Effects of an AlN passivation layer on the microstructure and electronic properties of AlGaN/GaN heterostructures

Effects of an AlN passivation layer on the microstructure and electronic properties of AlGaN/GaN heterostructures were investigated by X-ray diffraction and Hall effect measurements. AlN passivation induced an additional compressive stress in an AlGaN barrier layer instead of an additional tensile stress induced by Si₃N₄ passivation. The change of strain after passivation contributes in a relatively small proportion to the variation of the carrier concentration in AlGaN/GaN heterostructures compared with the contribution from passivation of surface traps. The results from Hall effect measurements show that the AlN passivation layer has a better effect on passivation of deep levels than the Si₃N₄ film and also results in a remarkable increase in mobility of the two-dimensional electron gas. PACS 73.40.Kp; 71.55.Eq; 81.65.Rv; 81.05.Ea; 61.05.cp     

Two-dimensional electron gas densities in AlGaN/AlN/GaN heterostructures

The dependence of two-dimensional electron gas (2DEG) density and distribution in an Al_xGa_1-xN/AlN/GaN heterostructure on the thicknesses of the Al_xGa_1-xN barrier layer and the AlN interfacial layer are investigated theoretically. A competitive contribution of the AlGaN and AlN layers to the 2DEG density is revealed. For an AlN interfacial layer thinner than a critical value d_cAlN, the 2DEG density is dominated by the AlGaN barrier and the 2DEG density increases with the increase of the AlGaN barrier thickness, as in the case of a simple AlGaN/GaN heterostructure. While the AlN interfacial layer will take the dominant contribution to the 2DEG density as its thickness exceeds d_cAlN. In this case, the increase of AlGaN barrier layer thickness leads to the decrease of the 2DEG density. Detailed calculations show that the critical AlN thickness increases with the increase of Al content in the AlGaN barrier. PACS 85.30.De; 73.40.Kp; 02.60.Cb     

AlN, GaN, AlxGa1 − xN nanotubes and GaN/AlxGa1 − xN nanotube heterojunctions

Semiconductor optoelectronic devices based on GaN and on InGaN or AlGaN alloys and superlattices can operate in a wide range of wavelengths, from far infrared to near ultraviolet region. The efficiency of these devices could be enhanced by shrinking the size and increasing the density of the semiconductor components. Nanostructured materials are natural candidates to fulfill these requirements. Here we use the density functional theory to study the electronic and structural properties of (10,0) GaN, AlN, Al_xGa_1 − xN nanotubes and GaN/Al_xGa_1 − xN heterojunctions, 0<x<1. The Al_xGa_1 − xN nanotubes exhibit direct band gaps for the whole range of Al compositions, with band gaps varying from 3.45 to 4.85 eV, and a negative band gap bowing coefficient of −0.14 eV. The GaN/Al_xGa_1 − xN nanotube heterojunctions show a type-I band alignment, with the valence band offsets showing a non-linear dependence with the Al content in the nanotube alloy. The results show the possibility of engineering the band gaps and band offsets of these III-nitrides nanotubes by alloying on the cation sites.     

DLTS characterization of silicon nitride passivated AlGaN/GaN heterostructures

Passivating the ungated surface of AlGaN/GaN HEMTs with silicon nitride (SiN) is effective in improving the microwave output power performances of these devices. However, very little information is available about surface states in GaN-based HEMTs after SiN passivation. In this work we investigate AlGaN/GaN HEMTs structures having either metal–semiconductor or metal–SiN–semiconductor gate contacts. In short gate devices conductance DLTS measurements point out a hole-like peak that shows an anomalous behaviour and can be ascribed to surface states in the access regions of the device. In insulated gate HEMTs a band of levels is detected and ascribed to surface states, whose energy ranges from 0.14 to 0.43 eV. Capacitance–voltage measurements allow us to point out the existence of a second band of interface states deeper in energy than the former one. This band is responsible for slow transients observed in the characteristics of the insulated gate FAT-HEMT.     

Dielectrophoretically aligned GaN nanowire rectifiers

We demonstrate GaN nanowire (NW) current rectifiers which were formed by assembling n-GaN nanowires on a patterned p-Si substrate by means of alternating current (ac) dielectrophoresis. The dielectrophoresis was accomplished at a frequency of 10 kHz with three different ac bias voltages (5, 10, and 15 V_p–p), indicating that the number of aligned GaN nanowires increased with increasing ac bias voltage. The n-GaN NW/p-Si diodes showed well-defined current rectifying behavior with a forward voltage drop of 1.2–1.5 V at a current density of 200 A/cm². We observed that the GaN NW diode functioned well as a half-wave rectifier. PACS 71.20.Nr; 73.40.Cg; 73.40.Ei; 73.40.Kp     

Photoreflectance investigations of AlGaN/GaN heterostructures with a two dimensional electron gas

