高温退火处理提高半绝缘VGF-GaAs单晶的电学性能

垂直梯度凝固法(VGF)生长的低位错半绝缘(SI)GaAs单晶存在电阻率和迁移率低、电学补偿度小、均匀性差等问题.在3种不同温度条件下,对VGF-SI-GaAs晶片进行了加As压的闭管退火处理.结果表明,经过1160℃/12h的高温退火处理后,VGF-SI-GaAs单晶的电阻率、迁移率和均匀性均得到了显著提高.利用Hall、热激电流谱(TSC)、红外吸收法分别测试分析了原生和退火VGF-SI-GaAs单晶样品的电学性质、深能级缺陷、EL2浓度和C浓度,并与常规液封直拉法(LEC)SI-GaAs单晶样品进行了比较.原生VGF-SI-GaAs单晶巾的EL2浓度明显低于LEC-SI-GaAs单晶,经过退火处理后其EL2浓度显著增加,电学补偿增强,而且能级较浅的一些缺陷的浓度降低,因而有效提高了其电学性能.     

空位和填隙缺陷对半绝缘InP单晶性质的影响

利用电学测试、正电子寿命谱和X射线衍射技术研究了原生和退火处理后InP单晶的空位和填隙缺陷.在原生掺铁半绝缘InP单晶中含有空位缺陷,这些空位产生深能级电学补偿缺陷,降低材料的电学性能.经高温磷化铁气氛下退火处理非掺InP制备的半绝缘材料,空位被充分抑制,却含有一定浓度填隙缺陷.根据实验结果分析了填隙和空位缺陷对掺铁半绝缘InP单晶材料电学性质和热稳定性的影响.     

空位和填隙缺陷对半绝缘InP单晶性质的影响

利用电学测试、正电子寿命谱和X射线衍射技术研究了原生和退火处理后InP单晶的空位和填隙缺陷.在原生掺铁半绝缘InP单晶中含有空位缺陷,这些空位产生深能级电学补偿缺陷,降低材料的电学性能.经高温磷化铁气氛下退火处理非掺InP制备的半绝缘材料,空位被充分抑制,却含有一定浓度填隙缺陷.根据实验结果分析了填隙和空位缺陷对掺铁半绝缘InP单晶材料电学性质和热稳定性的影响.     

半绝缘砷化镓单晶的整锭热退火

本文报道了整锭热退火对IEC-SI-GaAs单晶特性的影响.研究发现,在950℃温度和5小时条件下,对SI-GaAs单晶整锭热退火后,单晶的电阻率、迁移率、霍尔浓度、位错密度和电子陷阱El2浓度的分布均匀性有所改善,并且El2浓度和迁移率平均值经热退火后有所提高.     

SI-GaAs单晶中深能级陷阱退火特性研究

研究了LEC-SI-GaAs单晶热处理前后深能级陷阱的变化,比较了原生晶体在不同条件的热退火后SI-GaAs单晶中深能级陷阱的特性,分析了产生变化的原因,并讨论了LEC-SI-GaAs中两个主要深能级陷阱EL2和EL6的可能构型.     

非掺半绝缘磷化铟晶片的制备及其均匀性

对高温退火非掺磷化铟(InP)制备的半绝缘晶片的电学性质和均匀性进行了研究.非掺低阻N型磷化铟晶片分别在纯磷气氛和磷化铁气氛下进行930℃、80h退火均可获得半绝缘材料.但在这两种条件下制备的两种50mm半绝缘晶片却呈现出不同的电学性质和均匀性.纯磷气氛下制备的磷化铟片的电阻率和迁移率分别达到106Ω·cm和1800cm2/(V·s);而在磷化铁气氛下退火获得的半绝缘片的电阻率和迁移率分别高达107Ω*cm和3000cm2/(V*s)以上.对这两种半绝缘片和原生掺铁磷化铟半绝缘片的PL-Mapping结果进一步比较表明:在磷化铁气氛下退火获得的半绝缘材料的均匀性最好,而在纯磷气氛下制备的半绝缘磷化铟的均匀性较差.     

