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实验制备的柔性压电纳米发电机用旋涂得到的PVDF-Tr FE薄膜作为有源层来实现机电转换。纳米发电机的有源层PVDF-Tr FE薄膜在外加电场和温度场下被极化。在极化过程中,PVDF-Tr FE薄膜的部分顺电相(α相)转变成铁电相或压电相(β相)。纳米发电机上下电极间的电压分布经过Comsol Multiphysics的数值分析,发现其垂直于PVDF-Tr FE薄膜方向。纳米发电机产生的峰值开路输出电压值VOC为7 V,短路输出电流密度ISC/AE为0.53μA/cm2。实验发现纳米发电机的短路输出电流ISC与有效工作面积间AE近似有线性关系,而物理模型计算得到的ISC也揭示了ISC和AE两者间的线性关系,实验结果验证了物理模型计算结果的准确性。因此,增加纳米发电机的有效工作面积AE可以增强其短路输出电流和输出功率。 相似文献
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介绍了摩擦纳米发电机(TENG)的工作原理和特点,总结了从交流输出摩擦纳米发电机(AC-TENG)到直流输出摩擦纳米发电机(DC-TENG)的技术革新变化,根据摩擦纳米发电机不同的直流化技术原理,分别阐述了基于机械整流式、相位控制式、半导体聚合物的动态肖特基式、空气击穿式的DC-TENG近几年的研究进展,并重点分析了基于静电击穿式DC-TENG的工作原理、性能优化和应用方法等。讨论了AC-TENG和DC-TENG之间的异同,得出了通过两者输出性质的差异化来提高自供电传感器精度的结论。最后,对未来DC-TENG技术进行展望,认为DC-TENG与AC-TENG有相似的发展路线,将面临相似的不足与挑战,通过借鉴AC-TENG的改进过程,能有效减少在DC-TENG发展中可能出现的问题。 相似文献
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采用静电纺丝技术并通过两步低温水热法制备了“毛刷”状的氧化锌(ZnO)@聚偏二氟乙烯(PVDF)复合纳米纤维膜。结果表明,氧化锌纳米棒(ZnO NRs)均匀地径向生长在PVDF纳米纤维的表面,FTIR分析发现ZnO@PVDF复合纳米纤维膜β相含量相比PVDF纳米纤维膜从72.3%提升到85.6%,增加了18.4%。ZnO@PVDF复合压电纳米发电机(PENG)输出电压可达4.9 V,短路电流为293 nA。在外部负载电阻达到13 MΩ时,ZnO@PVDF复合PENG达到最大输出功率0.93μW。ZnO@PVDF复合PENG可以为电容器充电,电容放电时成功点亮LED小灯泡。此外,在5000次的循环敲击测试中,ZnO@PVDF复合PENG具有稳定的输出电压,有望作为无源设备的自供电电源得到广泛应用。 相似文献
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一、引言在现代电子设备的设计和制造中都要经过印刷电路板设计这一步骤,通常这一工作是在制图板上由人工设计完成的,这要求设计人员具备相当熟练的技巧和丰富的实践经验。随着CAD技术的发展,印刷电路板的计算机辅助设计取得了广泛的应用,它把计算机的快速、准确与设计者的经验、综合分析能力相结合,大大提高了印刷电路板的设计速度和设计质量。本文介绍一种使用环境简单、方便而功能较强的印刷板CAD软件EDPCB,它具有良好的用户界面,所有操作均在键盘上进行,可两层布线,能在点阵式打印机上输出正/反照相版图、阻焊图。其主要技术指标如下: 最大设计版图尺寸:508mm×406mm 两种连线宽度: 0.38mm,1.27mm 焊盘直径: 1.96mm 相似文献
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柔性电路板几乎用于每1类电器和电子产品中,而且是电子互连产品市场发展最快的产品之一,随着携带型电子产品小型化、轻量化及多功能化的发展,特别是半导体芯片的高集成化与高I/O数的迅速发展,柔性电路板技术向高密度即向精细导线/间距、微孔和精细窗口的方向发展。本从柔性电路板技术发展的驱动力、高密度柔性电路板基材、微孔制作技术以及覆盖层精细窗口制作技术等方面概述高密度柔性电路板的技术发展。 相似文献
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挠性印制电路(FPC)在IC封装中的应用,推进了电子产品小型化、轻量化、高性能化的进程,同时也推动了FPC向高密度方向发展。本文概述了基于挠性印制电路的芯片级封装技术,包括平面封装和三维封装技术,以及芯片级封装技术的发展对挠性载板的影响。 相似文献
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The desire of flexibility, compact, lightweight and low cost in current electronic device increases the application of flexible printed circuit board (FPCB). However, FPCB would encounter significant deflection and stress under operating condition (thermal factor) with air flow cooling system as compared to rigid printed circuit board (RPCB). Therefore, present study aims to investigate the effects of airflow rate and heat on FPCB attached with a ball grid array (BGA) package using experimental and numerical method. In this present study, the simulation was carried out by using FLUENT and ABAQUS, coupled in real time by Mesh-based Parallel Code Coupling Interface (MpCCI) where flow and thermal effects were coupled simultaneously. The experiments were conducted in a wind tunnel with the BGA package on the FPCB. Low discrepancy between simulation and experimental results indicated that the proposed numerical simulation method is proven to be reliable and sufficient to study the FPCB with thermal and flow effects which has not been established by previous researchers. The findings also showed that the Reynolds number and heat have significant effects on FPCB's deflection and stress. Therefore, it is important to include thermal effect when dealing with FPCB under flow environment. The outcomes of this paper can be a guideline to the FPCB industries. 相似文献