Undoped AlGaN/GaN heterostructures with different content and thickness of AlGaN layer are investigated by photoreflectance (PR) spectroscopy. We have observed PR resonances related to an absorption in both GaN and AlGaN layers. The character of these resonances has been analyzed, and PR lines associated with excitonic and band-to-band absorption in the GaN layer and band-to-band absorption in the AlGaN layer have been identified. The transition related to band-to-band absorption possesses characteristic Franz–Keldysh oscillations (FKOs) associated with a built-in electric field. The electric field in the AlGaN layer obtained on the basis of the analysis of FKOs has been found to be in the range of 244–341 kV/cm. The value of the field has been found to decrease with the increase in AlGaN thickness and to increase with the increase in Al concentration. The surface potential for AlGaN layers has been found to increase with the increase in Al mole fraction and has been estimated to be in the range of 1.0–1.7 eV.     

Transport mechanism of reverse surface leakage current in AlGaN/GaN high-electron mobility transistor with SiN passivation

The transport mechanism of reverse surface leakage current in the AlGaN/GaN high-electron mobility transistor(HEMT) becomes one of the most important reliability issues with the downscaling of feature size.In this paper,the research results show that the reverse surface leakage current in AlGaN/GaN HEMT with SiN passivation increases with the enhancement of temperature in the range from 298 K to 423 K.Three possible transport mechanisms are proposed and examined to explain the generation of reverse surface leakage current.By comparing the experimental data with the numerical transport models,it is found that neither Fowler-Nordheim tunneling nor Frenkel-Poole emission can describe the transport of reverse surface leakage current.However,good agreement is found between the experimental data and the two-dimensional variable range hopping(2D-VRH) model.Therefore,it is concluded that the reverse surface leakage current is dominated by the electron hopping through the surface states at the barrier layer.Moreover,the activation energy of surface leakage current is extracted,which is around 0.083 eV.Finally,the SiN passivated HEMT with a high Al composition and a thin AlGaN barrier layer is also studied.It is observed that 2D-VRH still dominates the reverse surface leakage current and the activation energy is around 0.10 eV,which demonstrates that the alteration of the AlGaN barrier layer does not affect the transport mechanism of reverse surface leakage current in this paper.     

The defect density of a SiNx/In0.53Ga0.47As interface passivated using (NH4)2Sx

Passivation of the electronic defect states at a SiN_x/InGaAs interface has been achieved using (NH₄)₂S_x treatments of the InGaAs surface. The X-ray photoelectron spectroscopy technique was used to investigate the mechanism of sulfur passivation. The results indicate that sulfur treatment can effectively erase the native oxides, and S-In, S-Ga and S-As bondings are formed after sulfidation. The fabrication of Au/SiN_x/InGaAs metal–insulator–semiconductor diodes has been achieved by depositing a layer of SiN_x on (NH₄)₂S_x-treated n-InGaAs using the plasma enhanced chemical vapor deposition technique. The effect of passivation on the InGaAs surface before and after annealing was evaluated by current–voltage and capacitance–voltage measurements. The results indicate that the SiN_x passivation layer exhibits good insulative properties. The annealing contributes to the decrease of the fixed charge density and the minimum surface state density, which are 4.5×10¹¹ cm^-2 and 3.92×10¹¹ cm^-2 eV^-1, respectively. A 256×1 InP/InGaAs/InP heterojunction short-wavelength infrared detector, fabricated with the sulfidation plus a SiN_x passivation layer, has shown a good response uniformity of 4.81%. PACS 73.20.At; 73.40.Kp; 73.40.Rw; 81.40.Rs; 71.55.Eq     

Angular resolved photoemission from intrinsic surface states on Al (100)

Using photon energies of 11.7, 16.8 and 21.2 eV, we have recorded angular resolved photoemission spectra from clean Al (100). A dominant, surface sensitive peak is interpreted as emission from a two-dimensional band of surface states. The band mass is $\text{m}{}^1\text{=(1.03±0.10)m}$, and the band minimum, (2.8±0.2) eV below E_F for surface momentum k₆=0, is located within the bulk band gap. The observed existence of the peak for large values of k₆, indicates a transition from a true surface state to a surface resonance.     

Deformation of AlGaN/GaN superlattice layers according to x-ray diffraction data

Three-crystal x-ray diffractometry is used for structural studies of nitride AlGaN/GaN superlattices (SLs) grown by metal-organic chemical vapor deposition on sapphire with GaN and AlGaN buffer layers with widely varied SL period (from 50 to 3500 Å), Al content in Al_x Ga_1?x N layers (0.1≤x≤0.5), and buffer layer composition. Satellite peaks characteristic of SLs are well pronounced up to the third order in θ-2θ scans of symmetric Bragg reflections and θ scans of the symmetric Laue geometry. The corresponding curves are well modeled by kinematic formulas. The average SL parameters, as well as the thickness, composition, and strain of individual layers, are determined using a combination of symmetric Bragg and Laue reflections. It is shown that all the samples under study are partially relaxed structures in which the elastic stresses between the entire SL and the buffer layer, as well as between individual layers, are relaxed. The AlGaN layers are stretched and the GaN layers are compressed. The GaN layer compression is larger in magnitude than the AlGaN layer tension because of thermoelastic stresses.     

