Synthesis and characterization of novel low‐dielectric cyanate esters. II

A novel cyanate ester, 2,6‐dimethyl phenol dipentene cyanate ester (DPCY), was successfully synthesized from cyanogen bromide with 2,6‐dimethyl phenol dipentene novolac, which was synthesized from dipentene and 2,6‐dimethyl phenol. For the purpose of increasing the mobility of residual DPCY during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of a monofunctional cyanate ester, 4‐tert‐butyl phenol cyanate ester, was added to DPCY to form a cyanate ester copolymer. The thermal properties of the cured cyanate ester resins were studied by dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those of the commercial bisphenol A cyanate ester system. The cured modified cyanate ester exhibited a dielectric constant of 2.59–2.50, a dissipation factor of 0.0055–0.0089, and moisture absorption of 0.91–1.17%; these values were all lower than those of the as‐cured bisphenol A dicyanate system. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 95: 369–379, 2005     

Synthesis and properties of ultraviolet‐curable resins via a thio–ene (thiol and allyl) addition reaction

Benzophenone diallyl ester (I) and benzophenone tetraallyl ester (II) based on 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) with allyl alcohol (AAL) were synthesized. Glycidyl methacrylate (GMA) was added to I and formed diallyl diglycidyl methacrylate (III). These BTDA‐based allyl‐containing compounds (II and III) reacted with 1,4‐butanedithiol and 4,4′‐thiol‐bisbenzene‐thiol to produce ultraviolet (UV)‐curable resins via a thio–ene addition reaction. The ester (III) was cured easily when exposed to UV or sunlight radiation without any photoinitiator and only required a lower thermal curing temperature. The diallyl ester (I) and tetraallyl ester (II) required the addition of benzophenone to increase the photosensitivity, which reduced the exposition time. These resins used AAL as a monomer to successfully reduce the oxygen effect of the photocuring. The resin BTDA–2Allyl–2GMA had a glass‐transition temperature of 166°C and a hardness of 6H. The resultant UV‐curable coatings had excellent hardness, chemical resistance, adhesion, and tensile properties. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1878–1885, 2002     

Preparation and characterization of soluble bismaleimide‐triazine resins based on asymmetric bismaleimide

A series of bismaleimide‐triazine resins (EBT) were prepared from 2‐(4′‐maleimido)phenyl‐2‐(4′‐maleimidophenoxyl)phenylbutane (EBA‐BMI) and 2,2‐bis(4‐cyanatophenyl)propane (BADCy). The resins show attractive processability with good solubility in low boiling point solvents and wide processing temperature windows. Introduction of diallylbisphenol A (DBA) can decrease the curing temperature of EBT resins that the curing exothermic peak temperature shifted from 291 to 237 °C as the content of DBA increased from 0 to 20%. The curing condition influenced the thermal properties of the cured EBT resins. The glass transition temperature increased as the curing temperature and curing time increased. The cured EBT resins show high glass transition temperature up to 352 °C, high thermal stability with 5% weight loss temperature over 405 °C, low coefficient of thermal expansion about 45 to 52 ppm/°C, and high storage modulus up to 2.6 GPa at 250 °C. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44519.     

Property of intrinsic flame retardant epoxy resin cured by functional magnesium organic composite salt and diethylenetriamine

An efficient intrinsic flame retardants composite was prepared by curing epoxy resin with a functional magnesium organic composite salt (FMOCS, 0.685 ± 0.3 nm) and diethylenetriamine (DETA). Curing behavior, thermal and flame‐retardant properties of the cured epoxy resins were systematically investigated by infrared spectrum (FTIR), thermogravimetric analysis (TGA), vertical burning test (UL‐94) and limited oxygen index (LOI) measurement. It was found that flame retardancy and mechanical properties of the cured composite are significantly enhanced compared with DETA/EP. The LOI of the EP reached to 33%, which is much higher than the DETA/EP (19%) or its IFR composite (31%) in the optimal addition of ammonium polyphosphate (APP, 18.69 wt %), pentaerythritol (PER, 6.21 wt %) and FMOCS (3.50 wt %). Furthermore, the mechanical properties of the composite material measurement results to imply that it can enhance tensile strength (150%) and bending strength (88%) rather than DETA/EP, which were tested by impact testing machine and microcomputer control electron universal testing machines. Copyright © 2016 John Wiley & Sons, Ltd.     

