Self-alignedIn0.52Al0.48As/In0.53Ga0.47As heterojunction bipolar transistors with graded interface onsemi-insulating InP grown by molecular beam epitaxy

A self aligned In_0.52Al_0.48As/In_0.53 Ga_0.47As double heterojunction bipolar transistor (HBT) with a graded heterointerface has been grown by molecular-beam epitaxy (MBE) and tested. The DC characteristics of HBT structures with a compositionally graded junction using a linear graded In_0.53Ga_0.47-xAl_xAs between two ternary layers were investigated. Typical quaternary graded devices with an emitter dimension of 50×50 μm² exhibited a current gain as high as 1260, as compared to 800 for abrupt devices, at a collector current density of 2.8×10³ A/cm²     

Backgating studies inIn0.53Ga0.47As/In0.52Al0.48As modulation-doped field-effect transistors

A study is presented of the backgating effects in normal and inverted modulation-doped field-effect transistors (MODFETs) grown by molecular-beam epitaxy and their dependence on material properties and device geometry. The experiments were performed on devices with 2-μm gate lengths. The effects of both positive and negative (with respect to the source of the experimental devices) voltages applied to both ohmic and Schottky side contacts were investigated. The inverted MODFET structures, which have a very-high-resistance InAlAs buffer layer, showed negligible backgating characteristics up to side-contact voltages as high as 50 V. The normal structures, on the other hand, were very sensitive to the side-contact voltages with essentially a zero threshold voltage     

High-frequency submicrometerAl0.48In0.52As/In0.53Ga0.47As heterostructure bipolar transistors

The high speed scaling of an Al_0.48In_0.52As/In_0.53Ga_0.47 As submicrometer heterostructure bipolar transistor (HBT) is presented. Transistors with emitter dimensions of 0.5×11 and 3.5×3.5 μm² exhibit unity current-gain cutoff frequencies of 63 and 70 GHz, respectively. Emitter current density greater than 3.3×10⁵ A/cm² is demonstrated in a submicrometer AlInAs/InGaAs HBT. The analysis shows that the device speed is limited by the parasitic collector charging time     

High-performance In0.52Al0.48As/In0.53Ga0.47As HFET compatible with optical-detectorintegration

The authors report the successful demonstration of a 1.0-μm gate InAlAs/InGaAs heterojunction FET (HFET) on top of thick InGaAs layers using lattice-matched molecular beam epitaxy (MBE). This scheme is compatible with metal-semiconductor-metal (MSM) photodetector fabrication. The authors measured the performance of InAlAs/InGaAs HFETs from 0 to 40 GHz. Device performance is characterized by peak extrinsic transconductances of 390 mS/mm and as-measured cutoff frequencies up to 30 GHz for a nominal 1.0-μm-gate-length HFET. HFET device measurements are compared for samples growth with and without the thick underlying InGaAs optical-detector absorbing layer     

Waveguide In0.53Ga0.47As-In0.52Al0.48As avalanche photodiode

A high-speed waveguide In_0.53Ga_0.47As-In_0.52Al_0.48 As separate absorption, charge, and multiplication avalanche photodiode suitable for operation at 1.55 μm has been demonstrated, a unity-gain bandwidth of 27 GHz was achieved with a gain-bandwidth product of 120 GHz     

In0.53Ga0.47As/In0.52Al0.48As雪崩光电二极管的数值模拟研究

建立了SACM型In0.53Ga0.47As/In0.52Al0.48As雪崩光电二极管(APD)的分析模型,通过数值研究和理论分析设计出高性能的In0.53Ga0.47As/In0.52Al0.48As APD。器件设计中,一方面添加了In0.52Al0.48As势垒层来阻挡接触层的少数载流子的扩散,进而减小暗电流的产生;另一方面,雪崩倍增区采用双层掺杂结构设计,优化了器件倍增区的电场梯度分布。最后,利用ATLAS软件较系统地研究并分析了雪崩倍增层、电荷层以及吸收层的掺杂水平和厚度对器件电场分布、击穿电压、IV特性和直流增益的影响。优化后APD的单位增益可以达到0.9 A/W,在工作电压(0.9 Vb)下增益为23.4,工作暗电流也仅是纳安级别(@0.9 Vb)。由于In0.52Al0.48As材料的电子与空穴的碰撞离化率比InP材料的差异更大,因此器件的噪声因子也较低。     