High-electric-field-stress-induced degradation of SiN passivated AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors (HEMTs) are fabricated by employing SiN passivation, this paper investigates the degradation due to the high-electric-field stress. After the stress, a recoverable degradation has been found, consisting of the decrease of saturation drain current I_Dsat, maximal transconductance g_m, and the positive shift of threshold voltage V_TH at high drain-source voltage V_DS. The high-electric-field stress degrades the electric characteristics of AlGaN/GaN HEMTs because the high field increases the electron trapping at the surface and in AlGaN barrier layer. The SiN passivation of AlGaN/GaN HEMTs decreases the surface trapping and 2DEG depletion a little during the high-electric-field stress. After the hot carrier stress with V_DS=20 V and V_GS=0 V applied to the device for 10⁴ sec, the SiN passivation decreases the stress-induced degradation of I_Dsat from 36% to 30%. Both on-state and pulse-state stresses produce comparative decrease of I_Dsat, which shows that although the passivation is effective in suppressing electron trapping in surface states, it does not protect the device from high-electric-field degradation in nature. So passivation in conjunction with other technological solutions like cap layer, prepassivation surface treatments, or field-plate gate to weaken high-electric-field degradation should be adopted.     

Photoluminescence enhancement by localized surface plasmons in AlGaN/GaN/AlGaN double heterostructures

Double heterostructures AlGaN/GaN/AlGaN grown by hydride vapor phase epitaxy and designed for use as light emitting diodes for 360 nm wavelength were patterned by shallow nanoholes and injected with Ag/SiO₂ or Al nanoparticles. A 1.8 times increase in the photoluminescence and microcathodoluminescence signal from the GaN active region was observed for 100 nm diameter Al nanoparticles, the efficiency decreased compared to the reference planar samples for small Al nanoparticles of 30–40 nm diameter, and a moderate increase of 1.2 times was detected for Ag/SiO₂ nanoparticles. The observed phenomena are explained by the GaN emitter coupling with localized surface plasmons produced by metallic nanoparticles. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

AlGaN插入层对InAlN/AlGaN/GaN异质结散射机制的影响

InAlN/AlN/GaN异质结中,名义上的AlN插入层实为Ga含量很高的AlGaN层, Al, Ga摩尔百分比决定了电子波函数与隧穿几率,因此影响与InAlN/AlGaN势垒层有关的散射机制.本文通过求解薛定谔-泊松方程与输运方程,研究了AlGaN层Al摩尔百分含量对InAlN组分不均匀导致的子带能级波动散射、导带波动散射以及合金无序散射三种散射机制的影响.结果显示:当Al含量由0增大到1,子带能级波动散射强度与合金无序散射强度先增大后减小,导带波动散射强度单调减小;在Al含量为0.1附近的小组分范围内,合金无序散射是限制迁移率的主要散射机制,该组分范围之外,子带能级波动散射是限制迁移率的主要散射机制;当Al摩尔百分含量超过0.52,三种散射机制共同限制的迁移率超过无插入层结构的迁移率, AlGaN层显示出对迁移率的提升作用.     

Surface Leakage Currents in SiN and Al_2O_3 Passivated AlGaN/GaN High Electron Mobility Transistors

Surface leakage currents of AlGaN/GaN high electron mobility transistors are investigated by utihzing a circular double-gate structure to eliminate the influence of mesa leakage current.Different mechanisms are found under various passivation conditions.The mechanism of the surface leakage current with Al_2O_3 passivation follows the two-dimensional variable range hopping model,while the mechanism of the surface leakage current with SiN passivation follows the Frenkel-Poole trap assisted emission.Two trap levels are found in the trap-assisted emission.One trap level has a barrier height of 0.22 eV for the high electric Geld,and the other trap level has a barrier height of 0.12 eV for the low electric field.     