Dielectric and thermal properties of polymer network based on bismaleimide resin and cyanate ester containing dicyclopentadiene or dipentene. III

A series of bismaleimide‐triazine (BT) resins were prepared from commercial bismaleimide (DDMBMI) and 2,6‐dimethylphenol‐dicyclopentadiene dicyanate ester (DCPDCY) or 2,6‐dimethylphenol‐dipentene dicyanate ester (DPCY). The thermal properties of cured BT resins containing DCPD or DP were studied using a dielectric analyzer (DEA), dynamic mechanical analyzer (DMA), and thermal gravimetric analyzer (TGA). These data were compared with that of DDMBMI cured with bisphenol A dicyanate ester (BADCY). The cured DDMBMI/DCPDCY or DDMBMI/DPCY exhibits a lower dielectric constant, dissipation factor, and moisture absorption than those of DDMBMI/BADCY. The effects of blend composition on the glass transition temperatures and thermal stability are discussed. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1942–1951, 2007     

Photopolymerization and thermal behavior of phosphate diacrylate and triacrylate used as reactive‐type flame‐retardant monomers in ultraviolet‐curable resins

Tri(acryloyloxyethyl)phosphate (TAEP) and di(acryloyloxyethyl)ethyl phosphate (DAEEP) were used as reactive‐type flame‐retardant monomers along with commercial epoxy acrylate and polyurethane acrylate oligomers in ultraviolet (UV)‐curable resins. The concentrations of the monomers were varied from 17 to 50 wt %. The addition of the monomers greatly reduced the viscosity of the oligomers and increased the photopolymerization rates of the resins. The flame retardancy and thermal degradation behavior of the UV‐cured films were investigated with the limiting oxygen index (LOI) and thermogravimetric analysis. The results showed that the thermal stability at high temperatures greater than 400°C and the LOI values of the UV‐cured resins, especially those containing epoxy acrylate, were largely improved by the addition of the monomers. The dynamic mechanical thermal properties of the UV‐cured films were also measured. The results showed that the crosslink density increased along with the concentrations of the monomers. However, the glass‐transition temperature decreased with an increasing concentration of DAEEP because of the reduction in the rigidity of the cured films, whereas the glass‐transition temperature increased with the concentration of TAEP because of the higher crosslink density of the cured films. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 185–194, 2005     

Microencapsulation of triglycidyl isocyanurate by solvent evaporation method for UV and thermal dual‐cured coatings

Triglycidyl isocyanurate (TGIC), a thermal curing agent, was encapsulated with poly(methyl methacrylate) with small particle size and narrow distribution for the application in acrylic resins to prepare one‐package UV and thermal dual‐cured coatings. Investigation of the wettability and thermal properties suggests that the microcapsules have better compatibility with acrylic resins and thermal stability as compared to pure TGIC. Results of the release performance experiments indicate good storage stability at 25°C and a quick release of vast TGIC at 120°C for the microcapsules. The UV‐thermal dual‐cured coatings prepared with the microcapsules exhibit a fast, even and complete hardening at 130°C together with an excellent adhesion to the mild steel panels. The results presented here show an application potential of the microcapsules in UV and thermal dual‐cured paints. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 41008.     

Phosphorous‐containing epoxy resins from a novel synthesis route

The ? P(O)‐H in 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) was used as an active group to react with the carbonyl group in 4,4′‐dihydroxybenzophenone (DHBP) to result a novel phosphorous‐containing biphenol compound (DOPO‐2OH). Phosphorous‐containing epoxy resins were therefore obtained from reacting DOPO‐2OH with epichlorohydrin or with diglycidylether bisphenol A. The synthesized compounds were characterized with FTIR, ¹H and ³¹P NMR, elemental analysis, and epoxide equivalent weight titration to demonstrate the their chemical structures. Cured epoxy resins were prepared via thermal curing the epoxy resins with various curing agents. Thermal analysis results (differential scanning calorimetry and thermogravimetric analysis) revealed that these cured epoxy resins exhibited high glass transition temperatures and high thermal stability. High char yields at 700°C and high LOI (limited oxygen index) values were also found for the cured epoxy resins to imply that the resins were possessing high flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1697–1701, 2002     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Improving thermal and flame‐retardant properties of epoxy resins by a new imine linkage phosphorous‐containing curing agent