MetamorphicIn0.53Ga0.47As/In0.52Al0.48As HEMTs on germanium substrates

We report for the first time the successful epitaxial growth and processing of high-performance metamorphic high electron mobility transistors (HEMTs) on Ge substrates, with a transconductance of 700 mS/mm and a saturation channel current of 650 mA/mm. To reduce parasitic capacitances due to the conductive substrate, a dry etch method based on CF₄ and O₂ reactive ion etching (RIE) is developed for selective substrate removal. Devices with 0.2 μm gate length display an increase of the extrinsic cut-off frequency f_T from 45 GHz before, to 75 GHz after substrate removal, whereas the maximum oscillation frequency f_max increases from 68 GHz to 95 GHz. Based on this excellent rf performance level, in combination with the highly selective thinning process, we think that Ge as a sacrificial substrate is a promising candidate for the integration of thinned individual HEMTs with passive circuitry on low-cost substrates. This could result in low-cost advanced hybrid systems for mass-market millimeter wave applications     

In0.52Al0.48As/In0.53Ga0.47As MSM photodetectors and HEMT's grown by MOCVD on GaAs substrates

The authors report the first demonstration of In_0.52Al _0.48As/In_0.53Ga_0.47As metal-semiconductor-metal (MSM) photodetectors and high-electron-mobility transistors (HEMTs) grown on GaAs substrates by organometallic chemical vapor deposition. Both photodetectors and transistors showed no degradation in performance compared to devices simultaneously grown on InP substrates. The photodetectors exhibited a responsivity of 0.45 A/W and leakage current of 10 to 50 nA. The HEMTs with a gate length of 1.0 μm showed a transconductance as high as 250 mS/mm, and f_T and f_max of 25 and 70 GHz, respectively     

Characterization of surface-undoped In0.52Al0.48As/In0.53Ga0.47As/InP high electron mobilitytransistors

High-performance 0.3-μm-gate-length surface-undoped In_0.52 Al_0.48As/In_0.53Ga_0.47As/InP high-electron-mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE) have been characterized and compared with a surface-doped structure. At 18 GHz, the surface-undoped HEMT has achieved a maximum stable gain (MSG) of 19.2 dB compared to 16.0 dB for the surface-doped structure. The higher MSG value of the surface-undoped HEMTs is obtained due to the improved g_m/g₀ ratio associated with the surface-induced electric field spreading effect. Comparison of identical 0.3-×150-μm-gate devices fabricated on surface-undoped and -doped structures has shown greatly improved gate leakage characteristics and much lower output conductance for the surface-undoped structure. It is demonstrated that the surface potential, modulated by different surface layer designs, affects the charge control in the conducting channel, especially the carrier injection into the buffer, resulting in excess output conductance. Several millimeter-wave coplanar waveguide (CPW) monolithic distributed amplifiers have been successfully fabricated by using the surface-undoped HEMT structure. A high gain per stage distributed amplifier with 170-dB±1-dB small-signal gain across a frequency band of 24-40 GHz, a W-band monolithic integrated circuit with 6.4-dB gain at 94 GHz, and a broad bandwidth distributed amplifier with 5-dB gain across a frequency band of 5 to 100 GHz have been demonstrated by using the surface-undoped structures     

Electron transport in 0.15-μm gate In0.52Al0.48As/In0.53Ga0.47As HEMT

Magneto-transport and cyclotron resonance measurements were made to determine directly the density, mobility, and the effective mass of the charge carriers in a high-performance 0.15-μm gate In_0.52 Al_0.48As/In_0.53Ga_0.47As high-electron-mobility transistor (HEMT) at low temperatures. At the gate voltage V_G=0 V, the carrier density n _g under the gate is 9×10¹¹ cm^-2, while outside of the gate region n_g=2.1×10¹² cm^-2. The mobility under the gate at 4.2 K is as low as 400 cm²/V-s when V_G<0.1 V and rapidly approaches 11000 cm²/V-s when V_G>0.1 V. The existence of this high mobility threshold is crucial to the operation of the device and sets its high-performance region in V_G>0.1 V     

