Fracture analysis of mode-II crack perpendicular to imperfect bimaterial interface

The problem of a mode-II crack close to and perpendicular to an imperfect interface of two bonded dissimilar materials is investigated.The imperfect interface is modelled by a linear spring with the vanishing thickness.The Fourier transform is used to solve the boundary-value problem and to derive a singular integral equation with the Cauchy kernel.The stress intensity factors near the left and right crack tips are evaluated by numerically solving the resulting equation.Several special cases of the mode-II crack problem with an imperfect interface are studied in detail.The effects of the interfacial imperfection on the stress intensity factors for a bimaterial system of aluminum and steel are shown graphically.The obtained observation reveals that the stress intensity factors are dependent on the interface parameters and vary between those with a fully debonded interface and those with a perfect interface.     

裂纹垂直于双相介质界面时的应力强度因子

本文利用Ｊ积分与应力强度因子的关系,采用有限元数值方法研究了当裂纹与双相介质的界面垂直时,其裂纹的近界面端和远界面端的应力强度因子随双相介质参数和裂纹端部到界面的距离的变化规律,同时还分析了当边裂纹逐渐扩展时,应力强度因子的变化特征。     

Elastic-plastic crack growth on plane strain bimaterial interface

Finite element computation are carried out to simulate plane strain crack growth on a bimaterial interface under the assumption of small scale yielding. The modified Gurson constitutive equation and the element vanish technique introduced by Tvergaard et al. are used to model the final formation of an open crack. It is found from the calculation that the critical fracture toughness for crack growth is much lower in bimaterials than that in homogeneous material. The critical fracture toughness is strongly dependent on material properties of the bimaterial pair and the mixed mode of remote loads. The interface crack grows in the more compliant (lower hardening) material or in the weaker (lower yield strength) material. In Mode-I loading, the crack grows zigzag along the interface. Project supported by Fok Ying-Tung Education Foundation and National Natural Science Foundation of China.     

A crack perpendicular to and terminating at a bimaterial interface

Using dislocation simulation approach, the basic equation for a finite crack perpendicular to and terminating at a bimaterial interface is formulated. A novel expansion method is proposed for solving the problem. The complete solution to the problem, including the explicit formulae for theT stresses ahead of the crack tip and the stress intensity factors are presented. The stress field characteristics are analysed in detail. It is found that normal stresses {ie27-1} and {ie27-2} ahead of the crack tip, are characterised byQ fields if the crack is within a stiff material and the parameters |p _T | and |q _T | are very small, whereQ is a generalised stress intensity factor for a crack normal to and terminating at the interface. If the crack is within a weak material, the normal stresses {ie27-3} and {ie27-4} are dominated by theQ field plusT stress. This work was supported by the Swedish Research Council for Engineering Sciences.     

Contact zone assessment for a fast growing interface crack in an anisotropic bimaterial

Summary A plane strain problem for a crack with a frictionless contact zone at the leading crack tip expanding stationary along the interface of two anisotropic half-spaces with a subsonic speed under the action of various loadings is considered. The cases of finite and infinite-length interface cracks under the action of a moving concentrated loading at its faces are considered. A finite-length crack for a uniform mixed-mode loading at infinity is considered as well. The associated combined Dirichlet-Riemann boundary value problems are formulated and solved exactly for all above-mentioned cases. The expressions for stresses and the derivatives of the displacement jumps at the interface are presented in a closed analytical form for an arbitrary contact zone length. Transcendental equations are obtained for the determination of the real contact zone length, and the associated closed form asymptotic formulas are found for small values of this parameter. It is found that independently of the types of the crack and loading, an increase of the crack tip speed leads to an increase of the real contact zone length and the correspondent stress intensity factor. The latter increase significantly for an interface crack tip speed approaching the Ragleigh wave speed.     

A general solution method for an anti-plane shear crack dynamically accelerating along a bimaterial interface

We develop a general solution method for a dynamically accelerating crack under anti-plane shear conditions along the interface between two different homogeneous isotropic elastic materials. The crack is initially at rest, and after loading is applied the crack-tip speed which may accelerate up to the shear wave speed of the more compliant material. The analysis includes an exact, closed-form expression for the stress intensity factor for an arbitrary time-dependent crack-face traction, as well as expressions for computing the crack-face displacements and the stress in front of the crack. We also present some numerical examples for fixed loads and for loads moving with the crack tip, using a stress intensity factor fracture criterion, in order to examine the predicted effect of material mismatch on interfacial fracture.     