A new reactive phosphorus‐containing curing agent with imine linkage called 4, 4′‐[1, 3‐phenyl‐bis(9, 10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl)dimethyneimino)]diphenol (2) was synthesized both via two‐pot and one‐pot procedure. The chemical structure of this curing agent was confirmed by FTIR, ¹H, ¹³C, and ³¹P NMR spectra. A series of thermosetting systems were prepared by using conventional epoxy resins (E51), 4, 4′‐diaminodiphenyl methane (DDM) and (2). Resins with different phosphorus contents were obtained by changing the DDM/(2) molar ratios. Their dynamic mechanical thermal, thermal and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis (DMTA), thermogravimetric analysis (TGA), and limiting oxygen index (LOI), respectively. All samples had a single T_g, which showed that these epoxy resins were homogeneous phase. Both the two char yields under nitrogen and air atmospheres increased with increasing content of (2) and the LOI values increased from 24.5 for standard resin to 37.5 for phosphorus‐containing resin, which indicated that incorporation of (2) could impart good thermal stability and excellent flame retardancy to the conventional epoxy thermosets. POLYM. ENG. SCI., 56:441–447, 2016. © 2016 Society of Plastics Engineers     

Synthesis and properties of a novel phosphorous‐containing flame‐retardant hardener for epoxy resin

An aryl phosphinate dianhydride 1,4‐bis(phthalic anhydride‐4‐carbonyl)‐2‐(6‐oxido‐6H‐dibenz[c,e][1,2]‐oxaphosphorin‐6‐yl)‐phenylene ester (BPAODOPE) was synthesized and its structure was identified by FTIR and ¹H‐NMR. BPAODOPE was used as hardener and flame retardant for preparing halogen‐free flame‐retarded epoxy resins when coupled with another curing agent. Thermal stability, morphologies of char layer, flame resistance and mechanical properties of flame‐retarded epoxy resins were investigated by thermogravimetric analysis, SEM, limiting oxygen index (LOI), UL‐94 test, tensile, and charpy impact test. The results showed that the novel BPAODOPE had a better flame resistance, the flame resistance and char yield of flame‐retarded epoxy resins increased with an increase of phosphorus content, tensile strength and impact strength of samples gradually decreased with the addition of BPAODOPE. The flame‐retarded sample with phosphorus contents of 1.75% showed best combination properties, LOI value was 29.3, and the vertical burning test reached UL‐94 V‐0 level, tensile strength and impact strength were 30.78 MPa and 3.53 kJ/m², respectively. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Acrylic resins resisting oxygen inhibition during free‐radical photocuring. I. Formulation attributes

A resin system was found to be resistant to the formation of an oxygen‐inhibited layer when cured in air via conventional free‐radical photopolymerization. The resins, containing multifunctional acrylates and a high concentration of a photoinitiator, were applied as thin film coatings and photocured with either visible light (400–500 nm) or UV light (254 nm). Fourier transform infrared spectroscopy with an attenuated total reflection attachment and pencil hardness were used to assess the surface double‐bond conversion and the surface hardness of the coatings cured in air and without air, respectively. The surfaces of many tested resins could produce similar conversions under both curing conditions. Optimally formulated resins had a high conversion and hardness even when the irradiance was as low as 50 mW/cm² for the visible light and 4 mW/cm² for the UV light. The requirements for possessing such a unique curing property are presented. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effect of the structure of curing agents modified by epoxidized oleic esters on the toughness of cured epoxy resins

The aim of this study was to determine the effect of the ester carbon chain length of curing agents modified by epoxidized oleic esters on the toughness of cured epoxy resins. An amine‐terminated prepolymer (i.e., curing agent G) was synthesized from a bisphenol A type liquid epoxy resin and triethylene tetramine. The toughening curing agents (G1 and G2) were prepared by reactions of epoxidized oleic methyl ester and epoxidized oleic capryl ester, respectively, with curing agent G. Fourier transform infrared spectrometry was used to characterize the chemical structure of the curing agents. The effects of the carbon chain length of the oleic ester group in the curing agents on the toughness and other performances of the curing epoxy resins were investigated by analysis of the Izod impact strength, tensile strength, elongation at break, thermal properties, and morphology of the fracture surfaces of the samples. The results denote that the toughness of the cured epoxy resins increased with the introduction of oleic esters into the curing agents without a loss of mechanical properties and that the toughness and thermal stability of the materials increased with increasing ester carbon chain length. The toughness enhancement was attributed to the flexibility of the end carbon chains and ester carbon chains of the oleic esters in the toughening curing agents. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis,characterization, and UV‐curing properties of silicon‐containing (Meth)acrylate monomers