7.1 GHz bandwidth monolithically integratedIn0.53Ga0.47As/In0.52Al0.48As PIN-HBT transimpedance photoreceiver

A monolithically integrated photoreceiver using an InAlAs/InGaAs HBT-based transimpedance amplifier has been fabricated and characterized. The p-i-n photodiode is implemented using the base-collector junction of the HBT. The 5 μm×5 μm emitter area transistors have self-aligned base metal and non-alloyed Ti/Pt/Au contacts. Discrete transistors demonstrated f_T and f_max of 54 GHz and 51 GHz, respectively. The amplifier demonstrated a -3 dB transimpedance bandwidth of 10 GHz and a gain of 40 dBΩ. The integrated photoreceiver with a 10 μm×10 μm p-i-n photodiode showed a -3 dB bandwidth of 7.1 GHz     

Impact of surface layer on In0.52Al0.48As/In0.53Ga0.47As/InP high electron mobilitytransistors

The surface potential of FETs has shown a strong effect on the channel potential and charge control in the channel. A study of the role of undoped versus doped cap layers in In_0.52Al_0.48As-In_0.53Ga_0.47 As-InP high-electron-mobility transistors (HEMT) is discussed. As the result of surface potential effect, direct comparison of 0.3×150-μm² gate devices yielded improved gate breakdown characteristics and a DC output conductance of less than 15 mS/mm for the surface undoped structure compared to 50 mS/mm for the doped structure. The surface undoped MEMT achieved a very high maximum stable gain of 19.2 dB compared to 16.0 dB for the surface doped HEMT at 18 GHz, largely due to the improved g_m/g ₀ ratio. This study demonstrates that control of the surface potential in In_0.52Al_0.48As-In_0.53Ga _0.47As-InP HEMTs is consistent with the effect of a gate recess in MESFETs. This study also shows that, in achieving high-gain applications of HEMTs, the surface potential near the gate edge should be optimized through unconventional surface layer design     

0.12 μm transferred-substrateIn0.52Al0.48As/In0.53Ga0.47As HEMTs on silicon wafer

New In_0.52Al_0.48As/In_0.53Ga_0.47 As transferred-substrate high electron mobility transistors (TS-HEMTs) have been successfully fabricated on 2-in Silicon substrate with 0.12 μm T-shaped gate length. These new TS-HEMTs exhibit typical drain currents of 450 mA/mm and extrinsic transconductance up to 770 mS/mm. An extrinsic current gain cutoff frequency f_T of 185 GHz is obtained. That result is the first reported for In_0.52Al_0.48As/In_0.53Ga_0.47 As TS-HEMTs on Silicon substrate     

The influence of gate-feeder/mesa-edge contacting on sidegatingeffects in In0.52Al0.48As/In0.53Ga0.47As heterostructure FET's

Sidegating effects in InAlAs/InGaAs heterostructure field effect transistors (HFETs) were experimentally investigated. Two different configurations of gate feeder across the mesa edges are compared in In _0.52Al_0.48As/In_0.53Ga_0.47As. HFETs. HEMTs and heterostructure insulated-gate FETs (HIGFETs) were fabricated, each with different gate-feeder configurations. HFETs with the gate air bridge over the mesa edge can maintain 99% of the drain-source (I_ds) current level at sidegate voltages (V_sg) extending up to -30 V, while the non-air-bridge configuration of HFETs show a 30% drop of I_ds at the same V _sg. This significant discrepancy of sidegating effect is attributed to depletion region modulation at the mesa edge below the gate feeder. By lifting the gate feeder above the mesa step, sidegating is reduced, which suggests the channel/substrate trap effects are negligibly small. The role of air-bridge structures in determining the sidegating characteristics is discussed     

Optical control and injection locking of monolithically integratedIn0.53Ga0.47As/In0.52Al0.48As MODFET oscillators

Optical tuning and injection locking characteristics of MMIC oscillators made with InP-based 0.25 μm gate In_0.53Ga_0.47As/In_0.52Al_0.48 As modulation-doped field-effect transistors (MODFETs) have been investigated. Optical tuning has been performed on the X- and R-band oscillator circuits and a maximum tuning range of 8.7 MHz and 11.7 MHz, respectively, has been measured. The tuning characteristics have been explained in terms of changes in the MODFET characteristics with absorption of incident light. Direct optical subharmonic injection locking of these oscillator circuits have been done at 10 and 19 GHz, which are the highest achieved for InP-based MMIC's     