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Real-world printed circuit board ESD failures 总被引:1,自引:0,他引:1
Andrew Olney Brad Gifford John Guravage Alan Righter 《Microelectronics Reliability》2005,45(2):287-295
ICs that are robust to ESD at the component-level may be damaged by ESD at the board-level. Two case studies show that real-world Charged Board Model (CBM) ESD damage is typically more severe than Human Body Model (HBM) or Charged Device Model (CDM) ESD damage. Consequently, CBM damage can be easily mistaken for electrical overstress (EOS) damage. A high-capacitance yet compact Printed Circuit Board (PCB) evaluation board facilitates qualitative CBM testing using conventional CDM test systems. Based on the case studies and test results, guidelines are provided on how to minimize the likelihood of real-world CBM failures. 相似文献
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挠性光电印制电路板(Flexible Electro-Optical Printed Circuit Board, FEOPCB)在高温层压制作过程中,埋入光纤会产生热应力,造成光纤损坏等缺陷,影响其可靠性和高速信号传输性能。为了降低FEOPCB弯曲半径并提升其可靠性,将在双面覆铜聚酰亚胺(PI)基板上设计制作高精度矩形光纤定位槽。首先建立有/无涂覆层光纤埋入挠性基板有限元仿真模型,对FEOPCB制造工艺进行模拟仿真,并对埋入光纤应力及影响因素进行分析。结果表明,有涂覆层光纤所受应力远小于无涂覆层光纤。针对有涂覆层光纤,采用激光刻蚀技术在双面覆铜PI基板上制作了高精度矩形定位槽,通过高温层压工艺完成了FEOPCB制作。FEOPCB完成了温度冲击、低温、高温、湿热和10万次弯曲疲劳可靠性试验,利用光学显微镜观察分析,埋入光纤无高温降解和破裂等缺陷。FEOPCB最小弯曲半径小至2 mm,弯曲损耗分别为0.57 dB (90°)和1.12 dB (180°),且相邻光纤之间无串扰,在850 nm波长条件下通信速率可达10 Gbps,误码率小于10-16。 相似文献
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在电子工程技术不断发展的今天,印制电路板及抗干扰技术的设计在集成度的要求上越来越高.本文分析了印制电路板的含义及分类,通过讨论其设计,得出了印制电路板抗干扰性设计的原则,为同行提供参考. 相似文献
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A flexible printed circuit board (FPCB) is flexible, thin and lightweight; however, FPCBs experience more deflection and stress in the flow environment because of fluid–structure interaction (FSI), which affects their performance. Therefore, the present study focuses to optimize a typical FPCB electronic in order to minimize the deflection and stress induced in the system. In this study, numeric parameters (i.e., flow velocity, component size, component thickness, misalignment angle, as well as the length and width of the FPCB) were optimized using response surface methodology (RSM) with the central composite design technique. The separate effects of the independent variables and their interactions were investigated. The optimized condition was also examined to substantiate the empirical models generated using RSM. At a flow velocity of 5 m/s, the optimum values of the component size, component thickness, misalignment angle, as well as the length and width of the FPCB were determined at 11.69 mm, 12.37 mm, −0.73°, as well as 180 mm and 180 mm, respectively. This optimized condition resulted in a maximum deflection of 0.402 mm and a maximum stress of 0.582 MPa. The findings conveyed can contribute to the development of FPCB industries. 相似文献
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