On interface crack models with contact zones situated in an anisotropic bimaterial

Summary A boundary value problem for two semi-infinite anisotropic spaces with mixed boundary conditions at the interface is considered. Assuming that the displacements are independent of the coordinate x ₃, stresses and derivatives of displacement jumps are expressed via a sectionally holomorphic vector function. By means of these relations the problem for an interface crack with an artificial contact zone in an orthotropic bimaterial is reduced to a combined Dirichlet-Riemann problem which is solved analytically. As a particular case of this solution, the contact zone model (in Comninou's sense) is derived. A simple transcendental equation and an asymptotic formula for the determination of the real contact zone length are obtained. The classical interface crack model with oscillating singularities at the crack tips is derived from the obtained solution as well. Analytical relations between fracture mechanical parameters of different models are found, and recommendations concerning their implementation are given. The dependencies of the contact zone lengths on material properties and external load coefficients are illustrated in graphical form. The practical applicability of the obtained results is demonstrated by means of a FEM analysis of a finite-sized orthotropic bimaterial with an interface crack. Received 19 October 1998; accepted for publication 13 November 1998     

An electrically conducting interface crack with a contact zone in a piezoelectric bimaterial

A plane problem for an electrically conducting interface crack in a piezoelectric bimaterial is studied. The bimaterial is polarized in the direction orthogonal to the crack faces and loaded by remote tension and shear forces and an electrical field parallel to the crack faces. All fields are assumed to be independent of the coordinate co-directed with the crack front. Using special presentations of electromechanical quantities via sectionally-analytic functions, a combined Dirichlet–Riemann and Hilbert boundary value problem is formulated and solved analytically. Explicit analytical expressions for the characteristic mechanical and electrical parameters are derived. Also, a contact zone solution is obtained as a particular case. For the determination of the contact zone length, a simple transcendental equation is derived. Stress and electric field intensity factors and, also, the contact zone length are found for various material combinations and different loadings. A significant influence of the electric field on the contact zone length, stress and electric field intensity factors is observed. Electrically permeable conditions in the crack region are considered as well and matching of different crack models has been performed.     

Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent

This paper presents an exact solution for the transverse interface crack in the plane strain case. The crack is perpendicular to the interface and in one material. The exact complex stress functions are first obtained with some unknown constants. The satisfactions of all boundary conditions are then checked, the condition at infinity is considered and the unknown constants are determined. Further study may focus on the case with different shear moduli and the influence of the large deformation.The English text was polished by Keren Wang.     

Scattering of SH-waves by an interacting interface linear crack and a circular cavity near bimaterial interface

An analytical method is developed for scattering of SH-waves and dynamic stress concentration by an interacting interface crack and a circular cavity near bimaterial interface. A suitable Green‘s function is contructed, which is the fundamental solution of the displacement field for an elastic half space with a circular cavity impacted by an out-plane harmonic line source loading at the horizontal surface. First, the bimaterial media is divided into two parts along the horizontal interface, one is an elastic half space with a circular cavity and the other is a complete half space. Then the problem is solved according to the procedure of combination and by the Green‘s function method. The horizontal surfaces of the two half spaces are loaded with undetermined anti-plane forces in order to satisfy continuity conditions at the linking section, or with some forces to recover cracks by means of crack-division technique. A series of Fredholm integral equations of first kind for determining the unknown forces can be set up through continuity conditions as expressed in terms of the Green‘s function. Moreover, some expressions are given in this paper, such as dynamic stress intensity factor (DSIF) at the tip of the interface crack and dynamic stress concentration factor (DSCF) around the circular cavity edge. Numerical examples are provided to show the influences of the wave numbers, the geometrical location of the interface crack and the circular cavity, and parameter combinations of different media upon DSIF and DSCF.     

Singular behaviour and asymptotic stress field of a crack terminating at a bimaterial interface

A crack terminating at an interface of two dissimilar elastic materials is investigated. It is found that the asymptotic stress field near the crack tip is in general composed of two parts with each part being characterized by one singularity. The detailed relation of the two singularities with the bimaterial properties is given for some special cases of the crack.     

Interaction of a conductive crack and of an electrode at a piezoelectric bimaterial interface

The interaction of a conductive crack and an electrode at a piezoelectric bi-material interface is studied. The bimaterial is subjected to an in-plane electrical field parallel to the interface and an anti-plane mechanical loading. The problem is formulated and reduced, via the application of sectionally analytic vector functions, to a combined Dirichlet–Riemann boundary value problem. Simple analytical expressions for the stress, the electric field, and their intensity factors as well as for the crack faces' displacement jump are derived. Our numerical results illustrate the proposed approach and permit to draw some conclusions on the crack–electrode interaction.     

A transverse crack tip field in bimaterial

The asymptotic field near an interface crack tip is analyzed with the fully nonlinear theory. By dividing the crack tip field into narrowing sectors and an expanding sector, the asymptotic equations for the crack tip field are derived and solved. The singular characters of stress and strain near the crack tip are revealed.     