1000 V p-GaN混合阳极AlGaN/GaN二极管

GaN材料具有优异的电学特性,如大的禁带宽度(3.4 eV)、高击穿场强(3.3 MV/cm)和高电子迁移率(600 cm~2/(V·s)). AlGaN/GaN异质结由于压电极化和自发极化效应,产生高密度(1×10~(13)cm~(-2))和高迁移率(2000 cm~2/(V·s))的二维电子气(2DEG),在未来的功率系统中, AlGaN/GaN二极管具有极大的应用前景.二极管的开启电压和击穿电压是影响其损耗和功率处理能力的关键参数,本文提出了一种新型的具有高阻盖帽层(high-resistance-cap-layer, HRCL)的p-GaN混合阳极AlGaN/GaN二极管来优化其开启电压和击穿特性.在p-GaN/AlGaN/GaN材料结构基础上,通过自对准的氢等离子体处理技术,在沟道区域形成高阻盖帽层改善电场分布,提高击穿电压,同时在阳极区域保留p-GaN结构,用于耗尽下方的二维电子气,调控开启电压.制备的p-GaN混合阳极(p-GaN HRCL)二极管在阴阳极间距Lac为10μm时,击穿电压大于1 kV,开启电压+1.2 V.实验结果表明, p-GaN混合阳极和高阻GaN盖帽层的引入,有效改善AlGaN/GaN肖特基势垒二极管电学性能.     

Band alignment at the In2S3/Cu2ZnSnS4 heterojunction interface investigated by X-ray photoemission spectroscopy

The band alignment at the In₂S₃/Cu₂ZnSnS₄ heterojunction interface is investigated by X-ray photoemission spectroscopy. In₂S₃ is thermally evaporated onto the contamination-free polycrystalline Cu₂ZnSnS₄ surface prepared by magnetron sputtering. The valence band offset is measured to be 0.46 ± 0.1 eV, which matches well with the valance band offset value 0.49 eV calculated using “transitivity” method. The conduction band offset is determined to be 0.82 ± 0.1 eV, indicating a ‘type I’ band alignment at the heterojunction interface.     

基于原位等离子体氮化及低压化学气相沉积-Si_3N_4栅介质的高性能AlGaN/GaN MIS-HEMTs器件的研究

通过对低压化学气相沉积(LPCVD)系统进行改造,实现在沉积Si_3N_4薄膜前的原位等离子体氮化处理,氮等离子体可以有效地降低器件界面处的氧含量和悬挂键,从而获得了较低的LPCVD-Si_3N_4/GaN界面态,通过这种技术制作的MIS-HEMTs器件,在扫描栅压范围V_(G-sweep)=(-30 V,+24 V)时,阈值回滞为186 mV,据我们所知为目前高扫描栅压V_(G+)(20 V)下的最好结果.动态测试表明,在400 V关态应力下,器件的导通电阻仅仅上升1.36倍(关态到开态的时间间隔为100μs).     

The In2O3/CdTe interface: A possible contact for thin film solar cells?

Transparent conductive In₂O₃ films were deposited by reactive evaporation of In and analyzed in-situ with photoelectron spectroscopy. The interface formation of In₂O₃ with evaporated CdTe has been investigated using the same technique. A valence band offset ΔE_VB=2.1±0.1 eV is determined, resulting in a negligible conduction band offset. However, In₂O₃ will not provide an Ohmic contact to n-CdTe, due to the Fermi level position at the interface.     

背势垒层结构对AlGaN/GaN双异质结载流子分布特性的影响

首先通过一维自洽求解薛定谔/泊松方程,研究了AlGaN/GaN双异质结构中AlGaN背势垒层Al组分和厚度对载流子分布特性的影响.其次利用低压MOCVD方法在蓝宝石衬底上生长出具有不同背势垒层的AlGaN/GaN双异质结构材料,通过汞探针CV测试验证了理论计算的正确性.理论计算和实验结果均表明,随着背势垒层Al组分的提高和厚度的增加,主沟道中的二维电子气面密度逐渐减小,寄生沟道的二维电子气密度逐渐增加;背势垒层Al组分的提高和厚度的增加能有效的增强主沟道的二维电子气限域性,但是却带来了较高的 关键词： AlGaN/GaN 双异质结构 限域性 寄生沟道     

Ni/Au Schottky gate oxidation and BCB passivation for high-breakdown-voltage AlGaN/GaN HEMT

A new AlGaN/GaN high electron mobility transistor (HEMT) employing Ni/Au Schottky gate oxidation and benzocyclobutene (BCB) passivation is fabricated in order to increase a breakdown voltage and forward drain current. The Ni/Au Schottky gate metal with a thickness of 50/300 nm is oxidized under oxygen ambient at 500 C and the highly resistive NiO is formed at the gate edge. The leakage current of AlGaN/GaN HEMTs is decreased from 4.94 μA to 3.34 nA due to the formation of NiO. The BCB, which has a low dielectric constant, successfully passivates AlGaN/GaN HEMTs by suppressing electron injection into surface states. The BCB passivation layer has a low capacitance, so BCB passivation increases the switching speed of AlGaN/GaN HEMTs compared with silicon nitride passivation, which has a high dielectric constant. The forward drain current of a BCB-passivated device is 199 mA /mm, while that of an unpassivated device is 172 mA /mm due to the increase in two-dimensional electron gas (2DEG) charge.