Development of copper coatings on molybdenum powders by electroless plating technique

Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was studied. The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD. The results indicate that the Mo powders are coated with copper, at （he same time, Mo-Cu composite powders with Cu content ranging from 15% to 85% （mass fraction） can be obtained. The optimal values of pH, HCHO concentration and temperature are in the ranges of 12-13, 22-26 ml/L and 60-65℃, respectively. The diffusion-shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface.     

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

Molybdenum powders with a diameter of approximately 3 μm were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃.The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature.The optimized values of pH and temperature were found to be 12.5 and 60℃,respectively,which attributes to the bright maroon color of the coating with an increase in weight of 46%.The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-ray diffraction (XRD).An attempt was made to understand the growth mechanism of the coating.The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.     

化学镀法制备Ni-P包覆SiC复合粉

用次亚磷酸钠作为还原剂,采用化学镀的方法制备表面包覆Ni-P镀层的Si C复合颗粒,其表面形貌、成分、结构、电磁波吸收性能分别利用SEM、EDS、XRD及矢量网络分析仪进行了研究。结果表明:经二次镀镍后Si C表面形成了一层连续且致密的Ni-P合金镀层,并且没有引入其它杂质元素。随着施镀时间的延长镀层不断增厚。化学镀镍工艺显著改善了Si C对电磁波的吸收能力,镀后复合颗粒在4~22 GHz频段范围内,超过-5 d B的吸收带宽高达11.8 GHz,最大吸收出现在17.7 GHz处,衰减值为-9.9 d B。     

简化预处理辅助化学镀制备Cu包覆TiC复合粉末

研究了一种简化预处理辅助化学镀工艺制备Cu包覆TiC复合粉末.利用场发射扫描电子显微镜和能谱仪分析了原始TiC粉末,预处理之后的TiC粉末,Cu包覆TiC复合粉末的表面形貌和成分,同时也阐述了Cu镀层的生长机理.结果表明,经过简化预处理之后的TiC出现了很多表面缺陷,Cu能够均匀的包覆在TiC颗粒表面.其生长机理如下:经过预处理之后的TiC出现很多表面缺陷,成为化学镀过程中的活性点;化学镀过程中,Cu在TiC表面的各个缺陷处形核长大;Cu与Cu之间相互接触相互作用形成密集的网状结构最终形成致密的Cu镀层.     

超声波辅助化学镀法制备CoAl_2O_4尖晶石粉体

采用超声波辅助化学镀法在室温条件下制备了Co/Al2O3复合粉体,1200℃下热处理1.5h获得了CoAl2O4尖晶石粉体。用扫描电镜、透射电镜和X射线衍射测定了粉体的微观形貌、成分和相组成;用差热分析法确定了粉体的尖晶石转变温度。结果表明:镀覆制备的Co/Al2O3复合粉体由金属钴和Al2O3两相组成,金属钴相包覆Al2O3相,Co包覆层在Al2O3颗粒表面分布均匀且结构较疏松;复合粉体的尖晶石转变温度为850℃左右;转变后获得的粉体也是一种复合粉体,由Al2O3和CoAl2O4两相组成,由粉体的生长机制可预见,它是以α-Al2O3为核心CoAl2O4尖晶石包覆在其表面的结构。     

Ni-P化学镀的机理及其研究方法

Ni-P化学镀镀液体系复杂,影响因素甚多,因此多种Ni-P化学镀机理理论共存,综述并评价了目前流行的几种化学镀的机理理论,同时介绍了其研究方法.     

Ni-P-Nanodiamond composite electroless plating

The effect of nanodiamond content in electrolyte and rotational speed of the stirrer on the deposition rate of coatings,the nanodiamond content in coatings,the microstructure and the micro-hardness of coatings were studied.A self-made pin-on-disk tribo-meter was employed to evaluate the wear resistance of prepared coatings.Results show that the thickness of composite coating decreases with the rotational speed,while the micro hardness of coating and the content of nanodiamond in coating increase with increa...     

Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass

Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy （FESEM） and atomic force microscopy （AFM）. The results indicate that the copper films have a （111） texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer （F-S）, Mayadas-Shatzkes （M-S） theory and a combined model, the grain boundary reflection coefficient （R） is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.     

纳米Al2O3p化学镀铜复合粉末的烧结致密化

化学镀是制备纳米颗粒增强金属基复合材料的有效方法.对纳米Al2O3p化学镀铜粉末的烧结致密化特点进行了研究,分析了化学镀粉末的预处理、成型压力、烧结温度、保温时间、复压复烧工艺等对致密化的影响.在优化各影响因素的情况下,对Al2O3含量为10%的化学镀铜粉末采用常规粉末冶金工艺得到了相对致密度达94%的试样.     

Process of electroless plating Cu-Sn-Zn ternary alloy

1 Introduction Electroless plating tin and tin alloy is an attractive technique to produce function plating layer with prior performances of corrosion resistance and decoration[1, 2], due to the possibility of uniform deposition on complex shapes, conduct…     

Ni-B合金化学镀包覆TiB2粉的研究

为改善TiB2粉末物性,采用化学镀工艺对其进行包覆Ni—B合金处理。经Hall流动仪检测,包覆后粉末松装密度由1．15～1．17g／cm^3增加到1．38～1．39g／cm^3,粉末流动性由包覆前粉末堵塞霍尔流动性测量仪喷嘴变为94～97s／50g;SEM形貌扫描分析表明包覆效果较好,包覆率大于90％;补加镀液包覆效果更好,镀层更致密,包覆率大于95％。     

Diffusion bonding of a superplastic inconel 718SPF superalloy by electroless nickel plating

Although intimate contact can be obtained for diffusion bonding of a superplastic Inconel 718SPF superalloy under a low pressure of 7 MPa, the precipitates formed at the interface retarded achievement of a sound joint. The shear strength was only 41.5 MPa for an overlap length of 12 T (T=1.3 mm, sheet thickness). The diffusion bondability of this Inconel 718SPF superalloy was enhanced by electroless nickel plating. In this situation, the bonding shear strength increased to 70.4 MPa for the same overlap length of 12 T under the same bonding condition, regardless of the roughness of the surface to be bonded. Upon decreasing the overlap length from 12 to 6 T, the bonding strength remained constant.     

化学镀Ni-B和Ni-B/BN镀层微动磨损性能研究

采用化学镀液相沉积技术,以钛合金TA7为基体材料,分别镀覆Ni-B合金镀层和Ni-B/BN自润滑复合镀层,对镀层进行微动磨损性能测试和镀层表面形貌观察.结果表明:在微动磨损过程中完全滑移状态下,Ni-B/BN镀层中六方BN微粒具有类似石墨层状结构,该Ni-B/BN镀层具有自润滑性能,使其摩擦因数比Ni-B镀层低,即Ni-B/BN复合镀层在滑移区耐微动磨损性能要优于化学镀Ni-B二元合金镀层.     

Progress of electroplating and electroless plating on magnesium alloy

The current research processes of electroplating and electroless Ni-P alloy plating on magnesium alloys were reviewed. Theoretically, the reason for difficulties in electroplating and electroless plating on magnesium alloys was given. The zinc immersion, copper immersion, direct electroless Ni-P alloy plating and electroplating and electroless plating on magnesium alloys prepared by chemical conversion coating were presented in detail. Especially, the research development of magnesium alloy AZ91 and AZ31 was discussed briefly. Based on the analysis, the existing problems and future research directions were then given.     