非掺半绝缘磷化铟晶片的制备及其均匀性

对高温退火非掺磷化铟(InP)制备的半绝缘晶片的电学性质和均匀性进行了研究.非掺低阻N型磷化铟晶片分别在纯磷气氛和磷化铁气氛下进行930℃、80h退火均可获得半绝缘材料.但在这两种条件下制备的两种50mm半绝缘晶片却呈现出不同的电学性质和均匀性.纯磷气氛下制备的磷化铟片的电阻率和迁移率分别达到106Ω·cm和1800cm2/(V·s);而在磷化铁气氛下退火获得的半绝缘片的电阻率和迁移率分别高达107Ω*cm和3000cm2/(V*s)以上.对这两种半绝缘片和原生掺铁磷化铟半绝缘片的PL-Mapping结果进一步比较表明:在磷化铁气氛下退火获得的半绝缘材料的均匀性最好,而在纯磷气氛下制备的半绝缘磷化铟的均匀性较差.     

InP中的深能级杂质与缺陷

综述了近年来关于InP中深能级缺陷和杂质的研究工作。讨论了深能级杂质及缺陷对InP材料性能的重要影响;介绍了深能级瞬态谱(DLTS)、光致发光谱(PL)、热激电流谱(TSC)、正电子寿命谱(PAS)、正电子深能级瞬态谱(PDLTS)等几种研究深中心的方法在研究InP时的某些特点;综合深能级缺陷和电学性质的测试结果,证明了半绝缘InP单晶材料的电学性能、热稳定性、均匀性等与材料中一些深能级缺陷的含量密切相关;分析了对掺铁和非掺退火两种半绝缘InP材料中深能级缺陷对电学补偿的影响;评述了对InP中的一些深中心所取得的研究成果和半绝缘InP的形成机理。     

PICTS方法研究SI-GaAs中深能级缺陷性质

本文用 PICTS方法配合退火实验对各种 LEC SI-GaAs材料的缺陷进行了测量,对照文献已有的各种结果,分析和讨论了一些缺陷的成因和可能结构.认为其中的W_1 可能是与As_(Ga)有关的 EL3缺陷,W_4为热应力产生的缺陷.P_1 与V_(Ga)有关.在原生富砷样品的PICTS谱中存在负峰N,实验发现它的存在与样品表面状况无关.若考虑该缺陷同时与两种载流子作用,理论计算与实验符合较好.在有些样品中用PICTS方法观察到EL2峰,对于原生样品,发现经快速退火后EL2的体内浓度减小.     

SI-GaAs材料的电学补偿

研究了ＨＰＬＥＣ工艺生长半绝缘砷化镓单晶过程中,熔体的化学剂量比对晶体深施主缺陷能级、浅受主碳的浓度以及晶体电学性能的影响．由Ｎ型半绝缘晶体的补偿机理对实验现象进行了解释,给出了既能保证晶体电学性能又可以使缺陷浓度较低的最佳熔体剂量比．并将近本征半导体的物理模型推广至半绝缘砷化镓单晶,得到了较理想的电阻率范围．     

Mobility spectrum analysis of anisotropic electron transport in N-polar GaN/AlGaN heterostructures on vicinal sapphire substrates

In this work, we present results of a study of anisotropic two-dimensional electron gas (2DEG) transport in N-polar GaN/AlGaN heterostructures grown on slightly mis-oriented sapphire substrates. High-resolution mobility spectrum analysis of magnetic-field dependent Hall-effect and resistivity indicate an isotropic 2DEG sheet carrier density, yet significant anisotropy was observed in carrier mobility. A single electron species with a narrow mobility distribution was found to be responsible for conduction parallel to the multi-atomic steps resulting from growth on the vicinal substrates; whilst in the perpendicular direction two distinct electrons peaks are evident at T ? 150 K, which merge near room temperature. The linewidth of the mobility distributions for transport in the perpendicular direction was found to be significantly broader than that of the single electron in the parallel direction. The broader mobility distribution and the lower average mobility for the 2DEG in the perpendicular direction are attributable to interface roughness scattering associated with the GaN/AlGaN interfacial steps.     