Eight different silicon‐containing (meth)acrylate monomers are synthesized by the substitution reaction of chlorosiloxanes with 2‐hydroxyethyl methacrylate or 2‐hydroxyethyl acrylate. Their molecular structures are confirmed by IR, ¹H‐NMR, and ¹³C‐NMR spectroscopic analyses. The effects of silicon content on the UV‐curing behavior, physical, surface, and thermal properties are investigated. The UV‐curing behavior is analyzed by photo differential scanning calorimetry. The surface free energy of the UV‐cured film is calculated from contact angles measured using the Lewis acid‐base three liquids method. The silicon‐containing (meth)acrylate monomers perform much better than traditional (meth)acrylate monomers on UV‐curing. The silicon‐containing monomers have higher final conversions and fast UV‐curing rates in photopolymerization. The surface free energy decreases with increasing silicon content, because silicon in the soft segment is transferred to the surface, producing a UV‐cured film; this is confirmed by X‐ray photoelectron spectroscopy measurements. All these advantageous properties enable these synthetic silicon‐containing monomers to perform better in applications. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Synthesis and properties of bismaleimide resin containing dicyclopentadiene or dipentene. VI

New aromatic bismaleimides (BMIs), bis(4‐maleimidophenoxy‐3,5‐dimethylphenyl)dicyclopentadiene (DCPDBMI) and bis(4‐maleimido‐phenoxy‐3,5‐dimethylphenyl)dipentene (DPBMI), containing a large dicyclopentadiene (DCPD) or dipentene (DP) and aryl ether linkage, were synthesized from diamine bis(4‐aminophenoxy‐3,5‐dimethylphenyl)dicyclopentadiene (DCPDA) or bis(4‐aminophenoxy‐3,5‐dimethylphenyl)dipentene(DPA) and maleic anhydride by the usual two‐step procedure that included ring‐opening addition to give bismaleamic acid, followed by cyclodehydration to bismaleimide. The monomers were characterized by Fourier transform infrared spectroscopy, proton NMR, elemental analyses, and mass spectra. Their thermal polymerization was investigated by DSC. The presence of a large cycloaliphatic moiety in the backbone of the bismaleimide increased the curing temperature and reduced the reactivity of the maleimide bond. Thermal and electrical properties of cured bismaleimide resins were studied using a dielectric analyzer, dynamic mechanical analyzer, and thermal gravimetric analyzer. These data were compared with that of commercial 4,4‐bismaleimidodiphenylmethane (DDMBMI). The cured DCPDBMI or DPBMI exhibits a lower dielectric constant, dissipation factor and moisture absorption than those of DDMBMI. Copyright © 2006 Society of Chemical Industry     

Synthesis of a self‐emulsifiable waterborne epoxy curing agent based on glycidyl tertiary carboxylic ester and its cure characteristics

A novel self‐emulsifiable waterborne amine‐terminated curing agent for epoxy resin based on glycidyl tertiary carboxylic ester (GTCE) was synthesized through three steps of addition reaction, capping reaction, and salification reaction of triethylene tetramine (TETA) and liquid epoxy resin (E‐44). The curing agent with good emulsifying and curing properties was gradually obtained under condition of the molar ratio of TETA: E‐44 as 2.2: 1 at 65 °C for 4 h, 100% primary amine capped with GTCE at 70 °C for 3 h, and 20% salifiable rate with glacial acetic acid. The curing agent was characterized by Fourier transform‐infrared spectroscopy (FT‐IR). The curing behavior of the E‐44/GTCE‐TETA‐E‐44 system was studied with differential scanning calorimetry (DSC) and FT‐IR. Results showed that the optimal mass ratio for E‐44/GTCE‐TETA‐E‐44 system was 3 to 1, and the curing agent showed a relatively lower curing temperature. The cured film prepared by the self‐emulsifiable curing agent and epoxy resin under the optimal mass ratio displayed good thermal property, hardness, toughness, adhesion, and corrosion resistance. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44246.     