Singular fields of a mode III interface crack in a power-law hardening bimaterial

A high order of asymptotic solution of the singular fields near the tip of a mode III interface crack for pure power-law hardening bimaterials is obtained by using the hodograph transformation. It is found that the zero order of the asymptotic solution corresponds to the assumption of a rigid substrate at the interface, and the first order of it is deduced in order to satisfy completely two continuity conditions of the stress and displacement across the interface in the asymptotic sense. The singularities of stress and strain of the zeroth order asymptotic solutions are −1/(n ₁+1) and −n/(n ₁+1) respectively. (n=n ₁,n ₂ is the hardening exponent of the bimaterials.) The applicability conditions of the asymptotic solutions are determined for both zeroth and first orders. It is proved that the Guo-Keer solution^[10] is limited in some conditions. The angular functions of the singular fields for this interface crack problem are first expressed by closed form. The project supported by National Natural Science Foundation of China     

Experimental analysis of an arbitrarily inclined semiinfinite crack terminated at the bimaterial interface

In this paper, the digital photoelastic technique was employed to investigate the effect of different material combinations and different crack inclination angles on the stress-intensity factors (SIFs). To produce a true bimaterial plate, the two component materials were naturally adhered together by a special casting procedure. The experimental results show that dimensionless combined SIF increases with increasingG ₁/G ₂ (or crack inclination angles) for different crack inclination angles (orG ₁/G ₂'s).     

Crack propagation along the interface of piezoelectric bimaterial

This paper is concerned with the propagation of a crack along the interface of a piezoelectric bimaterial, which can travel at subsonic or intersonic speed. The inertial effects are taken into account while the static approximation is applied to the electric fields. The effect of piezoelectricity on the asymptotic crack-tip field is discussed for an interface crack propagating subsonically and intersonically. An alternative method is used to avoid solving for the eigenvectors. This paper provides a unified method to analyze the crack-tip field of a crack propagating along a piezoelectric bimaterial interface.     

Micromechanics analyses of interface crack

A new mechanics model based on Peierls concept is presented in this paper, which can clearly characterize the intrinsic features near a tip of an interfacial crack. The stress and displacement fields are calculated under general combined tensile and shear loadings. The near tip stress fields show some oscillatory behaviors but without any singularity and the crack faces open completely without any overlapping when remote tensile loading is comparable with remote shear loading. A fracture criterion for predicting interface toughness has been also proposed, which takes into account for the shielding effects of emitted dislocations. The theoretical toughness curve gives excellent prediction, as compared with the existing experiment data. The project supported by the National Natural Science Foundation of China     

An analytically-numerical approach for the analysis of an interface crack with a contact zone in a piezoelectric bimaterial compound

An interface crack with an artificial contact zone at the right-hand side crack tip between two dissimilar finite-sized piezoelectric materials is considered under remote mixed-mode loading. To find the singular electromechanical field at the crack tip, an asymptotic solution is derived in connection with the conventional finite element method. For mechanical loads, the stress intensity factors at the singular points are obtained. As a particular case of this solution, the contact zone model (in Comninou’s sense) is derived. A simple transcendental equation and an asymptotic formula for the determination of the real contact zone length are derived. The dependencies of the contact zone lengths on external load coefficients are illustrated in graphical form. For a particular case of a short crack with respect to the dimensions of the bimaterial compound, the numerical results are compared to the exact analytical solutions, obtained for a piezoelectric bimaterial plane with an interface crack.     

Passages to the limit in the dynamic problem for a crack at the interface between elastic media

The paper analyzes numerically the passages to the limit in the dynamic problem for a penny-shaped crack at the interface between dissimilar linear elastic, homogeneous, isotropic materials as either the frequency of harmonic load or the difference between the properties of the materials decreases. It is shown that as the frequency decreases, the solution of the dynamic problem tends to that of the static problem, and as the physical and mechanical properties of the materials become less different, the original problem goes into the dynamic problem for a crack in a homogeneous body __________ Translated from Prikladnaya Mekhanika, Vol. 44, No. 7, pp. 26–34, July 2008.     

ASYMPTOTIC ANALYSIS OF MODE Ⅱ STATIONARY GROWTHCRACK ON ELASTIC-ELASTIC POWER LAWCREEPING BIMATERIAL INTERFACE

A mechanical model was established for mode Ⅱ interfacial crack static growingalong an elastic-elastic power law creeping bimaterial interface. For two kinds of boundaryconditions on crack faces, traction free and frictional contact, asymptotic solutions of thestress and strain near tip-crack were given. Results derived indicate that the stress andstrain have the same singularity, there is not the oscillatory singularity in the field; thecreep power-hardening index n and the ratio of Young‘s module notably influence the crack-tip field in region of elastic power law creeping material and n only influences distribution ofstresses and strains in region of elastic material. When n is bigger, the creepingdeformation is dominant and stress fields become steady, which does not change with n.Poisson‘s ratio does not affect the distributing of the crack-tip field.