Mobility of modulation doped AlGaAs/low-temperature MBE-grown GaAs heterostructures

A study of the mobility of a novel modulation doped heterostructure in which the channel region is made of low-temperature molecular beam epitaxially grown GaAs (LT-GaAs) and all other layers are grown at normal temperatures is presented for the first time. The resistivity of the as-grown samples(in- situ annealed) is very high, as is that of single layers of bulk LT-GaAs. However, in the presence of light, the resistivity of the LT-GaAs modulation-doped field effect transistor (MODFET) is significantly lower, facilitating reliable Hall measurements. We speculate that the observed decrease in resistivity of the LT-GaAs MODFET is due to the formation of a two-dimensional electron gas (2DEG) at the heterointerface under illumination. A number of samples grown under different growth conditions were investigated. Mobilities for these samples were found to be in the range of 250 to 750 cm²Vs at 300K and ∼3000 to 5500 cm²Vs at 77K. A first-order computer simulation was implemented to calculate the mobility of the 2DEG using the relaxation-time approximation to solve the Boltzmann equation, taking into account different scattering mechanisms. Scattering by the arsenic clusters and by ionized impurities in the LT-GaAs MODFET channel are found to be the two dominant mechanisms limiting the mobility of the LT-GaAs MODFET samples. Experimental values are in good agreement with theoretical results.     

Interpretation of hall and resistivity measurements in polycrystalline silicon

Grain boundary barriers play a dominant role in the transport properties of polycrystalline silicon. As a result, resistivity and Hall measurements in polysilicon, when interpreted in the normal manner used for single crystals, do not represent in general the same physical entities as in single crystals. The bulk of the grain is more conducting and has a larger free carrier concentration than the barrier. However, the Hall voltage, from which the carrier concentration and mobility are computed, arises from both the bulk and the barrier region. For small grains (< 10μm) the contribution to the Hall voltage from the barrīer region is dominant, while for large grains (≥ 100μm) the bulk dominates. There is a transition region between the two. The magnitudes of the contributions depend on the relative size and resistivity of the grain and the boundary. Thus the interpretation of the data varies with grain size. Doping also affects the relative contribution of the bulk and barrier regions. It is not necessary to invoke carrier depletion within the grain to account for the observed mobility minimum.     

Electrical and photoelectric properties of polycrystalline textured CdTe

The temperature dependences of the resistivity and photoconductivity spectra of polycrystalline coarse-grained stoichiometric CdTe purified in the process of repeated recrystallization at temperatures two times lower than melting point were studied; CdTe ingots were synthesized from starting components subjected profound purification. It is shown that the main characteristics of polycrystals (resistivity, and the lifetime and mobility of carriers) are determined by composite complexes formed as a result of interaction between extended and point defects. The values of the product of mobility multiplied by lifetime are determined.     

Thickness dependence of the properties of transparent conducting ZnO:Zr films deposited on flexible substrates by RF magnetron sputtering

Transparent conducting zirconium-doped zinc oxide(ZnO:Zr)thin films with high transparency,low resistivity and good adhesion were successfully prepared on water-cooled flexible substrates(polyethylene glycol terephthalate,PET)by RF magnetron sputtering.The structural,electrical and optical prooerties of the films were studied for different thicknesses in detail.X-ray diffraction(XRD)and scanning electron microscopy(SEM)revealed that all the deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate．The lowest resistivity achieved is 1.55×10-3 Ω·cm for a thickness of 189 nm with a Hall mobility of 17.6cm2/(V·s)and a carrier concentration of 2.15×1020cm-3.All the films present a high transmittance of above 90％in the wavelength range of the visible spectrum.     

