结构与设计相符合.通过制成器件对材料进行验证,室温下对器件进行直流测试,PVCR达到5.1,峰值电流密度达到73.6 kA/cm2.     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Highly linear Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMTs

We report an Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMT with enhanced linearity. By engineering the channel region, i.e., inserting a 6-nm-thick AlGaN layer with 5% Al composition in the channel region, a composite-channel HEMT was demonstrated. Transconductance and cutoff frequencies of a 1 /spl times/100 /spl mu/m HEMT are kept near their peak values throughout the low- and high-current operating levels, a desirable feature for linear power amplifiers. The composite-channel HEMT exhibits a peak transconductance of 150 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 12 GHz and a peak power gain cutoff frequency (f/sub max/) of 30 GHz. For devices grown on sapphire substrate, maximum power density of 3.38 W/mm, power-added efficiency of 45% are obtained at 2 GHz. The output third-order intercept point (OIP3) is 33.2 dBm from two-tone measurement at 2 GHz.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

Electrooptic ferroelectric Na/sub 0.5/K/sub 0.5/NbO/sub 3/ films

We report on waveguiding and electrooptic properties of epitaxial Na/sub 0.5/K/sub 0.5/NbO/sub 3/ films grown by radio-frequency magnetron sputtering on Al/sub 2/O/sub 3/(11_02) single crystal substrates. High optical waveguiding performance has been demonstrated in infrared and visible light. The in-plane electrooptic effect has been recorded in transmission using a transverse geometry. At dc fields, the effective linear electrooptic coefficient was determined to 28 pm/V, which is promising for modulator applications.