An In0.52Al0.48As/n+-In0.53Ga0.47As MISFET with a modulation-doped channel

A heterostructure metal-insulator-semiconductor field-effect transistor (MISFET) with a modulation-doped channel is proposed. In this device, a very thin undoped subchannel is located between the undoped wide-bandgap insulator and a thin heavily doped channel. In the depletion mode of operation, electron transport takes place along the heavily doped channel. When the device enters the accumulation mode of operation, electrons pile up against the heterointerface in the high-mobility undoped subchannel. This results in markedly improved transport characteristics at the onset of accumulation. The concept is demonstrated in the In_0.52Al_0.48As/In_0.53 Ga_0.47As system on InP. A 1.5-μm-gate-length MISFET shows a unity current-gain cutoff frequency of 37 GHz     

88 nm栅长fmax＝201 GHz InP基In0.53Ga0.47As/In0.52Al0.48As HEMT器件

我们成功研制了栅长88 nm, 栅宽2 50 μm, 源漏间距为2.4 μm 的InP基In0.53Ga0.47As/In0.52Al0.48As高电子迁移率器件(HEMT)。栅是使用PMMA/Al/UVⅢ,通过优化电子束曝光时间及其显影时间的方式制作的。这些器件有比较好的直流及其射频特性：峰值跨导、最大源漏饱和电流密度、开启电压、ft和fmax 分别为765 mS/mm, 591 mA/mm, -0.5 V, 150 GHz 和201 GHz。这些器件将非常适合于毫米波段集成电路。     

Effect of a Two-Step Recess Process Using Atomic Layer Etching on the Performance of In0.52Al0.48As/In0.53Ga0.47As p-HEMTs

The characteristics of 0.15- mum InAlAs/InGaAs pseudomorphic high-electron mobility transistors (p-HEMTs) that were fabricated using the Ne-based atomic layer etching (ALET) technology and the Ar-based conventional reactive ion etching (RIE) technology were investigated. As compared with the RIE, the ALET used a much lower plasma energy and thus produced much lower plasma-induced damages to the surface and bulk of the In_0.52AI_0.48As barrier and showed a much higher etch selectivity (~70) of the InP spacer against the In_0.52Al_0.48As barrier. The 0.15-mum InAlAs/InGaAs p-HEMTs that were fabricated using the ALET exhibited improved G_m,max (1.38 S/mm), I_ONn/I_OFF(1.18X10⁴), drain-induced barrier lowering (80 mWV), threshold voltage uniformity (V_th,avg = -190 mV and alpha = 15 mV), and ftau (233 GHz), mainly due to the extremely low plasma-induced damage in the Schottky gate area.     

On the non-ideal characteristics of Schottky-Barrier-gate diodes inIn0.52Al0.48As/In0.53Ga0.47As heterostructure FET's on InP substrates

We report results of determination of the zero-field barrier heights of Schottky-barrier-gate-diodes in InAlAs/InGaAs heterostructure modulation doped FET's by exploiting their temperature dependent I-V characteristics. The field-emission model has been found to account for the gate current flow mechanism particularly at temperatures below 200 K. Using this model the influence of the InAlAs/InGaAs heterostructure potential barrier on the gate current has been delineated and a possible cause behind the current's wide-range of variability, from 10^-1 to 10² A/cm² within 100 mV forward bias, has been suggested     

120nm栅长In0.7Ga0.3As/In0.52Al0.48As HEMTs 器件

利用新型的PMMA/PMGI/ZEP520/PMGI四层胶T形栅电子束光刻技术制备出120nm栅长InP基雁配In0.7Ga0.3As/In0.52Al0.48As 高电子迁移率晶体管。制作出的InP基HEMT器件获得了良好的直流和高频性能,跨导、饱和漏电流密度、阈值电压、电流增益截止频率和最大单向功率增益频率分别达到520 mS/mm, 446 mA/mm, -1.0 V, 141 GHz 及 120 GHz。文中的材料结构和所有器件制备均为本研究小组自主研究开发。