掺氮6H-SiC单晶的电阻率、迁移率及自由载流子浓度

测试了国产和美国Cree公司生产的n型6H-SiC低温下的电学参数,包括电阻率、迁移率和自由载流子浓度,并用FCCS软件数据拟合分析得到两种SiC的杂质浓度和能级.实验结果表明:杂质浓度和补偿度对低温下SiC的电性能有很大影响,轻度补偿的掺氮6H-SiC是施主氮的两个能级共同起作用;而重度补偿的6H-SiC在低温时则是受主能级起作用,并且后者迁移率随温度变化曲线的峰值降低并右移.同时发现重度补偿的SiC在较低温度时由n型转变成了p型,并从理论上分析了产生这种现象的原因.     

Transport properties of Mn-doped Ru2Si3

Transport properties of Mn-doped ruthenium silicide Ru₂Si₃ were studied both experimentally and theoretically. The precipitation-free Ru₂Si₃ single crystals were grown by the zone melting technique with radiation heating. The temperature dependence of the electrical resistivity and Hall coefficients of the crystals were measured. The electrical resistivity of 1% Mn-doped Ru₂Si₃ was lower than that of undoped crystals. The carrier concentration in the doped samples is about 10¹⁸ cm⁻³ at room temperature. Mn-doped Ru₂Si₃ has a twice higher carrier mobility compared to the undoped one. Theoretical calculation of the charge carrier mobility is based on the effective masses which are estimated from the ab initio electronic band structure and classical scattering mechanisms.     

Drift mobility measurements in thin epitaxial semiconductor layers using time-of-flight techniques

The conventional time-of-flight technique for measuring drift velocity in high mobility semiconductors is limited to relatively thick (> 200 μm) and high resistivity material. The microwave time-of-flight technique described here allows thin (～ 10 μm) low resistivity epitaxial layers to be measured with greater accuracy than is afforded by the conventional technique. The new experimental method is applied to the measurement of electron drift velocity in n-type GaAs at room temperature. The method, and its theory, is described in detail and its advantages and limitations are discussed.     

自由电子激光对GaAs/AlGaAs异质结构材料电学性质的影响

自由电子激光(FEL)辐照样品前和辐照样品时,使用变温霍尔测量系统测试了这种n型调制掺杂GaAs/AlGaAs异质结构材料中准二维电子气(2DEG)的迁移率、电子浓度和电阻率。对比这两种情况下的结果可以发现:1)迁移率随温度升高而降低,光照使迁移率增大;2)电子浓度随温度变化关系相对较为复杂,但是平均而言,光照会使电子浓度减小;3)电阻率随温度升高而升高,光照使电阻率减小,但这种影响不明显。对这些现象给出了具体的分析。     

Application of quantitative mobility-spectrum analysis to multilayer HgCdTe structures

For modern semiconductor heterostructures containing multiple populations of distinct carrier species, conventional Hall and resistivity data acquired at a single magnetic field provide far less information than measurements as a function of magnetic field. However, the extraction of reliable and accurate carrier densities and mobilities from the field-dependent data can present a number of difficult challenges, which were never fully overcome by earlier methods, such as the multicarrier fit, the mobility-spectrum analysis of Beck and Anderson, and the hybrid mixed-conduction analysis. More recently, to overcome the limitations of those methods, several research groups have contributed to development of the quantitative mobility-spectrum analysis (QMSA), which is now available as a commercial product. The algorithm is analogous to a fast Fourier transform in that it transforms from the magnetic-field (B) domain to the mobility (μ) domain. The QMSA converts the field-dependent Hall and resistivity data into a visually meaningful transformed output, comprising the conductivity density of electrons and holes in the mobility domain. In this article, we apply QMSA to both synthetic and real experimental data that are representative of modern multilayer HgCdTe structures. We discuss such features as the accuracy of the extraction of individual layer conductivities and average mobilities, reconstruction of the carrier mobility distribution within a particular layer, the resolution of two carriers with similar mobilities, and limits of the sensitivity.