化学镀制备Ni-Cu-P-TiN复合镀层及其热处理工艺

采用中温化学复合镀在高碳钢表面制备了Ni-Cu-P-TiN复合镀层,采用SEM、XRD对镀层的相组成与微观结构进行了分析,并研究了400℃热处理时间对镀层相组成、硬度、耐腐蚀性能的影响。结果表明,TiN相均匀的分散于Ni-Cu-P胞状结构的界面之间,沉积比例在4.5%~5.0%;在400℃下进行恒温热处理,随时间延长,Ni-Cu-P-TiN镀层中逐渐析出细小Ni3P相,截面硬度增加,40min时达到最高硬度960HV;随热处理时间继续延长,Ni3P相的晶粒粗化,镀层硬度下降;镀态Ni-Cu-P-TiN镀层的自腐蚀电流密度为7.92μA,仅为高碳钢(167μA)的1/20,经400℃下恒温热处理0~40min,其自腐蚀电流密度逐渐升高,40min时达到最大值28.2μA。     

AZ91镁合金化学镀镍前处理的工艺

研究了H3PO4+Na2MoO4、H3PO4+KMnO4和H3PO4+Na3PO4三种酸洗工艺以及NH4HF2活化工艺等前处理工艺对AZ91 HP镁合金化学镀的影响.通过金相实验及极化实验,结果表明,AZ91 HP镁合金经H3PO4+ Na3PO4酸洗后再经NH4HF2工艺活化处理后施镀,可获得表面光亮、结合力强和耐蚀性能较好的镍-磷镀层.镁合金酸洗处理后表面的平整程度会影响其化学镀层平整度和光亮度,而活化处理后表面的粗糙程度则影响镀层和基体的结合力.     

Preparation of nickel-coated tungsten carbide powders by room temperature ultrasonic-assisted electroless plating

In this paper nickel (Ni)-coated tungsten carbide (WC) composite powders have been synthesized by ultrasonic-assisted electroless plating with a simplified pretreatment at room temperature as the conventional sensitization and activation steps have not been employed. The growth mechanism of Ni layers and surface morphologies and composition of initial WC powders, pretreated WC powders and Ni-coated WC powders were analyzed by field emission scanning electron microscopy, and energy dispersion spectrometry. The results shows that uniform Ni-coated WC composite powders were successfully synthesized without conventional sensitization and activation steps by ultrasonic-assisted electroless plating at room temperature. The growth mechanism of Ni layers appears as follows: the surfaces of pretreated WC powders appear step-like defects which act as activated sites. Nucleation and the growth of nickel grains take place on the activated sites of pretreated WC powder, and the process repeats continuously on the lath particles with reticulate structure on the as-coated surfaces of previously deposited Ni-cells, finally Ni cells grow up and merge into a layer.     

AZ31镁合金表面碱性化学镀镍工艺研究

试验研究了AZ31镁合金表面碱性化学镀镍工艺。采用扫描电镜(SEM)、能谱成分分析(EDS)和X射线衍射(XRD)等方法对镀镍层的表面形貌、镀层成分及物相结构进行了分析,并测定了AZ31镁合金及镀层在w(NaCl)=3.5%的水溶液中的腐蚀电位和极化曲线,以此评价镀层的耐腐蚀性能。结果表明,预镀镍层为晶格畸变的晶态低磷镀层,二次镀镍层为非晶态高磷镀层,镁合金表面腐蚀电位在化学镀镍后明显升高,二次镀镍后钝化电位范围明显扩大,其耐腐蚀性能明显优于预镀镍层的。     

温度对金刚石粉体表面镀铜的影响

在金刚石粉体表面通过化学沉积得到铜金属镀层,通过X射线衍射(XRD)、扫描电镜(SEM)等测试手段研究了镀液温度对镀速、镀层组织及形貌的影响。结果表明:当镀液温度低于30℃时,镀速为零,反应不能发生;温度在30~45℃时,随着温度的升高,铜的衍射峰逐渐增强;45℃时,基体完全被覆盖,镀层致密均匀;温度在45~50℃时,衍射峰进一步增强,镀层晶粒明显变大,致密度降低,表层有脱落现象;随着温度进一步增大,铜的衍射峰强度开始降低,60℃时,镀层有明显的脱落,翻边起皮现象。