电子束固化木器清漆的制备及性能研究

电子束（ EB）固化技术作为一种重要的辐射固化技术,其固化的清漆涂层性能在许多方面优于紫外（ UV）光固化清漆涂层。本研究通过选取不同类型的商品化丙烯酸树脂及活性稀释剂配制木器涂料配方,分别利用电子束（ EB）和紫外光（ UV）对其进行固化,然后对固化后的涂层进行基本性能、热性能和机械性能的表征。研究结果表明： EB固化速度快,固化膜具有较高的铅笔硬度和附着力,而且树脂种类和单体结构的不同会对电子束固化涂层的热性能及机械性能产生影响。     

Comparison of microwave and thermal cure of epoxy–anhydride resins: Mechanical properties and dynamic characteristics

The objective of this work was to compare the mechanical properties of epoxy resins cured by thermal heating and microwave heating. Epoxy–anhydride (100:80) resins were cured in a domestic microwave oven and in a thermal oven. The hardening agents included methyl tetrahydrophthalic anhydride and methyl hexahydrophthalic anhydride. Three types of accelerators were employed. Thermal curing was performed at 150°C for 20 and 14 min for resins containing 1 and 4% accelerator, respectively. Microwave curing was carried out at a low power (207 or 276 W) for 10, 14, and 20 min. All cured resins were investigated with respect to their tensile properties, notched Izod impact resistance, and flexural properties (three‐point bending) according to ASTM standards. The tan δ and activation energy values were investigated with dynamic mechanical thermal analysis, and the extent of conversion was determined with differential scanning calorimetry. The differences in the mechanical properties of the thermally cured and microwave‐cured samples depended on the resin formulation and properties. Equivalent or better mechanical properties were obtained by microwave curing, in comparison with those obtained by thermal curing. Microwave curing also provided a shorter cure time and an equivalent degree of conversion. The glass‐transition temperatures (tan δ) of the thermally and microwave‐cured resins were comparable, and their activation energies were in the range of 327–521 kJ/mol. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 1442–1461, 2005     

Preparation of silicon‐/phosphorous‐containing epoxy resins from the fusion process to bring a synergistic effect on improving the resins' thermal stability and flame retardancy

Epoxy resins containing both phosphorous and silicon were prepared via the fusion process of reacting a phosphorous diol and a silicon diol with a bisphenol‐A‐type epoxy. With various feeding ratios of the reactants, epoxy resins with different phosphorous and silicon contents were obtained. Through curing the epoxies with diaminodiphenylmethane, the cured epoxy resins exhibit tailored glass transition temperatures (159–77°C), good thermal stability (>320°C), and high char yields at 700°C under air atmosphere. The high char yield was demonstrated to come from the synergistic effect of phosphorous and silicon, where phosphorous enriches char formation and silicon protects the char from thermal degradation. Moreover, high flame retardancy of the epoxy resins was found by the high LOI value of 42.5. The relationship of the char yields at 700°C under air atmosphere (ρ) and the LOI values of the epoxy resins could be expressed as LOI = 0.62ρ + 19.2. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 87: 404–411, 2003     

A novel UV‐curable epoxy acrylate resin containing arylene ether sulfone linkages: Preparation,characterization, and properties

UV‐curing processes are used in industrial applications because of their advantages such as high‐speed applications and solvent‐free formulations at ambient temperature. UV‐curable epoxy acrylate resins containing arylene ether sulfone linkages (EAAES) were synthesized through the condensation of bis(4‐chlorophenyl)sulphone and bisphenol‐A, followed by end‐caping of epichlorohydrin and subsequently acrylic acid. UV‐cured coatings were formulated with epoxy acrylates, reactive diluents such as pentaerythritol tri‐acrylate and pentaerythritol dia‐crylate and photoinitiator. Fourier transfer infrared, ¹H NMR, and thermal gravimetrical analysis were employed to investigate the structures and thermal properties of the EAs films. The introduction of EAAES into epoxy acrylate substantially improves its thermal properties and thermo‐oxidative stability at high temperatures. In addition, the acrylate containing arylene ether sulfone linkages can also improve pencil hardness and chemical and solvent resistance of the epoxy acrylate. The obtained UV‐curable epoxy acrylate containing arylene ether sulfone linkages is promising as oligomer for UV‐curable coatings, inks, and adhesives in some high‐tech regions. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 41067.